CN210351431U - Projector control board and projector - Google Patents
Projector control board and projector Download PDFInfo
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- CN210351431U CN210351431U CN201920960108.3U CN201920960108U CN210351431U CN 210351431 U CN210351431 U CN 210351431U CN 201920960108 U CN201920960108 U CN 201920960108U CN 210351431 U CN210351431 U CN 210351431U
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Abstract
The utility model belongs to the technical field of the projection, a projecting apparatus control panel and projecting apparatus are provided. The projector control board comprises a PCB board and a main control module arranged on the first surface of the PCB board, wherein the main control module comprises a programmable dual-core processor integrated with an ARM architecture; the storage module, the audio processing module, the signal conversion module, the wireless communication module, the charging module and the interface module are arranged on the first surface of the PCB and connected with the main control module through wiring; the battery module, the fan interface module, the DLPC module and the optical machine interface module are arranged on the second surface of the PCB and used for providing power supply, and the first heat dissipation module is used for dissipating heat of components on the first surface of the PCB; and the second heat dissipation module is used for dissipating heat of the components on the second surface of the PCB. The influence of overhigh temperature on the working performance of the chip system is prevented, the heat dissipation of the whole machine is facilitated, and the area of a control panel is reduced.
Description
Technical Field
The utility model belongs to the technical field of the projection, especially, relate to a projector control board and projecting apparatus.
Background
With the continuous development and progress of science and technology, in recent years, various intelligent products are improved in the aspects of lightness, thinness and miniaturization, for example, a projector product which is widely popular in the market at present, a projector is also called a projector, is a device capable of projecting images or videos onto a curtain, can be connected with a computer, a VCD, a DVD, a BD, a game machine, a DV and the like through different interfaces to play corresponding video signals, and can be widely applied to families, offices, schools and entertainment places, and according to different working modes, the projectors are different in types such as CRT, LCD, DLP and the like.
Along with the development of intelligent projecting apparatus, increased more and more components and parts in the control panel of projecting apparatus and increased the intellectuality of projecting apparatus, strengthened the function of projecting apparatus, however the projecting apparatus can give out great heat when using, and the radiator to the projecting apparatus adopts the large tracts of land to place the radiator usually in order to reach radiating requirement, and this kind of radiating mode radiating efficiency is low, and has increased the projected volume.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a projecting apparatus control panel and projecting apparatus, the control panel radiating efficiency who aims at existence in solving traditional projecting apparatus is low, and has increased the problem of projected volume.
A projector control board comprising a PCB board including a first surface and a second surface opposite to the first surface, characterized in that the projector control board further comprises:
the main control module is arranged on the first surface of the PCB and comprises a programmable dual-core processor integrated with an ARM architecture;
the storage module, the audio processing module, the signal conversion module, the wireless communication module, the charging module and the interface module are arranged on the first surface of the PCB and connected with the main control module through wiring;
the battery module, the fan interface module, the DLPC module and the optical-mechanical interface module are arranged on the second surface of the PCB and used for providing power supply;
the first heat dissipation module is used for dissipating heat of the components on the first surface of the PCB; and the second heat dissipation module is used for dissipating heat of the components on the second surface of the PCB. Fan interface module
In one embodiment, the first heat dissipation module includes a first heat dissipation fan and a first heat dissipation channel, the second heat dissipation module includes a second heat dissipation fan and a second heat dissipation channel, the first surface of the PCB is disposed opposite to the air opening of the first heat dissipation channel, and the second surface of the PCB is disposed opposite to the air opening of the second heat dissipation channel.
In one embodiment, the interface module includes a USB interface, an earphone interface, a TF interface, an external power interface, and a Type-C interface disposed on the same side of the first surface of the PCB.
In one embodiment, the master control module comprises an MSD6a638 chipset.
In one embodiment, the signal conversion module is connected to the Type-C interface and is configured to convert a Type-C signal input by the Type-C interface into an HDMI signal.
In one embodiment, the audio processing module is connected to the earphone interface, and is configured to process and convert the audio signal output by the main control module to generate an analog signal, and output the analog signal to an external audio device through the earphone interface.
In one embodiment, the charging module comprises a charging management chip and an electric quantity detection chip; the charging management chip is connected with the main control chip and the battery module, the electric quantity detection chip is used for detecting an electric quantity signal of the battery module, and the main control chip controls the charging management chip to charge the battery module according to the electric quantity signal.
In one embodiment, the power chip is connected to the external power interface, and the power chip is used for converting an external power into an optical-mechanical power to drive the optical-mechanical module.
In one embodiment, the optical-mechanical interface module includes an optical-mechanical power supply interface and a flexible flat cable interface, the optical-mechanical power supply interface is connected to the power chip, and the flexible flat cable interface is connected to the DLPC module and outputs an optical-mechanical control signal output by the DLPC module to the optical-mechanical module.
Further, there is provided a projector including: a housing; and the projector control board is arranged in the shell.
According to the projector control board, the main control chip with relatively low power consumption, the storage module, the audio processing module, the signal conversion module, the wireless communication module, the charging module and the interface module are arranged on the first surface of the circuit board, and heat dissipation is performed through the first heat dissipation module; the battery module, the DLPC module and the optical machine interface module cooling fan interface which are high in power and calorific capacity are used for cooling on the second surface of the circuit board through the second cooling module, so that the second surface is prevented from being influenced by overhigh temperature on the working performance of a chip system, the cooling of the whole machine is facilitated, and the area of a control panel is reduced.
Drawings
Fig. 1 is a schematic circuit diagram of a PCB board of a projector control board according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a first surface structure of a PCB board of a projector control board according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a second surface structure of a PCB board of a projector control board according to an embodiment of the present invention;
fig. 4 is a schematic diagram of heat dissipation of the PCB board of the projector control board provided by the embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Fig. 1 is a schematic circuit structure diagram of a PCB board of a projector control board provided by an embodiment of the present invention. As shown in fig. 1, the utility model provides a projector control board, this projector control board include PCB board 100, and PCB board 100 includes first surface and the second surface relative with the first surface, and projector control board still includes:
the main control module 101 is arranged on the first surface of the PCB 100, and the main control module 101 comprises a programmable dual-core processor integrated with an ARM architecture;
the storage module 102, the audio processing module 103, the signal conversion module 104, the wireless communication module 105, the charging module 106 and the interface module 107 are arranged on the first surface of the PCB 100 and connected with the main control module 101 through wires;
a battery module 201 arranged on the second surface of the PCB 100 for providing power, a fan interface module 202 for dissipating heat, a DLPC module 203 and an optical-mechanical interface module 204;
a first heat dissipation module 200 for dissipating heat of components on the first surface of the PCB; and a second heat dissipation module 300 for dissipating heat of components on the second surface of the PCB.
In this embodiment, the first surface of the PCB 100 is the front surface of the PCB 100, the second surface of the PCB 100 is the back surface of the PCB 100, most of the control chip systems are centrally disposed on the front surface of the PCB 100, for example, the main control module 101, the audio processing module 103, the signal conversion module 104, etc., heat dissipation is performed through the first heat dissipation module 200, the high-power and high-heat-generation components such as the battery, the optical-mechanical interface module 204, the DLPC module 203, etc., are centrally disposed on the back surface of the PCB 100, heat dissipation is performed through the second heat dissipation module 300, and heat dissipation processing is separately performed on electronic components with different heat generation amounts, so that on one hand, the influence of overhigh temperature on the working performance of each chip system can be prevented, on the other hand, heat dissipation of the whole machine is.
As shown in fig. 4, in one embodiment, the first heat dissipation module 200 includes a first heat dissipation fan 201 and a first heat dissipation channel 202, and the second heat dissipation module 300 includes a second heat dissipation fan 301 and a second heat dissipation channel 302, wherein a first surface of the PCB 100 is disposed opposite to an air opening of the first heat dissipation channel 202, and a second surface of the PCB is disposed opposite to an air opening of the second heat dissipation channel 302. The components arranged on the first surface of the PCB 100 and the components arranged on the second surface of the PCB 100 are respectively cooled through the first cooling channel 202 and the second cooling channel 302, which are not affected by each other, and the high heat of the second surface of the PCB 100 does not affect the working performance of each chip system on the first surface of the PCB 100.
In one embodiment, the interface module 107 includes a USB interface, a headphone interface, a TF interface, an external power interface, and a Type-C interface disposed on the same side of the first surface of the PCB board 100. The interface module 107 is disposed on the same side of the same surface of the PCB 100, so that the components of the PCB are more compactly distributed, and the interface is exposed outside the host.
In one embodiment, the USB interface includes a USB2.0 interface, which can be used to connect an external device such as a USB disk. The TF interface is used for connecting an external T-Flash Card, and the T-Flash Card is used as an external storage to be connected with the main control chip so as to input data. The external power interface is a circular dc power interface for accessing an external dc power to charge the battery module 201.
In one embodiment, the main control module 101 includes a programmable dual-core processor integrated with an ARM architecture, the main control module 101 adopts an MSD6a638 chip system produced by MSTAR corporation, and the MSD6a638 chip system is a conteex a53 architecture of ARM, so that the MSD6a638 chip system has the advantages of high performance and low power consumption, and is an extensible system-on-chip developed for various market demands such as smart phones and high-performance servers.
In one embodiment, the signal conversion module 104 is connected to the Type-C interface, and is configured to convert a Type-C signal input by the Type-C interface into an HDMI signal, and output the HDMI signal to the main control chip. In this embodiment, the signal conversion module 104 adopts a USB Type-C audio/video format conversion chip manufactured by kuntai corporation (chrntel) and having a model number of CH7211A, conforms to the latest Type-C standard of the USB-IF association, supports a DisplayPort alternative Mode of USB Type-C, is suitable for various USB Type-C audio/video interface conversion devices and peripheral base audio/video conversion docks, and can support various portable terminal devices having USB Type-C interfaces.
In one embodiment, the audio processing module 103 is connected to a headphone interface, and is configured to process and convert the audio signal output by the main control module 101 to generate an analog signal, and output the analog signal to an external audio device through the headphone interface. In a preferred embodiment, the second surface of the projector control board is further provided with a speaker 206, the speaker 206 is connected with the audio processing module 103, and when no external audio device is connected to the headphone interface, the analog signal generated by the audio signal processing and conversion can be directly played through the speaker 206. The audio signal processing adopts a system chip with the model of AK 7755.
In one embodiment, the charging module 106 includes a charging management chip and a power detection chip; the charging management chip is connected with the main control chip and the battery module 201, the electric quantity detection chip is used for detecting an electric quantity signal of the battery module 201, and the main control chip controls the charging management chip to charge the battery module 201 according to the electric quantity signal.
In one embodiment, wireless communication module 105 includes a WIFI radio.
In one embodiment, the power chip 205 is connected to an external power interface, and the power chip 205 is used for converting an external power into an optical mechanical power to drive the optical mechanical module.
In one embodiment, the optical-mechanical interface module 204 includes an optical-mechanical power supply interface and a flexible flat cable interface, the optical-mechanical power supply interface is connected to the power chip 205, and the flexible flat cable interface is connected to the DLPC module 203, and outputs an optical-mechanical control signal output by the DLPC module 203 to the optical-mechanical module.
The second surface of the PCB 100 is further provided with an infrared interface module 207, and the infrared interface module 207 is connected to the main control module 101, and is used for connecting an infrared radio frequency device and receiving an infrared signal sent by an external remote control device. The remote control device is configured outside the projector and can control the projector through the remote control device, specifically, the remote control device transmits an infrared signal to the infrared radio frequency device, the infrared radio frequency device receives the infrared signal and then transmits the infrared signal to the main control module 101 through the infrared interface module 207, and the main control module 101 controls the projector to realize remote infrared control of the projector.
Further, there is provided a projector including: the casing and locate the above-mentioned projector control panel in the casing.
The utility model provides a projector control board includes the PCB board, and the PCB board includes first surface and second surface, and projector control board still includes: the main control module is arranged on the first surface of the PCB and comprises a programmable dual-core processor integrated with an ARM framework; the storage module, the audio processing module, the signal conversion module, the wireless communication module, the charging module and the interface module are arranged on the first surface of the PCB and connected with the main control module through wiring; the battery module, the fan interface module, the DLPC module and the optical-mechanical interface module are arranged on the second surface of the PCB and used for providing power supply; the first heat dissipation module is used for dissipating heat of the components on the first surface of the PCB; and the second heat dissipation module is used for dissipating heat of the components on the second surface of the PCB. In this embodiment, the first surface of the PCB is the front surface of the PCB, the second surface of the PCB is the back surface of the PCB, and most of the control chip systems, such as the main control module, the audio processing module, the signal conversion module, and the like, are collectively disposed on the front surface of the PCB, and heat dissipation is performed through the first heat dissipation module; the back of the PCB is intensively provided with high-power and high-heat-productivity components such as a battery, an optical machine interface module and a DLPC module, the second heat dissipation module is used for dissipating heat, and electronic components with different heat productivity are separately subjected to heat dissipation treatment, so that on one hand, the influence of overhigh temperature on the working performance of each chip system can be prevented, on the other hand, the heat dissipation of the whole machine is facilitated, and the area of a control panel is reduced.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A projector control board comprising a PCB board including a first surface and a second surface opposite to the first surface, characterized in that the projector control board further comprises:
the main control module is arranged on the first surface of the PCB and comprises a programmable dual-core processor integrated with an ARM architecture;
the storage module, the audio processing module, the signal conversion module, the wireless communication module, the charging module and the interface module are arranged on the first surface of the PCB and connected with the main control module through wiring;
the battery module, the fan interface module, the DLPC module and the optical-mechanical interface module are arranged on the second surface of the PCB and used for providing power supply;
the first heat dissipation module is used for dissipating heat of the components on the first surface of the PCB; and the second heat dissipation module is used for dissipating heat of the components on the second surface of the PCB.
2. The projector control board as claimed in claim 1, wherein the first heat dissipation module includes a first heat dissipation fan and a first heat dissipation channel, and the second heat dissipation module includes a second heat dissipation fan and a second heat dissipation channel, the first surface of the PCB board is disposed opposite to the air opening of the first heat dissipation channel, and the second surface of the PCB board is disposed opposite to the air opening of the second heat dissipation channel.
3. The projector control board of claim 1, wherein the interface module comprises a USB interface, an earphone interface, a TF interface, an external power interface, and a Type-C interface disposed at the same side of the first surface of the PCB board.
4. The projector control board of claim 1, wherein the master module comprises an MSD6a638 chip system.
5. The projector control board according to claim 3, wherein the signal conversion module is connected to the Type-C interface, and is configured to convert a Type-C signal input from the Type-C interface into an HDMI signal.
6. The projector control board of claim 3, wherein the audio processing module is connected to the earphone interface, and is configured to process and convert the audio signal output by the main control module to generate an analog signal, and output the analog signal to an external audio device through the earphone interface.
7. The projector control board of claim 1 wherein the charging module comprises a charge management chip and a charge detection chip; the charging management chip is connected with the main control module and the battery module, the electric quantity detection chip is used for detecting an electric quantity signal of the battery module, and the main control module controls the charging management chip to charge the battery module according to the electric quantity signal.
8. The projector control panel of claim 3, further comprising: and the power supply chip is connected with the external power supply interface and used for converting an external power supply into an optical machine power supply to drive the optical machine module.
9. The projector control board of claim 8, wherein the opto-mechanical interface module comprises an opto-mechanical power supply interface and a flexible flat cable interface, the opto-mechanical power supply interface is connected to the power chip, and the flexible flat cable interface is connected to the DLPC module and outputs the opto-mechanical control signal output by the DLPC module to the opto-mechanical module.
10. A projector, characterized in that the projector comprises: a housing and a projector control board according to any one of claims 1 to 9 provided in the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920960108.3U CN210351431U (en) | 2019-06-21 | 2019-06-21 | Projector control board and projector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920960108.3U CN210351431U (en) | 2019-06-21 | 2019-06-21 | Projector control board and projector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210351431U true CN210351431U (en) | 2020-04-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920960108.3U Active CN210351431U (en) | 2019-06-21 | 2019-06-21 | Projector control board and projector |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210351431U (en) |
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2019
- 2019-06-21 CN CN201920960108.3U patent/CN210351431U/en active Active
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