CN210431878U - Silicon microphone sealing structure and recording pen - Google Patents
Silicon microphone sealing structure and recording pen Download PDFInfo
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- CN210431878U CN210431878U CN201921815018.1U CN201921815018U CN210431878U CN 210431878 U CN210431878 U CN 210431878U CN 201921815018 U CN201921815018 U CN 201921815018U CN 210431878 U CN210431878 U CN 210431878U
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- silicon microphone
- circuit board
- sound transmission
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- microphone
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Abstract
The utility model discloses a silicon microphone sealing structure and a recording pen, wherein the silicon microphone sealing structure comprises a silicon microphone, a circuit board, a shell, a sealing layer and a dust screen, and the silicon microphone is provided with a receiving direction for receiving sound; the circuit board is arranged in the receiving direction of the silicon microphone, and a first sound transmission hole is formed in the circuit board corresponding to the receiving direction of the silicon microphone; the shell is arranged on one side of the circuit board, which is far away from the silicon microphone, and the shell is arranged in a surrounding mode corresponding to the first sound transmission hole to form a microphone hole; the sealing layer is arranged between the circuit board and the shell, and is provided with a second sound transmission hole corresponding to the first sound transmission hole; the dust screen is arranged between the circuit board and the sealing layer, and the dust screen cover is arranged above the first sound transmission hole. The utility model discloses can effectively reduce the in-process of silicon wheat at the encapsulation, inside dust or impurity easily entered into the silicon wheat, guarantee the tone quality performance of silicon wheat.
Description
Technical Field
The utility model relates to a microphone encapsulation technical field especially relates to a silicon microphone seal structure and recording pen.
Background
With the gradual development of artificial intelligence electronic products, many electronic products have more requirements on the design of microphones, and silicon microphones are also called MEMS (micro electro Mechanical Systems) microphones, and the MEMS microphones have stable performance at different temperatures.
However, in the process of packaging the silicon microphone, dust or impurities easily enter the silicon microphone, and the sound quality performance of the silicon microphone is directly affected.
The above is only for the purpose of assisting understanding of the technical solutions of the present application, and does not represent an admission that the above is prior art.
SUMMERY OF THE UTILITY MODEL
Based on this, to the problem that the sound quality performance of the silicon microphone is directly affected by dust or impurities which easily enter the silicon microphone in the packaging process of the silicon microphone, it is necessary to provide a sealing structure and a recording pen for the silicon microphone, which can effectively reduce the possibility that the dust or impurities easily enter the silicon microphone in the packaging process of the silicon microphone, and ensure the sound quality performance of the silicon microphone.
In order to achieve the above object, the present invention provides a silicon microphone sealing structure, including:
a silicon microphone having a receiving direction to receive sound;
the circuit board is arranged in the receiving direction of the silicon microphone, and a first sound transmission hole is formed in the circuit board corresponding to the receiving direction of the silicon microphone;
the shell is arranged on one side, away from the silicon microphone, of the circuit board, and the shell is arranged in a surrounding mode corresponding to the first sound transmission hole to form a microphone hole;
the sealing layer is arranged between the circuit board and the shell, and a second sound transmission hole is formed in the sealing layer corresponding to the first sound transmission hole; and
the dustproof net is arranged between the circuit board and the sealing layer, and the dustproof net cover is arranged above the first sound transmission hole.
Optionally, the upper surface and/or the lower surface of the sealing layer is an adhesive surface.
Optionally, the sealing layer is a double-sided tape.
Optionally, the sealing layer is between 0.2mm and 0.3mm thick.
Optionally, the silicon microphone sealing structure includes a circuit board reinforcement member, the circuit board reinforcement member is disposed between the circuit board and the sealing layer, and the circuit board reinforcement member is provided with a third sound transmission hole corresponding to the first sound transmission hole.
Optionally, the opening area of the third sound transmission hole is larger than the opening area of the first sound transmission hole, and the opening area of the second sound transmission hole is larger than the opening area of the third sound transmission hole.
Optionally, the laying area of the dust screen is larger than the opening area of the second sound transmission hole.
Optionally, the opening area of the microphone hole is smaller than or equal to the opening area of the second sound transmission hole.
Optionally, a supporting layer is disposed on a lower surface of the silicon microphone, and the supporting layer supports and fixes the silicon microphone.
Furthermore, in order to achieve the above object, the present invention also provides a recording pen, the recording pen includes a housing and a silicon microphone sealing structure as described above, the silicon microphone sealing structure being disposed on the housing.
The utility model provides an among the technical scheme, set up the dust screen between the circuit board of silicon wheat and the sealing layer, namely at the in-process of encapsulation silicon wheat, the setting of silicon wheat is at the circuit board lower surface, and the dust screen setting is at the circuit board upper surface, can know from this, and at the in-process that subsequently sets up sealing layer and shell, the dust screen can effectively avoid dust or impurity to fall into silicon wheat inside, guarantees the tone quality performance of silicon wheat.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of a silicon microphone sealing structure according to the present invention;
fig. 2 is a schematic view of a portion of the structure of fig. 1.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 10 | |
41 | Second |
| 20 | |
50 | Dust- |
| 21 | |
60 | Circuit |
| 30 | |
61 | Third |
| 31 | |
70 | Supporting |
| 40 | Sealing layer |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In addition, the technical solutions between the embodiments of the present invention can be combined with each other, but it is necessary to be able to be realized by a person having ordinary skill in the art as a basis, and when the technical solutions are contradictory or cannot be realized, the combination of such technical solutions should be considered to be absent, and is not within the protection scope of the present invention.
Referring to fig. 1, the present invention provides a silicon microphone sealing structure, including: the silicon microphone comprises a silicon microphone 10, a circuit board 20 and a shell 30 which are arranged from bottom to top in sequence, and a sealing layer 40 and a dust screen 50 are arranged between the circuit board 20 and the shell 30.
The silicon microphone 10 has a receiving direction for receiving sound. Generally, the silicon microphone 10 includes an MEMS microphone, and a sound hole (not shown) is formed in a body of the silicon microphone 10, and the sound hole may be formed in an upper surface of the body of the silicon microphone 10, wherein the sound hole may be formed in a middle portion of the upper surface of the body of the silicon microphone 10 or may be formed in a position close to an edge of the upper surface of the body of the silicon microphone 10.
Referring to fig. 2, the circuit board 20 is disposed in the receiving direction of the silicon microphone 10, and the circuit board 20 is provided with a first sound hole 21 corresponding to the receiving direction of the silicon microphone 10. Specifically, the silicon microphone 10 is electrically connected to the circuit board 20, the silicon microphone 10 is welded to the circuit board 20, the circuit board 20 is used for providing power for the silicon microphone 10, the circuit board 20 can be a flexible circuit board, the flexible circuit board can be arranged according to a structural space, and meanwhile, the flexible circuit board is thinner, so that the installation space can be effectively saved, and the sound propagation distance can be reduced. Of course, the circuit board 20 may also be a rigid circuit board. Usually, the first sound transmission hole 21 faces the sound transmission hole formed on the upper surface of the body of the silicon microphone 10, and the opening area of the first sound transmission hole 21 is larger than or equal to the opening area of the sound transmission hole.
The shell 30 is disposed on a side of the circuit board 20 away from the silicon microphone 10, and the shell 30 surrounds the first sound hole 21 to form a microphone hole 31. The casing 30 is usually made of stainless steel or plastic, and the casing 30 protects the silicon microphone 10 and forms a microphone hole 31 for receiving sound, which is transmitted to the silicon microphone 10 through the microphone hole 31.
The sealing layer 40 is arranged between the circuit board 20 and the shell 30, and the sealing layer 40 is provided with a second sound transmission hole 41 corresponding to the first sound transmission hole 21; specifically, the sealing layer 40 is usually made of a soft material, such as silica gel and foam, the sealing layer 40 may also be made of other glues, the sealing layer 40 is used to seal a gap between the circuit board 20 and the housing 30, so as to prevent sound from being transmitted outside and affecting the transmission effect, and meanwhile, under the action of the sealing layer 40, impurities such as dust can be prevented from entering the inside of the silicon microphone 10.
The dust screen 50 is disposed between the circuit board 20 and the sealing layer 40, and the dust screen 50 is disposed over the first sound hole 21. Usually, the dust screen 50 is provided with tiny staggered holes, and under such a situation, the dust screen 50 can ensure that sound normally passes through, and impurities such as dust are intercepted by the dust screen 50, so that the dust is prevented from falling into the silicon wheat 10, and meanwhile, other impurities are prevented from falling into the silicon wheat 10 in the subsequent process of arranging the sealing layer 40 and the shell 50.
In the technical scheme of the embodiment, the dust screen 50 is arranged between the circuit board 20 and the sealing layer 40 of the silicon microphone 10, that is, in the process of packaging the silicon microphone, the silicon microphone 10 is arranged on the lower surface of the circuit board 20, and the dust screen 50 is arranged on the upper surface of the circuit board 20, so that in the subsequent process of arranging the sealing layer 40 and the shell 30, the dust screen 50 can effectively prevent dust or impurities from falling into the silicon microphone 10, and the tone quality performance of the silicon microphone 10 is ensured.
In one embodiment, the upper and/or lower surfaces of the sealing layer 40 are adhesive surfaces. Specifically, the upper surface of the sealing layer 40 is an adhesive surface, or the lower surface of the sealing layer 40 is an adhesive surface, or both the upper surface and the lower surface of the sealing layer 40 are adhesive surfaces, and the sealing effect can be improved by the manner in which the sealing layer 40 is adhered. In addition, the double-sided adhesive tape model comprises 3M VHB4914, has good sealing performance and stability, and can effectively seal a gap between the circuit board 20 and the shell 50.
In one embodiment, the sealing layer 40 is a double sided tape. Specifically, the circuit board 20 and the case 50 can be effectively pasted together by the double-sided tape. Meanwhile, in the process of attaching the circuit board 20 and the housing 50, a certain pressure is applied to the circuit board 20 and the housing 50, and the double-sided tape itself is deformed by being pressed, so that the double-sided tape is more firmly contacted with the circuit board 20 and the housing 50, respectively.
In one embodiment, the sealing layer 40 is between 0.2mm and 0.3mm thick. For example, the thickness of the sealing layer 40 is 0.2mm, which further reduces the overall thickness of the sealing layer 40, facilitating reduction of the sound pickup distance. The sealing layer 40 may also be 0.3mm thick, which effectively isolates the circuit board 20 from the housing 50, prevents the circuit board 20 from directly contacting the housing 50, and effectively seals the circuit board 20 from the housing 50. In addition, the thickness of the sealing layer 40 can be 0.275mm, and under the squeezing action of the two sides of the circuit board 20 and the shell 50, the thickness of the sealing layer 40 is reduced from 0.275mm to 0.25mm, so that the sealing layer 40 can effectively seal the gap between the circuit board 20 and the shell 50 under the condition that a short sound pickup distance can be ensured.
In one embodiment, the silicon microphone sealing structure includes a circuit board reinforcing member 60, the circuit board reinforcing member 60 is disposed between the circuit board 20 and the sealing layer 40, and the circuit board reinforcing member 60 has a third sound hole 61 corresponding to the first sound hole 21. Specifically, the circuit board reinforcement member 60 is plate-shaped, the circuit board 20 is disposed on the lower surface of the circuit board reinforcement member 60, and the circuit board 20 can be well spread by the supporting function of the circuit board reinforcement member 60, generally, the circuit board reinforcement member 60 is made of stainless steel.
In one of the embodiments, the opening area of the third sound-transmitting hole 61 is larger than the opening area of the first sound-transmitting hole 21, and the opening area of the second sound-transmitting hole 41 is larger than the opening area of the third sound-transmitting hole 61. Therefore, the first sound transmission hole 21, the third sound transmission hole 61 and the second sound transmission hole 41 are sequentially arranged from bottom to top, and the opening areas of the three sound transmission holes are sequentially increased from bottom to top, so that the sound transmission is gradually concentrated, the sound outward expansion is reduced, and the sound transmission effect is prevented from being influenced by the formation of echoes.
In one embodiment, the dust-proof net 50 has a larger laying area than the opening area of the second sound-transmitting hole 41. Specifically, the laying area of the dust-proof net 50 is larger than the opening area of the third sound-transmitting holes 61, that is, the dust-proof net 50 can effectively cover the opening positions of the second sound-transmitting holes 41 and the third sound-transmitting holes 61. The sealing layer 40 effectively fixes both ends of the dust-proof net 50, for example, the sealing layer 40 fixes both ends of the dust-proof net 50 by adhering, so that it stably covers the third sound transmission hole 61.
In one embodiment, the opening area of the microphone hole 31 is equal to or smaller than the opening area of the second sound transmission hole 41. Generally, the sealing layer 40 is white, if the opening area of the microphone hole 31 is larger than the opening area of the second sound transmission hole 41, the sealing layer 40 is visually observed through the microphone hole 31 by human eyes, which results in poor appearance, and the sealing layer 40 generally has certain viscosity, which causes dust to stick on the sealing layer 40, while the opening area of the microphone hole 31 is smaller than or equal to the opening area of the second sound transmission hole 41, so that the sealing layer 40 cannot be observed by human eyes, and the overall neatness effect of the product is improved.
In one embodiment, the lower surface of the silicon microphone 10 is provided with a supporting layer 70, and the supporting layer 70 supports and fixes the silicon microphone 10. Specifically, the supporting layer 70 includes silicon gel or foam, the supporting layer 70 is used to support and fix the silicon microphone 10, and meanwhile, the supporting layer 70 is soft in texture, so that the silicon microphone 10 can be effectively protected, and the silicon microphone 10 is prevented from being damaged in the packaging process.
The utility model also provides a recording pen, recording pen include the casing and the silicon microphone seal structure, and silicon microphone seal structure sets up on the casing. The silicon microphone sealing structure includes: the silicon microphone comprises a silicon microphone 10, a circuit board 20 and a shell 30 which are arranged from bottom to top in sequence, and a sealing layer 40 and a dust screen 50 are arranged between the circuit board 20 and the shell 30.
The silicon microphone 10 has a receiving direction for receiving sound. Generally, the silicon microphone 10 includes an MEMS microphone, and a sound hole (not shown) is formed in a body of the silicon microphone 10, and the sound hole may be formed in an upper surface of the body of the silicon microphone 10, wherein the sound hole may be formed in a middle portion of the upper surface of the body of the silicon microphone 10 or may be formed in a position close to an edge of the upper surface of the body of the silicon microphone 10.
The circuit board 20 is disposed in the receiving direction of the silicon microphone 10, and the circuit board 20 has a first sound hole 21 corresponding to the receiving direction of the silicon microphone 10. Specifically, the silicon microphone 10 is electrically connected to the circuit board 20, the silicon microphone 10 is welded to the circuit board 20, the circuit board 20 is used for providing power for the silicon microphone 10, the circuit board 20 can be a flexible circuit board, the flexible circuit board can be arranged according to a structural space, and meanwhile, the flexible circuit board is thinner, so that the installation space can be effectively saved, and the sound propagation distance can be reduced. Of course, the circuit board 20 may also be a rigid circuit board. Usually, the first sound transmission hole 21 faces the sound transmission hole formed on the upper surface of the body of the silicon microphone 10, and the opening area of the first sound transmission hole 21 is larger than or equal to the opening area of the sound transmission hole.
The shell 30 is disposed on a side of the circuit board 20 away from the silicon microphone 10, and the shell 30 surrounds the first sound hole 21 to form a microphone hole 31. The casing 30 is usually made of stainless steel or plastic, and the casing 30 protects the silicon microphone 10 and forms a microphone hole 31 for receiving sound, which is transmitted to the silicon microphone 10 through the microphone hole 31.
The sealing layer 40 is arranged between the circuit board 20 and the shell 30, and the sealing layer 40 is provided with a second sound transmission hole 41 corresponding to the first sound transmission hole 21; specifically, the sealing layer 40 is usually made of a soft material, such as silica gel and foam, the sealing layer 40 may also be made of other glues, the sealing layer 40 is used to seal a gap between the circuit board 20 and the housing 30, so as to prevent sound from being transmitted outside and affecting the transmission effect, and meanwhile, under the action of the sealing layer 40, impurities such as dust can be prevented from entering the inside of the silicon microphone 10.
The dust screen 50 is disposed between the circuit board 20 and the sealing layer 40, and the dust screen 50 is disposed over the first sound hole 21. Usually, the dust screen 50 is provided with tiny staggered holes, and under such a situation, the dust screen 50 can ensure that sound normally passes through, and impurities such as dust are intercepted by the dust screen 50, so that the dust is prevented from falling into the silicon wheat 10, and meanwhile, other impurities are prevented from falling into the silicon wheat 10 in the subsequent process of arranging the sealing layer 40 and the shell 50.
In the technical scheme of the embodiment, the dust screen 50 is arranged between the circuit board 20 and the sealing layer 40 of the silicon microphone 10, that is, in the process of packaging the silicon microphone, the silicon microphone 10 is arranged on the lower surface of the circuit board 20, and the dust screen 50 is arranged on the upper surface of the circuit board 20, so that in the subsequent process of arranging the sealing layer 40 and the shell 30, the dust screen 50 can effectively prevent dust or impurities from falling into the silicon microphone 10, and the tone quality performance of the silicon microphone 10 is ensured.
The above is only the preferred embodiment of the present invention, and the patent scope of the present invention is not limited thereby, all the equivalent structure changes made by the contents of the specification and the drawings are utilized under the inventive concept of the present invention, or the direct/indirect application in other related technical fields is included in the patent protection scope of the present invention.
Claims (10)
1. A silicon microphone sealing structure, comprising:
a silicon microphone having a receiving direction to receive sound;
the circuit board is arranged in the receiving direction of the silicon microphone, and a first sound transmission hole is formed in the circuit board corresponding to the receiving direction of the silicon microphone;
the shell is arranged on one side, away from the silicon microphone, of the circuit board, and the shell is arranged in a surrounding mode corresponding to the first sound transmission hole to form a microphone hole;
the sealing layer is arranged between the circuit board and the shell, and a second sound transmission hole is formed in the sealing layer corresponding to the first sound transmission hole; and
the dustproof net is arranged between the circuit board and the sealing layer, and the dustproof net cover is arranged above the first sound transmission hole.
2. A silicon microphone sealing structure as claimed in claim 1 wherein the upper and/or lower surface of the sealing layer is adhesive.
3. A silicon microphone sealing arrangement as claimed in claim 1 wherein the sealing layer is double sided tape.
4. A silicon microphone sealing structure as claimed in claim 3 wherein the sealing layer is between 0.2mm and 0.3mm thick.
5. A silicon microphone sealing structure as claimed in any one of claims 1 to 4 wherein the silicon microphone sealing structure includes a circuit board reinforcement member disposed between the circuit board and the sealing layer, the circuit board reinforcement member having a third sound transmission hole corresponding to the first sound transmission hole.
6. A silicon microphone sealing structure as claimed in claim 5 wherein the third sound transmission aperture has an open area greater than that of the first sound transmission aperture and the second sound transmission aperture has an open area greater than that of the third sound transmission aperture.
7. A silicon microphone sealing structure as claimed in claim 6 wherein the dust-proof mesh is laid over an area larger than an opening area of the second sound-transmitting hole.
8. A silicon microphone sealing structure as claimed in claim 5 wherein the microphone aperture has an open area equal to or less than the open area of the second sound transmission aperture.
9. A silicon microphone sealing structure as claimed in claim 1 wherein the lower surface of the silicon microphone is provided with a supporting layer which supports and fixes the silicon microphone.
10. A stylus comprising a housing and a silicon microphone sealing structure as claimed in any one of claims 1 to 9, the silicon microphone sealing structure being provided on the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921815018.1U CN210431878U (en) | 2019-10-25 | 2019-10-25 | Silicon microphone sealing structure and recording pen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921815018.1U CN210431878U (en) | 2019-10-25 | 2019-10-25 | Silicon microphone sealing structure and recording pen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210431878U true CN210431878U (en) | 2020-04-28 |
Family
ID=70368890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921815018.1U Active CN210431878U (en) | 2019-10-25 | 2019-10-25 | Silicon microphone sealing structure and recording pen |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210431878U (en) |
-
2019
- 2019-10-25 CN CN201921815018.1U patent/CN210431878U/en active Active
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