CN210346973U - Compact high-temperature-resistant pressure transmitter - Google Patents

Compact high-temperature-resistant pressure transmitter Download PDF

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Publication number
CN210346973U
CN210346973U CN201921474280.4U CN201921474280U CN210346973U CN 210346973 U CN210346973 U CN 210346973U CN 201921474280 U CN201921474280 U CN 201921474280U CN 210346973 U CN210346973 U CN 210346973U
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CN
China
Prior art keywords
temperature
resistant
base
upper cover
circuit board
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CN201921474280.4U
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Chinese (zh)
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黄韬
张鄢煜
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Jiangsu Shengshiming Technology Co ltd
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Jiangsu Shengshiming Technology Co ltd
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Abstract

The utility model relates to a compact high temperature resistant pressure transmitter, which comprises a base, a high temperature resistant pressure measuring element, a pressing cap, a high temperature resistant lead, a high temperature resistant circuit board and an upper cover component; the base is internally provided with an installation cavity, the high-temperature-resistant pressure measuring element is arranged in the installation cavity, a compression cap is screwed in the installation cavity, and the high-temperature-resistant pressure measuring element is installed in the base through the compression cap; the upper cover assembly comprises an upper cover, a high-temperature-resistant injection molding joint and a high-temperature-resistant cable, the upper cover is welded on the base in a laser mode, the high-temperature-resistant injection molding joint is fixed on the upper cover, the high-temperature-resistant circuit board is welded on the high-temperature-resistant injection molding joint, and the high-temperature-resistant circuit board is located in the installation cavity of the base; the high-temperature-resistant pressure measuring element is connected with the high-temperature-resistant circuit board through a high-temperature-resistant lead; one end of the high-temperature-resistant cable is connected with the high-temperature-resistant circuit board, and the other end of the high-temperature-resistant cable penetrates out of the mounting cavity of the base through the upper cover and the high-temperature injection molding connector. Through the utility model discloses, can be applicable to the pressure measurement of high temperature trade.

Description

Compact high-temperature-resistant pressure transmitter
Technical Field
The utility model relates to a compact high temperature resistant pressure transmitter belongs to sensor technical field.
Background
In typical hydraulic and air pressure measurement, because the temperature of the measured medium reaches nearly 180 ℃, and the local environment temperature of the test point reaches nearly 150 ℃, in order to solve the temperature resistance problem of the pressure transmitter in the pressure test process, generally, the pressure transmitter with a radiating fin or a buffer coil is adopted, so that the temperature of the medium at the measurement point is partially naturally reduced through the radiating fin or the buffer coil, and the temperature bearing range of the conventional pressure transmitter is reached. However, in some application places, the actual pressure value must be accurately measured at high temperature under the influence of equipment installation space and the requirement of measurement working conditions, so that the mode of loading the radiating fins or the buffer coil pipes by the conventional pressure sensor cannot meet the test requirement.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a rational in infrastructure, the easy high temperature resistant pressure transmitter of manufacturing to the drawback that above-mentioned prior art exists.
The utility model aims at realizing like this, a compact high temperature resistant pressure transmitter, characterized by: the device comprises a base, a high-temperature-resistant pressure measuring element, a pressing cap, a high-temperature-resistant lead, a high-temperature-resistant circuit board and an upper cover assembly;
the high-temperature-resistant pressure measuring device comprises a base, a pressure cap, a pressure sensor and a pressure sensor, wherein an installation cavity is formed in the base, a high-temperature-resistant pressure measuring element is arranged in the installation cavity, the pressure cap is screwed in the installation cavity, and the high-temperature-resistant pressure measuring element is;
the upper cover assembly comprises an upper cover, a high-temperature-resistant injection molding joint and a high-temperature-resistant cable, the upper cover is welded on the base in a laser mode, the high-temperature-resistant injection molding joint is fixed on the upper cover, the high-temperature-resistant circuit board is welded on the high-temperature-resistant injection molding joint, and the high-temperature-resistant circuit board is located in the installation cavity of the base;
the high-temperature-resistant pressure measuring element is connected with the high-temperature-resistant circuit board through a high-temperature-resistant lead; one end of the high-temperature-resistant cable is connected with the high-temperature-resistant circuit board, and the other end of the high-temperature-resistant cable penetrates through the upper cover and the high-temperature injection joint and penetrates out of the mounting cavity of the base through the upper cover and the high-temperature injection joint.
The base is made of metal 304.
The high-temperature-resistant pressure measuring element adopts a high-performance ceramic piezoresistive core body.
The inner wall of the installation cavity of the base is provided with an internal thread, the outer wall of the pressing cap is provided with an external thread, and the pressing cap is screwed in the installation cavity of the base.
And a gasket is arranged between the high-temperature-resistant pressure measuring element and the base.
The high-temperature-resistant circuit board is welded on a lead-out pin on the high-temperature-resistant injection molding joint, and the high-temperature-resistant circuit board and a lead welding part are wrapped by filling the high-temperature-resistant injection molding joint with the cold glue.
The utility model has the advantages of reasonable and simple structure, manufacturing is easy, convenient to use, through the utility model discloses, a pair of compact high temperature resistant pressure transmitter is provided, including base (shell and base are integrative), high temperature resistant pressure measurement element, compress tightly cap, high temperature resistant circuit board, high temperature resistant lead wire, upper cover subassembly (including upper cover, high temperature resistant injection joint, high temperature resistant cable conductor). Wherein, the base is made of metal 304, and is integrally processed with the shell, and the high-temperature resistant pressure core (high-temperature resistant pressure measuring element) is a high-performance ceramic piezoresistive core; installing a high-temperature-resistant pressure measuring element in the base through a pressing cap; connecting the high-temperature-resistant pressure measuring element with the high-temperature-resistant circuit board by using a high-temperature-resistant lead; the high-temperature resistant circuit board is directly welded on a lead-out pin on the high-temperature resistant injection molding joint, and the high-temperature resistant circuit board and a lead welding part are wrapped by filling the high-temperature resistant injection molding joint with the cold glue; the upper cover assembly and the shell are connected together through laser welding.
The novel structure of this design is reasonable simple, adopts ceramic piezoresistive core body as high temperature resistant pressure measurement component, and ceramic piezoresistive core body can satisfy the pressure measurement in-40 ~200 ℃ temperature, and measurement accuracy reaches 0.2% FS.
Through the utility model, the compact high temperature resistant pressure transmitter of the utility model has the advantages that the base and the shell are integrally processed, and the high temperature resistant injection molding joint and the upper cover can be injection molded; the base is made of stainless steel materials which can be 304 stainless steel or 316L materials, and the high-temperature-resistant injection molding connector, the high-temperature-resistant lead and the cable are made of silica gel materials. The pressure measuring element adopts a high-performance ceramic piezoresistive core body; when in use, the electrical output mode is as follows: there are output signals of 4-20MA, 0-10V, etc. The output signal of the product is led out through the high-temperature-resistant injection molding connector, and a portable high-temperature-resistant four-core plug-in can be connected to the tail end of the product, so that the operation is more convenient in the wiring process; the base is internally filled with the cold glue to wrap the high-temperature resistant circuit board, so that the circuit part of the product is protected.
The utility model relates to a pressure measurement suitable for most high temperature trades can bear by within the measured medium 200 ℃, all hydraulic pressure and barometry within the test environment temperature 150 ℃, and the pressure measurement in various high temperature occasions can wide application in work for million times.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
In the figure: the high-temperature-resistant pressure measuring device comprises a base 1, a gasket 2, a high-temperature-resistant pressure measuring element 3, a pressing cap 4, a high-temperature-resistant lead 5, a high-temperature-resistant circuit board 6, an upper cover assembly 7, a high-temperature-resistant injection molding joint 8, a high-temperature-resistant cable 9 and an upper cover 10.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and the accompanying description.
A compact high temperature resistant pressure transmitter comprises a base 1, a high temperature resistant pressure measuring element 3, a pressing cap 4, a high temperature resistant lead 5, a high temperature resistant circuit board 6 and an upper cover assembly 7; a mounting cavity is arranged in the base 1, the high-temperature-resistant pressure measuring element 3 is arranged in the mounting cavity, a compression cap 4 is screwed in the mounting cavity, and the high-temperature-resistant pressure measuring element 3 is mounted in the base 1 through the compression cap 4; the upper cover assembly 7 comprises an upper cover 10, a high-temperature-resistant injection molding connector 8 and a high-temperature-resistant cable 9, the upper cover 10 is welded on the base 1 in a laser mode, the high-temperature-resistant injection molding connector 8 is fixed on the upper cover, the high-temperature-resistant circuit board 6 is welded on the high-temperature-resistant injection molding connector 8, and the high-temperature-resistant circuit board 6 is located in a mounting cavity of the base 1. The high-temperature-resistant pressure measuring element 3 is connected with the high-temperature-resistant circuit board 6 through a high-temperature-resistant lead 5; one end of a high-temperature-resistant cable 9 is connected with the high-temperature-resistant circuit board 6, the other end of the high-temperature-resistant cable passes through the upper cover 10 and the high-temperature injection joint 8, and the high-temperature injection joint 8 penetrates out of the installation cavity of the base 1 through the upper cover.
Further, the material of the base 1 is metal 304. The high-temperature resistant pressure measuring element 3 adopts a high-performance ceramic piezoresistive core body. The inner wall of the installation cavity of the base 1 is provided with an internal thread, the outer wall of the pressing cap 4 is provided with an external thread, and the pressing cap 4 is screwed in the installation cavity of the base 1 through the thread. A gasket 2 is arranged between the high temperature resistant pressure measuring element 3 and the base 1. The high-temperature resistant circuit board 6 is welded on the lead-out terminal pin on the high-temperature resistant injection molding joint 8, and the high-temperature resistant circuit board 6 and the lead welding part are wrapped by the cold glue filled in the high-temperature injection molding joint 8.

Claims (6)

1. The utility model provides a compact high temperature resistant pressure transmitter which characterized by: the device comprises a base (1), a high-temperature-resistant pressure measuring element (3), a pressing cap (4), a high-temperature-resistant lead (5), a high-temperature-resistant circuit board (6) and an upper cover assembly (7);
the high-temperature-resistant pressure measuring device is characterized in that an installation cavity is formed in the base (1), the high-temperature-resistant pressure measuring element (3) is arranged in the installation cavity, a compression cap (4) is screwed in the installation cavity, and the high-temperature-resistant pressure measuring element (3) is installed in the base (1) through the compression cap (4);
the upper cover assembly (7) comprises an upper cover (10), a high-temperature-resistant injection molding connector (8) and a high-temperature-resistant cable (9), the upper cover (10) is welded on the base (1) in a laser mode, the high-temperature-resistant injection molding connector (8) is fixed on the upper cover, the high-temperature-resistant circuit board (6) is welded on the high-temperature-resistant injection molding connector (8), and the high-temperature-resistant circuit board (6) is located in a mounting cavity of the base (1);
the high-temperature-resistant pressure measuring element (3) is connected with the high-temperature-resistant circuit board (6) through a high-temperature-resistant lead (5); one end of the high-temperature-resistant cable (9) is connected with the high-temperature-resistant circuit board (6), the other end of the high-temperature-resistant cable penetrates through the upper cover (10) and the high-temperature injection molding joint (8), and the mounting cavity of the base (1) is penetrated through the upper cover (10) and the high-temperature injection molding joint (8).
2. The compact, high temperature resistant pressure transmitter of claim 1, wherein: the base (1) is made of metal 304.
3. The compact, high temperature resistant pressure transmitter of claim 1, wherein: the high-temperature-resistant pressure measuring element (3) adopts a high-performance ceramic piezoresistive core body.
4. The compact, high temperature resistant pressure transmitter of claim 1, wherein: the inner wall of the installation cavity of the base (1) is provided with an internal thread, the outer wall of the pressing cap (4) is provided with an external thread, and the pressing cap (4) is screwed in the installation cavity of the base (1) in a threaded manner.
5. The compact, high temperature resistant pressure transmitter of claim 1, wherein: and a gasket (2) is arranged between the high-temperature-resistant pressure measuring element (3) and the base (1).
6. The compact, high temperature resistant pressure transmitter of claim 1, wherein: the high-temperature-resistant circuit board (6) is welded on the lead-out pins on the high-temperature-resistant injection molding joint (8), and the high-temperature-resistant circuit board (6) and the lead welding part are wrapped by the cold glue filled in the high-temperature injection molding joint (8).
CN201921474280.4U 2019-09-06 2019-09-06 Compact high-temperature-resistant pressure transmitter Active CN210346973U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921474280.4U CN210346973U (en) 2019-09-06 2019-09-06 Compact high-temperature-resistant pressure transmitter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921474280.4U CN210346973U (en) 2019-09-06 2019-09-06 Compact high-temperature-resistant pressure transmitter

Publications (1)

Publication Number Publication Date
CN210346973U true CN210346973U (en) 2020-04-17

Family

ID=70177134

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921474280.4U Active CN210346973U (en) 2019-09-06 2019-09-06 Compact high-temperature-resistant pressure transmitter

Country Status (1)

Country Link
CN (1) CN210346973U (en)

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Date Code Title Description
GR01 Patent grant
GR01 Patent grant
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of utility model: A compact high temperature resistant pressure transmitter

Effective date of registration: 20220118

Granted publication date: 20200417

Pledgee: China Construction Bank Corporation Yizheng sub branch

Pledgor: JIANGSU SHENGSHIMING TECHNOLOGY Co.,Ltd.

Registration number: Y2022980000673

PE01 Entry into force of the registration of the contract for pledge of patent right
PC01 Cancellation of the registration of the contract for pledge of patent right

Date of cancellation: 20230129

Granted publication date: 20200417

Pledgee: China Construction Bank Corporation Yizheng sub branch

Pledgor: JIANGSU SHENGSHIMING TECHNOLOGY Co.,Ltd.

Registration number: Y2022980000673

PC01 Cancellation of the registration of the contract for pledge of patent right
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of utility model: A compact high temperature resistant pressure transmitter

Effective date of registration: 20230201

Granted publication date: 20200417

Pledgee: China Construction Bank Corporation Yizheng sub branch

Pledgor: JIANGSU SHENGSHIMING TECHNOLOGY Co.,Ltd.

Registration number: Y2023980031933

PE01 Entry into force of the registration of the contract for pledge of patent right