CN210426787U - Temperature monitoring device for fungus cultivation - Google Patents
Temperature monitoring device for fungus cultivation Download PDFInfo
- Publication number
- CN210426787U CN210426787U CN201921208279.7U CN201921208279U CN210426787U CN 210426787 U CN210426787 U CN 210426787U CN 201921208279 U CN201921208279 U CN 201921208279U CN 210426787 U CN210426787 U CN 210426787U
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- Prior art keywords
- curb plate
- activity
- heat dissipation
- fixed
- installation
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- 241000233866 Fungi Species 0.000 title claims abstract description 23
- 238000012806 monitoring device Methods 0.000 title claims abstract description 17
- 230000000694 effects Effects 0.000 claims abstract description 41
- 238000009434 installation Methods 0.000 claims abstract description 32
- 230000017525 heat dissipation Effects 0.000 claims abstract description 29
- 230000007246 mechanism Effects 0.000 claims abstract description 23
- 230000003139 buffering effect Effects 0.000 claims abstract description 14
- 230000006835 compression Effects 0.000 claims description 13
- 238000007906 compression Methods 0.000 claims description 13
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
- 239000000428 dust Substances 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 241000209140 Triticum Species 0.000 description 1
- 235000021307 Triticum Nutrition 0.000 description 1
- 240000008042 Zea mays Species 0.000 description 1
- 235000005824 Zea mays ssp. parviglumis Nutrition 0.000 description 1
- 235000002017 Zea mays subsp mays Nutrition 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 235000005822 corn Nutrition 0.000 description 1
- 238000012364 cultivation method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 235000021190 leftovers Nutrition 0.000 description 1
- 235000013372 meat Nutrition 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000010902 straw Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Apparatus Associated With Microorganisms And Enzymes (AREA)
Abstract
The utility model discloses a temperature monitoring device for fungus cultivation, including the device main part, the device main part includes front end, backshell and two movable heat dissipation mechanisms that relatively distribute, the backshell is fixed at the front end rear surface, the front end front surface embedding is installed the display screen, the backshell side is provided with the breach, the detachable installation of activity heat dissipation mechanism is in the backshell left and right sides, and the activity heat dissipation mechanism includes installation curb plate, activity curb plate, buffer assembly and fixed subassembly, and installation curb plate and activity curb plate tip cross-section are "L" type, and the two mutually support and form the rectangle, and installation curb plate and activity curb plate tip pass through buffer assembly swing joint; the utility model discloses be provided with movable heat dissipation mechanism, both be convenient for install and dismantle, the convenient louvre to on the activity curb plate is cleared up, does benefit to the heat dissipation, is convenient for take off again and overhauls the main part is inside, and when receiving external impact force or inside impact force, plays the buffering and unloads the power effect.
Description
Technical Field
The utility model belongs to the technical field of fungus class temperature monitoring, concretely relates to temperature monitoring device is used in fungus class cultivation is a temperature monitor very much.
Background
The fungi are a general term of edible macrofungi, and particularly refer to edible or medicinal fungi which can form fruiting bodies or dredging river tissues with colloid or meat quality in macrofungi. At present, more than 10 tens of thousands of known fungi exist, the types of the edible fungi are more, the cultivation is less, the development capacity is high, agricultural and sideline product leftovers such as wheat straws, sawdust and corn stalks of cultivation raw materials exist all over the country, the cultivation method is suitable for the growth of various edible fungi, the popularization and the development are convenient, the fungus cultivation needs a proper growth environment, and a corresponding temperature monitoring device is needed to control the environmental temperature for the fungus growth in the fungus cultivation.
Current temperature monitoring device self work can produce more heat, consequently can set up the thermovent usually, but the thermovent is usually all fixed with whole device, uses for a long time, and the thermovent is piled up the dust easily and is influenced the heat dissipation, perhaps installs inside problem, and inconvenient dismantlement is to the inside problem of overhauing, for this we propose a temperature monitoring device for fungus cultivation.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a temperature monitoring device is used in fungus class cultivation to the temperature monitoring device self work of proposing in solving above-mentioned background art can produce more heat, consequently can set up the thermovent usually, but the thermovent is usually fixed with whole device, uses for a long time, and the thermovent is piled up the dust easily and is influenced the heat dissipation, perhaps installs inside problem, and inconvenient dismantlement is to the inside problem of overhauing.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a temperature monitoring device for cultivation of fungus, includes the device main part, the device main part includes front end, backshell and two relative distribution's activity heat dissipation mechanism, the backshell is fixed front end rear surface, the display screen is installed in the embedding of front end front surface, the backshell side is provided with the breach, activity heat dissipation mechanism is detachable installs side about the backshell, just activity heat dissipation mechanism is including installation curb plate, activity curb plate, buffering subassembly and fixed subassembly, installation curb plate and activity curb plate tip cross-section are "L" type, and the two is mutually supported and is formed the rectangle, installation curb plate and activity curb plate tip pass through buffering subassembly swing joint, just activity curb plate can all remove, fixed subassembly is including removing post, compression spring and firm board.
Preferably, the steadying plate is fixed installation curb plate top surface, and the two all is provided with and supplies remove the perforation that the post passed, steadying plate outer orifice of a hole is fixed with two relative distribution's stopper, it is located the steadying plate outside to remove post one end, and is fixed with the pull ring, and the other end is located installation curb plate perforation, just the end fixing has the fixture block, compression spring establishes the cover removes the post surface.
Preferably, a clamping groove is formed in the surface of the rear shell corresponding to the through hole, the other end of the clamping block is located in the clamping groove, two ends of the compression spring are fixed to the surface of the limiting block and the surface of the inner end of the moving column respectively, and the moving column can move up and down.
Preferably, the buffering assembly comprises a movable column and two buffering springs, two ends of the movable column penetrate through the mounting side plate and the movable side plate respectively and are exposed outside, a convex block is fixed on the movable column, the buffering springs are sleeved on the outer surface of the movable column, and two ends of the buffering springs are fixed on the surface of the convex block and the surface of the mounting side plate or the surface of the movable side plate respectively.
Preferably, the movable column outer surface is also sleeved with a buffer block, the buffer block is positioned between the installation side plate and the movable side plate, two ends of the buffer block are respectively in contact with the opposite surfaces of the installation side plate and the movable side plate, and the buffer block is a sponge block.
Preferably, activity curb plate internal surface is provided with a plurality of reference columns, the breach is "T" type, just the breach tank bottom with the corresponding department of reference column is provided with the recess, the reference column other end is located the recess, and the recess tank bottom is fixed with supplementary piece, supplementary piece is the sponge piece.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) the utility model discloses be provided with activity heat dissipation mechanism, the installation and the dismantlement of individual activity heat dissipation mechanism of both being convenient for can clear up the louvre on the activity curb plate, and convenient heat dissipation is convenient for take off again and is overhauld the main part is inside, and when receiving external impact force or inside impact force, plays the buffering and unloads the power effect.
(2) The utility model is provided with a plurality of positioning columns, which play a role in positioning and fastening the movable heat dissipation mechanism and prevent the movable heat dissipation mechanism from moving.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a left side view structure diagram of the present invention;
FIG. 3 is a schematic sectional view of the present invention;
FIG. 4 is a schematic view of the internal partial structure of the movable heat dissipation mechanism of the present invention;
fig. 5 is a schematic view of the internal structure of the fixing assembly of the present invention;
FIG. 6 is a schematic view of the internal structure of the buffering assembly of the present invention;
in the figure: 1. a device main body; 2. a front end; 3. a display screen; 4. a rear housing; 5. a movable heat dissipation mechanism; 6. a notch; 7. installing a side plate; 8. a movable side plate; 9. a buffer assembly; 10. a fixing assembly; 11. moving the column; 12. a limiting block; 13. a stabilizing plate; 14. a clamping block; 15. a compression spring; 16. a movable post; 17. a buffer spring; 18. a buffer block; 19. a positioning column; 20. and an auxiliary block.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides a technical solution: a temperature monitoring device for fungus cultivation comprises a device main body 1, the device main body 1 comprises a front end 2, a rear shell 4 and two movable heat dissipation mechanisms 5 which are distributed oppositely, the rear shell 4 is fixed on the rear surface of the front end 2, a display screen 3 is embedded in the front surface of the front end 2, a notch 6 is arranged on the side surface of the rear shell 4, the movable heat dissipation mechanisms 5 are detachably arranged on the left side surface and the right side surface of the rear shell 4, the movable heat dissipation mechanisms 5 comprise installation side plates 7, movable side plates 8, buffer assemblies 9 and fixing assemblies 10, the cross sections of the end parts of the installation side plates 7 and the movable side plates 8 are L-shaped, the installation side plates 7 and the movable side plates 8 are matched with each other to form a rectangle, the end parts of the installation side plates 7 and the movable side plates 8 are movably connected through the buffer assemblies 9, the movable side plates 8 can all move, the fixing assemblies 10 comprise moving, and the two are both provided with the perforation that can supply to remove post 11 to pass, firm board 13 outer orifice is fixed with two stoppers 12 of relative distribution, remove post 11 one end and be located the firm board 13 outside, and be fixed with the pull ring, the other end is located installation curb plate 7 perforation, and the end fixing has fixture block 14, compression spring 15 cover is established and is removed post 11 surface, backshell 4 surface and perforation corresponding department are provided with the draw-in groove, the fixture block 14 other end is located the draw-in groove, compression spring 15 both ends are fixed respectively on stopper 12 surface and remove post 11 inner surface, and remove post 11 and can reciprocate, through being provided with fixed subassembly 10, be convenient for with the installation and the dismantlement of whole activity heat dissipation mechanism 5, both can clear up the louvre on the activity curb plate 8, convenient heat dissipation, be convenient for take off again and overhaul the inside of device main part.
In this embodiment, preferably, the buffer assembly 9 includes a movable column 16 and two buffer springs 17, two ends of the movable column 16 respectively penetrate through the installation side plate 7 and the movable side plate 8 and are exposed to the outside, and a bump is fixed on the outer surface of the movable column 16, the buffer springs 17 are sleeved on the outer surface of the movable column 16, and two ends of the buffer springs are respectively fixed on the surface of the bump and the surface of the installation side plate 7 or the surface of the movable side plate 8, the outer surface of the movable column 16 is further sleeved with a buffer block 18, the buffer block 18 is located between the installation side plate 7 and the movable side plate 8, two ends of the buffer block 18 are respectively in opposite surface contact with the installation side plate 7 and the movable side plate 8, and the buffer block 18 is a sponge block, and the buffer assembly 9 can play a role in buffering and unloading force when the movable side plate 8.
In this embodiment, preferably, the inner surface of the movable side plate 8 is provided with a plurality of positioning columns 19, the positioning columns 19 can play a role in positioning the whole movable heat dissipation mechanism 5, the notch 6 is of a T shape, a groove is formed at the bottom of the notch 6 and corresponds to the positioning columns 19, the other end of the positioning columns 19 is located in the groove, an auxiliary block 20 is fixed at the bottom of the groove, and the auxiliary block 20 is a sponge block and plays an auxiliary buffering role.
The utility model discloses a theory of operation and use flow: the utility model discloses when the installation is used, fixed subassembly 10 work, earlier two pull rings of outside pulling, drive and remove post 11 and fixture block 14 and move to the outside, compression spring 15 is in compression state, until, the terminal surface is located backshell 4 on the surface in the fixture block 14, install whole activity heat dissipation mechanism 5 in the backshell 4 side again, make reference column 19 align with the recess on breach 6, and simultaneously, the draw-in groove on fixture block 14 and the backshell 4 aligns, loosen the pull ring, compression spring 15 resumes elasticity, drive and remove post 11 and fixture block 14 inward movement, until fixture block 14 card advances in the draw-in groove, and under the spring action, give a relative extrusion force of tank bottom, thereby install whole activity heat dissipation mechanism 5, if dismantle, then take the same operation can.
When activity curb plate 8 receives external impact force inward shift, buffering subassembly 9 work, activity curb plate 8 is along the inward shift of activity post 16, buffer block 18 receives the extrusion compression, buffer spring 17 is in tensile state, and in the removal, buffer spring 17 tensile elasticity offsets gradually with the impact force, is greater than the impact force until tensile elasticity for buffer spring 17 resumes elasticity, drives activity curb plate 8 outward shift, and whole process is relapse, thereby realizes the cushioning effect of unloading to external impact force.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a temperature monitoring device is used in fungus class cultivation, includes device main part (1), device main part (1) includes front end (2), backshell (4) and two activity heat dissipation mechanism (5) that distribute relatively, backshell (4) are fixed front end (2) rear surface, display screen (3), its characterized in that are installed in front end (2) front surface embedding: the utility model discloses a solar energy heat dissipation device, including backshell (4) side, activity heat dissipation mechanism (5) is detachable installs side about backshell (4), just activity heat dissipation mechanism (5) is including installation curb plate (7), activity curb plate (8), buffering subassembly (9) and fixed subassembly (10), installation curb plate (7) and activity curb plate (8) tip cross-section are "L" type, and the two mutually supports and forms the rectangle, installation curb plate (7) and activity curb plate (8) tip pass through buffering subassembly (9) swing joint, just activity curb plate (8) can all remove, fixed subassembly (10) are including removing post (11), compression spring (15) and firm board (13).
2. The temperature monitoring device for cultivating fungi according to claim 1, wherein: the utility model discloses a fixing device for fixing the mobile post, including installation curb plate (7), firm board (13), and the both all is provided with and supplies the perforation that removal post (11) passed, firm board (13) outer orifice is fixed with two relative distribution's stopper (12), remove post (11) one end and be located firm board (13) outside, and be fixed with the pull ring, the other end is located installation curb plate (7) perforation, just the end fixing has fixture block (14), compression spring (15) cover is established remove post (11) surface.
3. The temperature monitoring device for cultivating fungi according to claim 2, wherein: the surface of the rear shell (4) is provided with a clamping groove corresponding to the through hole, the other end of the clamping block (14) is positioned in the clamping groove, two ends of the compression spring (15) are respectively fixed on the surface of the limiting block (12) and the surface of the inner end of the movable column (11), and the movable column (11) can move up and down.
4. The temperature monitoring device for cultivating fungi according to claim 1, wherein: buffer unit (9) are including activity post (16) and two buffer spring (17), activity post (16) both ends are passed respectively installation curb plate (7) and activity curb plate (8) expose in the outside, and are fixed with the lug, buffer spring (17) cover is established activity post (16) surface, and both ends are fixed respectively the lug surface with installation curb plate (7) or activity curb plate (8) surface.
5. The temperature monitoring device for cultivating fungi according to claim 4, wherein: the surface of the movable column (16) is further sleeved with a buffer block (18), the buffer block (18) is located between the installation side plate (7) and the movable side plate (8), two ends of the buffer block (18) are in opposite surface contact with the installation side plate (7) and the movable side plate (8) respectively, and the buffer block (18) is a sponge block.
6. The temperature monitoring device for cultivating fungi according to claim 1, wherein: activity curb plate (8) internal surface is provided with a plurality of reference columns (19), breach (6) are "T" type, just breach (6) tank bottom with the corresponding department of reference column (19) is provided with the recess, reference column (19) other end is located the recess, and the recess tank bottom is fixed with supplementary piece (20), supplementary piece (20) are the sponge piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921208279.7U CN210426787U (en) | 2019-07-30 | 2019-07-30 | Temperature monitoring device for fungus cultivation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921208279.7U CN210426787U (en) | 2019-07-30 | 2019-07-30 | Temperature monitoring device for fungus cultivation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210426787U true CN210426787U (en) | 2020-04-28 |
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ID=70383473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921208279.7U Expired - Fee Related CN210426787U (en) | 2019-07-30 | 2019-07-30 | Temperature monitoring device for fungus cultivation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210426787U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113616243A (en) * | 2021-08-09 | 2021-11-09 | 深圳卫康明科技有限公司 | Doppler blood flow analyzer with double heat dissipation functions and using method |
-
2019
- 2019-07-30 CN CN201921208279.7U patent/CN210426787U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113616243A (en) * | 2021-08-09 | 2021-11-09 | 深圳卫康明科技有限公司 | Doppler blood flow analyzer with double heat dissipation functions and using method |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200428 |