CN210399973U - Sintering mold for semiconductor packaging shell - Google Patents
Sintering mold for semiconductor packaging shell Download PDFInfo
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- CN210399973U CN210399973U CN201921297083.XU CN201921297083U CN210399973U CN 210399973 U CN210399973 U CN 210399973U CN 201921297083 U CN201921297083 U CN 201921297083U CN 210399973 U CN210399973 U CN 210399973U
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- support column
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Abstract
The utility model discloses a semiconductor packaging is sintering die for shell, including base, control panel, spout, slider, the base front-mounted have control panel, be provided with on the base the spout, the quantity of spout is two, spout internally mounted has the slider, two be fixed with the lifter plate between the slider, the lifter plate top is fixed with the connecting rod, electric putter is installed to the lifter plate below, the cable is installed at the base rear portion, the cable is kept away from the one end of base is provided with the plug, the support column is installed to the base top, the support column top is fixed with the tray. The utility model discloses a set up movable plate and telescopic link, can absorb the buffering to the vibrations that the motor produced, reduced the transmission effect of power effectively, through setting up electric putter, lifter plate and roof, can be ejecting with the product in the shaping chamber, so improved the practicality of device.
Description
Technical Field
The utility model belongs to the technical field of the sintering mould technique and specifically relates to a semiconductor packaging is sintering mould for shell.
Background
Sintering, which means to convert the powdery material into a compact, is a traditional process. This process has long been used to produce ceramics, powder metallurgy, refractory materials, ultra high temperature materials, and the like. Generally, after the powder is shaped, the dense body obtained by sintering is a polycrystalline material whose microstructure is composed of crystals, vitreous bodies and pores. The sintering process directly affects the grain size, pore size and grain boundary shape and distribution in the microstructure, thereby affecting the performance of the material.
The semiconductor packaging shell needs to use a sintering mold during production, but the existing sintering mold for the semiconductor packaging shell is not easy to take out after being molded and is fixed in a molding cavity, and the heat dissipation motor can generate severe vibration in the working process, so that the service life of the motor can be reduced, and further improvement is needed on the basis.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a sintering mould for semiconductor package shell to fix after solving the present sintering mould for semiconductor package shell product shaping that proposes in the above-mentioned background and be difficult for taking out in the molding chamber, and the heat dissipation motor can produce violent vibrations in the course of the work, so can reduce the life's of motor problem.
In order to achieve the above object, the utility model provides a following technical scheme:
the sintering mold for the semiconductor packaging shell comprises a base, a control panel, sliding grooves and sliding blocks, wherein the control panel is installed on the front portion of the base, the sliding grooves are formed in the base, the number of the sliding grooves is two, the sliding blocks are installed inside the sliding grooves, a lifting plate is fixed between the two sliding blocks, a connecting rod is fixed above the lifting plate, an electric push rod is installed below the lifting plate, cables are installed on the rear portion of the base, a plug is arranged at one end, away from the base, of each cable, a supporting column is installed above the base, a tray is fixed above each supporting column, a forming cavity is formed in each tray, a top plate is arranged inside each forming cavity, fixing rods are installed on two sides of the base, a protective shell is fixed at one end, away from the base, of each fixing rod, the utility model discloses a fan blade mounting structure, including install bin, motor, pivot, telescopic link, supporting plate, spring, install the fixed column, the inside motor that is fixed with of install bin, be provided with the pivot on the motor, the pivot is kept away from the one end of motor is fixed with the flabellum, the movable plate is all installed to install bin top and below, the movable plate is kept away from one side of install bin is fixed with the telescopic link, the telescopic link includes sleeve, backup pad, fixed column, spring, the sleeve is inside to be provided with the backup pad, install the backup pad top the fixed column, the backup pad below is fixed with the spring.
Further, the control panel is connected with the base through screws, and the thickness of the base is 4 cm.
Further, the spout shaping in the base, the slider with the lifter plate welding, the material of slider is the martensite stainless steel.
Further, the connecting rod with the lifter plate welding, the shape of connecting rod is the cylinder, and the diameter is 6 cm.
Furthermore, the support column is welded with the base, the inner diameter of the support column is 10cm, the outer diameter of the support column is 14cm, and the support column is made of hard alloy.
Further, the protective housing with the dead lever welding, the install bin with the movable plate welding, the pivot with the flabellum passes through threaded connection.
Furthermore, the supporting plate is welded with the fixing column, and the spring is made of carbon steel.
The utility model provides a technical scheme can include following beneficial effect:
1. when the device is used, an external power supply is connected with the device through a plug, materials are added into a forming cavity, a motor is started through a control panel after sintering is finished, the motor drives fan blades to rotate, the fan blades cool products, vibration is generated by the motor in the working process, impact force generated by the vibration is applied to a telescopic rod through a movable plate, the telescopic rod stretches continuously to buffer and absorb the impact force, after the temperature is reduced for a period of time, an electric push rod is started through the control panel, the electric push rod drives a lifting plate to ascend, the lifting plate drives a connecting rod to ascend, the connecting rod drives a top plate to ascend, the top plate ejects out the cooled products in the forming cavity, and the vibration generated by the motor can be absorbed and buffered through the movable plate and the telescopic rod, so that the;
2. through setting up electric putter, lifter plate and roof, can be ejecting with the product in the shaping chamber, so improved the practicality of device.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of a sintering mold for a semiconductor package housing according to the present invention;
fig. 2 is a right side view of the sintering mold for a semiconductor package according to the present invention;
fig. 3 is a schematic view of the internal structure of the sintering mold for a semiconductor package housing according to the present invention;
fig. 4 is an enlarged schematic structural view of a telescopic rod in the sintering mold for the semiconductor package housing according to the present invention;
fig. 5 is a block diagram of a circuit structure of the sintering mold for a semiconductor package housing according to the present invention.
In the figure: 1. a base; 2. a control panel; 3. a support pillar; 4. a tray; 5. a molding cavity; 6. a top plate; 7. a cable; 8. a plug; 9. fixing the rod; 10. a protective shell; 11. a rotating shaft; 12. a fan blade; 13. a chute; 14. a slider; 15. a lifting plate; 16. a connecting rod; 17. an electric push rod; 18. installing a box; 19. a motor; 20. moving the plate; 21. a telescopic rod; 2101. a sleeve; 2102. a support plate; 2103. fixing a column; 2104. a spring.
Detailed Description
Hereinafter, embodiments will be described with reference to the drawings. The embodiments described below do not limit the scope of the invention described in the claims. Further, the entire contents of the configurations shown in the following embodiments are not limited to those necessary as a solution of the invention described in the claims.
Referring to fig. 1 to 5, the present embodiment provides a sintering mold for a semiconductor package, including a base 1, a control panel 2, two sliding slots 13, and two sliding blocks 14, the control panel 2 is installed in front of the base 1, the control panel 2 is used to control the operation of a device, the base 1 is provided with the two sliding slots 13, the sliding slots 13 are internally provided with the sliding blocks 14, the sliding blocks 14 are used to improve the stability of a lifting plate 15, a lifting plate 15 is fixed between the two sliding blocks 14, a connecting rod 16 is fixed above the lifting plate 15, the connecting rod 16 is used to connect the lifting plate 15 and a top plate 6, an electric push rod 17 is installed below the lifting plate 15, the electric push rod 17 is used to drive the lifting plate 15 to lift, the rear of the base 1 is provided with a cable 7, one end of the cable 7, which is far away from the base 1, is provided with a plug 8, a tray 4 is fixed above the supporting column 3, a forming cavity 5 is arranged on the tray 4, a top plate 6 is arranged in the forming cavity 5, the top plate 6 is used for ejecting products in the forming cavity 5, fixing rods 9 are arranged at two sides of the base 1, a protective shell 10 is fixed at one end of each fixing rod 9 far away from the base 1, an installation box 18 is arranged in the protective shell 10, a motor 19 is fixed in the installation box 18, the motor 19 is used for driving a rotating shaft 11 to rotate, a rotating shaft 11 is arranged on the motor 19, fan blades 12 are fixed at one end of the rotating shaft 11 far away from the motor 19, the fan blades 12 are used for cooling the products, movable plates 20 are arranged above and below the installation box 18, an expansion link 21 is fixed at one side of the movable plate 20 far away from the installation box 18, the expansion link 21 is used for absorbing impact force generated by vibration, the expansion link 21 comprises a, a fixing column 2103 is arranged above the supporting plate 2102, a spring 2104 is fixed below the supporting plate 2102, and the motor 19 and the electric push rod 17 are electrically connected with the control panel 2.
The utility model discloses a theory of operation and use flow: when the device is used, an external power supply is connected with the device through a plug 8, materials are added into a forming cavity 5, a motor 19 is started through a control panel 2 after sintering is finished, the motor 19 drives a fan blade 12 to rotate, the fan blade 12 cools a product, the motor 19 generates vibration in the working process, impact force generated by the vibration is applied to an expansion link 21 through a moving plate 20, the expansion link 21 continuously expands and contracts to buffer and absorb the impact force, after the temperature is reduced for a period of time, an electric push rod 17 is started through the control panel 2, the electric push rod 17 drives a lifting plate 15 to ascend, the lifting plate 15 drives a connecting rod 16 to ascend, the connecting rod 16 drives a top plate 6 to ascend, the cooled product in the forming cavity 5 is ejected out by the top plate 6, and by arranging the moving plate 20 and the expansion link 21, the vibration generated by the motor 19 can be absorbed, through setting up electric putter 17, lifter plate 15 and roof 6, can be ejecting with the product in the shaping chamber 5, so improved the practicality of device.
The utility model discloses a base 1, control panel 2, support column 3, tray 4, become die cavity 5, roof 6, cable 7, plug 8, dead lever 9, protective housing 10, pivot 11, flabellum 12, spout 13, slider 14, lifter plate 15, connecting rod 16, electric putter 17, install bin 18, motor 19, movable plate 20, telescopic link 21, sleeve 2101, backup pad 2102, fixed column 2103, spring 2104 are the parts that general standard or technical personnel know, its structure and principle all are that this technical staff all can learn through the technical manual or learn through conventional experimental method.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.
Claims (7)
1. The sintering mould for the semiconductor packaging shell is characterized in that: comprises a base (1), a control panel (2), a sliding groove (13) and two sliding blocks (14), wherein the control panel (2) is arranged at the front part of the base (1), the sliding groove (13) is arranged on the base (1), the sliding grooves (13) are arranged in two, the sliding blocks (14) are arranged inside the sliding grooves (13), a lifting plate (15) is fixed between the two sliding blocks (14), a connecting rod (16) is fixed above the lifting plate (15), an electric push rod (17) is arranged below the lifting plate (15), a cable (7) is arranged at the rear part of the base (1), a plug (8) is arranged at one end of the cable (7) far away from the base (1), a support column (3) is arranged above the base (1), a tray (4) is fixed above the support column (3), and a forming cavity (5) is arranged on the tray (4), the molding cavity (5) is internally provided with a top plate (6), fixing rods (9) are installed on two sides of the base (1), a protective shell (10) is fixed at one end, far away from the base (1), of each fixing rod (9), an installation box (18) is arranged inside each protective shell (10), a motor (19) is fixed inside each installation box (18), a rotating shaft (11) is arranged on each motor (19), fan blades (12) are fixed at one end, far away from the motor (19), of each rotating shaft (11), movable plates (20) are installed above and below the installation boxes (18), a telescopic rod (21) is fixed on one side, far away from the installation boxes (18), of each movable plate (20), each telescopic rod (21) comprises a sleeve (2101), a support plate (2102), a fixed column (2103) and a spring (2104), the support plate (2102) is arranged inside each sleeve (2101), the fixing column (2103) is installed above the supporting plate (2102), the spring (2104) is fixed below the supporting plate (2102), and the motor (19) and the electric push rod (17) are electrically connected with the control panel (2).
2. The sintering mold for a semiconductor package according to claim 1, wherein: the control panel (2) is connected with the base (1) through screws, and the thickness of the base (1) is 4 cm.
3. The sintering mold for a semiconductor package according to claim 1, wherein: the sliding groove (13) is formed in the base (1), the sliding block (14) is welded with the lifting plate (15), and the sliding block (14) is made of martensitic stainless steel.
4. The sintering mold for a semiconductor package according to claim 1, wherein: the connecting rod (16) is welded with the lifting plate (15), and the connecting rod (16) is cylindrical and has a diameter of 6 cm.
5. The sintering mold for a semiconductor package according to claim 1, wherein: the support column (3) is welded with the base (1), the inner diameter of the support column (3) is 10cm, the outer diameter of the support column is 14cm, and the support column is made of hard alloy.
6. The sintering mold for a semiconductor package according to claim 1, wherein: the protective housing (10) is welded with the fixing rod (9), the mounting box (18) is welded with the moving plate (20), and the rotating shaft (11) is connected with the fan blades (12) through threads.
7. The sintering mold for a semiconductor package according to claim 1, wherein: the supporting plate (2102) is welded with the fixing column (2103), and the spring (2104) is made of carbon steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921297083.XU CN210399973U (en) | 2019-08-12 | 2019-08-12 | Sintering mold for semiconductor packaging shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921297083.XU CN210399973U (en) | 2019-08-12 | 2019-08-12 | Sintering mold for semiconductor packaging shell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210399973U true CN210399973U (en) | 2020-04-24 |
Family
ID=70359381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921297083.XU Active CN210399973U (en) | 2019-08-12 | 2019-08-12 | Sintering mold for semiconductor packaging shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210399973U (en) |
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2019
- 2019-08-12 CN CN201921297083.XU patent/CN210399973U/en active Active
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Address after: 714000 No. 18, chongye Second Road, high tech Industrial Development Zone, Weinan City, Shaanxi Province Patentee after: Weinan Muwang Intelligent Technology Co.,Ltd. Address before: 714000 northwest corner of Dongfeng Street and Shiquan Road, high tech Industrial Development Zone, Weinan City, Shaanxi Province Patentee before: WEINAN HI-TECH ZONE WOOD KING TECHNOLOGY Co.,Ltd. |