CN210435913U

CN210435913U - Silicon wafer finish machining and polishing equipment

Info

Publication number: CN210435913U
Application number: CN201921018784.5U
Authority: CN
Inventors: 廖海涛
Original assignee: Advanced Materials Technology and Engineering Inc
Current assignee: Wuxi Yiwen Microelectronics Technology Co ltd
Priority date: 2019-07-02
Filing date: 2019-07-02
Publication date: 2020-05-01
Anticipated expiration: 2029-07-02

Abstract

The utility model belongs to the technical field of polishing equipment, in particular to silicon wafer finish machining polishing equipment, which comprises a polishing table, wherein a supporting plate is welded at the edge of the polishing table, a hydraulic cylinder is fixed at the upper end of the supporting plate through a bolt, a polishing motor is fixedly connected with an output shaft of the hydraulic cylinder, an eccentric polishing wheel is fixedly connected with the output shaft of the polishing motor, a sleeve is welded on the upper surface of the polishing table, and an air pump is fixed at the lower part inside the sleeve through a bolt; the round crystal is placed in the telescopic inside of polishing platform surface through welded fastening when polishing for round crystal and sucking disc contact, the outside exhaust of air pump makes the inside pressure of sucking disc reduce, has increased the stability of round crystal with the sucking disc contact, and the inside pressure of sucking disc reduces the back shrink simultaneously, makes round crystal and the contact of anti-skidding rubber strip, has increased the stability of round crystal installation in sleeve inside, avoids the round crystal to appear rotating when polishing, has improved the stability that the round crystal was polished.

Description

Silicon wafer finish machining and polishing equipment

Technical Field

The utility model belongs to the technical field of the polishing equipment, concretely relates to silicon wafer finish machining polishing equipment.

Background

A round crystal finish machining polishing device is used for polishing round crystals and is used for improving the smoothness of the surfaces of the round crystals, polishing is a machining method for reducing the surface roughness of workpieces to obtain bright and flat surfaces, when the traditional round crystal finish machining polishing device is used, the round crystals are complex in fixing mode and poor in stability, the round crystals are easy to rotate when polished, and meanwhile, the problem that the difficulty of collecting chips generated during the polishing of the round crystals is large is solved.

SUMMERY OF THE UTILITY MODEL

To solve the problems set forth in the background art described above. The utility model provides a silicon wafer finish machining polishing equipment has that the wafer is fixed firm, and the polishing is stable simultaneously, and the convenient characteristics are collected to the piece.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a silicon wafer finish machining polishing equipment, includes the polishing platform, the edge welding of polishing platform has the backup pad, there is the hydraulic cylinder upper end of backup pad through the bolt fastening, the output shaft fixedly connected with polishing motor of hydraulic cylinder, the eccentric throwing aureola of output shaft fixedly connected with of polishing motor, the last skin weld of polishing platform has the sleeve, there is the air pump sleeve inside lower through the bolt fastening, telescopic last fixed surface has the sucking disc, the output and the sucking disc of air pump are connected, the chip groove has been seted up to the inside upper surface of sleeve, the inside last surface adhesion of sleeve has anti-skidding rubber strip.

As the utility model discloses a preferred technical scheme of silicon wafer finish machining polishing equipment, the ash collecting cover is installed to telescopic below, just the upper end of ash collecting cover is installed in telescopic inside and is fixed through magnet.

As the utility model discloses a preferred technical scheme of silicon wafer finish machining polishing equipment, the surface bonding of collection ash cover has the filter screen, the lower extreme of collection ash cover has the fan through the bolt fastening, just the fan is located the filter screen under.

As the utility model discloses a preferred technical scheme of brilliant finish machining polishing equipment of silicon circle, the ash collecting cover is double-barrelled column structure, the inner tube of ash collecting cover cup joints in the outside of air pump, the outer tube of ash collecting cover is located the chip groove under.

As the utility model discloses a preferred technical scheme of brilliant finish machining polishing equipment of silicon circle, the chip groove is fan-shaped structure, the anti-skidding rubber strip is bar structure, just chip groove and anti-skidding rubber strip dislocation are placed.

As the utility model discloses a preferred technical scheme of brilliant finish machining polishing equipment of silicon circle, the sucking disc is the bellows tubular structure, the antiskid groove has been seted up to the upper end integrated into one piece's of sucking disc skirt strip department.

As the utility model discloses a preferred technical scheme of silicon wafer finish machining polishing equipment, eccentric throwing aureola is square platelike structure, just four corners of eccentric throwing aureola all are provided with the chamfer.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the round crystal is placed in the telescopic inside of polishing platform surface through welded fastening when polishing for round crystal and sucking disc contact, the outside exhaust of air pump makes the inside pressure of sucking disc reduce, has increased the stability of round crystal with the sucking disc contact, and the inside pressure of sucking disc reduces the back shrink simultaneously, makes round crystal and the contact of anti-skidding rubber strip, has increased the stability of round crystal installation in sleeve inside, avoids the round crystal to appear rotating when polishing, has improved the stability that the round crystal was polished.

2. The upper end of collection ash cover is passed through magnet and is fixed at the inside upper surface of sleeve, and the lower extreme of collection ash cover passes through the fan of bolt fastening, makes the inside air of sleeve enter into the inside of collection ash cover when the fan rotates, and the air of being convenient for carries the inside that the piece got into collection ash cover, and the inside adhesive filter screen of collection ash cover simultaneously filters the piece through the filter screen and keeps apart, avoids the outside discharge of piece that the brilliant was polished to the circle, has increased the convenience that the piece that the brilliant was polished down was collected.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention.

In the drawings:

fig. 1 is a schematic view of the structure of the present invention;

fig. 2 is a left side view structure diagram of the present invention;

FIG. 3 is a schematic structural view of the sleeve and the dust collecting cover of the present invention;

fig. 4 is a schematic top view of the sleeve according to the present invention;

FIG. 5 is a schematic cross-sectional view of the sucking disc of the present invention;

FIG. 6 is a schematic view of an eccentric polishing wheel according to the present invention;

in the figure: 1. a polishing table; 2. a support plate; 3. a hydraulic cylinder; 4. polishing the motor; 5. an eccentric polishing wheel; 6. a sleeve; 8. an air pump; 9. a suction cup; 10. an anti-slip groove; 11. a chip groove; 12. an anti-slip rubber strip; 13. a dust collecting cover; 14. filtering with a screen; 15. a fan.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Examples

Referring to fig. 1-6, the present invention provides a technical solution: the utility model provides a silicon wafer finish machining polishing equipment, including polishing platform 1, the edge welding of polishing platform 1 has backup pad 2, there is hydraulic cylinder 3 upper end of backup pad 2 through the bolt fastening, hydraulic cylinder 3's output shaft fixedly connected with polishing motor 4, polishing motor 4's output shaft fixedly connected with eccentric polishing wheel 5, polishing platform 1's last surface welding has sleeve 6, there is air pump 8 sleeve 6 inside lower through the bolt fastening, sleeve 6's last fixed surface has sucking disc 9, air pump 8's output and sucking disc 9 are connected, chip groove 11 has been seted up to sleeve 6 inside upper surface, sleeve 6 inside upper surface bonding has anti-skidding rubber strip 12.

In this embodiment, place in the inside through welded fastening at 1 surperficial sleeve 6 of polishing platform during the round crystal is polished, make round crystal and sucking disc 9 contact, air pump 8 is outwards carminative, make the inside pressure of sucking disc 9 reduce, the stability of round crystal and sucking disc 9 contact has been increased, the inside pressure of sucking disc 9 reduces the back shrink simultaneously, make round crystal and the contact of anti-skidding rubber strip 12, the stability of installing at sleeve 6 inside of round crystal has been increased, avoid the round crystal to appear rotating when polishing, the stability of polishing of round crystal has been improved.

Specifically, the dust collection cover 13 is installed below the sleeve 6, the upper end of the dust collection cover 13 is installed inside the sleeve 6 and fixed through a magnet, the filter screen 14 is bonded on the surface of the dust collection cover 13, the fan 15 is fixed to the lower end of the dust collection cover 13 through a bolt, the fan 15 is located right below the filter screen 14, the dust collection cover 13 is of a double-pipe structure, the inner pipe of the dust collection cover 13 is sleeved outside the air pump 8, and the outer pipe of the dust collection cover 13 is located right below the chip discharge groove 11.

In this embodiment, magnet is passed through to the upper end of collection ash cover 13 and is fixed at the inside upper surface of sleeve 6, the lower extreme of collection ash cover 13 passes through the fan 15 of bolt fastening, make the inside air of sleeve 6 enter into the inside of collection ash cover 13 when fan 15 rotates, the inside adhesive filter screen 14 of the inside of collection ash cover 13 simultaneously, filter the isolation through filter screen 14 to the piece, the piece of avoiding the round brilliant polishing outwards discharges, the convenience of the piece collection that the round brilliant was polished down has been increased.

Specifically, the chip groove 11 is of a fan-shaped structure, the anti-skid rubber strip 12 is of a strip-shaped structure, and the chip groove 11 and the anti-skid rubber strip 12 are arranged in a staggered mode.

In this embodiment, through the chip groove 11 that is fan-shaped structure, the collection of the piece under the brilliant polishing of circle of being convenient for, simultaneously be bar-shaped structure's anti-skidding rubber strip 12, chip groove 11 and anti-skidding rubber strip 12 dislocation are placed simultaneously for every anti-skidding rubber strip 12 is perpendicular with the brilliant rotation direction of circle.

Specifically, the suction cup 9 is of a corrugated pipe structure, and the skirt belt integrally formed at the upper end of the suction cup 9 is provided with an anti-slip groove 10.

In this embodiment, the anti-slip groove 10 is provided at the integrally formed skirt at the upper end of the suction cup 9, so that the contact stability between the suction cup 9 and the wafer is improved.

Specifically, the eccentric polishing wheel 5 is of a square plate-shaped structure, and four corners of the eccentric polishing wheel 5 are provided with chamfers.

In this embodiment, through the eccentric aureola 5 that is square plate structure, four corners of eccentric aureola 5 all are provided with the chamfer simultaneously, and the eccentric aureola 5 of being convenient for is polished the brilliant.

The utility model provides a DSBC type that hydraulic cylinder 3 chose for use guangdong fis intelligence science and technology share limited company to produce, the model that burnishing motor 4 chooseed for use Dongguan market shenlong electromechanical limited company to produce is the ESA-10S type, and the model that air pump 8 chooseed for use the production of Shanghai full wind industry limited company is the YX-51D type, and fan 15 chooses for use the model that Shanghai Xiguan five metals electrical apparatus limited company produced to be ACFP-108K type.

The utility model discloses a theory of operation and use flow: during the use, place the brilliant inside at sleeve 6 of circle, the brilliant and the contact of sucking disc 9 of circle this moment, when air pump 8 starts, the inside air of air pump 8 outwards discharges, make the inside air of sucking disc 9 enter into the inside of air pump 8, the upper end and the brilliant contact of circle of sucking disc 9 simultaneously, make the inside atmospheric pressure of sucking disc 9 reduce, sucking disc 9 contracts under the effect of atmospheric pressure, make the brilliant laminating of circle on the surface of anti-skidding rubber strip 12, during the polishing, the output shaft of hydraulic cylinder 3 descends, the output shaft of polishing motor 4 takes eccentric buffing wheel 5 to polish the brilliant, the fan 15 of the installation of the lower extreme of collection ash cover 13 simultaneously, make the inside air of sleeve 6 carry the piece and enter into the inside of collection ash cover 13, the piece that enters into collection ash cover 13 simultaneously passes through filter screen 14 and keeps apart.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A silicon wafer finish machining polishing device comprises a polishing table (1), and is characterized in that: the edge welding of polishing platform (1) has backup pad (2), there is hydraulic cylinder (3) upper end of backup pad (2) through the bolt fastening, the output shaft fixedly connected with polishing motor (4) of hydraulic cylinder (3), the eccentric polishing wheel (5) of output shaft fixedly connected with of polishing motor (4), the last surface welding of polishing platform (1) has sleeve (6), there are air pump (8) through the bolt fastening under sleeve (6) inside, the last fixed surface of sleeve (6) has sucking disc (9), the output and the sucking disc (9) of air pump (8) are connected, chip groove (11) have been seted up to the upper surface of sleeve (6) inside, the last surface bonding of sleeve (6) inside has anti-skidding rubber strip (12).

2. A silicon wafer finishing and polishing apparatus as claimed in claim 1, wherein: the dust collecting cover (13) is installed below the sleeve (6), and the upper end of the dust collecting cover (13) is installed in the sleeve (6) and fixed through a magnet.

3. A silicon wafer finishing and polishing apparatus as claimed in claim 2, wherein: the surface bonding of collection grey cover (13) has filter screen (14), the lower extreme of collection grey cover (13) is fixed with fan (15) through the bolt, just fan (15) are located filter screen (14) under.

4. A silicon wafer finishing and polishing apparatus as claimed in claim 2, wherein: the dust collection cover (13) is of a double-pipe-shaped structure, the inner pipe of the dust collection cover (13) is sleeved outside the air pump (8), and the outer pipe of the dust collection cover (13) is located right below the dust discharge groove (11).

5. A silicon wafer finishing and polishing apparatus as claimed in claim 1, wherein: chip groove (11) are fan-shaped structure, anti-skidding rubber strip (12) are bar structure, just chip groove (11) and anti-skidding rubber strip (12) dislocation are placed.

6. A silicon wafer finishing and polishing apparatus as claimed in claim 1, wherein: the sucker (9) is of a corrugated pipe-shaped structure, and an anti-skid groove (10) is formed in the skirt belt integrally formed at the upper end of the sucker (9).

7. A silicon wafer finishing and polishing apparatus as claimed in claim 1, wherein: the eccentric polishing wheel (5) is of a square plate-shaped structure, and four corners of the eccentric polishing wheel (5) are provided with chamfers.