CN210380876U - Quantum key distribution transmitting terminal chip, packaging structure and equipment - Google Patents
Quantum key distribution transmitting terminal chip, packaging structure and equipment Download PDFInfo
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- CN210380876U CN210380876U CN201921215254.XU CN201921215254U CN210380876U CN 210380876 U CN210380876 U CN 210380876U CN 201921215254 U CN201921215254 U CN 201921215254U CN 210380876 U CN210380876 U CN 210380876U
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Abstract
The utility model discloses a quantum key distribution transmitting terminal chip, packaging structure and equipment, this transmitting terminal chip include the substrate and two at least quantum key distribution transmitting terminal modules of integration on this substrate, and every quantum key distribution transmitting terminal module is independent operation separately, and it all includes optical fiber coupling module, intensity modulator, quantum attitude modulation unit, adjustable optical attenuator one and optical fiber coupling module. The utility model discloses a quantum key distribution transmitting terminal chip carries out photon integration with the light path of a plurality of quantum key distribution transmitting terminals on single photon NULL, can effectively promote quantum key distribution equipment's one-tenth code rate for an equipment that uses this chip just can realize the one-tenth code ability of centralized control station scheme. On the other hand, compared with a centralized control station scheme for providing quantum keys together by using a plurality of quantum key distribution devices, the device does not need so many discrete optical elements, is more miniaturized, greatly reduces the device cost and the deployment space, and improves the manufacturing efficiency.
Description
Technical Field
The utility model relates to a quantum key distribution device technical field, concretely relates to quantum key distribution transmitting terminal chip, packaging structure and equipment.
Background
The quantum key security coding rate of quantum key distribution equipment deployed in a quantum secret communication trunk (called quantum trunk for short) at present is generally in the order of 10kbps to 100kbps, and when a large amount of encryption services exist, the number of keys is difficult to meet the service requirements. One solution today is to deploy multiple quantum key distribution devices at various nodes of the quantum trunk to provide quantum keys together, referred to herein as a "hub solution. However, the optical part of the current commercial quantum key distribution equipment is built by adopting discrete optical elements no matter a sending end or a receiving end, for example, the optical part of the sending end of the quantum key distribution scheme based on the phase type BB84 protocol comprises a laser, an intensity modulator, a phase modulator, an unequal arm interference device, an adjustable optical attenuator and the like, and all the optical elements are connected by optical fibers, so that the quantum key distribution equipment has high cost, large volume and unstable performance. The scheme of deploying a plurality of devices at the quantum trunk node greatly increases the cost and space resource requirements.
Disclosure of Invention
The to-be-solved technical problem of the utility model is to provide a little volume, high integration degree and large capacity quantum key distribution transmitting terminal chip.
In order to solve the technical problem, the utility model provides a quantum key distribution transmitting terminal chip, including substrate and integrated two at least quantum key distribution transmitting terminal modules on this substrate, every quantum key distribution transmitting terminal module is independent operation separately, and it all includes optic fibre coupling-in module, intensity modulator, quantum attitude modulation unit, adjustable optical attenuator one and optic fibre coupling-out module;
the intensity modulator carries out random intensity modulation on the optical signal coupled into the chip by the optical fiber coupling-in module to be in a signal state or a decoy state;
the quantum state modulation unit carries out quantum state coding on the signal light processed by the intensity modulator;
the first adjustable optical attenuator attenuates the signal light processed by the quantum state modulation unit to a single photon magnitude;
and the optical fiber coupling-out module couples the signal light processed by the adjustable optical attenuator from the chip to the optical fiber.
In a preferred embodiment of the present invention, the intensity modulator further comprises a first optical beam splitter, a first optical beam combiner, and a first phase modulator; the first optical beam splitter equally divides one path of signal light into two paths of signal light according to power, one path of output is connected to the first optical beam combiner through the first phase modulator, and the other path of output is directly connected to the first optical beam combiner;
the phase modulator is used for dynamically changing the phase of the signal light;
and the first optical beam combiner combines the two paths of signal light into one path of signal light.
In a preferred embodiment of the present invention, the quantum state modulation unit further comprises a second optical beam splitter, a second optical beam combiner, a delay line, a second variable optical attenuator, and a second phase modulator;
the second optical beam splitter equally divides one path of signal light into two paths of signal light according to power, one path of output is connected to the second optical beam combiner through the delay line, and the other path of output is connected to the second optical beam combiner through the second phase modulator and the second adjustable optical attenuator in sequence;
the delay line is used for delaying the time of the signal light in the optical waveguide where the delay line is located entering the second optical beam combiner;
the second phase modulator is used for dynamically modulating the phase of the signal light in the optical waveguide where the second phase modulator is located to 0, pi/2, pi and 3 pi/2;
the second adjustable optical attenuator is used for adjusting the signal light loss in the optical waveguide where the second adjustable optical attenuator is located to be consistent with the signal light loss in the optical waveguide where the delay line is located;
and the second optical beam combiner is used for combining the signal light in the optical waveguide where the delay line is positioned and the signal light in the optical waveguide where the adjustable optical attenuator is positioned into one optical waveguide with the efficiency of 50%.
The present invention provides a preferred embodiment, further comprising each of the signal light wavelengths coupled into the optical fiber coupling module included in the quantum key distribution transmitting terminal module are different and are in the wavelength division multiplexer operating band.
In a preferred embodiment of the present invention, the transmitting end chip further includes a synchronous laser, all the quantum key distribution transmitting end modules included in the transmitting end chip include signal lasers, the light emitting wavelengths of the signal lasers are different and are in the operating band of the wavelength division multiplexer, and the signal lasers are connected to the intensity modulator through optical waveguides; the synchronous laser is connected with the optical fiber coupling-out module through an optical waveguide.
In order to solve the technical problem, the utility model provides a quantum key distributes packaging structure of sending end chip, this packaging structure includes 2N (N is more than or equal to 2) optic fibre pins and Y-2N electrode pins; the pin 1, the pin 2, and the pin … …, the pin N, are optical fiber input ports of the chip, and are respectively connected to optical fiber coupling-in modules of the chip; the pin N +1, the pin N +2 and the pin 2N … … are optical fiber output ports of the chip and are respectively connected with an optical fiber coupling-out module of the chip; pin 2N +1, pin 2N +2, and pin Y (Y >2N) … … are electrode pins of the chip.
In a preferred embodiment of the present invention, the package structure further comprises pin 1, pin 2, pin … …, pin N +1, pin N +2, pin … …, pin 2N, and pin b 2N, respectively, disposed on the first side of the package structure; pin 2N +1, pin 2N +2, pin X … … are disposed on the third side of the package structure, pin X +1, pin X +2, pin Y … … (Y > X >2N) are disposed on the fourth side of the package structure; the first side and the second side of the packaging structure are positioned at two opposite sides, and the third side and the fourth side of the packaging structure are positioned at two opposite sides.
In order to solve the technical problem, the utility model provides a quantum key distributes packaging structure of sending end chip, and the packaging structure includes N +1 optic fibre pins and Y-N-1 electrode pins; the pin 1, the pin 2, the pin N +1(N is more than or equal to 2) of … … are optical fiber output ports of the chip and are respectively connected with an optical fiber coupling-out module of the chip; pin N +2, pin N +3, and pin Y (Y > N +1) … … are electrode pins of the chip.
In a preferred embodiment of the present invention, the package structure further includes the pin 1, the pin 2, the pin N +1 … … disposed on the first side of the package structure; the pin N +2, the pin N +3, and the pin … …, pin X, are disposed on the second side of the package structure; the pin X +1, the pin X +2, the pin Y (Y > X > N +1) … … are disposed on the third side of the package structure; the second side of the packaging structure and the third side of the packaging structure are positioned on two opposite sides, and the first side of the packaging structure is positioned between the second side and the third side of the packaging structure.
In order to solve the technical problem, the utility model provides a quantum key distribution transmitting terminal equipment, which comprises the quantum key distribution transmitting terminal chip;
the system also comprises a signal laser, a synchronous laser, a wavelength division multiplexer and an optical circulator;
n (N is more than or equal to 2) different wavelength output ends of the signal laser are respectively connected with N optical fiber input ports of the quantum key distribution transmitting end chip; n optical fiber output ports of the quantum key distribution transmitting terminal chip are connected with N input channels of a wavelength division multiplexer, the (N +1) th channel of the wavelength division multiplexer is connected with a synchronous laser, and a public output end of the wavelength division multiplexer is connected with an optical circulator.
The utility model has the advantages that:
the utility model discloses quantum key distribution transmitting terminal chip carries out photon integration with the light path of a plurality of quantum key distribution transmitting terminals on single photon integrated chip for an equipment that uses this chip just can realize the ability of centralized control station scheme, can also effectively promote quantum key distribution equipment's the one-tenth code rate simultaneously. On the other hand, compared with a centralized control station scheme for providing quantum keys together by using a plurality of quantum key distribution devices, the device does not need so many discrete optical elements, is more miniaturized, greatly reduces the device cost and the deployment space, and improves the manufacturing efficiency.
This scheme adopts the integrated mode of chip, and the equipment performance that uses this chip is more stable, and easily mass production just only needs an equipment to realize the performance of many equipment, and the cost is lower.
Drawings
Fig. 1 is a block diagram of a quantum key distribution transmitting end chip according to a first embodiment of the present invention;
fig. 2 is a block diagram of an intensity modulator in the transmitting-end chip shown in fig. 1;
fig. 3 is a block diagram of a quantum state modulation unit in the transmitting end chip shown in fig. 1;
fig. 4 is a block diagram of a quantum key distribution transmitting end chip according to a second embodiment of the present invention;
fig. 5 is a schematic diagram of a package structure of a quantum key distribution transmitting end chip in a third embodiment of the present invention;
fig. 6 is a schematic diagram of a package structure of a quantum key distribution transmitting end chip in a fourth embodiment of the present invention;
fig. 7 is a schematic structural diagram of a quantum key distribution transmitting terminal device in a fifth embodiment of the present invention.
Detailed Description
The present invention is further described with reference to the following drawings and specific embodiments so that those skilled in the art can better understand the present invention and can implement the present invention, but the embodiments are not to be construed as limiting the present invention.
Example one
The present embodiment discloses a quantum key distribution sender chip, as shown in fig. 1, the chip includes a substrate 0 and at least two quantum key distribution sender modules (1, 2, … … N) integrated on the substrate 0, each of the quantum key distribution sender modules operates independently, and each of the quantum key distribution sender modules includes an optical fiber coupling-in module (11, 21, … … N1), an intensity modulator (12, 22, … … N2), a quantum state modulation unit (13, 23, … … N3), a first adjustable optical attenuator (14, 24, … … N4), and an optical fiber coupling-out module (15, 25, … … N5).
Modules or units contained in each quantum key distribution transmitting terminal module are connected based on a planar optical waveguide, signals are coupled to a chip from an optical fiber coupling-in module, and the intensity modulator modulates the random intensity of optical signals coupled by the optical fiber coupling-in module into a signal state or a decoy state; the quantum state modulation unit carries out quantum state coding on the signal light processed by the intensity modulator; the first variable optical attenuator attenuates the signal light processed by the quantum state modulation unit to a single photon magnitude; the optical fiber coupling-out module couples out the signal light processed by the adjustable optical attenuator from the chip to the optical fiber.
The fiber coupling-in module and the fiber coupling-out module can be single-mode optical waveguides, grating couplers or wedge couplers.
The intensity modulator is composed of 1 or more mach-zehnder interferometers (MZ interferometers), and as shown in fig. 2, the intensity modulator includes a first optical beam splitter 121, a first optical beam combiner 122, and a first phase modulator 123, and each part included in the intensity modulator is connected by a planar optical waveguide; the first optical splitter 121 is used for averagely splitting the light intensity in one optical waveguide into two optical waveguides; the beam combiner 122 is used to combine light from two optical waveguides into one optical waveguide. The optical splitter may be a structure based on a Y-branch optical waveguide, an optical waveguide directional coupler, or a multi-mode interferometer, and the optical combiner may be a structure based on a Y-branch optical waveguide, an optical waveguide directional coupler, or a multi-mode interferometer. Specifically, the first optical splitter 121 equally divides one path of signal light into two paths of signal light according to power, one path of output is connected to the first optical combiner 122 through the first phase modulator 123, and the other path of output is directly connected to the first optical combiner 122; the first optical combiner 122 combines the two signal lights into one signal light. The first phase modulator 123 is used for dynamically changing the phase of the signal light. In the technical solution of this embodiment, the first phase modulator 123 may be a phase modulator based on an electro-optical effect, a thermo-optical effect, or a carrier dispersion effect.
The quantum state modulation unit can perform phase encoding, polarization encoding or time phase encoding on the signal light. Taking phase encoding as an example, the quantum state modulation unit performing phase encoding may be an unequal arm MZ interferometer structure. As shown in fig. 3, the quantum state modulation unit includes a second optical beam splitter 131, a second optical beam combiner 132, a delay line 133, a second adjustable optical attenuator 135, and a second phase modulator 134.
The second optical splitter can be a structure based on a Y-branch waveguide, an optical waveguide directional coupler or a multi-mode interferometer; the second optical combiner can be a structure based on a Y-branch waveguide, an optical waveguide directional coupler or a multi-mode interferometer. The delay line may be an optical waveguide of an arc or spiral type. The second phase modulator 134 may be a phase modulator based on an electro-optical effect, a thermo-optical effect, or a carrier dispersion effect; the second adjustable optical attenuator 135 can be an adjustable optical attenuator based on MZ interferometer or optical absorption effect.
Specifically, the second optical splitter 131 equally divides one path of signal light into two paths of signal light according to power, one path of output is connected to the second optical combiner 132 through the delay line 133, and the other path of output is connected to the second optical combiner 132 through the second phase modulator 134 and the second adjustable optical attenuator 135 in sequence;
the delay line 133 is used for delaying the time when the signal light in the optical waveguide where the delay line is located enters the second optical combiner;
the second phase modulator 134 is used for dynamically modulating the phase of the signal light in the optical waveguide where the second phase modulator is located by 0, pi/2, pi and 3 pi/2;
the second variable optical attenuator 135 is used for adjusting the optical loss of the signal in the optical waveguide where the second variable optical attenuator is located to be consistent with the optical loss of the signal in the optical waveguide where the delay line is located;
the second optical combiner 132 is used for combining the signal light in the optical waveguide where the delay line is located and the signal light in the optical waveguide where the adjustable optical attenuator is located into one optical waveguide with 50% efficiency.
In order to save optical fiber resources, the optical wavelengths of the signals coupled into the optical fiber coupling-in module included in each quantum key distribution transmitting terminal module are different, a plurality of signals with different wavelengths need to be transmitted in the same optical fiber of a quantum trunk line, a wavelength division multiplexing technology is adopted in application, the optical wavelengths of the signals input into a chip from N optical fiber input ports of the chip are different, and the signals with different wavelengths are output from the chip from an optical fiber output port and then combined to the same optical fiber through the wavelength division multiplexer. Signal lights with different wavelengths can be emitted and generated by different signal lasers, and the different lasers are connected with different optical fiber coupling-in modules; or may be generated by a laser emitting multiple wavelengths.
The quantum key distribution transmitter chip disclosed in the second embodiment of the present invention, as shown in fig. 4, further includes a synchronous laser 201, all the quantum key distribution transmitter modules included in the transmitter chip include a signal laser (10, 20, … … N0), the signal laser (10, 20, … … N0) is used to generate N (N is greater than or equal to 2) signal lights with different wavelengths, and the signal laser (10, 20, … … N0) is connected to the intensity modulator (12, 22, … … N2) through an optical waveguide; the synchronous laser 201 is coupled out of the module 202 through an optical waveguide connection fiber.
In a third embodiment of the present invention, a package structure of a quantum key distribution transmitting end chip of the embodiment is disclosed, as shown in fig. 5, the package structure includes 2N (N is greater than or equal to 2) optical fiber pins and Y-2N electrode pins; the pin 1, the pin 2, and the pin … …, the pin N, are optical fiber input ports of the chip, and are respectively connected to optical fiber coupling-in modules of the chip; the pin N +1, the pin N +2 and the pin 2N … … are optical fiber output ports of the chip and are respectively connected with an optical fiber coupling-out module of the chip; pin 2N +1, pin 2N +2, and pin Y (Y >2N) … … are electrode pins of the chip.
The pin 1, the pin 2, the pin N … … are disposed on the first side of the package structure, and the pin N +1, the pin N +2, the pin 2N … … are disposed on the second side of the package structure; pin 2N +1, pin 2N +2, pin X … … are disposed on the third side of the package structure, pin X +1, pin X +2, pin Y … … (Y > X >2N) are disposed on the fourth side of the package structure; the first side and the second side of the package structure are located at two opposite sides, and the third side and the fourth side of the package structure are located at two opposite sides.
In a fourth embodiment of the present invention, a package structure of a quantum key distribution transmitting end chip of the second embodiment is disclosed, as shown in fig. 6, the package structure includes N +1 optical fiber pins and Y-N-1 electrode pins; the pin 1, the pin 2, the pin N +1(N is more than or equal to 2) of … … are optical fiber output ports of the chip and are respectively connected with an optical fiber coupling-out module of the chip; pin N +2, pin N +3, and pin Y (Y > N +1) … … are electrode pins of the chip.
The pin 1, the pin 2, the pin N +1 of … … are disposed on the first side of the package structure; the pin N +2, the pin N +3, and the pin … …, pin X, are disposed on the second side of the package structure; the pin X +1, the pin X +2, and the pin Y (Y > X > N +1) … … are disposed on the third side of the package structure; the second side and the third side of the packaging structure are positioned at two opposite sides, and the first side of the packaging structure is positioned between the second side and the third side of the packaging structure.
The utility model discloses a fifth embodiment discloses a quantum key distribution transmitting terminal equipment that quantum key distribution transmitting terminal chip in the use embodiment one was built, as shown in fig. 7, this transmitting terminal equipment still includes the quantum key distribution transmitting terminal chip in signal laser ware, synchronous laser ware, wavelength division multiplexer, optical circulator and embodiment one.
The signal laser outputs signal light with N (N is more than or equal to 2) wavelengths, and N (N is more than or equal to 2) different wavelength output ends of the signal laser are respectively connected with N optical fiber input ports of the quantum key distribution transmitting end chip; the N optical fiber output ports of the quantum key distribution transmitting end chip are connected with N input channels of a wavelength division multiplexer, the (N +1) th channel of the wavelength division multiplexer is connected with a synchronous laser, and the public output end of the wavelength division multiplexer is connected with an optical circulator. The signal light laser, the quantum key distribution transmitting end chip, the synchronous laser, the wavelength division multiplexer and the optical circulator are connected through polarization maintaining optical fibers.
The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. Equivalent substitutes or changes made by the technical personnel in the technical field on the basis of the utility model are all within the protection scope of the utility model. The protection scope of the present invention is subject to the claims.
Claims (10)
1. A quantum key distribution transmitting end chip is characterized in that: the quantum key distribution transmitting terminal comprises a substrate and at least two quantum key distribution transmitting terminal modules integrated on the substrate, wherein each quantum key distribution transmitting terminal module operates independently and comprises an optical fiber coupling-in module, an intensity modulator, a quantum state modulation unit, a first adjustable optical attenuator and an optical fiber coupling-out module;
the intensity modulator carries out random intensity modulation on the optical signal coupled into the chip by the optical fiber coupling-in module to be in a signal state or a decoy state;
the quantum state modulation unit carries out quantum state coding on the signal light processed by the intensity modulator;
the first adjustable optical attenuator attenuates the signal light processed by the quantum state modulation unit to a single photon magnitude;
and the optical fiber coupling-out module couples the signal light processed by the adjustable optical attenuator from the chip to the optical fiber.
2. The quantum key distribution sender chip of claim 1, wherein: the intensity modulator comprises a first optical beam splitter, a first optical beam combiner and a first phase modulator; the first optical beam splitter equally divides one path of signal light into two paths of signal light according to power, one path of output is connected to the first optical beam combiner through the first phase modulator, and the other path of output is directly connected to the first optical beam combiner;
the phase modulator is used for dynamically changing the phase of the signal light;
and the first optical beam combiner combines the two paths of signal light into one path of signal light.
3. The quantum key distribution sender chip of claim 1, wherein: the quantum state modulation unit comprises a second optical beam splitter, a second optical beam combiner, a delay line, a second adjustable optical attenuator and a second phase modulator;
the second optical beam splitter equally divides one path of signal light into two paths of signal light according to power, one path of output is connected to the second optical beam combiner through the delay line, and the other path of output is connected to the second optical beam combiner through the second phase modulator and the second adjustable optical attenuator in sequence;
the delay line is used for delaying the time of the signal light in the optical waveguide where the delay line is located entering the second optical beam combiner;
the second phase modulator is used for dynamically modulating the phase of the signal light in the optical waveguide where the second phase modulator is located to 0, pi/2, pi and 3 pi/2;
the second adjustable optical attenuator is used for adjusting the signal light loss in the optical waveguide where the second adjustable optical attenuator is located to be consistent with the signal light loss in the optical waveguide where the delay line is located;
and the second optical beam combiner is used for combining the signal light in the optical waveguide where the delay line is positioned and the signal light in the optical waveguide where the adjustable optical attenuator is positioned into one optical waveguide with the efficiency of 50%.
4. The quantum key distribution sender chip of claim 1, wherein: the wavelength of the signal light coupled in by the optical fiber coupling-in module included in each quantum key distribution transmitting terminal module is different and is in the working waveband of the wavelength division multiplexer.
5. The quantum key distribution sender chip of claim 1, wherein: the sending end chip also comprises a synchronous laser, all quantum key distribution sending end modules contained in the sending end chip comprise signal lasers, the light-emitting wavelengths of the signal lasers are different and are positioned in the working wave band of the wavelength division multiplexer, and the signal lasers are connected with the intensity modulator through optical waveguides; the synchronous laser is connected with the optical fiber coupling-out module through an optical waveguide.
6. A package structure comprising the quantum key distribution sender chip according to any one of claims 1 to 4, wherein: the packaging structure comprises 2N optical fiber pins and Y-2N electrode pins, wherein N is more than or equal to 2; the pin 1, the pin 2, and the pin … …, the pin N, are optical fiber input ports of the chip, and are respectively connected to optical fiber coupling-in modules of the chip; the pin N +1, the pin N +2 and the pin 2N … … are optical fiber output ports of the chip and are respectively connected with an optical fiber coupling-out module of the chip; pin 2N +1, pin 2N +2, and pin Y … … are electrode pins of the chip, and Y > 2N.
7. The package structure of claim 6, wherein: the pin 1, the pin 2, the pin N … … are arranged at the first side of the package structure, and the pin N +1, the pin N +2, the pin 2N … … are arranged at the second side of the package structure; pin 2N +1, pin 2N +2, pin X … … are disposed on the third side of the package structure, pin X +1, pin X +2, pin Y … … are disposed on the fourth side of the package structure, and Y > X > 2N; the first side and the second side of the packaging structure are positioned at two opposite sides, and the third side and the fourth side of the packaging structure are positioned at two opposite sides.
8. A package structure comprising the quantum key distribution sender chip of claim 5, wherein: the packaging structure comprises N +1 optical fiber pins and Y-N-1 electrode pins; the pin 1, the pin 2, and the pin N +1 of … … are optical fiber output ports of the chip and are respectively connected with an optical fiber coupling-out module of the chip; pin N +2, pin N +3, pin Y … … are electrode pins of the chip; n is more than or equal to 2; y > N + 1.
9. The package structure of claim 8, wherein: the pin 1, the pin 2, the pin N +1 of … … are disposed on the first side of the package structure; the pin N +2, the pin N +3, and the pin … …, pin X, are disposed on the second side of the package structure; the pin X +1, the pin X +2, and the pin Y … … are disposed on a third side of the package structure; the second side and the third side of the packaging structure are positioned at two opposite sides, and the first side of the packaging structure is positioned between the second side and the third side of the packaging structure; y > X > N + 1.
10. A quantum key distribution transmitting terminal device is characterized in that: the quantum key distribution transmitting terminal chip comprises the quantum key distribution transmitting terminal chip according to any one of 1-4;
the system also comprises a signal laser, a synchronous laser, a wavelength division multiplexer and an optical circulator; n different wavelength output ends of the signal laser are respectively connected with N optical fiber input ports of the quantum key distribution transmitting end chip; n optical fiber output ports of the quantum key distribution transmitting end chip are connected with N input channels of a wavelength division multiplexer, the (N +1) th channel of the wavelength division multiplexer is connected with a synchronous laser, and a public output end of the wavelength division multiplexer is connected with an optical circulator; the signal light laser, the quantum key distribution transmitting end chip, the synchronous laser, the wavelength division multiplexer and the optical circulator are connected through polarization-maintaining optical fibers; n is more than or equal to 2.
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| CN201921215254.XU CN210380876U (en) | 2019-07-30 | 2019-07-30 | Quantum key distribution transmitting terminal chip, packaging structure and equipment |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110324144A (en) * | 2019-07-30 | 2019-10-11 | 江苏亨通问天量子信息研究院有限公司 | Quantum-key distribution transmitting terminal chip, encapsulating structure and equipment |
| WO2023246768A1 (en) * | 2022-06-22 | 2023-12-28 | 科大国盾量子技术股份有限公司 | Method for adjusting time delay difference between unequal-arm interferometer chip and time phase coding chip |
-
2019
- 2019-07-30 CN CN201921215254.XU patent/CN210380876U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110324144A (en) * | 2019-07-30 | 2019-10-11 | 江苏亨通问天量子信息研究院有限公司 | Quantum-key distribution transmitting terminal chip, encapsulating structure and equipment |
| CN110324144B (en) * | 2019-07-30 | 2023-09-22 | 江苏亨通问天量子信息研究院有限公司 | Quantum key distribution transmitting end chip, packaging structure and device |
| WO2023246768A1 (en) * | 2022-06-22 | 2023-12-28 | 科大国盾量子技术股份有限公司 | Method for adjusting time delay difference between unequal-arm interferometer chip and time phase coding chip |
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