CN210326090U

CN210326090U - Antenna support

Info

Publication number: CN210326090U
Application number: CN201921275566.XU
Authority: CN
Inventors: 周世方
Original assignee: Shenzhen Sunway Communication Co Ltd
Current assignee: Shenzhen Sunway Communication Co Ltd
Priority date: 2019-08-06
Filing date: 2019-08-06
Publication date: 2020-04-14
Anticipated expiration: 2029-08-06

Abstract

The utility model discloses an antenna bracket, include the bottom plate and locate the district is plated to the change on the bottom plate, change and plate the district including the front change plate the district and back change plate the district, the front change plate the district to be located the top surface of bottom plate, back change plate the bottom surface that the district is located the bottom plate, change and plate the district still including connecting and plate the district, still include at least one via hole of locating on the bottom plate, the via hole intercommunication the front change plate the district and back change plate the district, the lateral wall of via hole is covered with connect change plate the district, the front change plate the district through connect change plate the district with back change plate the district electricity to be connected; the aperture of the via hole is greater than or equal to 0.3 mm. The through holes on the bottom plate are covered with the connection plating area, the front surface plating area is electrically connected with the back surface plating area through the connection plating area, the upper surface plating area of the antenna support is reduced, the production cost is reduced, the electric connection mode of the through holes is utilized to achieve more reliable connection, and the risk of circuit breaking of the antenna support is greatly reduced.

Description

Antenna support

Technical Field

The utility model relates to a communication equipment technical field especially relates to an antenna boom.

Background

Usually, the surface of the antenna bracket needs to be provided with a proper chemical plating area through an LDS process to meet the electrical performance of the antenna, and the LDS process requires that the section difference and the flash height of the plastic bracket are less than 0.3mm, so the chemical plating area has risks of parting the section difference and excessive flash in the side processing of the antenna bracket, or the laser processing of the LDS has risks of poor chemical plating and no processing, and the increase of the chemical plating area on the side of the antenna bracket also leads to the increase of the manufacturing cost of the antenna bracket.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve is: an antenna stand of low cost is provided.

In order to solve the technical problem, the utility model discloses a technical scheme be: an antenna bracket comprises a base plate and a chemical plating area arranged on the base plate, wherein the chemical plating area comprises a front chemical plating area and a back chemical plating area, the front chemical plating area is positioned on the top surface of the base plate, the back chemical plating area is positioned on the bottom surface of the base plate, the chemical plating area further comprises a connecting chemical plating area and at least one through hole arranged on the base plate, the through hole is communicated with the front chemical plating area and the back chemical plating area, the connecting chemical plating area covers the side wall of the through hole, and the front chemical plating area is electrically connected with the back chemical plating area through the connecting chemical plating area; the aperture of the via hole is greater than or equal to 0.3 mm.

Further, the through hole is a tapered hole, and the taper angle of the through hole is greater than or equal to 30 degrees.

Further, the diameter of the small end of the through hole is larger than or equal to 0.3 mm.

Further, still include arc portion, the major part department of via hole is equipped with arc portion.

Furthermore, the chemical plating area is processed by an LDS chemical plating process.

Furthermore, the number of the through holes is multiple, and the multiple through holes are uniformly distributed in the chemical plating area.

Furthermore, the number of the chemical plating areas is multiple, and the through holes are formed in each chemical plating area.

The beneficial effects of the utility model reside in that: the through holes on the bottom plate are covered with the connection plating area, the front surface plating area is electrically connected with the back surface plating area through the connection plating area, the upper surface plating area of the antenna support is reduced, the production cost is reduced, the electric connection mode of the through holes is utilized to achieve more reliable connection, and the risk of circuit breaking of the antenna support is greatly reduced.

Drawings

Fig. 1 is a top view of the antenna stand of the present invention;

FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1;

fig. 3 is an enlarged view of detail B in fig. 2.

Description of reference numerals:

1. a base plate;

2. a chemical plating area;

3. a via hole;

4. an arc-shaped portion.

Detailed Description

In order to explain the technical content, the objects and the effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.

The utility model discloses the most crucial design lies in: the through holes on the bottom plate are covered with a connection chemical plating area, and the front chemical plating area is electrically connected with the back chemical plating area through the connection chemical plating area.

Referring to fig. 1 to 3, an antenna bracket includes a base plate 1 and a chemical plating area 2 disposed on the base plate 1, wherein the chemical plating area 2 includes a front chemical plating area and a back chemical plating area, the front chemical plating area is located on a top surface of the base plate 1, the back chemical plating area is located on a bottom surface of the base plate 1, the chemical plating area 2 further includes a connecting chemical plating area, and at least one via hole 3 disposed on the base plate 1, the via hole 3 communicates the front chemical plating area and the back chemical plating area, a side wall of the via hole 3 is covered with the connecting chemical plating area 2, and the front chemical plating area is electrically connected with the back chemical plating area through the connecting chemical plating area; the aperture of the via hole 3 is greater than or equal to 0.3 mm.

The utility model discloses a structural principle brief follows as follows: the bottom plate is provided with the via hole, the side wall of the via hole is covered with the connection plating area, the front surface plating area and the back surface plating area are not required to be electrically connected through the connection plating area of the side wall of the bottom plate, and the connection plating area is connected with the front surface plating area and the back surface plating area, so that the connection effect is more stable and reliable while the chemical plating area is reduced.

From the above description, the beneficial effects of the present invention are: the through holes on the bottom plate are covered with the connection plating area, the front surface plating area is electrically connected with the back surface plating area through the connection plating area, the upper surface plating area of the antenna support is reduced, the production cost is reduced, the electric connection mode of the through holes is utilized to achieve more reliable connection, and the risk of circuit breaking of the antenna support is greatly reduced.

Further, the via hole 3 is a tapered hole, and the taper of the via hole 3 is greater than or equal to 30 °.

From the above description, the via hole of the taper hole is simple to process and easier to form.

Further, the diameter of the small end of the through hole 3 is greater than or equal to 0.3 mm.

Further, still include arc portion 4, the major part department of via hole 3 is equipped with arc portion 4.

From the above description, the smooth transition of the arc portion can protect the connection chemical plating area covering the surface and prevent the connection chemical plating area from being worn at the corner.

Further, the chemical plating area 2 is processed by an LDS chemical plating process.

As can be seen from the above description, the LDS chemical plating process has the characteristics of low processing cost and high efficiency.

Furthermore, the number of the via holes 3 is multiple, and the multiple via holes 3 are uniformly distributed in the chemical plating area 2.

Furthermore, the number of the chemical plating areas 2 is multiple, and the through holes 3 are arranged in each chemical plating area 2.

Example one

Referring to fig. 1 and fig. 2, a first embodiment of the present invention is: an antenna bracket comprises a base plate 1 and a chemical plating area 2 arranged on the base plate 1, wherein the chemical plating area 2 comprises a front chemical plating area and a back chemical plating area, the front chemical plating area is positioned on the top surface of the base plate 1, the back chemical plating area is positioned on the bottom surface of the base plate 1, the chemical plating area 2 further comprises a connecting chemical plating area and at least one through hole 3 arranged on the base plate 1, the through hole 3 is communicated with the front chemical plating area and the back chemical plating area, the connecting chemical plating area is covered on the side wall of the through hole 3, and the front chemical plating area is electrically connected with the back chemical plating area through the connecting chemical plating area; the aperture of the via hole 3 is larger than 0.3 mm.

In detail, the chemical plating area 2 is processed by an LDS chemical plating process.

Optionally, the number of the via holes 3 is multiple, the via holes 3 are uniformly distributed in the chemical plating region 2, and the electrical connection stability can be improved by arranging the via holes 3 in the chemical plating region 2.

In detail, the number of the chemical plating areas 2 is multiple, the through hole 3 is arranged in each chemical plating area 2, in this embodiment, the number of the front chemical plating areas is four, and the back chemical plating areas and the front chemical plating areas are arranged in a one-to-one correspondence manner, that is, the four back chemical plating areas are arranged on the back surface of the bottom plate 1.

Example two

Referring to fig. 3, a second embodiment of the present invention is: an antenna bracket comprises a base plate 1 and a chemical plating area 2 arranged on the base plate 1, wherein the chemical plating area 2 comprises a front chemical plating area and a back chemical plating area, the front chemical plating area is positioned on the top surface of the base plate 1, the back chemical plating area is positioned on the bottom surface of the base plate 1, the chemical plating area 2 further comprises a connecting chemical plating area and at least one through hole 3 arranged on the base plate 1, the through hole 3 is communicated with the front chemical plating area and the back chemical plating area, the connecting chemical plating area is covered on the side wall of the through hole 3, and the front chemical plating area is electrically connected with the back chemical plating area through the connecting chemical plating area; the aperture of the via hole 3 is larger than 0.3 mm.

In detail, the via hole 3 is a tapered hole, the taper of the via hole 3 is greater than 30 °, specifically, the diameter of the small end of the via hole 3 is greater than 0.3 mm.

In this embodiment, the connecting structure further includes an arc portion 4, the arc portion 4 is disposed at the large end of the via hole 3, referring to fig. 3, the arc portion 4 is disposed at the joint of the via hole 3 and the bottom surface of the bottom plate 1, and compared with the conventional right-angle transition, the connecting plating area is not easily worn at the corner, and the service life of the product is prolonged.

To sum up, the utility model provides an antenna support, via hole pass through an arc portion rounding off on the bottom plate, and the front that the electricity connection one-to-one set up is changed and is plated the district and back and change and plate the district, has promoted antenna support's connection stability, through LDS chemical plating technology and via hole's structural design greatly reduced antenna support's manufacturing cost.

The above mentioned is only the embodiment of the present invention, and not the limitation of the patent scope of the present invention, all the equivalent transformations made by the contents of the specification and the drawings, or the direct or indirect application in the related technical field, are included in the patent protection scope of the present invention.

Claims

1. The utility model provides an antenna boom, includes the bottom plate and locates the district is plated to the ization on the bottom plate, the district is plated to the ization is plated the district and is plated the district with the back side ization including the front side ization, the front side ization plate the position in the top surface of bottom plate, the back side ization plate the position in the bottom surface of bottom plate, its characterized in that: the chemical plating area also comprises a connecting chemical plating area and at least one through hole arranged on the bottom plate, the through hole is communicated with the front chemical plating area and the back chemical plating area, the connecting chemical plating area is covered on the side wall of the through hole, and the front chemical plating area is electrically connected with the back chemical plating area through the connecting chemical plating area; the aperture of the via hole is greater than or equal to 0.3 mm.

2. The antenna stand of claim 1, wherein: the through hole is a tapered hole, and the taper of the through hole is greater than or equal to 30 degrees.

3. The antenna stand of claim 2, wherein: the diameter of the small end of the through hole is larger than or equal to 0.3 mm.

4. The antenna stand of claim 2, wherein: still include arc portion, the major part department of via hole is equipped with arc portion.

5. The antenna stand of claim 1, wherein: the chemical plating area is processed by an LDS chemical plating process.

6. The antenna stand of claim 1, wherein: the number of the through holes is multiple, and the through holes are uniformly distributed in the chemical plating area.

7. The antenna stand of claim 1, wherein: the number of the chemical plating areas is multiple, and the through holes are formed in each chemical plating area.