CN210381428U - Be applied to PCB substrate waterproof coating structure - Google Patents
Be applied to PCB substrate waterproof coating structure Download PDFInfo
- Publication number
- CN210381428U CN210381428U CN201920665424.8U CN201920665424U CN210381428U CN 210381428 U CN210381428 U CN 210381428U CN 201920665424 U CN201920665424 U CN 201920665424U CN 210381428 U CN210381428 U CN 210381428U
- Authority
- CN
- China
- Prior art keywords
- waterproof coating
- layer
- bottom substrate
- substrate
- nanometer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Laminated Bodies (AREA)
Abstract
The utility model discloses a be applied to PCB substrate waterproof coating structure, including the model identification block, fixed screw, side U type groove, inboard circuit, waterproof coating, the epoxy layer, organosilicon cross-linking agent layer, nanometer adhesion layer, and bottom substrate, through the epoxy layer, waterproof coating that organosilicon cross-linking agent layer and nanometer adhesion layer are constituteed has fine waterproof nature, and be difficult to drop, when waterproof coating's nanometer adhesion layer is connected on bottom substrate, the nanometer molecule on nanometer adhesion layer will solidify with attaching to in bottom substrate space, and through the emulsion reaction on organosilicon cross-linking agent layer, make the nonionic emulsification of bottom substrate, make coating film intensity obtain improving, and the epoxy layer has fine waterproof performance, during the solidification, the film of compactness that forms that the surface can be fine, like this the molecular gap through film and nanometer adhesion layer of epoxy layer fills, so that the waterproof effect is good.
Description
Technical Field
The utility model belongs to the technical field of relevant PCB substrate, concretely relates to be applied to PCB substrate waterproof coating structure.
Background
PCB boards, also known as printed circuit boards, are providers of electrical connections for electronic components. Its development has been over 100 years old, its design is mainly territory design, and the main advantages of adopting circuit board are that the errors of wiring and assembling can be greatly reduced, and the automation level and production labour rate can be raised. The circuit board can be divided into a single-sided board, a double-sided board, a four-layer board, a six-layer board and other multi-layer circuit boards according to the number of the layers of the circuit board. Since printed circuit boards are not typical end products, they are somewhat confusing in the definition of names such as: the motherboard for a personal computer is called a motherboard and cannot be directly called a circuit board, and although the circuit board exists in the motherboard, the motherboard is different from the motherboard, so that the two aspects cannot be said to be the same when evaluating the industry. For another example: because of the integrated circuit components mounted on the circuit board, the news media is called an IC board, but it is not substantially identical to a printed circuit board. By printed circuit board we generally say bare board-i.e. a circuit board without upper components. In the manufacturing process of the PCB substrate, the substrate waterproof coating needs to be used for coating, so that the surface substrate has good waterproofness.
The existing PCB substrate waterproof coating technology has the following problems: the existing waterproof coating of the PCB substrate easily causes the damage of a waterproof layer when in use, and the adhesion strength is not good, so that the substrate can not be well protected when in use.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a be applied to PCB substrate waterproof coating structure to solve the current PCB substrate waterproof coating who proposes in the above-mentioned background art and when using, cause the damage of waterproof layer easily, the adhesion strength is not fine, makes the problem of can not fine protection substrate when using.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides a be applied to PCB substrate waterproof coating structure, includes model identification block, fixed screw, side U type groove, inboard circuit, waterproof coating, epoxy layer, organosilicon cross-linking agent layer, nanometer adhesion layer and bottom substrate, the installation of model identification block is fixed on the front end top intermediate position of bottom substrate, the below of model identification block is provided with inboard circuit in the middle of the upper end of bottom substrate, be provided with side U type groove in the middle of the both ends outside that the both sides of inboard circuit are located the bottom substrate, the outside in side U type groove is provided with fixed screw in the middle of four corners that are located the bottom substrate, the surface coating of bottom substrate is provided with waterproof coating.
Preferably, the waterproof coating comprises an epoxy resin layer, an organic silicon cross-linking agent layer and a nano adhesion layer, wherein the organic silicon cross-linking agent layer is arranged at the lower end of the epoxy resin layer, the nano adhesion layer is arranged at the lower end of the organic silicon cross-linking agent layer, and the nano adhesion layer is connected to the bottom base material.
Preferably, the base substrate is cylindrical, and the thickness of the base substrate is 0.5 cm.
Preferably, the number of the fixing screw holes is four, and the fixing screw holes are symmetrically fixed in the corner inner part of the bottom base material.
Preferably, the waterproof coating is attached to the base substrate by a spraying or brushing tool, and the waterproof coating has a thickness of 50 μm.
Preferably, the number of the side U-shaped grooves is two, and the side U-shaped grooves are symmetrically fixed in the middle of two ends of the bottom base material.
Preferably, the inner line is an axial center, and both ends of the inner line are in a symmetrical state.
Compared with the prior art, the utility model provides a be applied to PCB substrate waterproof coating structure possesses following beneficial effect:
the utility model is applied to the waterproof coating of the PCB substrate, the waterproof coating formed by the epoxy resin layer, the organic silicon cross-linking agent layer and the nanometer adhesion layer has good waterproofness and is not easy to fall off, when the nanometer adhesion layer of the waterproof coating is connected on the bottom substrate, the nanometer molecules of the nanometer adhesion layer can be solidified in the gap of the bottom substrate by attaching, thereby the fixed connection is carried out, the falling off is not easy to occur, and the nonionic emulsification of the bottom substrate is realized by the emulsification reaction of the organic silicon cross-linking agent layer, thereby the whole adhesion can be further strengthened, the strength of the coating film is improved, the epoxy resin layer has good waterproofness, when the surface can be well formed into a compact film, thus the film passing through the epoxy resin layer and the molecule gap of the nanometer adhesion layer are filled, thereby making outside rainwater be difficult to get into for play fine waterproof protection effect.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description, do not constitute a limitation of the invention, in which:
fig. 1 is a schematic structural view of a waterproof coating applied to a PCB substrate according to the present invention;
fig. 2 is a schematic view of an enlarged structure of the region a provided by the present invention;
fig. 3 is a schematic structural view of the waterproof coating provided by the present invention;
in the figure: 1. a model identification block; 2. fixing screw holes; 3. a side U-shaped groove; 4. an inner side circuit; 5. a water-resistant coating; 51. an epoxy resin layer; 52. an organosilicon crosslinker layer; 53. a nano adhesion layer; 6. a bottom substrate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution:
the utility model provides a be applied to PCB substrate waterproof coating structure, including model identification block 1, fixed screw 2, side U type groove 3, inboard circuit 4, waterproof coating 5, epoxy layer 51, organosilicon cross-linking agent layer 52, nanometer adhesion layer 53, and bottom substrate 6, the installation of model identification block 1 is fixed on the front end top intermediate position of bottom substrate 6, be provided with inboard circuit 4 in the middle of the upper end that is located bottom substrate 6 below model identification block 1, inboard circuit 4 is the axle center, and the both ends of inboard circuit 4 become symmetrical state. When using, through the suggestion of model identification block 1, make personnel can be fine look over, thereby it is more convenient when selecting, and the inboard circuit 4 of bottom substrate 6 can be fine through the electric current, make the transport of carrying out information that can be fine, make more convenient when using, and the both ends of inboard circuit 4 become symmetrical state, and inboard circuit 4 is the axle center, it is more convenient when using like this, thereby use that can be fine.
The utility model provides a be applied to PCB substrate waterproof coating structure, is provided with side U type groove 3 in the middle of the both ends outside that the both sides that are located bottom substrate 6 including inboard circuit 4, and bottom substrate 6 is cylindrical, and the rear end of bottom substrate 6 is 0.5cm, and side U type groove 3 is provided with two altogether, and 3 symmetries in side U type groove are fixed on in the middle of the both ends of bottom substrate 6. When fixed, through side U type groove 3 in the middle of the 6 both ends outsides of bottom substrate, make buckle object that can be fine, make convenience more in fixed use, and make more stable in fixed, and when using, because of bottom substrate 6 is cylindrical, make can be fine accord with the cylinder equipment and use, and when fixed, because of the thickness of bottom substrate 6 is 0.5cm, the area that the installation is fixed has been reduced, thereby the installation in less space of satisfying that can be fine, make more facility in the installation like this.
The utility model provides a be applied to PCB substrate waterproof coating structure, is provided with fixed screw 2 including the outside in side U type groove 3 in the middle of four corners that are located bottom substrate 6, and fixed screw 2 is provided with four altogether, and 2 symmetries of fixed screw are fixed in the corner inside of bottom substrate 6. When fixed, carry out the screw fixation through four fixed screw 2, make more convenient when fixed like this to four fixed screw 2 are fixed in four turning insides of bottom substrate 6, thereby make fixed more firm, thereby bottom substrate 6 is difficult to take place to drop when using, thereby installation use that like this can be fine.
The utility model provides a be applied to PCB substrate waterproof coating structure, the surface that includes bottom substrate 6 is brushed and is provided with waterproof coating 5, waterproof coating 5 is attached to bottom substrate 6 through spraying or brush the instrument with a brush, and waterproof coating 5's thickness is 50 mu m, waterproof coating 5 includes epoxy layer 51, organosilicon cross-linking agent layer 52 and nanometer adhesion layer 53, the lower extreme of epoxy layer 51 is provided with organosilicon cross-linking agent layer 52, the lower extreme on organosilicon cross-linking agent layer 52 is provided with nanometer adhesion layer 53, nanometer adhesion layer 53 is connected on bottom substrate 6. When in use, the waterproof coating 5 is attached to the bottom substrate 6 by a spraying or brushing tool, so that the manual strength is reduced, and the spraying and brushing are carried out by a machine, so that the thickness of the waterproof coating 5 on the surface of the bottom substrate 6 is more uniform, the spraying or brushing is more efficient, the overall working efficiency is improved, the manual strength and the labor cost are reduced, the nanometer adhesion layer 53 of the waterproof coating 5 is connected to the bottom substrate 6, so that in adhesion, nanometer molecules of the nanometer adhesion layer 53 can be attached to the gaps of the bottom substrate 6, so that the adhesion can be well fixed, the falling is not easy to occur, and in adhesion, the nonionic emulsification of the bottom substrate 6 is realized through the emulsification of the organosilicon crosslinking agent layer 52, the integral adhesion is further strengthened, and the strengths of the bottom substrate and the bottom substrate are strengthened, the strength of the coating film is improved, and the epoxy resin layer 51 has good waterproof performance, so that a compact film can be well formed on the surface, external rainwater cannot easily enter the film, and a good waterproof protection effect is achieved.
The utility model discloses a theory of operation and use flow: the utility model discloses be applied to 5 spraying of PCB substrate waterproof coating and apply paint the back with a brush and just can take the assigned position to install and use. And when the bottom base material 6 is fixedly installed, the bottom base material 6 can be well selected through the model identification block 1. And when fixed, fix through four fixed screw 2 of bottom substrate 6 for can be fine fix, and the side U type groove 3 of bottom substrate 6 can be fine carry out the buckle fixed, make wholly more convenient in fixed mounting. When in use, the waterproof coating 5 on the surface of the bottom substrate 6 ensures that the waterproof coating has good waterproofness. And waterproof coating 5 is through epoxy layer 51, organosilicon cross-linking agent layer 52 and nanometer adhesion layer 53 are constituteed, like this in the adhesion, nanometer adhesion layer 53's nanometer molecule will with adhere to in the space of bottom substrate 6, thereby be difficult to take place to drop, and organosilicon cross-linking agent layer 52's emulsification, make bottom substrate 6's nonionic emulsification, make coating film strength obtain improving, and epoxy layer 51 has fine waterproof performance, when fixed, make the surface can be fine form the film of compactness, thereby make outside rainwater be difficult to get into, play fine waterproof protection like this.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a be applied to PCB substrate waterproof coating structure, includes model identification block (1), fixed screw (2), side U type groove (3), inboard circuit (4), water proof coating (5), epoxy layer (51), organosilicon cross-linking agent layer (52), nanometer adhesion layer (53) and bottom substrate (6), its characterized in that: model identification block (1) installation is fixed on the front end top intermediate position of bottom substrate (6), the below of model identification block (1) is provided with inboard circuit (4) in the middle of the upper end of bottom substrate (6), be provided with side U type groove (3) in the middle of the both ends outside that the both sides of inboard circuit (4) are located bottom substrate (6), be provided with fixed screw (2) in the middle of four corners that the outside of side U type groove (3) is located bottom substrate (6), the surface coating of bottom substrate (6) is provided with waterproof coating (5).
2. The waterproof coating structure applied to the PCB substrate according to claim 1, wherein: waterproof coating (5) include epoxy layer (51), organosilicon cross-linking agent layer (52) and nanometer adhesion layer (53), the lower extreme of epoxy layer (51) is provided with organosilicon cross-linking agent layer (52), the lower extreme of organosilicon cross-linking agent layer (52) is provided with nanometer adhesion layer (53), nanometer adhesion layer (53) are connected on bottom substrate (6).
3. The waterproof coating structure applied to the PCB substrate according to claim 1, wherein: the base substrate (6) is cylindrical, and the thickness of the base substrate (6) is 0.5 cm.
4. The waterproof coating structure applied to the PCB substrate according to claim 1, wherein: the number of the fixing screw holes (2) is four, and the fixing screw holes (2) are symmetrically fixed in the inner part of the corner of the bottom base material (6).
5. The waterproof coating structure applied to the PCB substrate according to claim 1, wherein: the waterproof coating (5) is attached to the bottom base material (6) through a spraying or brushing tool, and the thickness of the waterproof coating (5) is 50 micrometers.
6. The waterproof coating structure applied to the PCB substrate according to claim 1, wherein: the side U-shaped grooves (3) are provided with two, and the side U-shaped grooves (3) are symmetrically fixed in the middle of two ends of the bottom base material (6).
7. The waterproof coating structure applied to the PCB substrate according to claim 1, wherein: the inner side circuit (4) is an axial center, and two ends of the inner side circuit (4) are in a symmetrical state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920665424.8U CN210381428U (en) | 2019-05-10 | 2019-05-10 | Be applied to PCB substrate waterproof coating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920665424.8U CN210381428U (en) | 2019-05-10 | 2019-05-10 | Be applied to PCB substrate waterproof coating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210381428U true CN210381428U (en) | 2020-04-21 |
Family
ID=70260028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920665424.8U Active CN210381428U (en) | 2019-05-10 | 2019-05-10 | Be applied to PCB substrate waterproof coating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210381428U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115188283A (en) * | 2021-08-16 | 2022-10-14 | 深圳市普唐光电科技有限公司 | Circuit board capable of preventing black screen in renting LED display screen work and display screen assembly |
-
2019
- 2019-05-10 CN CN201920665424.8U patent/CN210381428U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115188283A (en) * | 2021-08-16 | 2022-10-14 | 深圳市普唐光电科技有限公司 | Circuit board capable of preventing black screen in renting LED display screen work and display screen assembly |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0048406B1 (en) | Heat dissipating printed-circuit board | |
| US7368513B2 (en) | Water-soluble electrically insulative composition, modifications, and applications thereof | |
| US9668360B2 (en) | Polyamideimide adhesives for printed circuit boards | |
| CN101330805A (en) | Method for preparing firm flexible printed board | |
| US9670306B2 (en) | Liquid coverlays for flexible printed circuit boards | |
| CN101146407A (en) | Graph transfer shaping technology for carrier board circuit of printed circuit board | |
| CN210381428U (en) | Be applied to PCB substrate waterproof coating structure | |
| CN101304639A (en) | Method for producing printed circuit board | |
| CN103666363A (en) | Conductive adhesive containing conductive macromolecules and preparation method thereof | |
| CN110139491A (en) | A kind of circuit board preparation method and circuit board | |
| CN1242659C (en) | Method for depositing conductive layer on substrate | |
| CN114049987A (en) | Metal grid conductive film and preparation method thereof | |
| CN109016769A (en) | A kind of anti-static silica gel protective film and preparation method thereof | |
| CN102833941B (en) | A kind of Novel slide and preparation method thereof | |
| CN101343771A (en) | Plating device | |
| CN207053876U (en) | A kind of FPC and electronic equipment | |
| US20040179347A1 (en) | Circuit board | |
| US20040078968A1 (en) | Printed circuit board manufacturing method | |
| CN102625591B (en) | Method for manufacturing solder mask of unit plate by using electrostatic spray coating machine | |
| CN107666765A (en) | Circuit board structure | |
| CN103419518B (en) | A kind of method preparing field type display back electrode plate of electronic ink | |
| CN110267440A (en) | A kind of manufacturing method of COF flexible substrate | |
| CN210381443U (en) | Single-layer one-way wiring structure for improving bending performance of FPC (flexible printed circuit) of liquid crystal display module | |
| CN207321633U (en) | A kind of Novel single-face circuit board | |
| CN215744438U (en) | Construction is with supplementary installation device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 510000 room 213, building B10, 11 Kaiyuan Avenue, Huangpu District, Guangzhou City, Guangdong Province Patentee after: Guangzhou Biran New Material Technology Co.,Ltd. Address before: 2 / F, building 1, No.12, Nanyun 3rd road, Guangzhou Economic and Technological Development Zone, Guangdong 510000 Patentee before: GUANGZHOU BIRAN ENVIRONMENTAL PROTECTION Co.,Ltd. |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A waterproof coating structure for PCB substrate Effective date of registration: 20210318 Granted publication date: 20200421 Pledgee: China Co. truction Bank Corp Guangzhou economic and Technological Development Zone sub branch Pledgor: Guangzhou Biran New Material Technology Co.,Ltd. Registration number: Y2021980001808 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220310 Granted publication date: 20200421 Pledgee: China Co. truction Bank Corp Guangzhou economic and Technological Development Zone sub branch Pledgor: Guangzhou Biran New Material Technology Co.,Ltd. Registration number: Y2021980001808 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A waterproof coating structure applied to PCB substrate Effective date of registration: 20220331 Granted publication date: 20200421 Pledgee: China Construction Bank Corporation Guangzhou Development Zone Branch Pledgor: Guangzhou Biran New Material Technology Co.,Ltd. Registration number: Y2022980003644 |