CN210334121U

CN210334121U - Pin forming die of diode

Info

Publication number: CN210334121U
Application number: CN201920980705.2U
Authority: CN
Inventors: 瑭规尝; 詹波
Original assignee: Dongguan Jiajun Science & Technology Co ltd
Current assignee: Dongguan Jiajun Science & Technology Co ltd
Priority date: 2019-06-25
Filing date: 2019-06-25
Publication date: 2020-04-17
Anticipated expiration: 2029-06-25

Abstract

The utility model provides a pin forming die of diode, including the cope match-plate pattern that sets gradually, go up mould, lower mould and lower bolster, go up the mould and include two first briquetting, the top of lower mould is equipped with the pin extension board that two intervals set up, and the projection of first briquetting on the lower mould is first projection, and two first projections are located two pin extension boards respectively and keep away from one side at lower mould center, are equipped with the interval between first projection and the pin extension board. The utility model discloses be provided with the pin extension board that is used for hugging closely the support in the bottom of pin, when the compound die is bent the shaping, the pin extension board can effectively offset the power of bending that transmits the plastic main part, reduces the trend that pin and plastic main part take place relative displacement, can effectively avoid the plastic main part to be torn to ensure the reliability of the action of bending.

Description

Pin forming die of diode

Technical Field

The utility model relates to a forming die specifically discloses a pin forming die of diode.

Background

Manufacturing diodes, welding chips in pin frames with the arranged passage structures, putting the frame communicated chips into an injection mold, injecting a fluid-shaped insulating material into the mold through an injection molding machine, cooling and molding the insulating material, demolding and taking out the insulating material, cutting the insulating material to obtain independent semi-finished diodes, and finally bending the pins to obtain the diodes.

The bending of the diode pins is finished through a forming die, a semi-finished diode is placed into the forming die, the upper die and the lower die bend the pins of the diode after die assembly, and then a finished diode can be obtained.

SUMMERY OF THE UTILITY MODEL

Therefore, it is necessary to provide a pin forming mold for a diode, which can effectively offset the bending force transmitted to the plastic body and effectively prevent the plastic body from being torn, in view of the problems in the prior art.

For solving the prior art problem, the utility model discloses a pin forming die of diode, including the cope match-plate pattern that sets gradually, go up mould, lower mould and lower bolster, go up the mould and include two first briquetting, the top of lower mould is equipped with the pin extension board that two intervals set up, and the projection of first briquetting on the lower mould is first projection, and two first projections are located two pin extension boards respectively and keep away from one side at lower mould center, are equipped with the interval between first projection and the pin extension board.

Furthermore, the upper die further comprises two second pressing blocks, the second pressing blocks are located on one side, close to the center of the lower die, of the first pressing block, and the two second pressing blocks are located right above the two pin supporting plates respectively.

Furthermore, the lower die comprises two bearing seats arranged at intervals, and the two pin support plates are respectively positioned on the two bearing seats.

Furthermore, each supporting seat is provided with a supporting lug, the supporting lug is positioned on one side of the pin supporting plate far away from the first projection, the height of the supporting lug is H, and the height of the pin supporting plate is H, wherein H is greater than H.

Furthermore, a guide pillar is fixed at the bottom of the upper template, a guide groove seat is fixed at the top of the lower template, and the guide pillar is inserted into the guide groove seat.

The utility model has the advantages that: the utility model discloses a pin forming die of diode is provided with the pin extension board that is used for hugging closely the support in the bottom of pin, and when the compound die was bent the shaping, the pin extension board can effectively offset the power of bending that transmits the plastic main part, reduces the trend that pin and plastic main part take place relative displacement, can effectively avoid the plastic main part to be torn to ensure the reliability of the action of bending.

Drawings

Fig. 1 is a schematic structural view of the utility model during mold opening.

Fig. 2 is a schematic structural diagram of the die assembly of the present invention.

The reference signs are: the die comprises an upper die plate 10, an upper die 11, a first pressing block 111, a second pressing block 112, a guide post 12, a lower die plate 20, a lower die 21, a bearing plate 211, a pin support plate 22, a supporting bump 23 and a guide groove seat 24.

Detailed Description

For further understanding of the features and technical means of the present invention, as well as the specific objects and functions attained by the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.

Refer to fig. 1 and 2.

The embodiment of the utility model discloses a pin forming die of diode, including cope match-plate pattern 10, go up mould 11, lower mould 21 and lower bolster 20 that sets gradually, go up mould 11 and include two first briquetting 111, the top of lower mould 21 is equipped with two pin extension boards 22 that the interval set up, the interval between two pin extension boards 22 is D, the width of diode plastic main part is D, the plastic main part of diode just can insert between two pin extension boards 22, the projection of first briquetting 111 on lower mould 21 is the first projection, two first projections are located two pin extension boards 22 respectively and keep away from one side of lower mould 21 center, be equipped with the interval between first projection and the pin extension board 22, when closing the mould, first briquetting 111 is located one side that pin extension board 22 keeps away from the lower mould 21 center, first briquetting 111 and pin extension board 22 dislocation set when closing the mould, and the distance of first briquetting 111 and pin extension board 22 is P when closing the mould, the pin thickness of the diode is d, and P > d.

After welding a chip to the lead frame, injection molding and cutting, a diode semi-finished product is obtained, when the die is opened, the upper die 11 is positioned right above the lower die 21, the diode semi-finished product is placed into the lower die 21, the plastic body of the diode semi-finished product is clamped between the two pin support plates 22, the tops of the two pin support plates 22 support the bottoms of the two pins of the diode semi-finished product, and when the die is closed, the upper die 11 is descended close to the lower die 21, the first pressing block 111 presses the pins of the diode semi-finished product, the pin support plate 22 supports the bottom of one end of the pins close to the plastic main body, the pins are bent by the first pressing block 111, because the first pressing block 111 presses down one end of the pin far away from the plastic main body in the diode semi-finished product, the pin support plate 22 can offset the pressure applied to most of the pins when the pins are bent, and the motion amplitude of the connecting part of the pins and the plastic main body can be effectively reduced, so that the plastic main body is effectively prevented from being pulled apart.

The utility model discloses be provided with the pin extension board 22 that is used for hugging closely the support in the bottom of pin, when the compound die is bent the shaping, pin extension board 22 can effectively offset the power of bending that transmits the plastic main part, reduces the trend that pin and plastic main part take place relative displacement, can effectively avoid the plastic main part to be torn to ensure the reliability of the action of bending.

Further, go up mould 11 and still include two second briquetting 112, second briquetting 112 is located one side that first briquetting 111 is close to the lower mould 21 center, two second briquetting 112 are located two pin extension board 22 directly over respectively, during the moulding-die, first briquetting 111 cooperates pin extension board 22 effectively to press from both sides the pin of tight diode, avoid pin and plastic main part to take place relative motion, when the compound die is bent the shaping, can show to reduce the effect of bending force and act on between plastic main part and the pin, can further avoid the plastic main part to be pulled apart, can effectively improve the reliability of bending the shaping, the projection of second briquetting 112 on lower mould 21 is the second projection, pin extension board 22 is in the second projection.

Further, lower mould 21 includes the bearing seat 211 that two intervals set up, and two pin extension boards 22 are located two bearing seats 211 respectively, and the plastic main part of various shapes can be held in the space between the bearing seat 211, and the bottom both sides of two edge support plastic main parts that bear the seat 211 can avoid influencing the effect of buckling because of the bottom unevenness of plastic main part.

Further, all be equipped with a support lug 23 on every bearing seat 211, support lug 23 is located pin extension board 22 and keeps away from one side of first projection, support lug 23 highly be H, pin extension board 22 highly be H, H > H, when the diode was put on lower mould 21, two support lugs 23 support the bottom both sides of plastic main part respectively, support lug 23 is protruding in bearing seat 211, can ensure that the bottommost face of bending shaping back pin is less than the bottommost face of plastic main part, it can ensure that pin extension board 22 can effectively support the bottom surface of pin one end to set up H > H.

Further, the guide posts 12 are fixed at the bottom of the upper die plate 10, the guide groove seats 24 are fixed at the top of the lower die plate 20, the guide posts 12 are inserted into the guide groove seats 24, and the guide posts 12 are matched with the guide groove seats 24 to improve the reliability of the die opening and closing action.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. The utility model provides a pin forming die of diode, is including cope match-plate pattern (10), last mould (11), lower mould (21) and lower bolster (20) that set gradually, its characterized in that, it includes two first briquetting (111) to go up mould (11), the top of lower mould (21) is equipped with pin extension board (22) that two intervals set up, first briquetting (111) are in projection on lower mould (21) is first projection, two first projection is located two respectively pin extension board (22) are kept away from one side at lower mould (21) center, first projection with be equipped with the interval between pin extension board (22).

2. The die for forming the pin of the diode according to claim 1, wherein the upper die (11) further comprises two second pressing blocks (112), the second pressing blocks (112) are located on one side of the first pressing block (111) close to the center of the lower die (21), and the two second pressing blocks (112) are respectively located right above the two pin support plates (22).

3. The die for forming the pin of the diode according to claim 1, wherein the lower die (21) comprises two spaced-apart supporting seats (211), and the two pin support plates (22) are respectively located on the two supporting seats (211).

4. The die for forming the pin of the diode according to claim 3, wherein each of the supporting bases (211) is provided with a supporting protrusion (23), the supporting protrusion (23) is located on a side of the pin support plate (22) away from the first projection, the height of the supporting protrusion (23) is H, and the height of the pin support plate (22) is H, H > H.

5. The die for forming the pin of the diode according to claim 1, wherein the bottom of the upper die plate (10) is fixed with a guide post (12), the top of the lower die plate (20) is fixed with a guide slot seat (24), and the guide post (12) is inserted into the guide slot seat (24).