CN210346618U

CN210346618U - Wafer frame roughness detection device

Info

Publication number: CN210346618U
Application number: CN201921084226.9U
Authority: CN
Inventors: 王宜
Original assignee: Jiangsu Simike Electronic Technology Co ltd
Current assignee: Jiangsu Simike Electronic Technology Co ltd
Priority date: 2019-07-11
Filing date: 2019-07-11
Publication date: 2020-04-17
Anticipated expiration: 2029-07-11

Abstract

The utility model belongs to the technical field of roughness detection, especially, be a wafer frame roughness detection device, including roughness detector main part and camera subassembly, pass through cable electric connection between roughness detector main part and the camera subassembly, the camera subassembly includes grab handle and camera, be connected with positioning mechanism between grab handle and the camera, positioning mechanism includes link, movable groove, clamp plate, compression spring, hand screw rod, rubber buffer pad and scale plate; through grab handle and the camera that positioning mechanism connects, camera fixed surface's scale plate is installed in the inside of link, and the one end of the screw rod is twisted to the hand simultaneously closes the inside of embedding the link soon, and the hand is twisted the screw rod and is passed through the bearing and be connected with the clamp plate rotation, clamp plate surface adhesion's rubber buffer pad and scale plate contact simultaneously, the scale plate of being convenient for passes through the clamp plate, the hand is twisted screw rod and rubber buffer pad and is fixed in the inside of link, the convenience that grab handle and camera are connected has been increased.

Description

Wafer frame roughness detection device

Technical Field

The utility model belongs to the technical field of the roughness detects, concretely relates to wafer frame roughness detection device.

Background

Wafer frame roughness detection device, be used for detecting the roughness on wafer frame surface, observe the slot through the camera, make the picture of shooing transmit for the roughness detector main part through the cable, carry out the analysis through the roughness detector main part to the picture, wafer frame mainly plays the effect of placing and carrying the wafer in semiconductor production, in order to simplify the transportation and reduce contaminated risk as far as possible, chip manufacturer utilizes wafer frame to carry and store the wafer, make and require highly to the inside slot roughness of frame, the inside slot of traditional wafer frame is difficult to observe, cause the slot roughness to detect the degree of difficulty and increase, detect the problem that consumes time simultaneously.

SUMMERY OF THE UTILITY MODEL

To solve the problems set forth in the background art described above. The utility model provides a wafer frame roughness detection device has that the wafer frame slot detects conveniently, consumes the less characteristics of time.

In order to achieve the above object, the utility model provides a following technical scheme: a wafer frame flatness detection device comprises a flatness detection instrument main body and a camera assembly, wherein the flatness detection instrument main body is electrically connected with the camera assembly through a cable, the camera assembly comprises a grab handle and a camera, a positioning mechanism is connected between the grab handle and the camera, the positioning mechanism comprises a connecting frame, a movable groove, a pressing plate, a compression spring, a hand-screwed screw rod, a rubber cushion pad and a scale plate, the connecting frame is welded at one end of the grab handle, the movable groove is formed in the connecting frame, the compression spring is fixed in the movable groove, the pressing plate is movably arranged in the movable groove through the compression spring, the hand-screwed screw rod is screwed and embedded into the connecting frame, the lower end of the hand-screwed screw rod is rotatably connected with the pressing plate through a bearing, the rubber cushion pad is adhered to one end of the pressing plate, one end of the scale plate is fixed on the surface of the camera, the other end of the scale plate is inserted into the inside of the connecting frame and contacts with the rubber cushion pad.

As the utility model discloses a preferred technical scheme of wafer frame roughness detection device, the both sides surface of camera tip all is fixed with the slot probe rod, spacing rubber wheel is installed to the side surface of camera.

As the utility model discloses a preferred technical scheme of wafer frame roughness detection device, the tip of slot probe rod is 3cm apart from the horizontal distance of camera tip, the tip of slot probe rod is 2cm apart from the horizontal distance of spacing rubber wheel tip.

As the utility model discloses a preferred technical scheme of wafer frame roughness detection device, the camera that the grab handle tip passes through positioning mechanism to be connected is provided with two altogether the camera is symmetrical about the axis of grab handle.

As the utility model discloses a preferred technical scheme of wafer frame roughness detection device, the clamp plate is the tubbiness structure, compression spring is helical structure, just compression spring's one end welding is at the surface of clamp plate, compression spring's the other end welding is on the surface of activity groove.

As the utility model discloses a preferred technical scheme of wafer frame roughness detection device, rubber buffer is circular structure, just rubber buffer's lower surface is equidistant to be seted up flutedly.

As the utility model discloses a preferred technical scheme of wafer frame roughness detection device, the scale plate is bar platelike structure, just the surface of scale plate is equal to be opened between and is equipped with the scale mark.

Compared with the prior art, the beneficial effects of the utility model are that:

1. grab handle and camera through positioning mechanism connects, the inside at the link is installed to camera fixed surface's scale plate, the one end of the screw rod is twisted to the hand simultaneously closes the inside of embedding the link soon, and the screw rod is twisted to the hand passes through the bearing and is connected with the clamp plate rotation, clamp plate surface bonding's rubber buffer pad and scale plate contact simultaneously, the scale plate of being convenient for passes through the clamp plate, the hand is twisted the inside at the link of screw rod and rubber buffer pad fixation, the convenience that grab handle and camera are connected has been increased, welded compression spring between activity groove and the clamp plate simultaneously, when being convenient for the hand to twist the screw rod and circle round, the clamp plate resets in the inside of activity groove, the convenience of scale plate in the inside angle modulation of link has been increased, the time that the slot roughness detected has.

2. Through camera fixed surface's slot probe rod, when making a video recording the subassembly and removing in wafer frame, the slot probe rod removes in the inside of frame spout, the camera of being convenient for detects the frame spout, camera fixed surface's spacing rubber wheel removes at the internal surface of frame simultaneously, make the camera carry on spacingly through spacing rubber wheel, the uniformity that camera and frame spout relative movement time interval kept has been improved, the precision that the roughness of frame spout detected has been improved, the convenience that the wafer frame roughness detected has been improved.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic structural view of the camera module of the present invention;

FIG. 3 is a schematic cross-sectional view taken along line A-A of FIG. 2;

fig. 4 is a schematic structural diagram of the present invention;

in the figure: 1. a flatness detector main body; 2. a camera assembly; 3. a handle; 4. a camera; 5. a connecting frame; 6. a movable groove; 7. pressing a plate; 8. a compression spring; 9. screwing the screw rod by hand; 10. a rubber cushion pad; 11. a scale plate; 12. a trench probe; 13. and a limiting rubber wheel.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Examples

Referring to fig. 1-4, the present invention provides a technical solution: a wafer frame flatness detection device comprises a flatness detection instrument main body 1 and a camera assembly 2, wherein the flatness detection instrument main body 1 is electrically connected with the camera assembly 2 through a cable, the camera assembly 2 comprises a grab handle 3 and a camera 4, a positioning mechanism is connected between the grab handle 3 and the camera 4, the positioning mechanism comprises a connecting frame 5, a movable groove 6, a pressing plate 7, a compression spring 8, a hand-screwed screw rod 9, a rubber buffer cushion 10 and a scale plate 11, the connecting frame 5 is welded at one end of the grab handle 3, the movable groove 6 is arranged in the connecting frame 5, the compression spring 8 is fixed in the movable groove 6, the pressing plate 7 is movably arranged in the movable groove 6 through the compression spring 8, the hand-screwed screw rod 9 is screwed and embedded in the connecting frame 5, the lower end of the hand-screwed screw rod 9 is rotatably connected with the pressing plate 7 through a bearing, the rubber buffer cushion 10 is adhered to one end of the pressing plate 7, one end of the scale plate 11 is fixed on the surface of the camera 4, and the other end of the scale plate 11 is inserted into the inside of the connecting frame 5 and contacts the rubber bumper 10.

In this embodiment, through grab handle 3 and camera 4 that positioning mechanism connects, the inside at link 5 is installed to camera 4 fixed surface's scale plate 11, the inside of link 5 is closed to the one end of twisting screw rod 9 soon simultaneously, and hand is twisted screw rod 9 and is rotated with clamp plate 7 through the bearing and be connected, clamp plate 7 surface adhesion's rubber buffer 10 and scale plate 11 contact simultaneously, be convenient for scale plate 11 to pass through clamp plate 7, hand is twisted screw rod 9 and rubber buffer 10 and is fixed in the inside of link 5, the convenience of grab handle 3 and camera 4 connection has been increased, welded compression spring 8 between activity groove 6 and the clamp plate 7 simultaneously, when being convenient for hand is twisted screw rod 9 and is convoluteed, clamp plate 7 resets in the inside of activity groove 6, the convenience of scale plate 11 at the inside angle modulation of link 5 has been increased.

Specifically, the two side surfaces of the end part of the camera 4 are both fixed with a groove probe rod 12, the side surface of the camera 4 is provided with a limiting rubber wheel 13, the horizontal distance from the end part of the groove probe rod 12 to the end part of the camera 4 is 3cm, and the horizontal distance from the end part of the groove probe rod 12 to the end part of the limiting rubber wheel 13 is 2 cm.

In this embodiment, slot probe rod 12 through 4 fixed surface of camera, make when camera subassembly 2 removes in the wafer frame, slot probe rod 12 removes in the inside of frame spout, it detects the frame spout to be convenient for camera 4, simultaneously camera 4 fixed surface's spacing rubber wheel 13 removes at the internal surface of frame, it is spacing to make camera 4 carry out through spacing rubber wheel 13, the uniformity that camera 4 and frame spout relative movement time interval kept has been improved, the precision that the roughness of frame spout detected has been improved, the convenience that the wafer frame roughness detected has been improved.

Specifically, two cameras 4 connected with the end of the grab handle 3 through the positioning mechanism are arranged, and the two cameras 4 are symmetrical about the central axis of the grab handle 3.

In this embodiment, the two cameras 4 are symmetrical about the central axis of the handle 3, so that the two symmetrical cameras 4 can conveniently detect the groove in the frame.

Specifically, the pressing plate 7 is of a barrel-shaped structure, the compression spring 8 is of a spiral structure, one end of the compression spring 8 is welded on the outer surface of the pressing plate 7, and the other end of the compression spring 8 is welded on the surface of the movable groove 6.

In this embodiment, the pressing plate 7 having a barrel-shaped structure and the compression spring 8 having a spiral structure facilitate the resetting of the pressing plate 7 after the movement.

Specifically, the rubber cushion pad 10 is of a circular structure, and grooves are formed in the lower surface of the rubber cushion pad 10 at equal intervals.

In this embodiment, set up notched rubber buffer 10 through the lower surface equidistant, increased the roughness of rubber buffer 10 lower surface, improved the stability of rubber buffer 10 and scale plate 11 contact.

Specifically, the scale plate 11 is a strip-shaped plate structure, and scale marks are equally spaced on the surface of the scale plate 11.

In this embodiment, the scale plates 11 provided with scale marks are equally spaced, so that the length of the scale plates 11 can be conveniently adjusted at a fixed distance.

The utility model discloses a theory of operation and use flow: during the use, adjust the interval of two cameras 4 according to the internal diameter of wafer frame that awaits measuring, scale plate 11 removes in the inside of link 5 this moment, it twists screw rod 9 to rotate the hand, make the hand twist the one end of screw rod 9 and take clamp plate 7 to remove in the inside of activity groove 6, make clamp plate 7 tip adhesive rubber buffer 10 and scale plate 11 contact, compression spring 8 continues the compression between activity groove 6 and clamp plate 7 simultaneously, insert the inside of wafer frame to make a video recording subassembly 2, camera 4 fixed surface's slot probe 12 removes in the inside of frame spout this moment, camera 4 fixed surface's spacing rubber wheel 13 removes at the internal surface of frame simultaneously.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a wafer frame roughness detection device, includes roughness detector main part (1) and camera module (2), its characterized in that: the flatness detector is characterized in that the flatness detector main body (1) and the camera assembly (2) are electrically connected through a cable, the camera assembly (2) comprises a grab handle (3) and a camera (4), a positioning mechanism is connected between the grab handle (3) and the camera (4), the positioning mechanism comprises a connecting frame (5), a movable groove (6), a pressing plate (7), a compression spring (8), a hand-screwed screw rod (9), a rubber buffer (10) and a scale plate (11), the connecting frame (5) is welded at one end of the grab handle (3), the movable groove (6) is arranged in the connecting frame (5), the compression spring (8) is fixed in the movable groove (6), the pressing plate (7) is movably arranged in the movable groove (6) through the compression spring (8), the hand-screwed screw rod (9) is screwed and embedded in the connecting frame (5), and the lower end of the hand-screwed screw rod (9) is rotatably connected with the pressing plate (7) through a bearing, the rubber buffer pad (10) is adhered to one end of the pressing plate (7), one end of the scale plate (11) is fixed on the surface of the camera (4), and the other end of the scale plate (11) is inserted into the connecting frame (5) and is in contact with the rubber buffer pad (10).

2. The wafer frame flatness detecting apparatus according to claim 1, wherein: the groove feeler lever (12) is fixed on the surfaces of the two sides of the end part of the camera (4), and a limiting rubber wheel (13) is mounted on the side surface of the camera (4).

3. The wafer frame flatness detecting apparatus according to claim 2, wherein: the horizontal distance from the end part of the groove probe rod (12) to the end part of the camera (4) is 3cm, and the horizontal distance from the end part of the groove probe rod (12) to the end part of the limiting rubber wheel (13) is 2 cm.

4. The wafer frame flatness detecting apparatus according to claim 1, wherein: the two cameras (4) connected with the end part of the grab handle (3) through the positioning mechanism are arranged, and the two cameras (4) are symmetrical about the central axis of the grab handle (3).

5. The wafer frame flatness detecting apparatus according to claim 1, wherein: the pressing plate (7) is of a barrel-shaped structure, the compression spring (8) is of a spiral structure, one end of the compression spring (8) is welded on the outer surface of the pressing plate (7), and the other end of the compression spring (8) is welded on the surface of the movable groove (6).

6. The wafer frame flatness detecting apparatus according to claim 1, wherein: the rubber buffer pad (10) is of a circular structure, and grooves are formed in the lower surface of the rubber buffer pad (10) at equal intervals.

7. The wafer frame flatness detecting apparatus according to claim 1, wherein: the scale plate (11) is of a strip-shaped plate structure, and scale marks are arranged on the surface of the scale plate (11) at equal intervals.