CN210420154U - Filtering device for process residual gas for atomic layer deposition equipment - Google Patents
Filtering device for process residual gas for atomic layer deposition equipment Download PDFInfo
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- CN210420154U CN210420154U CN201921510660.9U CN201921510660U CN210420154U CN 210420154 U CN210420154 U CN 210420154U CN 201921510660 U CN201921510660 U CN 201921510660U CN 210420154 U CN210420154 U CN 210420154U
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Abstract
The utility model relates to a film preparation technical field especially relates to an atomic layer is technological residual gas's for deposition equipment filter equipment, its characterized in that: the filtering device is arranged between the atomic layer deposition vacuum cavity and a vacuum dry pump for pumping process residual gas in the atomic layer deposition vacuum cavity; the filtering device at least comprises a condensation filtering device and a reaction filtering device, wherein an inlet of the condensation filtering device is connected with the atomic layer deposition vacuum cavity, an outlet of the condensation filtering device is connected with an inlet of the reaction filtering device, and an outlet of the reaction filtering device is connected with the vacuum dry pump. The utility model has the advantages that: 1) 99% of atomic layer deposition residual process gas can be filtered; 2) the dust entering the dry pump is greatly reduced, and the service life of the dry pump is prolonged.
Description
Technical Field
The utility model relates to a film preparation technical field especially relates to an atomic layer is technological residual gas's for deposition equipment filter equipment.
Background
Prolonging the service life of a dry pump of the atomic layer deposition equipment and reducing more dust entering a pump opening are one target of processing residual gas of the atomic layer deposition equipment.
For atomic layer deposition equipment, most of the currently used process sources react with water. Most equipment suppliers lack a filtering device for residual process gas of the atomic layer deposition equipment, and most process residues can be condensed into a film in a pipeline or a pump to become dust. Because the amount of dust contained in the pump for the atomic layer deposition equipment is limited, the service life of the dry pump for the atomic layer deposition equipment is greatly shortened, and the subsequent work load of a subsequent tail gas treatment device is increased by discharging the unfiltered residual process gas at the pump opening.
Disclosure of Invention
The utility model aims at providing a processing residual gas's for atomic layer deposition equipment filter equipment according to above-mentioned prior art not enough, through set up filter equipment between atomic layer deposition vacuum cavity and vacuum dry pump to among reducing residual processing gas entering vacuum dry pump, improve vacuum dry pump life.
The utility model discloses the purpose is realized accomplishing by following technical scheme:
a filtering device for process residual gas for atomic layer deposition equipment is characterized in that: the filtering device is arranged between the atomic layer deposition vacuum cavity and a vacuum dry pump for pumping process residual gas in the atomic layer deposition vacuum cavity; the filtering device at least comprises a condensation filtering device and a reaction filtering device, wherein an inlet of the condensation filtering device is connected with the atomic layer deposition vacuum cavity, an outlet of the condensation filtering device is connected with an inlet of the reaction filtering device, and an outlet of the reaction filtering device is connected with the vacuum dry pump.
The condensation filtering device refers to a vacuum condensation tank, multiple guide plates are arranged in the vacuum condensation tank to form a gas passage, and the multiple guide plates are arranged in a staggered mode.
The reaction filtering device is a vacuum filtering tank, the vacuum filtering tank is connected with a water replenishing tank, and a dust filter is arranged in the vacuum filtering tank; the water vapor provided by the water make-up tank reacts with the process residue gas on the surface of the dust filter and is generated on the surface of the dust filter.
The dust filter is connected with a rotary driving device, and can rotate in the vacuum filter tank under the driving of the rotary driving device; and a dust scraper is arranged on the side wall of the vacuum filter tank and faces the dust filter.
The utility model has the advantages that: 1) 99% of atomic layer deposition residual process gas can be filtered; 2) the dust entering the dry pump is greatly reduced, and the service life of the dry pump is prolonged.
Drawings
Fig. 1 is a system configuration diagram of the present invention.
Detailed Description
The features of the present invention and other related features are described in further detail below by way of example in conjunction with the accompanying drawings to facilitate understanding by those skilled in the art:
as shown in fig. 1, the symbols 1-11 in the figure are respectively expressed as: the device comprises a vacuum condensing tank 1, a vacuum filtering tank 2, a dust filter 3, a guide plate 4, a water supplementing tank 5, a dust scraper 6, a dust filter motor 7, an atomic layer deposition vacuum cavity 8, a vacuum dry pump 9, a vacuum connecting pipeline 10 and a vacuum connecting pipeline 11.
Example (b): as shown in fig. 1, the filtering device for the process residual gas for the atomic layer deposition apparatus in this embodiment is disposed between the atomic layer deposition vacuum chamber 8 and the vacuum dry pump 9 to filter the residual process gas exhausted from the atomic layer deposition vacuum chamber 8, so as to avoid a large amount of residual process gas from entering the vacuum dry pump 9 and causing a reduction in the service life thereof.
As shown in fig. 1, a vacuum connection pipe 10 is disposed at an outlet of one side of the atomic layer deposition vacuum chamber 8, and the vacuum connection pipe 10 introduces the process gas in the atomic layer deposition vacuum chamber 8 into the vacuum condensation tank 1 for condensation and filtration.
As shown in fig. 1, a plurality of guide plates 4 are arranged inside the vacuum condensation tank 1, and the guide plates 4 are arranged inside the vacuum condensation tank 1 in a staggered array, so that a square-shaped gas passage is formed for the process gas to pass through, and at the moment, a part of the process gas gasified at high temperature forms a film on the surface of the guide plates 4, thereby realizing condensation filtration. Due to the adoption of the round-shaped roundabout arrangement of the multiple guide plates 4, the passing distance and the passing time of the process gas in the vacuum condensing tank 1 are increased on the premise that the volume of the vacuum condensing tank 1 is fixed, and the condensing and filtering effects of the vacuum condensing tank 1 are further improved.
As shown in fig. 1, the residual process gas passing through the vacuum condensing tank 1 is introduced into the vacuum filtering tank 2 through a pipeline, and the vacuum filtering tank 2 performs reaction filtering on the residual process gas.
As shown in fig. 1, a dust filter 3 is disposed inside the vacuum filtration tank 2, and the vacuum filtration tank 2 is further connected to a water replenishing tank 5, so that water vapor is continuously gasified from the water replenishing tank 5 to the inside of the vacuum filtration tank 2 due to a negative pressure state. The water vapor in the vacuum filtering tank 2 reacts with the residual process gas entering from the vacuum condensing tank 1 on the surface of the dust filter 3 to generate dust which is retained on the surface of the dust filter 3, thereby realizing reaction filtering.
As shown in fig. 1, in order to improve the effect of using the dust filter 3, a dust filter motor 7 is provided on the top of the dust filter 3, and the dust filter motor 7 can rotate the dust filter 3 inside the vacuum filtration tank 2. A dust scraper 6 is arranged on the inner wall of the vacuum filter tank 2, and a certain gap is reserved between the dust scraper 6 and the dust filter 3; when the thickness of the dust retained on the surface of the dust filter 3 is gradually thickened until the dust filter contacts with the dust scraper 6, the dust scraper 6 can scrape off the dust with a certain thickness, so that the use effect of the dust filter 3 is ensured.
As shown in fig. 1, the clean gas filtered by the reaction of the vacuum filter tank 2 enters the vacuum dry pump 9 through the vacuum connection pipe 11, thereby improving the life of the vacuum dry pump 9.
Although the conception and the embodiments of the present invention have been described in detail with reference to the drawings, those skilled in the art will recognize that various changes and modifications can be made therein without departing from the scope of the appended claims.
Claims (4)
1. A filtering device for process residual gas for atomic layer deposition equipment is characterized in that: the filtering device is arranged between the atomic layer deposition vacuum cavity and a vacuum dry pump for pumping process residual gas in the atomic layer deposition vacuum cavity; the filtering device at least comprises a condensation filtering device and a reaction filtering device, wherein an inlet of the condensation filtering device is connected with the atomic layer deposition vacuum cavity, an outlet of the condensation filtering device is connected with an inlet of the reaction filtering device, and an outlet of the reaction filtering device is connected with the vacuum dry pump.
2. The apparatus of claim 1, wherein the apparatus comprises: the condensation filtering device refers to a vacuum condensation tank, multiple guide plates are arranged in the vacuum condensation tank to form a gas passage, and the multiple guide plates are arranged in a staggered mode.
3. The apparatus of claim 1, wherein the apparatus comprises: the reaction filtering device is a vacuum filtering tank, the vacuum filtering tank is connected with a water replenishing tank, and a dust filter is arranged in the vacuum filtering tank; the water vapor provided by the water make-up tank reacts with the process residue gas on the surface of the dust filter and is generated on the surface of the dust filter.
4. The apparatus of claim 3, wherein the apparatus comprises: the dust filter is connected with a rotary driving device, and can rotate in the vacuum filter tank under the driving of the rotary driving device; and a dust scraper is arranged on the side wall of the vacuum filter tank and faces the dust filter.
Priority Applications (1)
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CN201921510660.9U CN210420154U (en) | 2019-09-11 | 2019-09-11 | Filtering device for process residual gas for atomic layer deposition equipment |
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CN201921510660.9U CN210420154U (en) | 2019-09-11 | 2019-09-11 | Filtering device for process residual gas for atomic layer deposition equipment |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110453199A (en) * | 2019-09-11 | 2019-11-15 | 光驰科技(上海)有限公司 | A kind of filter device of atomic layer deposition apparatus technique residual gas |
CN112546793A (en) * | 2020-12-03 | 2021-03-26 | 山东伍玖真空科技有限公司 | Dry vacuum system for modified plastic system |
-
2019
- 2019-09-11 CN CN201921510660.9U patent/CN210420154U/en active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110453199A (en) * | 2019-09-11 | 2019-11-15 | 光驰科技(上海)有限公司 | A kind of filter device of atomic layer deposition apparatus technique residual gas |
CN110453199B (en) * | 2019-09-11 | 2024-04-23 | 光驰科技(上海)有限公司 | Filtering device for process residual gas of atomic layer deposition equipment |
CN112546793A (en) * | 2020-12-03 | 2021-03-26 | 山东伍玖真空科技有限公司 | Dry vacuum system for modified plastic system |
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