CN210336482U - Silicon chip section device - Google Patents

Silicon chip section device Download PDF

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Publication number
CN210336482U
CN210336482U CN201920890980.5U CN201920890980U CN210336482U CN 210336482 U CN210336482 U CN 210336482U CN 201920890980 U CN201920890980 U CN 201920890980U CN 210336482 U CN210336482 U CN 210336482U
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China
Prior art keywords
bottom plate
box body
wall
impurity
fixing
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CN201920890980.5U
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Chinese (zh)
Inventor
李�杰
朱棣
于友
刘世伟
石坚
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Shandong Jiusi New Material Technology Co ltd
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Shandong Jiusi New Material Technology Co ltd
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Priority to CN201920890980.5U priority Critical patent/CN210336482U/en
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Abstract

The utility model discloses a silicon chip section device, including bottom plate and motor, the top of bottom plate has the mount through the bolt fastening, and one side of mount is rotated and is connected with the driving roller, the last round trip of motor output shaft has the steel cable, and the other end of steel cable is connected with the driving roller, the fixed block has all been welded to the both sides at bottom plate top, and has all opened the spout on the relative one side outer wall of two fixed blocks, the bottom of bottom plate has the dead lever through the bolt fastening. The utility model discloses can fix the silicon chip on the slider to drive the raw materials and remove steel cable department cutting under the drive of slider, the flexibility of device has been improved, can blow off the impurity on the steel cable, prevent that the impurity from causing the influence to it, the impurity that blows in addition can fall into the aquatic on the solid fixed cylinder, absorb impurity, prevent its polluted environment, the water that can extract in the box passes through the shower nozzle blowout, also can give its cooling when wasing impurity on the steel cable, make it can continuous operation.

Description

Silicon chip section device
Technical Field
The utility model relates to a silicon chip technology field especially relates to a silicon chip section device.
Background
The solar photovoltaic industry is a new green energy industry, the photovoltaic industry develops rapidly with the attention of all countries in the world on green energy, high quality and low cost are the key points of enterprise development, and the linear cutting mechanism of the solar silicon ingot is the process that a machine guide wheel drives a steel wire to rotate in high-speed operation and continuously rubs with a workpiece pressed on a wire net to finish cutting in the high-speed operation of the steel wire.
In the cutting process of a plurality of devices, dust and cutting scraps are easily attached to the steel rope, and if the impurities cannot be removed well, cutting errors are easily caused, so that the quality of silicon wafer cutting is affected, and the requirements of people cannot be met.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing a silicon wafer slicing device.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a silicon wafer slicing device comprises a bottom plate and a motor, wherein a fixing frame is fixed at the top of the bottom plate through a bolt, a transmission roller is rotatably connected to one side of the fixing frame, a steel rope is wound on an output shaft of the motor, the other end of the steel rope is connected with the transmission roller, fixing blocks are welded to two sides of the top of the bottom plate, a sliding groove is formed in the outer wall of one side, opposite to the two fixing blocks, of the bottom plate, a fixing rod is fixed to the bottom of the bottom plate through the bolt, a cleaning device is arranged at the bottom of the fixing rod and comprises a box body, the bottom of the fixing rod is fixed to the box body through the bolt, connecting ports are formed in the top and the bottom of the box body, the steel rope penetrates through the connecting ports, an air blower is fixed to the bottom of the bottom plate through the bolt, a connecting pipe is welded to, the bottom of the annular tube is provided with a plurality of air outlets.
Further, the top welding of spout has the slide rail, and the top sliding connection of slide rail has the slider, and open at the top of slider has the bolt hole, and bolt hole female connection has fixing bolt, and fixing bolt's top welding has the clamp plate.
Furthermore, an inclined tube is welded on the inner wall of the air outlet, and the extension end of the inclined tube is intersected with the steel rope.
Furthermore, a fixed cylinder is welded on the inner wall of the bottom of the box body, and the fixed cylinder is of a truncated cone-shaped structure without a top and a bottom.
Furthermore, a filter screen plate is fixed on the outer wall of the bottom of the box body through bolts, and a through hole is formed in the bottom of the filter screen plate.
Further, still include the water pump, the water pump passes through the bolt fastening in one side of box, and the welding has the inlet tube on the water inlet inner wall of water pump, and the other end of inlet tube is linked together with the inside of box, and the welding has the outlet pipe on the delivery port inner wall of water pump, and the other end of outlet pipe passes through the bolt fastening and has the shower nozzle, and the height of shower nozzle is greater than the height of solid fixed cylinder.
The utility model has the advantages that:
1. thereby can drive the steel cable through the setting of motor with the driving roller cooperation and rotate the convenience and carry out cutting work to the silicon chip, can make things convenient for the slip of inserting of silicon chip through the setting of spout, stability is good, can fix the silicon chip on the slider through fixing bolt's setting to drive the raw materials and remove steel cable department cutting under the drive of slider, improved the flexibility of device.
2. Can blow off the impurity on the steel rope with annular tube and pipe chute cooperation through setting up of air-blower, prevent that the impurity from causing the influence to it, the impurity that blows moreover can fall into the aquatic on the solid fixed cylinder, absorbs impurity, prevents its polluted environment.
3. Impurity in the air can be prevented through the setting of filtering screen plate and get into from the connector of below, and the setting through the water pump can extract the water in the box and pass through the shower nozzle blowout, also can cool down for it when wasing impurity on the steel cable, makes it can continuous operation, and the water droplet of adhesion also can blow off through the wind of top on the steel cable after wasing moreover, can not exert an influence to the cutting silicon chip.
Drawings
Fig. 1 is a schematic cross-sectional structural diagram of a silicon wafer slicing apparatus according to embodiment 1 of the present invention;
fig. 2 is a schematic view of a partial three-dimensional structure of a silicon wafer slicing apparatus according to embodiment 1 of the present invention;
fig. 3 is a schematic cross-sectional structural view of a cleaning device in embodiment 1 of a silicon wafer slicing device according to the present invention;
fig. 4 is a schematic sectional structure diagram of a silicon wafer slicing apparatus according to embodiment 2 of the present invention.
In the figure: the device comprises a base plate 1, a fixing block 2, a sliding groove 3, a sliding rail 4, a sliding block 5, a fixing bolt 6, a motor 7, a steel rope 8, a cleaning device 9, an air blower 10, a fixing frame 11, a driving roller 12, a filter screen plate 13, a box body 14, a fixing barrel 15, an inclined pipe 16, an annular pipe 17, a connecting port 18, a water pump 19, a water outlet pipe 20 and a spray head 21.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Example 1
Referring to fig. 1-3, a silicon wafer slicing device comprises a bottom plate 1 and a motor 7, wherein a fixing frame 11 is fixed on the top of the bottom plate 1 through bolts, one side of the fixing frame 11 is rotatably connected with a transmission roller 12, an output shaft of the motor 7 is wound with a steel rope 8, the other end of the steel rope 8 is connected with the transmission roller 12, two sides of the top of the bottom plate 1 are welded with fixing blocks 2, the outer walls of the two opposite sides of the fixing blocks 2 are respectively provided with a sliding groove 3, the silicon wafers can be conveniently inserted and slide through the sliding grooves 3, the stability is good, the bottom of the bottom plate 1 is fixed with a fixing rod through bolts, the bottom of the fixing rod is provided with a cleaning device 9, the cleaning device 9 comprises a box body 14, the box body 14 is fixed with the bottom of the fixing rod through bolts, the top and the bottom of the box body 14 are respectively provided, and the output welding of air-blower 10 has the connecting pipe, the welding has ring pipe 17 on the one side inner wall of box 14, and one side of ring pipe 17 is connected with the connecting pipe, and open the bottom of ring pipe 17 has a plurality of air outlets, through air-blower 10 and ring pipe 17 and the cooperation of pipe chute 16, blow off the impurity on the steel cable 8, prevent that the impurity from causing the influence to it, the impurity that blows in addition can fall into the aquatic on the solid fixed cylinder 15, absorb impurity, prevent its polluted environment.
Sliding rail 4 has been welded at the top of spout 3, and sliding rail 4's top sliding connection has slider 5, open at slider 5's top has the bolt hole, bolt hole internal thread connection has fixing bolt 6, fixing bolt 6's top welding has the clamp plate, the welding has pipe chute 16 on the inner wall of air outlet, and pipe chute 16's extension end intersects with steel cable 8, fix the silicon chip on slider 5 through fixing bolt 6, thereby drive the raw materials and remove the cutting of steel cable 8 department under slider 5's drive, the flexibility of device has been improved.
The inner wall of the bottom of the box body 14 is welded with a fixed cylinder 15, the fixed cylinder 15 is of a truncated cone-shaped structure without a top and a bottom, the outer wall of the bottom of the box body 14 is fixed with a filter screen 13 through bolts, and the bottom of the filter screen 13 is provided with through holes.
The working principle of the embodiment is as follows: the silicon chip is fixed on the sliding block 5 through the fixing bolt 6, thereby driving the raw material to move to the cutting position of the steel rope 8 under the driving of the sliding block 5, the steel rope 8 is driven to rotate through the matching of the motor 7 and the driving roller 12, thereby facilitating the cutting work of the silicon chip, the air is blown into the box body 14 through the air blower 10 in cooperation with the annular pipe 17 and the inclined pipe 16, the impurities on the steel rope 8 are blown off directly, the influence of the impurities on the steel rope 8 is prevented, the blown impurities can fall into the water on the fixed cylinder 15, the impurities are absorbed, the environment is prevented from being polluted, and the impurities in the air are prevented from entering from the connecting port 18 below through the filter screen plate 13.
Example 2
Referring to fig. 4, the silicon wafer slicing apparatus of the present embodiment is mainly different from embodiment 1 in that the apparatus further includes a water pump 19, the water pump 19 is fixed to one side of the box 14 through a bolt, a water inlet pipe is welded to an inner wall of a water inlet of the water pump 19, the other end of the water inlet pipe is communicated with the inside of the box 14, a water outlet pipe 20 is welded to an inner wall of a water outlet of the water pump 19, a nozzle 21 is fixed to the other end of the water outlet pipe 20 through a bolt, and the nozzle 21 is higher than the fixing cylinder 15.
The working principle of the embodiment is as follows: water in the box body 14 is pumped by the water pump 19 and sprayed out through the spray head 21, impurities on the steel rope 8 can be cleaned, meanwhile, the temperature of the steel rope can be reduced, the steel rope can work continuously, water drops adhered to the cleaned steel rope 8 can be blown off through wind above the steel rope, and the silicon wafer cutting cannot be influenced.
In the description of the present invention, it is to be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "other end", "upper", "one side", "top", "inner", "front", "center", "both ends", "first", "second", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
In the description of this patent, it is noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can include, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims (6)

1. A silicon wafer slicing device comprises a bottom plate (1) and a motor (7), and is characterized in that a fixing frame (11) is arranged at the top of the bottom plate (1), a transmission roller (12) is rotatably connected to one side of the fixing frame (11), a steel rope (8) is wound on an output shaft of the motor (7), the other end of the steel rope (8) is connected with the transmission roller (12), fixing blocks (2) are arranged on two sides of the top of the bottom plate (1), sliding grooves (3) are formed in the outer walls of the two opposite sides of the two fixing blocks (2), a fixing rod is arranged at the bottom of the bottom plate (1), a cleaning device (9) is arranged at the bottom of the fixing rod, the cleaning device (9) comprises a box body (14), the box body (14) is provided with the bottom of the fixing rod, connectors (18) are formed in the top and the bottom of the box body (14), and the steel rope (, the bottom of bottom plate (1) is equipped with air-blower (10), and the output of air-blower (10) is equipped with the connecting pipe, be equipped with ring pipe (17) on the inner wall of one side of box (14), and one side of ring pipe (17) is connected with the connecting pipe, and the bottom of ring pipe (17) is opened has a plurality of air outlets.
2. The silicon wafer slicing device according to claim 1, wherein a slide rail (4) is arranged at the top of the slide groove (3), a slide block (5) is slidably connected to the top of the slide rail (4), a bolt hole is formed in the top of the slide block (5), a fixing bolt (6) is connected to the bolt hole in a threaded manner, and a pressing plate is arranged at the top of the fixing bolt (6).
3. The silicon wafer slicing device according to claim 1, wherein an inclined tube (16) is arranged on the inner wall of the air outlet, and the extension end of the inclined tube (16) is intersected with the steel rope (8).
4. The silicon slice slicing device according to claim 1, wherein the inner wall of the bottom of the box body (14) is provided with a fixed cylinder (15), and the fixed cylinder (15) is of a truncated cone structure without top and bottom.
5. The silicon wafer slicing device according to claim 4, wherein the outer wall of the bottom of the box body (14) is provided with a filter screen plate (13), and the bottom of the filter screen plate (13) is provided with through holes.
6. The silicon wafer slicing device according to claim 4, further comprising a water pump (19), wherein the water pump (19) is fixed on one side of the box body (14) through a bolt, a water inlet pipe is arranged on the inner wall of a water inlet of the water pump (19), the other end of the water inlet pipe is communicated with the inside of the box body (14), a water outlet pipe (20) is arranged on the inner wall of a water outlet of the water pump (19), a spray head (21) is arranged at the other end of the water outlet pipe (20), and the height of the spray head (21) is greater than that of the fixed cylinder (15).
CN201920890980.5U 2019-06-12 2019-06-12 Silicon chip section device Active CN210336482U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920890980.5U CN210336482U (en) 2019-06-12 2019-06-12 Silicon chip section device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920890980.5U CN210336482U (en) 2019-06-12 2019-06-12 Silicon chip section device

Publications (1)

Publication Number Publication Date
CN210336482U true CN210336482U (en) 2020-04-17

Family

ID=70185853

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920890980.5U Active CN210336482U (en) 2019-06-12 2019-06-12 Silicon chip section device

Country Status (1)

Country Link
CN (1) CN210336482U (en)

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