CN210333180U - Continuous wafer dispensing equipment - Google Patents

Continuous wafer dispensing equipment Download PDF

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Publication number
CN210333180U
CN210333180U CN201920623101.2U CN201920623101U CN210333180U CN 210333180 U CN210333180 U CN 210333180U CN 201920623101 U CN201920623101 U CN 201920623101U CN 210333180 U CN210333180 U CN 210333180U
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China
Prior art keywords
dispensing
glue
marking
roller
glue supply
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CN201920623101.2U
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Chinese (zh)
Inventor
吴成秀
李萍
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Tongling Fenghua Electronics Co ltd
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Tongling Fenghua Electronics Co ltd
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Priority to CN201920623101.2U priority Critical patent/CN210333180U/en
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Abstract

The utility model provides a continuous wafer dispensing device, which comprises a substrate, a first driving mechanism, a second driving mechanism, a feeding mechanism, a dispensing mechanism and a discharging mechanism; a feeding belt discharged by the unwinding roller winds the first guide roller and the second guide roller and then is wound by the winding roller, and a plurality of glue dispensing grooves which are arranged from one end of the feeding belt to the direction of one end of the feeding belt at equal intervals are formed in the feeding belt; the feeding mechanism is used for feeding the workpiece with the dispensing into the dispensing groove; the dispensing mechanism is arranged on the base plate and used for dispensing the workpieces in the dispensing groove; the blanking mechanism is arranged on the base plate and used for blanking the workpieces subjected to glue dispensing in the glue dispensing groove. The utility model discloses a spaced arrangement a plurality of point glue groove on the pay-off belt, the work piece material loading that feed mechanism will take the point to glue to the point glue inslot, and the point gum machine constructs the work piece of point glue inslot and carries out the point and glue, and qualified work piece is glued to the point in the inslot point to unloading mechanism will glue, and unloading is gone up automatically, realizes the work of gluing in succession, and the point is glued accurately.

Description

Continuous wafer dispensing equipment
Technical Field
The utility model relates to a quartz crystal syntonizer produces technical field, especially relates to an equipment is glued to continuous type wafer point.
Background
The quartz crystal resonator mainly comprises a base and a quartz wafer, is widely applied to communication systems, monitoring systems and alarm systems in telecommunication and electronic industries such as interphones, PDAs, mobile phones, wireless telephones, VCDs, DVDs, computers, televisions, satellites, automobile sound equipment, vehicle radio stations, automobile anti-theft, digital products, remote control systems and the like, is one of core components of the products, is similar to a human heart in image, and has importance second only to IC.
When the quartz crystal resonator is produced, the quartz crystal wafer is bonded and fixed with the ceramic base through the silver adhesive and is sealed in a space formed by the ceramic upper cover and the ceramic base, however, the existing quartz crystal wafer adhesive dispensing mainly adopts manual adhesive dispensing, the adhesive dispensing position is difficult to control, personnel are extremely tired, and leakage points are easy to cause a plurality of quality hidden dangers.
SUMMERY OF THE UTILITY MODEL
Based on the technical problem who exists among the background art, the utility model provides an equipment is glued to continuous type wafer point.
The utility model provides a continuous wafer dispensing device, which comprises a substrate, a first driving mechanism, a second driving mechanism, a feeding mechanism, a dispensing mechanism and a discharging mechanism; wherein:
the substrate is vertically arranged, an unwinding roller, a winding roller, a first guide roller and a second guide roller are fixed on the substrate, the unwinding roller and the winding roller are horizontally arranged oppositely, the unwinding roller and the winding roller are respectively driven by a first driving mechanism and a second driving mechanism to unwind and wind, the first guide roller and the second guide roller are positioned between the unwinding roller and the winding roller and above the unwinding roller and the winding roller, the first guide roller and the second guide roller are horizontally arranged oppositely, a feeding belt discharged by the unwinding roller winds the first guide roller and the second guide roller and then is wound by the winding roller, and a plurality of glue dispensing grooves are formed in the feeding belt and are arranged at equal intervals from one end of the feeding belt to the other end of the feeding belt; the feeding mechanism is used for feeding the workpiece with the dispensing into the dispensing groove; the dispensing mechanism is arranged on the base plate and used for dispensing the workpieces in the dispensing groove; the blanking mechanism is arranged on the base plate and used for blanking the workpieces subjected to glue dispensing in the glue dispensing groove.
Preferably, the blanking mechanism comprises an air blowing pipe, a first air pump and a first conveying mechanism, an air vent is arranged at the bottom of the dispensing tank, the air blowing pipe is fixed on the base plate and located between the second guide roller and the winding roller, a blowing nozzle blowing air to the dispensing tank is arranged at one end, close to the feeding belt, of the air blowing pipe, the air blowing pipe is connected with the first air pump, a first detector used for detecting workpieces and controlling the first air pump to work is arranged on the blowing nozzle, and the first conveying mechanism is located below the winding roller and used for conveying the workpieces subjected to dispensing.
Preferably, a horizontally arranged bearing plate is arranged in the dispensing slot, the bottom of the bearing plate is connected with the bottom of the dispensing slot through an elastic piece, an iron sheet is arranged at the bottom of the bearing plate, an electromagnet is arranged at the bottom of the dispensing slot, and the on-off of the electromagnet and a power supply is controlled by a first detector.
Preferably, the feeding mechanism comprises a material guide cylinder, a material guide plate and a second conveying mechanism, the material guide cylinder is vertically arranged and fixed on the base plate, the second conveying mechanism is located above the material guide cylinder, a distance is reserved between the second conveying mechanism and the material guide cylinder, one end of the material guide plate is in butt joint with the second conveying mechanism, and the other end of the material guide plate is in butt joint with the top end of the material guide cylinder.
Preferably, the inner diameter of the material guide cylinder is gradually reduced from the top end to the lower end of the material guide cylinder, and a plurality of soft bristles which are horizontally arranged are vertically distributed on two sides of the inner wall of the material guide cylinder.
Preferably, the point gum machine constructs including supplying gluey box, supplies gluey box to fix on the base plate, supplies to be equipped with in the gluey box and stores up gluey chamber, it has the silver glue to store up gluey intracavity storage, supply gluey box bottom be equipped with store up gluey chamber intercommunication supply glue mouthful, supply glue mouthful department to be equipped with can seal the ration that supplies to glue mouthful and supply to glue the device, supply gluey box bottom to be equipped with some gluey mouth, glue mouthful inside be equipped with supply the passageway of gluing of mouth intercommunication, it is equipped with the second detector that is used for detecting the work piece and controls ration and supplies the gluey device work to glue mouth bottom.
Preferably, the ration supplies mucilage binding to put including two mutual dispositions's ration and supplies gluey subassembly, the ration supplies gluey subassembly to include closed block, cam and driving motor, the closed block has arc cross-section and its arc opening orientation and supplies gluey mouthful outside, closed block border is through connecting band and supply gluey box inner wall sealing connection, the connecting band is made by elastic material, the cam setting is installed on supplying gluey box inner wall in the inboard of closed block and rotation, driving motor is connected with the cam and is controlled work by the second detector.
Preferably, still including being used for detecting whether qualified and carry out the detection mechanism who marks unqualified work piece is glued to the work piece point, detection mechanism includes the mark box, the mark box is fixed on the base plate, be equipped with the stock solution chamber in the mark box, the stock solution intracavity is stored and is used for the mark liquid of mark, the mark box bottom is equipped with the liquid outlet with the stock solution chamber intercommunication, the mark box bottom is equipped with the mark mouth, be equipped with the drain passage with the liquid outlet intercommunication in the mark mouth, be equipped with mark controlling means in the mark mouth, be equipped with on the mark mouth and be used for detecting whether qualified and the third detector of controlling mark controlling means work is glued to.
Preferably, the marking control device comprises a moving rod and a driving cylinder, a limiting plate horizontally arranged is arranged in the liquid outlet channel, the moving rod is vertically arranged in the liquid outlet channel and is in sliding connection with the inner wall of the liquid outlet channel, a sealing plate capable of being clamped with the limiting plate to seal the liquid outlet channel is arranged at the bottom end of the moving rod, the diameters of the limiting plate and the sealing plate are smaller than the diameter of the liquid outlet channel, and a cylinder shaft of the driving cylinder is connected with the moving rod and is controlled to work by a third detector.
Preferably, still including being used for dispensing unqualified work piece screening mechanism away with the point, screening mechanism includes screening pipe and second air pump, and the screening pipe is fixed on the base plate, and screening pipe one end is connected with the second air pump and its other end is equipped with the screening nozzle towards the point groove of gluing, is equipped with the fourth detector that is used for detecting the mark on the unqualified work piece and controls the work of second air pump on the screening pipe.
The utility model provides an equipment is glued to continuous type wafer point through interval arrangement a plurality of point glue groove on the pay-off belt, and workpiece feeding to the point glue inslot that feed mechanism will take the point to glue, and the point glue mechanism is glued the work piece of point glue inslot and is glued, and detection mechanism detects whether qualified and mark unqualified work piece of work piece is glued to the work piece point, and screening mechanism will glue and glue unqualified work piece screening away, and unloading mechanism will glue the inslot point glue of gluing and glue qualified work piece and carry out the unloading, the utility model discloses unloading is gone up automatically, realizes the work of gluing in succession, and it is accurate to glue to can glue unqualified wafer screening away.
Drawings
Fig. 1 is a schematic structural diagram of a continuous wafer dispensing apparatus according to the present invention;
fig. 2 is a schematic structural diagram of a feeding belt in a continuous wafer dispensing device according to the present invention;
fig. 3 is a schematic structural diagram of a dispensing mechanism in a continuous wafer dispensing apparatus according to the present invention;
fig. 4 is a schematic structural diagram of a detection mechanism in a continuous wafer dispensing device according to the present invention.
Detailed Description
Referring to fig. 1-4, the present invention provides a continuous wafer dispensing device, which comprises a substrate 1, a first driving mechanism, a second driving mechanism, a feeding mechanism, a dispensing mechanism, a detecting mechanism, a screening mechanism and a discharging mechanism; wherein:
the substrate 1 is vertically arranged, an unwinding roller 2, a winding roller 3, a first guide roller 4 and a second guide roller 5 are fixed on the substrate 1, the unwinding roller 2 and the winding roller 3 are horizontally arranged oppositely, the unwinding roller 2 and the winding roller 3 are respectively provided with a first driving mechanism, the second driving mechanism drives the unwinding and winding rollers to unwind, the first guide roller 4 and the second guide roller 5 are located between the unwinding roller 2 and the winding roller 3 and located above the unwinding roller 2 and the winding roller 3, the first guide roller 4 and the second guide roller 5 are horizontally arranged oppositely, a feeding belt 6 discharged from the unwinding roller 2 winds around the first guide roller 4, the winding roller 3 winds after the second guide roller 5, and a plurality of glue dispensing grooves 7 are formed in the feeding belt 6 at equal intervals from one end of the feeding belt to one end of the feeding belt.
The feeding mechanism is used for feeding the workpiece with the dispensing into the dispensing groove 7. The dispensing mechanism is arranged on the substrate 1 and used for dispensing the workpieces in the dispensing groove 7. The detection mechanism is arranged on the substrate 1 and used for detecting whether the dispensing of the workpieces is qualified or not and marking unqualified workpieces. The screening mechanism is installed and is used for going out the unqualified work piece screening of point gluing on the base plate. The blanking mechanism is arranged on the base plate 1 and used for blanking the workpiece subjected to glue dispensing in the glue dispensing groove 7.
The utility model discloses an interval arrangement a plurality of point glue groove on the pay-off belt, the work piece material loading that feed mechanism will take the point to glue in the groove 7, and the work piece that the point glue in the groove 7 is glued to the point glue mechanism carries out the point, and detection mechanism detects whether qualified and mark unqualified work piece is glued to the work piece point, and unqualified work piece screening is gone out to the point glue of screening mechanism, and unloading mechanism carries out the unloading with the qualified work piece of point glue in the groove 7 that glues of point glue, the utility model discloses automatic go up unloading realizes the work of gluing in succession, and the point is glued accurately to can glue unqualified wafer screening away with.
In this embodiment, the bottom of the dispensing slot 7 is provided with an air vent, a horizontally arranged bearing plate 10 is arranged in the dispensing slot 7, the bottom of the bearing plate 10 is connected with the bottom of the dispensing slot 7 through an elastic member 11, the bottom of the bearing plate 10 is provided with an iron sheet, and the bottom of the dispensing slot 7 is provided with an electromagnet. The electromagnet attracts the iron sheet, so that the elastic part 11 is compressed, and the bearing plate 10 is located at the bottom of the glue dispensing groove 7.
In this embodiment, the feeding mechanism includes a material guiding cylinder 12, a material guiding plate 13, and a second conveying mechanism 14. The material guide cylinder 12 is vertically arranged and fixed on the base plate 1, the inner diameter of the material guide cylinder 12 is gradually reduced from the top end to the lower end, and a plurality of soft bristles 15 which are horizontally arranged are vertically arranged on two sides of the inner wall of the material guide cylinder 12. The second conveying mechanism 14 is located above the material guiding cylinder 12 and spaced from the material guiding cylinder 12, one end of the material guiding plate 13 is butted with the second conveying mechanism 14, and the other end is butted with the top end of the material guiding cylinder 12. The second conveying mechanism 14 conveys the wafer to be dispensed to the guide plate 13, the wafer slides down along the guide plate 13 and enters the guide cylinder 12, and the wafer falls into the dispensing slot 7 in a horizontal state under the action of the soft bristles 15.
In this embodiment, the glue dispensing mechanism includes a glue supply box 16, and the glue supply box 16 is fixed on the substrate 1. Supply to be equipped with in the gluey box 16 of storage and glue chamber 17, store up gluey intracavity 17 and store up silver-colored glue, supply gluey box 16 bottom be equipped with store up gluey chamber 17 intercommunication supply gluey mouth 18, supply gluey mouth 18 department to be equipped with the ration that can seal and supply gluey mouth 18 and supply gluey device, the ration supplies gluey device to supply the ration including two mutual disposition's ration to supply gluey subassembly, the ration supplies gluey subassembly to include closed block 21, cam 22 and driving motor, closed block 21 has arc cross-section and its arc opening orientation and supplies gluey mouth 18 outside, closed block 21 border is through connecting band 23 and supply gluey box 16 inner wall sealing connection, connecting band 23 is made by elastic material, cam 22 sets up and rotates to install on supplying gluey box 16 inner wall at the inboard of closed. A dispensing nozzle 19 is arranged at the bottom of the glue supply box 16, a glue supply channel 20 communicated with the glue supply port 18 is arranged inside the dispensing nozzle 19, and a second detector used for detecting the wafer and controlling the work of the driving motor is arranged at the bottom of the dispensing nozzle 19. When the second detector detects the wafer in the dispensing slot 7 below the second detector, a signal is sent, the driving motor works to drive the cam 22 to rotate for a circle, the sealing block 21 moves towards two sides under the action of the connecting belt 23 to open the dispensing opening 18, the silver colloid enters the colloid supply channel 20 and dispenses the wafer, and then the sealing block 21 moves towards the inside of the colloid supply opening 18 under the action of the cam 22 to mutually abut against the sealed colloid supply opening 18.
In this embodiment, detection mechanism includes mark box 24, and mark box 24 is fixed on base plate 1, is equipped with stock solution chamber 25 in the mark box 24, and stock solution chamber 25 is internal to be stored and is used for the marked mark liquid, and the mark box 24 bottom is equipped with the liquid outlet 26 that communicates with stock solution chamber 25. The bottom end of the marking box 24 is provided with a marking nozzle 27, a liquid outlet channel 28 communicated with the liquid outlet 26 is arranged in the marking nozzle 27, a marking control device is arranged in the marking nozzle 27 and comprises a moving rod 29 and a driving cylinder 32, a limiting plate 30 horizontally arranged is arranged in the liquid outlet channel 28, the moving rod 29 is vertically arranged in the liquid outlet channel 28 and is in sliding connection with the inner wall of the liquid outlet channel 28, the bottom end of the moving rod 29 is provided with a closing plate 31 which can be clamped with the limiting plate 30 to close the liquid outlet channel 28, the diameters of the limiting plate 30 and the closing plate 31 are smaller than that of the liquid outlet channel 28, and a cylinder shaft of the driving cylinder 32 is connected with the moving rod 29 and is controlled to. The marking nozzle 27 is provided with a third detector for detecting whether the dispensing of the wafer is qualified and controlling the operation of the driving cylinder. When the third detector detects that the dispensing position of the wafer in the dispensing groove 7 below the third detector detects that the wafer is dispensed with glue, and when the wafer is not dispensed with glue, the third detector sends a signal to drive the air cylinder 32 to work to drive the moving rod 29 to move downwards, the closing plate 31 is separated from the limiting plate 30 to open the liquid outlet channel 28, the marking nozzle 27 sprays marking liquid to mark the wafer, then the air cylinder 32 is driven to drive the moving rod 29 to move upwards, and the sealing plate 31 is clamped with the limiting plate 30.
In this embodiment, the screening mechanism includes screening pipe 33 and second air pump, and screening pipe 33 is fixed on base plate 1, and screening pipe 33 one end is connected with the second air pump and its other end is equipped with the screening nozzle towards glue dispensing groove 7, is equipped with the fourth detector that is used for detecting the mark on the unqualified wafer and controls the work of second air pump on the screening pipe 33, and the break-make of electro-magnet and power is still controlled to the fourth detector. When the fourth detector detects the unqualified mark on the wafer below the fourth detector, a signal is sent, the wafer is in dispensing, the electromagnet in the dispensing slot 7 is disconnected from the power supply, the bearing plate 10 moves to the opening end of the dispensing slot 7 under the action of the elastic piece 11, the second air pump works to introduce air into the screening pipe 33, and the screening nozzle sprays the air to blow the wafer out.
In this embodiment, the blanking mechanism includes the gas blowing pipe 8, first air pump and first transport mechanism 9, the gas blowing pipe 8 is fixed on base plate 1 and is located between second guide roll 5 and wind-up roll 3, the blow gun that blows to glue dispensing groove 7 is equipped with near the one end of pay-off strip 6 to gas blowing pipe 8, gas blowing pipe 8 is connected with first air pump, be equipped with the first detector that is used for detecting the wafer and controls first air pump work on the blow gun, the break-make of electro-magnet and power is still controlled to first detector simultaneously, first transport mechanism 9 is located the wind-up roll 3 below and is used for conveying away the wafer after the glue dispensing. When the first detector detects the wafer in the dispensing groove 7, the first detector sends a signal, the electromagnet is disconnected from the power supply, the bearing plate 10 moves to the opening end of the dispensing groove 7 under the action of the elastic piece 11, meanwhile, the first air pump works to introduce air into the air blowing pipe 8, the air blowing nozzle blows air into the dispensing groove 7 through the air vent, so that the wafer is blown down onto the first conveying mechanism 9, the surface of the wafer with silver paste is kept all the time upward by controlling the amount and direction of the air blown out by the air blowing nozzle, and the first conveying mechanism 9 conveys out the qualified wafer.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims (10)

1. A continuous wafer dispensing device is characterized by comprising a substrate, a first driving mechanism, a second driving mechanism, a feeding mechanism, a dispensing mechanism and a discharging mechanism; wherein:
the substrate is vertically arranged, an unwinding roller, a winding roller, a first guide roller and a second guide roller are fixed on the substrate, the unwinding roller and the winding roller are horizontally arranged oppositely, the unwinding roller and the winding roller are respectively driven by a first driving mechanism and a second driving mechanism to unwind and wind, the first guide roller and the second guide roller are positioned between the unwinding roller and the winding roller and above the unwinding roller and the winding roller, the first guide roller and the second guide roller are horizontally arranged oppositely, a feeding belt discharged by the unwinding roller winds the first guide roller and the second guide roller and then is wound by the winding roller, and a plurality of glue dispensing grooves are formed in the feeding belt and are arranged at equal intervals from one end of the feeding belt to the other end of the feeding belt; the feeding mechanism is used for feeding the workpiece with the dispensing into the dispensing groove; the dispensing mechanism is arranged on the base plate and used for dispensing the workpieces in the dispensing groove; the blanking mechanism is arranged on the base plate and used for blanking the workpieces subjected to glue dispensing in the glue dispensing groove.
2. A continuous wafer dispensing device according to claim 1, wherein the blanking mechanism comprises an air blowing pipe, a first air pump and a first conveying mechanism, an air vent is arranged at the bottom of the dispensing slot, the air blowing pipe is fixed on the substrate and located between the second guide roller and the wind-up roller, one end of the air blowing pipe close to the feeding belt is provided with a blowing nozzle for blowing air to the dispensing slot, the air blowing pipe is connected with the first air pump, the blowing nozzle is provided with a first detector for detecting the workpiece and controlling the first air pump to work, and the first conveying mechanism is located below the wind-up roller and used for conveying the dispensed workpiece out.
3. A continuous chip dispensing device as claimed in claim 2, wherein the dispensing slot is provided with a horizontally disposed carrier plate, the bottom of the carrier plate is connected to the bottom of the dispensing slot through an elastic member, the bottom of the carrier plate is provided with an iron plate, the bottom of the dispensing slot is provided with an electromagnet, and the connection and disconnection between the electromagnet and the power source are controlled by the first detector.
4. A continuous wafer dispensing apparatus according to any one of claims 1-3, wherein the feeding mechanism comprises a guiding cylinder, a guiding plate and a second conveying mechanism, the guiding cylinder is vertically disposed and fixed on the substrate, the second conveying mechanism is located above the guiding cylinder and spaced from the guiding cylinder, one end of the guiding plate is abutted with the second conveying mechanism, and the other end of the guiding plate is abutted with the top end of the guiding cylinder.
5. A continuous wafer dispensing apparatus as claimed in claim 4, wherein the inner diameter of the guiding barrel decreases from the top end to the bottom end thereof, and a plurality of soft bristles are vertically arranged on both sides of the inner wall of the guiding barrel.
6. A continuous wafer dispensing apparatus according to any of claims 1-3, wherein the dispensing mechanism comprises a glue supply box fixed on the substrate, a glue storage chamber is disposed in the glue supply box, silver glue is stored in the glue storage chamber, a glue supply port communicated with the glue storage chamber is disposed at the bottom of the glue supply box, a quantitative glue supply device capable of sealing the glue supply port is disposed at the glue supply port, a dispensing nozzle is disposed at the bottom of the glue supply box, a glue supply channel communicated with the glue supply port is disposed inside the dispensing nozzle, and a second detector for detecting the workpiece and controlling the quantitative glue supply device is disposed at the bottom of the dispensing nozzle.
7. A continuous wafer dispensing apparatus according to claim 6, wherein the quantitative glue supply device comprises two quantitative glue supply assemblies disposed opposite to each other, the quantitative glue supply assemblies comprise a sealing block, a cam and a driving motor, the sealing block has an arc-shaped cross section and an arc-shaped opening thereof faces the outside of the glue supply opening, the edge of the sealing block is hermetically connected to the inner wall of the glue supply box through a connecting band, the connecting band is made of an elastic material, the cam is disposed inside the sealing block and rotatably mounted on the inner wall of the glue supply box, and the driving motor is connected to the cam and controlled by the second detector.
8. A continuous wafer dispensing apparatus according to any one of claims 1-3, further comprising a detecting mechanism for detecting whether dispensing of the workpiece is acceptable and marking the unqualified workpiece, wherein the detecting mechanism comprises a marking box, the marking box is fixed on the substrate, a liquid storage cavity is arranged in the marking box, marking liquid for marking is stored in the liquid storage cavity, a liquid outlet communicated with the liquid storage cavity is arranged at the bottom of the marking box, a marking nozzle is arranged at the bottom end of the marking box, a liquid outlet channel communicated with the liquid outlet is arranged in the marking nozzle, a marking control device is arranged in the marking nozzle, and a third detector for detecting whether dispensing of the workpiece is acceptable and controlling the marking control device to operate is arranged on the marking nozzle.
9. A continuous wafer dispensing device as claimed in claim 8, wherein the marking control device comprises a moving rod and a driving cylinder, a limiting plate is horizontally arranged in the liquid outlet channel, the moving rod is vertically arranged in the liquid outlet channel and is slidably connected with the inner wall of the liquid outlet channel, a closing plate capable of being clamped with the limiting plate to close the liquid outlet channel is arranged at the bottom end of the moving rod, the diameters of the limiting plate and the closing plate are smaller than the diameter of the liquid outlet channel, and the cylinder shaft of the driving cylinder is connected with the moving rod and is controlled by a third detector to operate.
10. A continuous wafer dispensing apparatus according to claim 8, further comprising a screening mechanism for screening out the unqualified workpieces for dispensing, wherein the screening mechanism comprises a screening tube and a second air pump, the screening tube is fixed on the substrate, one end of the screening tube is connected to the second air pump, and the other end of the screening tube is provided with a screening nozzle facing the dispensing slot, and the screening tube is provided with a fourth detector for detecting the mark on the unqualified workpiece and controlling the second air pump to operate.
CN201920623101.2U 2019-04-30 2019-04-30 Continuous wafer dispensing equipment Active CN210333180U (en)

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Application Number Priority Date Filing Date Title
CN201920623101.2U CN210333180U (en) 2019-04-30 2019-04-30 Continuous wafer dispensing equipment

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Application Number Priority Date Filing Date Title
CN201920623101.2U CN210333180U (en) 2019-04-30 2019-04-30 Continuous wafer dispensing equipment

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Publication Number Publication Date
CN210333180U true CN210333180U (en) 2020-04-17

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Application Number Title Priority Date Filing Date
CN201920623101.2U Active CN210333180U (en) 2019-04-30 2019-04-30 Continuous wafer dispensing equipment

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111999234A (en) * 2020-09-25 2020-11-27 南京盛力宇网络科技有限公司 Elasticity garment materials gas permeability check out test set based on new material
CN113522661A (en) * 2021-06-29 2021-10-22 洪可场 Annular spraying and dispensing device used after limiting of hydrogen fuel cell electrode plate
CN114472071A (en) * 2021-12-27 2022-05-13 深圳市利拓光电有限公司 Semiconductor packaging equipment and packaging method thereof
CN114950866A (en) * 2022-06-21 2022-08-30 江苏创鼎精密科技有限公司 Electronic component dispensing device and dispensing method for FPC industry
CN114985155A (en) * 2022-06-02 2022-09-02 绍兴市嘉诚感光材料有限公司 PCB photoresist spraying equipment and photoresist spraying method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111999234A (en) * 2020-09-25 2020-11-27 南京盛力宇网络科技有限公司 Elasticity garment materials gas permeability check out test set based on new material
CN111999234B (en) * 2020-09-25 2021-05-07 安徽卡儿菲特服饰有限公司 Elasticity garment materials gas permeability check out test set based on new material
CN113522661A (en) * 2021-06-29 2021-10-22 洪可场 Annular spraying and dispensing device used after limiting of hydrogen fuel cell electrode plate
CN114472071A (en) * 2021-12-27 2022-05-13 深圳市利拓光电有限公司 Semiconductor packaging equipment and packaging method thereof
CN114472071B (en) * 2021-12-27 2023-03-07 深圳市利拓光电有限公司 Semiconductor packaging equipment and packaging method thereof
CN114985155A (en) * 2022-06-02 2022-09-02 绍兴市嘉诚感光材料有限公司 PCB photoresist spraying equipment and photoresist spraying method
CN114950866A (en) * 2022-06-21 2022-08-30 江苏创鼎精密科技有限公司 Electronic component dispensing device and dispensing method for FPC industry

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