CN210337685U

CN210337685U - Wire coil foot pad

Info

Publication number: CN210337685U
Application number: CN201921429948.3U
Authority: CN
Inventors: 孙洋
Original assignee: Gaomi Rui Automobile Decoration Co Ltd
Current assignee: Gaomi Rui Automobile Decoration Co Ltd
Priority date: 2019-08-30
Filing date: 2019-08-30
Publication date: 2020-04-17
Anticipated expiration: 2029-08-30

Abstract

The utility model provides a wire winding callus on sole belongs to wire winding pad technical field, including wire winding and first backing plate, the wire winding is evenly laid on first backing plate upper portion, be provided with a plurality of evenly distributed and the vertical chip removal hole that runs through in first backing plate on the first backing plate, first backing plate below can dismantle with the second backing plate and be connected. The embodiment of the utility model provides an in, through set up a plurality of chip removal holes on first backing plate to first backing plate can be dismantled with the second backing plate and be connected, makes the debris that fall in the silk circle collect in the chip removal downthehole, through dismantling the second backing plate from first backing plate bottom, thereby realizes the clearance of debris, the effectual problem that debris scatter and be difficult to the clearance in the silk circle of having solved.

Description

Wire coil foot pad

Technical Field

The utility model relates to a belong to wire winding pad technical field, specifically a wire winding callus on sole.

Background

The wire coil foot pad is suitable for automobiles, and the surface is a filamentous surface layer and then is connected to a soft bottom plate in a viscose or hot melting mode. Compare in traditional leather callus on the sole, cloth line callus on the sole, the silk circle callus on the sole can be cut by the car owner by oneself and take shape, is difficult to make and produces the interior moldy taste of car, consequently, the silk circle callus on the sole more and more receives liking of car owner in recent years.

When people drive, granular sundries such as silt carried by the soles of the feet easily fall into the wire coil foot pads, and the sundries falling into the wire coils are difficult to clean based on the structure of the wire coils. In the prior art, the bottom plate is provided with the grooves for accommodating dirt, and sundries falling into the wire loops are collected in the grooves, so that the sundries cannot bounce when the feet touch the wire loop foot pads. The collection mode of the impurities has at least the following problems: because the capacity of recess is limited, and the time is a long time, after being filled up by the dirt in the recess, unnecessary dirt then still scatters in the silk circle to lead to the practicality not high, consequently, provide one kind and can collect and concentrate the silk circle callus on the sole of clearance to debris with satisfy the demand.

SUMMERY OF THE UTILITY MODEL

To the not enough of above-mentioned prior art, the to-be-solved technical problem of the utility model is to provide a wire winding callus on sole.

In order to solve the technical problem, the utility model provides a following technical scheme:

the utility model provides a wire winding callus on sole, includes wire winding and first backing plate, the wire winding is evenly laid on first backing plate upper portion, be provided with a plurality of evenly distributed and vertical chip removal hole that runs through in first backing plate on the first backing plate, first backing plate below can dismantle with the second backing plate and be connected.

As a further improvement of the utility model: and the upper part of the second base plate is provided with a chip collecting groove corresponding to the chip removing hole.

As a further improvement of the utility model: the chip removal hole is of a cylindrical structure.

As a further improvement of the utility model: a plurality of plug-ins of fixed connection are put in first backing plate bottom edge, a plurality of jacks corresponding with the plug-in have been seted up on second backing plate upper portion.

As a further improvement of the present invention: the plug-in components are made of hard materials and are in interference fit with the jacks.

As a further improvement of the present invention: the plug-in components are made of plastic materials, and the interior of the plug-in components is hollow.

As a further improvement of the present invention: the jack is of a blind hole structure.

As a further improvement of the present invention: the chip removal hole is in a tapered hole structure with a large upper part and a small lower part.

Compared with the prior art, the beneficial effects of the utility model are that:

the embodiment of the utility model provides an in, through set up a plurality of chip removal holes on first backing plate to first backing plate can be dismantled with the second backing plate and be connected, makes the debris that fall in the silk circle collect in the chip removal downthehole, through dismantling the second backing plate from first backing plate bottom, thereby realizes the clearance of debris, the effectual problem that debris scatter and be difficult to the clearance in the silk circle of having solved.

Drawings

FIG. 1 is a schematic view of a wire loop footpad of embodiment 1;

FIG. 2 is a schematic cross-sectional view taken along line A-A of a wire loop footpad of example 1;

FIG. 3 is a schematic view of a bottom structure of a first pad in a wire loop footpad in accordance with example 1;

FIG. 4 is a schematic view of the clearance hole in a wire loop footpad of example 2;

in the figure: 1-a first base plate, 2-a wire ring, 3-a chip removal hole, 4-a second base plate, 5-a chip collecting groove and 6-an insert.

Detailed Description

The technical solution of the present patent will be described in further detail with reference to the following embodiments.

Reference will now be made in detail to embodiments of the present patent, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present patent and are not to be construed as limiting the present patent.

In the description of this patent, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for the convenience of describing the patent and for the simplicity of description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the patent.

In the description of this patent, it is noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can include, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.

Example 1

Referring to fig. 1-3, the present embodiment provides a wire loop foot pad, including a wire loop 2 and a first base plate 1, wherein the wire loop 2 is uniformly laid on the upper portion of the first base plate 1, the first base plate 1 is provided with a plurality of chip removal holes 3 which are uniformly distributed and vertically penetrate through the first base plate 1, and the lower portion of the first base plate 1 is detachably connected with a second base plate 4;

after the device is used for a period of time, the particle sundries attached in the wire loops 2 are gathered at the chip removal holes 3 along the gaps among the wire loops 2, at the moment, the second base plate 4 can be detached from the bottom of the first base plate 1, and the sundries accumulated in the chip removal holes 3 are cleaned;

in order to increase the storage space of sundries and prolong the cleaning time of the foot pad, the upper part of the second base plate 4 is provided with a scrap collecting groove 5 corresponding to the scrap discharging hole 3, the granular sundries are discharged into the scrap collecting groove 5 through the scrap discharging hole 3 for temporary storage, and meanwhile, when the liquid is turned over to the thread ring 2 carelessly, the scrap collecting groove 5 can also collect the liquid;

the chip removal holes 3 are cylindrical structures;

the edge of the bottom of the first base plate 1 is fixedly connected with a plurality of plug-in units 6, the upper part of the second base plate 4 is provided with a plurality of plug-in holes corresponding to the plug-in units 6, the plug-in units 6 are inserted into the corresponding plug-in holes, so that the first base plate 1 and the second base plate 4 can be detachably connected, and granular sundries can be cleaned regularly;

the insert 6 is made of a hard material, and the insert 6 is in interference fit with the jack; the material of the insert 6 is not limited, and may be plastic, aluminum alloy, or the like, in order to reduce the manufacturing cost of the foot pad and the overall mass of the foot pad, in this embodiment, preferably, the insert 6 is made of a plastic material, and the interior of the insert 6 is hollow;

in order to ensure the appearance quality of the second base plate 4, the insertion holes are of a blind hole structure.

The working principle of the embodiment is as follows: after the foot pad is used for a period of time, the particle sundries attached to the wire loops 2 are gathered at the chip removal holes 3 along the gaps among the wire loops 2, at the moment, the second base plate 4 can be detached from the bottom of the first base plate 1, and the sundries accumulated in the chip removal holes 3 are cleaned;

through inserting plug-in components 6 in the jack that corresponds, realize first backing plate 1 and the dismantled being connected of second backing plate 4, conveniently carry out regularly clearance to granule debris.

Example 2

Referring to fig. 4, in order to ensure that the particulate impurities can smoothly enter the chip collecting groove 5 from the chip removing hole 3 and prevent the particulate impurities in the chip collecting groove 5 from reversely sliding into the wire ring 2 again when the foot pad is moved, in this embodiment, compared with embodiment 1, the chip removing hole 3 has a tapered hole structure with a large top and a small bottom.

Although the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present patent within the knowledge of those skilled in the art.

Claims

1. The utility model provides a wire winding callus on sole, includes wire winding (2) and first backing plate (1), wire winding (2) are evenly laid on first backing plate (1) upper portion, characterized by, be provided with a plurality of evenly distributed and vertical chip removal hole (3) that run through in first backing plate (1) on first backing plate (1), first backing plate (1) below can dismantle with second backing plate (4) and be connected.

2. A wire loop footpad in accordance with claim 1, characterized in that the second pad plate (4) is provided at its upper part with chip collecting grooves (5) corresponding to the chip removing holes (3).

3. A wire loop footpad as defined in claim 1 or 2, wherein the clearance hole (3) is of cylindrical configuration.

4. The wire coil foot pad as claimed in claim 1, wherein a plurality of inserts (6) are fixedly connected to the bottom edge of the first base plate (1), and a plurality of insertion holes corresponding to the inserts (6) are formed in the upper portion of the second base plate (4).

5. A wire loop footpad in accordance with claim 4, wherein the insert (6) is made of a hard material and the insert (6) is an interference fit with the receptacle.

6. A wire loop footpad as defined in claim 5, wherein the insert (6) is made of plastic material and the insert (6) is hollow inside.

7. A wire loop footpad as defined in claim 5 or 6, wherein the insertion hole has a blind hole structure.

8. A wire loop footpad as defined in claim 1 or 2, wherein the clearance hole (3) has a tapered hole structure with a large top and a small bottom.