CN210320599U - Semiconductor heat exchange module for heater - Google Patents
Semiconductor heat exchange module for heater Download PDFInfo
- Publication number
- CN210320599U CN210320599U CN201921198409.3U CN201921198409U CN210320599U CN 210320599 U CN210320599 U CN 210320599U CN 201921198409 U CN201921198409 U CN 201921198409U CN 210320599 U CN210320599 U CN 210320599U
- Authority
- CN
- China
- Prior art keywords
- channel
- channels
- medium
- heating
- heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model relates to a semiconductor heat exchange module for heater, include: the module body is made of heat conducting materials; the medium channel comprises a plurality of first channels positioned at the upper part and a plurality of second channels positioned at the lower part, the first channels and the second channels are sequentially connected in series to form a snake-shaped structure, and two ends of the medium channel respectively form a medium inlet and a medium outlet on the surface of the module body; the heating channel is positioned between the first channel and the second channel, and a semiconductor heating pipe with a matched shape is arranged in the heating channel; the utility model has the advantages of reasonable design, through adopting modularized design and semiconductor heating pipe, through module body itself as the heat transfer main part, ensured that the heat can obtain effective utilization to the heating efficiency and the heat exchange efficiency of heater.
Description
Technical Field
The utility model relates to a heater technical field especially relates to a semiconductor heat transfer module for heater.
Background
In the prior art, a metal electric heating device is generally used in an electric heater, the heat generation efficiency is low, meanwhile, the heat transfer is mainly carried out by liquid media such as heat conduction oil, the heat conversion rate is not ideal, the relative energy consumption is high, and the use cost of a user is increased.
Disclosure of Invention
In order to solve the defects in the prior art, the utility model aims to provide a semiconductor heat exchange module for heater for improve heating efficiency and heat exchange efficiency.
The utility model provides a technical scheme that its technical problem adopted is:
a semiconductor heat exchange module for a heater, comprising:
the module body is made of heat conducting materials;
the medium channel comprises a plurality of first channels positioned at the upper part and a plurality of second channels positioned at the lower part, the first channels and the second channels are sequentially connected in series to form a snake-shaped structure, and two ends of the medium channel respectively form a medium inlet and a medium outlet on the surface of the module body;
and the heating channel is positioned between the first channel and the second channel, and a semiconductor heating pipe with a matched shape is arranged in the heating channel.
The medium channels are provided with two or more groups;
the medium channels are positioned in the same plane and distributed in parallel; or
The medium channels are located in different planes and are longitudinally and sequentially arranged.
The medium channels are longitudinally and sequentially arranged, the heating channels are further arranged between the medium channels, and the semiconductor heating pipes with matched shapes are arranged in the heating channels.
The first channels are obliquely distributed relative to the axial direction of the second channels, the first channels are positioned between every two adjacent second channels, one end of each first channel is positioned right above one end of one of the second channels, and the other end of each first channel is positioned right above the other end of the other second channel, which is opposite to the other end.
The first channel and the second channel are respectively formed by punching on the side wall of the module body, the communication channel of the first channel and the second channel is also formed by punching on the side wall of the module body, and the punching parts of the first channel, the second channel and the communication channel are respectively arranged in a sealing way through the blocking blocks connected with the module body.
The cross sections of the first channel and the second channel are processed into flat structures, and the bottom surface of the first channel and the top surface of the second channel are respectively positioned on the upper side and the lower side of the heating channel.
The module body is also wrapped by a heat insulation layer, and the heat insulation layer is provided with openings which are distributed in one-to-one correspondence with the medium inlet, the medium outlet and the heating channel.
The medium inlet and the medium outlet are provided with interfaces, the inner walls of which are provided with internal threads.
The utility model has the advantages that: structural design is reasonable, through adopting modular design and semiconductor heating pipe, through module body itself as the heat transfer main part, has ensured that the heat can obtain effective utilization to the heating efficiency and the heat exchange efficiency of heater.
Drawings
The present invention will be further explained with reference to the drawings and examples.
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic top view of the present invention.
Fig. 3 is a schematic bottom view of the present invention.
Fig. 4 is a schematic view of the structure of the right side of the present invention.
Fig. 5 is a schematic view of the front view structure of the present invention (see-through effect).
Fig. 6 is a right-view structural diagram of the module body.
FIG. 7 is a schematic cross-sectional view of the module body and insulation.
Fig. 8 is a schematic structural view of the medium passage and the semiconductor heating tube.
Fig. 9 is a partial structural schematic view of a medium passage and a semiconductor heating tube.
In the figure: the module comprises a module body 1, a first blocking block 2, a second blocking block 3, a semiconductor heating pipe 4, a third blocking block 5, a fourth blocking block 6, a medium inlet 7, a medium outlet 8, a heating channel 9, a medium channel 10, a first channel 11, a second channel 12 and a heat preservation layer 13.
Detailed Description
The following description is provided for illustrative purposes, and other advantages and features of the present invention will become apparent to those skilled in the art from the following detailed description.
Example one
According to the illustrations of fig. 1 to 9: the embodiment provides a semiconductor heat exchange module for heater, including heat preservation 13, module body 1 and semiconductor heating pipe 4, module body 1 adopts whole module structure, and semiconductor heating pipe 4 then is located module body 1 inside and is used for the direct contact heating, and heat preservation 13 parcel is outside at module body 1 for prevent the heat loss, and the structure of module body 1 and semiconductor heating pipe 4 is specifically described as follows.
The module body 1 is made of metal heat conducting materials such as copper or aluminum, the whole copper of the module body 1 is a cuboid with a flat structure, and the thickness of the module body 1 is required to meet the processing requirement of an internal channel, so that the whole module has smaller thickness and can occupy smaller space when being installed in a heater;
a group of medium channels 10 are arranged in the module body 1, each medium channel 10 comprises a plurality of first channels 11 located at the upper part and a plurality of second channels 12 located at the lower part, the second channels 12 are vertically distributed, the first channels 11 are axially and obliquely distributed relative to the second channels 12, the inclination angle of each first channel 11 is determined by the arrangement distance between the second channels 12, the first channels 11 are located between two adjacent second channels 12, the lower side end part of each first channel 11 is located right above the lower side end part of the right second channel 12 and is communicated with the lower side end part through a communication channel, and the upper side end part of each first channel 11 is located right above the upper side end part of the left second channel 12 and is communicated with the upper side end part through a communication channel; through the channels, the first channel 11 and the second channel 12 are sequentially connected in series to form a serpentine structure, two ends of the medium channel 10 respectively form a medium inlet 7 and a medium outlet 8 on the surface of the module body 1, and the medium inlet 7 and the medium outlet 8 are positioned on two sides of the bottom surface of the module body 1;
furthermore, the first channel 11 and the second channel 12 are respectively formed by punching holes on the side wall of the module body 1, the communication channel of the first channel 11 and the second channel 12 is also formed by punching holes on the side wall of the module body 1, the punching positions of the first channel 11, the second channel 12 and the communication channel are respectively sealed by a blocking block connected with the module body 1, the blocking block is connected with the inner wall of the punching position in a threaded connection mode, and the blocking block is positioned in the holes, so that the flatness of the surface of the module body 1 is guaranteed;
the above-mentioned sprue comprises:
a first block 2 located at an upper portion of a front side surface of the module body 1 for sealing a perforated portion of a communicating passage between an upper side end portion of the first passage 11 and an upper side end portion of the second passage 12;
a second block 3 located at a lower portion of a front surface of the module body 1 for sealing a perforated portion of a communicating passage between a lower side end portion of the first passage 11 and a lower side end portion of the second passage 12;
the third block 5 is positioned on the upper part of the upper side surface of the module body 1 and is used for sealing the punched position of the first channel 11;
the fourth block 6 is positioned on the upper part of the lower side surface of the module body 1 and is used for sealing the punched position of the second channel 12;
the medium inlet 7 and the medium outlet 8 are formed by reserving punched positions at the end parts of a first channel 11 and a second channel 12 of a medium channel 10 at the end parts, in order to ensure the connection effect of the medium inlet 7 and the medium outlet 8 with an external pipeline, the end parts of the medium inlet 7 and the medium outlet 8 are provided with interfaces with inner threads on the inner walls, the interiors of the interfaces can be connected with the external pipeline in a threaded connection mode, and the disassembly is convenient;
the heating channel 9 is positioned in the module body 1, the punching position of the heating channel 9 is positioned on the right side surface of the module body 1, the heating channel 9 is positioned between the first channel 11 and the second channel 12, the semiconductor heating pipe 4 with a matched shape is arranged in the heating channel 9, the semiconductor heating pipe 4 is inserted into the heating channel 9, and the outer wall of the semiconductor heating pipe 4 is in close contact with the inner wall of the heating channel 9, so that a good heat conduction effect is guaranteed;
further, in order to ensure the heat exchange effect between the medium in the medium channel 10 and the heat emitted from the heating channel 9, the cross sections of the first channel 11 and the second channel 12 are both processed into flat structures, and the bottom surface of the first channel 11 and the top surface of the second channel 12 are respectively located at the upper side and the lower side of the heating channel 9, so that the medium in the first channel 11 and the medium in the second channel 12 are flattened, the heat exchange area is increased, and the internal medium is ensured to obtain enough heat in the module body 1;
the heat preservation layer 13 is made of rubber sponge plates and is bonded with the outer wall of the module body 1, openings which are distributed in a one-to-one correspondence mode are formed in the heat preservation layer 13, the medium inlets 7, the medium outlets 8 and the heating channels 9 are used for guaranteeing normal use of the module body 1, and meanwhile, the leakage part of the module body 1 is reduced.
Example two
The embodiment provides a semiconductor heat exchange module for heater, including heat preservation 13, module body 1 and semiconductor heating pipe 4, lie in with embodiment one difference:
when the medium channels of the module body 1 are provided with two or more than two groups of 10, the medium channels 10 are located in different planes, the medium channels 10 are longitudinally and sequentially arranged, the heating channels 9 are further arranged between the medium channels 10, and the semiconductor heating pipes 4 with matched shapes are arranged inside the heating channels 9, in this embodiment, on the premise that the heating channels 9 are arranged inside the medium channels 10, the heating channels 9 are further arranged between the medium channels 10, so that the heat exchange effect of the medium in the semiconductor heating pipes 4 and the medium channels 10 is better, and the semiconductor heating pipes can be used in high-power and high-speed heating application environments.
The above is only the preferred embodiment of the present invention, as long as the preferred embodiment is realized by the same means, the objective technical solution of the present invention all belongs to the protection scope of the present invention.
Claims (8)
1. A semiconductor heat exchange module for a heater, comprising:
the module body is made of heat conducting materials;
the medium channel comprises a plurality of first channels positioned at the upper part and a plurality of second channels positioned at the lower part, the first channels and the second channels are sequentially connected in series to form a snake-shaped structure, and two ends of the medium channel respectively form a medium inlet and a medium outlet on the surface of the module body;
and the heating channel is positioned between the first channel and the second channel, and a semiconductor heating pipe with a matched shape is arranged in the heating channel.
2. The semiconductor heat exchange module for a heater of claim 1, wherein: the medium channels are provided with two or more groups;
the medium channels are positioned in the same plane and distributed in parallel; or
The medium channels are located in different planes and are longitudinally and sequentially arranged.
3. The semiconductor heat exchange module for a heater of claim 2, wherein: the medium channels are longitudinally and sequentially arranged, the heating channels are further arranged between the medium channels, and the semiconductor heating pipes with matched shapes are arranged in the heating channels.
4. The semiconductor heat exchange module for a heater of claim 1, wherein: the first channels are obliquely distributed relative to the axial direction of the second channels, the first channels are positioned between every two adjacent second channels, one end of each first channel is positioned right above one end of one of the second channels, and the other end of each first channel is positioned right above the other end of the other second channel, which is opposite to the other end.
5. The semiconductor heat exchange module for a heater of claim 1, wherein: the first channel and the second channel are respectively formed by punching on the side wall of the module body, the communication channel of the first channel and the second channel is also formed by punching on the side wall of the module body, and the punching parts of the first channel, the second channel and the communication channel are respectively arranged in a sealing way through the blocking blocks connected with the module body.
6. The semiconductor heat exchange module for a heater of claim 1, wherein: the cross sections of the first channel and the second channel are processed into flat structures, and the bottom surface of the first channel and the top surface of the second channel are respectively positioned on the upper side and the lower side of the heating channel.
7. The semiconductor heat exchange module for a heater of claim 1, wherein: the module body is also wrapped by a heat insulation layer, and the heat insulation layer is provided with openings which are distributed in one-to-one correspondence with the medium inlet, the medium outlet and the heating channel.
8. The semiconductor heat exchange module for a heater of claim 1, wherein: the medium inlet and the medium outlet are provided with interfaces, the inner walls of which are provided with internal threads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921198409.3U CN210320599U (en) | 2019-07-29 | 2019-07-29 | Semiconductor heat exchange module for heater |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921198409.3U CN210320599U (en) | 2019-07-29 | 2019-07-29 | Semiconductor heat exchange module for heater |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210320599U true CN210320599U (en) | 2020-04-14 |
Family
ID=70126434
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921198409.3U Active CN210320599U (en) | 2019-07-29 | 2019-07-29 | Semiconductor heat exchange module for heater |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210320599U (en) |
-
2019
- 2019-07-29 CN CN201921198409.3U patent/CN210320599U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204732500U (en) | A kind of electric automobile liquid cooling battery modules | |
| CN204014395U (en) | Heat radiation module | |
| CN210320599U (en) | Semiconductor heat exchange module for heater | |
| CN210862322U (en) | Three-medium heat exchanger | |
| CN103629953A (en) | Water cooler | |
| CN210379348U (en) | New energy automobile power battery water-cooling heat dissipation system | |
| CN210004824U (en) | heat exchanger for automobile engine | |
| CN211651287U (en) | Spiral tube type heat exchanger | |
| CN107966057A (en) | A kind of plate heat exchanger and its application method | |
| CN217303664U (en) | Energy-conserving heat exchange device is used to chemical industry | |
| CN103376005A (en) | High-strength aluminum-plate fin-type heat exchanger | |
| CN211204985U (en) | Splicing type efficient heat exchanger | |
| CN204649017U (en) | A kind of tubular heat exchanger | |
| CN114688900A (en) | Multi-module combined plate-fin heat exchanger | |
| CN210136989U (en) | Double-channel power battery liquid cooling plate | |
| CN210036401U (en) | Baffle plate assembly | |
| CN207866058U (en) | A kind of tubular heat exchanger | |
| CN102536509B (en) | Heat exchange-type regenerator for Stirling heat engine | |
| CN219301362U (en) | Overheat high-temperature vacuum superconductive heat exchanger | |
| CN210625427U (en) | Multi-flow heat exchanger | |
| CN215332736U (en) | Tank body wallboard with heat exchange function and mud tank comprising same | |
| CN219589483U (en) | Three-medium heat exchanger, three-medium heat exchange system and air conditioning system | |
| CN209763802U (en) | Novel micro-channel flat tube heat exchanger with internal teeth | |
| CN211739982U (en) | High-performance heat exchange plate | |
| CN216282953U (en) | Heat exchanger |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |