CN210428056U

CN210428056U - Double-shaft array reflection type MEMS chip and lighting system

Info

Publication number: CN210428056U
Application number: CN201921777150.8U
Authority: CN
Inventors: 郭田忠; 戈斌; 朱明华
Original assignee: HASCO Vision Technology Co Ltd
Current assignee: HASCO Vision Technology Co Ltd
Priority date: 2019-10-22
Filing date: 2019-10-22
Publication date: 2020-04-28
Anticipated expiration: 2029-10-22

Abstract

The utility model relates to an intelligence lighting technology field especially relates to a biax array reflective MEMS chip and a lighting system including this biax array reflective MEMS chip. The double-shaft array reflection type MEMS chip comprises a plurality of MEMS micro-mirrors and a plurality of MEMS micro-mirror driving circuits, wherein the MEMS micro-mirrors are distributed in an array mode, the MEMS micro-mirrors reflect projected light, and the MEMS micro-mirror driving circuits are connected with the MEMS micro-mirrors in a one-to-one correspondence mode and drive each MEMS micro-mirror to rotate around a transverse axis or a longitudinal axis, perpendicular to the projected light, of the MEMS micro-mirror. Every MEMS micro-mirror all can realize the biax rotation under corresponding MEMS micro-mirror drive circuit's drive, can change the mirror surface direction of each MEMS micro-mirror from this, the light that sends by the light source throws on MEMS micro-mirror array and jets out after MEMS micro-mirror array reflection, forms the illumination light type, through the mirror surface direction that changes each MEMS micro-mirror, can change the height about or the position of controlling of illumination light type to realize adjusting light function about and adjusting light.

Description

Double-shaft array reflection type MEMS chip and lighting system

Technical Field

The utility model relates to an intelligence lighting technology field especially relates to a biax array reflective MEMS chip and a lighting system including this biax array reflective MEMS chip.

Background

At present, smart lighting has been developed towards high pixelation, wherein superior ones are DLP (digital light Processing) headlamps. The DLP headlamp uses a DMD (Digital Micromirror Device) chip as a key execution component, and performs pixelized illumination in a reflection manner, so as to realize high-pixelized intelligent illumination. The DMD chip is an MEMS micro-mirror array chip, and the working principle is as follows: when the micro-mirror does not receive the working signal, the micro-mirror stays at the non-projection position and is in an off state; when the micro-mirror receives the working signal, the chip deflects to the working position and is in an 'on' state. That is, the DMD chip has only two working positions of "on" and "off", and is a single axis motion MEMS micromirror array chip. Although DLP headlamps can realize high-pixel illumination due to the limitation of the operating mode of the DMD chip and the limitation of the projection field angle, they cannot realize the functions of vertical dimming and AFS (Adaptive Front-Lighting System) dimming (horizontal dimming) in the vehicle lamp illumination.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is to provide a biax array reflective MEMS chip that can realize down dimming about and dimming function and the lighting system including this biax array reflective MEMS chip to overcome prior art's above-mentioned defect.

In order to solve the technical problem, the utility model discloses a following technical scheme:

a double-shaft array reflection type MEMS chip comprises a plurality of MEMS micro-mirrors and a plurality of MEMS micro-mirror driving circuits, wherein the MEMS micro-mirrors are distributed in an array mode, the MEMS micro-mirrors reflect projected light, and the MEMS micro-mirror driving circuits are connected with the MEMS micro-mirrors in a one-to-one correspondence mode and drive each MEMS micro-mirror to rotate around a transverse axis or a longitudinal axis, perpendicular to the projected light, of the MEMS micro-mirror.

Preferably, the MEMS micro-mirror array further comprises a supporting frame, the MEMS micro-mirrors are rotatably arranged on the supporting frame around the transverse axis and the longitudinal axis, and the plurality of MEMS micro-mirrors are distributed on the supporting frame in an array manner.

Preferably, the MEMS micromirrors are rotatably mounted on the MEMS micromirror base about a lateral axis and a longitudinal axis, and a plurality of MEMS micromirrors are attached to the same substrate in an array manner through the MEMS micromirror base.

Preferably, there is a spacing between adjacent MEMS micromirrors.

Preferably, the driving manner of the MEMS micro-mirror driving circuit driving the MEMS micro-mirror to rotate is any one or a combination of more of electromagnetic type, electrostatic type, piezoelectric type and electrothermal type.

A lighting system comprises a light source and the biaxial array reflective MEMS chip, wherein light rays emitted by the light source are projected on the MEMS micro-mirror and are emitted after being reflected by the MEMS micro-mirror.

Preferably, the light source is a halogen light source or a xenon light source or an LED light source or a laser light source.

Compared with the prior art, the utility model discloses the progress that has showing:

(1) the utility model provides an every MEMS micro-mirror all can rotate around this MEMS micro-mirror and projection light looks vertically horizontal axis or this MEMS micro-mirror and projection light looks vertically longitudinal axis under corresponding MEMS micro-mirror drive circuit's drive, and every MEMS micro-mirror can all realize the biax under corresponding MEMS micro-mirror drive circuit's drive promptly and rotate, can change each MEMS micro-mirror's mirror surface direction from this. Light rays emitted by the light source are projected on the MEMS micro-mirror array and are emitted after being reflected by the MEMS micro-mirror array to form an illumination light type, and the up-down height or the left-right position of the illumination light type can be changed by changing the mirror surface direction of each MEMS micro-mirror, so that the up-down dimming and the left-right dimming functions are realized.

(2) In the prior art, a lighting type projection picture formed by a DLP headlamp has black lines due to pixel pitches. The utility model discloses in, but because biax pivoted MEMS micro-mirror can fill the non-reflection region between the pixel through scanning about from top to bottom to avoid the black line that similar DLP projection system can appear because micro-mirror pixel interval leads to.

(3) The utility model discloses in, MEMS micro-mirror's mirror surface shape can adopt arbitrary shape as required, and illumination pixel's shape not only can be MEMS micro-mirror's mirror surface shape, also can be through the scanning of each MEMS micro-mirror, realizes that arbitrary pixel scans is arbitrary shape.

(4) The utility model discloses in, because every MEMS micro mirror pixel all can scan, consequently can use the MEMS micro mirror of less quantity to realize high pixel resolution, the reduction of MEMS micro mirror quantity has important meaning to reducing lighting system cost, because less MEMS micro mirror array quantity means less processing degree of difficulty to can increase chip processing yield, be favorable to improving lighting system's price/performance ratio.

(5) Compare the scheme of single micro mirror scanning, under the prerequisite of the same angle of field, the utility model discloses a scheme that biax MEMS micro mirror array scanned has higher resolution ratio, frame rate and luminance.

Drawings

Fig. 1 is a schematic diagram illustrating a dual-axis array reflective MEMS chip according to a first embodiment of the present invention deflecting around one side of a transverse axis.

Fig. 2 is a schematic diagram of a dual-axis array reflective MEMS chip according to a first embodiment of the present invention deflecting around the other side of the lateral axis.

Fig. 3 is a schematic diagram illustrating the deflection of the dual-axis array reflective MEMS chip around one side of the longitudinal axis according to the first embodiment of the present invention.

Fig. 4 is a schematic diagram illustrating the deflection of the dual-axis array reflective MEMS chip around the other side of the longitudinal axis according to the first embodiment of the present invention.

Fig. 5 is a schematic structural diagram of a single MEMS micromirror in a dual-axis array reflective MEMS chip according to a second embodiment of the present invention.

Fig. 6 is a schematic structural diagram of a two-axis array reflective MEMS chip according to a second embodiment of the present invention.

Fig. 7 is a schematic diagram of the dual-axis array reflective MEMS chip according to an embodiment of the present invention for implementing an up-down dimming function.

Fig. 8 is a schematic diagram of the dual-axis array reflective MEMS chip according to an embodiment of the present invention for implementing left and right dimming functions.

Fig. 9 is a schematic projection diagram of an illumination pattern formed by a prior art DLP headlamp.

Fig. 10 is a schematic projection diagram of an illumination pattern formed by a two-axis array reflective MEMS chip according to an embodiment of the present invention.

Fig. 11 is a schematic diagram of a biaxial array reflective MEMS chip according to an embodiment of the present invention, in which each pixel can be scanned to have an arbitrary shape.

Fig. 12 is a schematic diagram of a dual-axis array reflective MEMS chip according to an embodiment of the present invention, which realizes high pixel projection with a small number of MEMS micro mirrors.

Wherein the reference numerals are as follows:

1. double-shaft array reflection type MEMS chip 11 and MEMS micro-mirror

12. Support frame 13 and MEMS micro-mirror seat

14. Substrate 2 and light source

3. Black line 4, cut-off line

Detailed Description

The following describes the present invention in further detail with reference to the accompanying drawings. These embodiments are provided only for illustrating the present invention and are not intended to limit the present invention.

In the description of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.

It should be noted that a MEMS (Micro-Electro-Mechanical System) is a controllable Micro-Mechanical structure System made of semiconductor material or other materials suitable for Micro-machining, and the basic principle of a MEMS Micro-mirror is to rotate or translate a movable Micro-mirror surface through the action of static electricity (or electromagnetism, or piezoelectricity, or electrothermal).

As shown in fig. 1 to 12, the present invention relates to a two-axis array reflective MEMS chip 1.

Referring to fig. 1 to 6, the biaxial array reflective MEMS chip 1 of the present embodiment includes a plurality of MEMS micromirrors 11 and a plurality of MEMS micromirror driving circuits (not shown). The MEMS micro-mirrors 11 reflect the projected light, and the plurality of MEMS micro-mirrors 11 are distributed in an array to form a MEMS micro-mirror array, which includes a plurality of rows and columns of MEMS micro-mirrors 11. The MEMS micromirror driving circuits are connected to the MEMS micromirrors 11 in a one-to-one manner and drive each MEMS micromirror 11 to rotate independently, i.e. each MEMS micromirror 11 can be controlled independently by the MEMS micromirror driving circuit, and each MEMS micromirror 11 can rotate around a transverse axis of the MEMS micromirror 11 perpendicular to the projection light or a longitudinal axis of the MEMS micromirror 11 perpendicular to the projection light under the driving of the corresponding MEMS micromirror driving circuit, i.e. each MEMS micromirror 11 can rotate in two axes under the driving of the corresponding MEMS micromirror driving circuit, thereby changing the mirror direction of each MEMS micromirror 11. Light that is sent by light source 2 throws on MEMS micro mirror array and jets out after MEMS micro mirror array reflection, forms the illumination light type, through the mirror surface direction that changes each MEMS micro mirror 11, can change the height about or position about the illumination light type to realize adjusting luminance about and adjusting luminance the function.

Referring to fig. 1, 2 and 7, a transverse axis of each MEMS micromirror 11 perpendicular to the projected light is a transverse axis parallel to a transverse axis X of the MEMS micromirror array in a plane of the MEMS micromirror array, and each MEMS micromirror 11 in the same row of the MEMS micromirror array coincides with the transverse axis perpendicular to the projected light. All the MEMS micromirrors 11 are deflected by the same angle around the transverse axis of the MEMS micromirrors 11 perpendicular to the projection light, so that the whole illumination light pattern can be moved up or down, and the up-and-down height adjustment of the illumination light pattern can be realized.

Referring to fig. 3, 4 and 8, a longitudinal axis of each MEMS micro-mirror 11 perpendicular to the projection light is a longitudinal axis parallel to a longitudinal axis Y of the MEMS micro-mirror array on a plane of the MEMS micro-mirror array, the longitudinal axis Y of the MEMS micro-mirror array is perpendicular to a transverse axis X of the MEMS micro-mirror array, and each MEMS micro-mirror 11 in the same column of the MEMS micro-mirror array coincides with the longitudinal axis perpendicular to the projection light. All the MEMS micromirrors 11 are deflected by the same angle around the longitudinal axis of the MEMS micromirrors 11 perpendicular to the projection light, so that the whole illumination light pattern can be moved left and right, and the left and right position adjustment of the illumination light pattern can be realized.

The double-shaft array reflection type MEMS chip 1 of the embodiment is utilized to realize the functions of up-down dimming and left-right dimming, no additional electromechanical transmission mechanism is needed, and the whole structure of the illumination system can be effectively simplified.

In this embodiment, the MEMS micro-mirror driving circuit can drive the rotation of the single MEMS micro-mirror 11 by providing a driving voltage or a driving current to the single MEMS micro-mirror 11 corresponding thereto. The driving voltage or the driving current provided to the MEMS micro-mirror 11 by the MEMS micro-mirror driving circuit to drive the MEMS micro-mirror 11 to rotate can be realized by those skilled in the art according to the prior art, and is not described herein in detail. In this embodiment, the driving manner of the MEMS micro-mirror driving circuit driving the MEMS micro-mirror 11 to rotate may be any one or a combination of electromagnetic, electrostatic, piezoelectric and electrothermal.

Referring to fig. 1 to 4, in the first embodiment, the biaxial array reflective MEMS chip 1 of the present embodiment may further include a supporting frame 12, the MEMS micro-mirror 11 is rotatably disposed on the supporting frame 12, and the MEMS micro-mirror 11 may rotate on the supporting frame 12 around a transverse axis of the MEMS micro-mirror 11 perpendicular to the projection light, or may rotate around a longitudinal axis of the MEMS micro-mirror 11 perpendicular to the projection light. The MEMS micromirrors 11 are distributed in an array on the supporting frame 12 to form a MEMS micromirror array, and the supporting frame 12, the MEMS micromirror array, and the MEMS micromirror driving circuit connected to each MEMS micromirror 11 in the MEMS micromirror array together form a chip.

Referring to fig. 5 and 6, in a second embodiment, the biaxial array reflective MEMS chip 1 of the present embodiment is formed by an array arrangement of a plurality of biaxial rotation micromirror chips. Specifically, each MEMS micro-mirror 11 is disposed on a MEMS micro-mirror base 13, and the MEMS micro-mirror 11 can rotate on the MEMS micro-mirror base 13 around a transverse axis of the MEMS micro-mirror 11 perpendicular to the projection light, or rotate around a longitudinal axis of the MEMS micro-mirror 11 perpendicular to the projection light, and a single MEMS micro-mirror 11, the corresponding MEMS micro-mirror base 13, and the MEMS micro-mirror driving circuit constitute a biaxial rotation micro-mirror chip. The MEMS micromirrors 11 are attached to the same substrate 14 in an array manner through the MEMS micromirror base 13, thereby forming the dual-axis array reflective MEMS chip 1 of the present embodiment. The substrate 14 may be a package board or a wiring board.

In the biaxial array reflective MEMS chip 1 of the present embodiment, a single MEMS micro-mirror 11 forms an illumination pixel and corresponds to an illumination area, and pixelized intelligent illumination is realized by the MEMS micro-mirror array. When the mirror surface filling rate of the MEMS micro-mirror 11 is not high and the pitch of the MEMS micro-mirror array is too large, the gap between the pixels can be filled by high frequency scanning of a single MEMS micro-mirror 11, so as to ensure the continuity and uniformity of the illumination area, therefore, in the biaxial array reflective MEMS chip 1 of the present embodiment, the adjacent MEMS micro-mirrors 11 of the MEMS micro-mirror array may have a pitch.

Referring to fig. 9, in the conventional DLP headlamp, a black line 3 exists in a projection screen of an illumination type due to a pixel pitch. Referring to fig. 10, the projection picture of the illumination light type formed by the biaxial array reflective MEMS chip 1 of the present embodiment does not have black lines 3 due to the pixel pitch, because the MEMS micro-mirror 11 capable of biaxial rotation can fill the non-reflective area between pixels by up-down, left-right scanning, thereby avoiding the black lines 3 due to the pixel pitch of the micro-mirror, which would occur in a DLP projection system.

In the biaxial array reflective MEMS chip 1 of the present embodiment, the MEMS micro-mirror array can be expanded by any multiple pixels as required, and the application is very flexible. The mirror surface shape of the MEMS micro-mirror 11 can be any shape as required, and the shape of the illumination pixel can be not only the mirror surface shape of the MEMS micro-mirror 11, but also any pixel can be scanned to any shape by scanning of each MEMS micro-mirror 11. Referring to fig. 11, a schematic diagram showing the shape of the cut-off line 4 formed by the pixel scanning of each MEMS micro-mirror 11 of the biaxial array reflective MEMS chip 1 of the present embodiment is shown, it should be noted that a rectangular frame in fig. 11 indicates a scanning area corresponding to each MEMS micro-mirror 11 pixel, instead of the black line 3 existing in the projection screen shown in fig. 9, a hatched area filled with oblique lines in fig. 11 is a lighting area, and it can be seen that the whole cut-off line 4 portion is a special pixel outline.

In the biaxial array reflective MEMS chip 1 of the present embodiment, since each MEMS micromirror 11 pixel can be scanned, a high pixel resolution can be achieved by using a small number of MEMS micromirrors 11. For example, referring to fig. 12, assuming that the scanning resolution of each MEMS micro-mirror 11 is 4K, if 4 MEMS micro-mirrors 11 are used, the final resolution is 16K by using a 2 × 2 array. Therefore, the biaxial array reflective MEMS chip 1 of the present embodiment can use a small number of MEMS micromirrors 11 to achieve high pixel resolution, and the reduction of the number of MEMS micromirrors 11 is significant to reduce the cost of the illumination system, because the small number of MEMS micromirrors means a small processing difficulty, and the yield of the chip processing can be increased, which is beneficial to improving the cost performance of the illumination system. It should be noted that the rectangular frame in the projection screen in fig. 12 indicates the scanning area corresponding to each pixel of the MEMS micro-mirror 11, instead of the black line 3 existing in the projection screen in fig. 9, the dashed line in fig. 12 indicates the scanning path of the single MEMS micro-mirror 11, and fig. 12 shows the progressive scanning mode, and in practical applications, other scanning modes, such as lissajous scanning, proper scanning, etc., may also be adopted. In addition, compared with the single-micromirror scanning scheme, the scheme of the present embodiment using MEMS micromirror array scanning has higher resolution, frame rate and brightness under the premise of the same field angle.

Based on above-mentioned biax array reflective MEMS chip 1, the embodiment of the utility model provides a lighting system is still provided. The illumination system of the present embodiment includes a light source 2 and the two-axis array reflective MEMS chip 1 of the present embodiment, and light emitted from the light source 2 is projected onto the MEMS micro-mirror 11 and reflected by the MEMS micro-mirror 11 to be emitted.

In the illumination system of the present embodiment, the light source 2 may be a halogen light source, a xenon light source, an LED light source, or a laser light source.

The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and replacements can be made without departing from the technical principle of the present invention, and these modifications and replacements should also be regarded as the protection scope of the present invention.

Claims

1. The double-shaft array reflection type MEMS chip is characterized by comprising a plurality of MEMS micro-mirrors (11) distributed in an array mode and a plurality of MEMS micro-mirror driving circuits, wherein the MEMS micro-mirrors (11) reflect projected light, the MEMS micro-mirror driving circuits are connected with the MEMS micro-mirrors (11) in a one-to-one correspondence mode and drive each MEMS micro-mirror (11) to rotate around a transverse axis or a longitudinal axis of the MEMS micro-mirror (11) perpendicular to the projected light.

2. The dual-axis array reflective MEMS chip of claim 1, further comprising a support frame (12), wherein said MEMS micro-mirrors (11) are rotatably disposed on said support frame (12) about said transverse axis and said longitudinal axis, and wherein said plurality of MEMS micro-mirrors (11) are distributed in an array on said support frame (12).

3. The dual-axis array reflective MEMS chip of claim 1, wherein the MEMS micromirrors (11) are rotatably mounted on the MEMS micromirror base (13) around the transverse axis and the longitudinal axis, and the MEMS micromirrors (11) are array-mounted on the same substrate (14) through the MEMS micromirror base (13).

4. The biaxial array reflective MEMS chip as claimed in claim 1, wherein adjacent MEMS micro mirrors (11) have a pitch therebetween.

5. The dual-axis array reflective MEMS chip of claim 1, wherein the MEMS micromirror driving circuit drives the MEMS micromirror (11) to rotate in any one or a combination of electromagnetic, electrostatic, piezoelectric and electrothermal modes.

6. An illumination system, comprising a light source (2) and the two-axis array reflective MEMS chip of any one of claims 1 to 5, wherein light emitted from the light source (2) is projected onto the MEMS micro-mirror (11) and reflected by the MEMS micro-mirror (11) and then emitted.

7. The illumination system according to claim 6, wherein the light source (2) is a halogen light source or a xenon light source or an LED light source or a laser light source.