CN210301043U - Heat dissipation host computer and ultrasonic diagnosis equipment - Google Patents

Abstract

The utility model provides a heat dissipation host and ultrasonic diagnostic equipment, which comprises a shell and a main board assembly, wherein the shell comprises a base, a first side board and a second side board, the first side board and the second side board are positioned at two opposite sides of the base, and the inner side of the first side board is provided with a fan assembly; the mainboard subassembly is located between first curb plate and the second curb plate, and the mainboard subassembly includes two at least parallel arrangement's plate body, is formed with the wind channel between the adjacent plate body. The utility model provides a heat dissipation host computer and ultrasonic diagnosis equipment, fan unit can accelerate the heat dissipation between first curb plate and the second curb plate, and the heat that produces between the mainboard subassembly gives off through the wind channel between each plate body to take away the heat between each plate body, have better radiating effect, and can avoid more dust to fall into to the mainboard subassembly on, reduce the life of mainboard subassembly.

Description

Heat dissipation host computer and ultrasonic diagnosis equipment

Technical Field

The utility model relates to the technical field of medical equipment, concretely relates to heat dissipation host computer and ultrasonic diagnosis equipment.

Background

At present, the diversification requirement of users on ultrasonic products is higher and higher, and for desktop ultrasonic diagnostic equipment, as ultrasonic products are smaller and smaller, a case is smaller and smaller, and the heat dissipation requirement on the case is higher and higher. The heat dissipation of the case generally adopts the way that heat dissipation holes are arranged on two sides of the case, so that the case is dissipated by utilizing natural wind.

In the prior art, the ultrasonic diagnosis equipment adopts a mode of air outlet at the upper end of air inlet at the bottom, and fans are used for auxiliary heat dissipation at the upper end and the lower end of a case. The bottom fan of quick-witted case absorbs cold wind to the inside of quick-witted case from ground, and there is more dust on the ground, causes extremely the increase of inside dust very easily to need more fan or radiating part to assist the radiating effect of realization.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a heat dissipation host computer and ultrasonic diagnosis equipment to solve among the prior art more technical problem of dust that the mode of bottom air inlet upper end air-out leads to.

In order to achieve the above object, the utility model adopts the following technical scheme: the heat dissipation host comprises a shell and a main board assembly, wherein the shell comprises a base, a first side board and a second side board, the first side board and the second side board are positioned on two opposite sides of the base, and a fan assembly is arranged on the inner side of the first side board; the main board assembly is arranged between the first side board and the second side board and comprises at least two board bodies arranged in parallel, and an air channel is formed between the board bodies.

Further, the air duct is perpendicular to the first side plate and the second side plate.

Furthermore, the first side plate is provided with a plurality of first air guide holes, the second side plate is provided with a plurality of second air guide holes, and the air duct is communicated with the first air guide holes and the second air guide holes.

Furthermore, a fixed frame plate is sleeved on the outer side of the main board assembly, heat dissipation holes are formed at two opposite ends of the air duct of the fixed frame plate, and the heat dissipation holes are opposite to the first air guide holes or the second air guide holes.

Further, the first air guide hole and the second air guide hole are both long holes.

Further, the fan assembly comprises at least one fan and a fixing supporting plate for fixing the fan, and the fan and the first side plate are fixedly connected through a fixing piece.

Furthermore, the fixed supporting plate is provided with a fan fixing hole, and the fan is embedded in the fan fixing hole.

Furthermore, one side of the fixed supporting plate is provided with an air deflector, one end of the air deflector is fixed on the fixed supporting plate, and the other end of the air deflector is abutted against the outer edge of the main board assembly.

Furthermore, the fixed supporting plate and the first side plate are provided with stand columns therebetween, the fixed supporting plate is provided with limiting bulges, and the limiting bulges are abutted against the stand columns.

Further, a filter screen is arranged on the inner side of the second side plate.

The utility model also discloses an ultrasonic diagnosis equipment, include the heat dissipation host computer in any above-mentioned.

The utility model provides a heat dissipation host computer and ultrasonic diagnosis equipment's beneficial effect lies in: compared with the prior art, the utility model discloses a heat dissipation host computer and ultrasonic diagnosis equipment, first curb plate and second curb plate are located the relative both sides of base respectively, fan assembly can accelerate the heat dissipation between first curb plate and the second curb plate, the heat that produces between the mainboard subassembly gives off through the wind channel between each plate body, first curb plate, wind channel and second curb plate are linked together in proper order, can be quick dispel the heat to the wind channel between each plate body, thereby take away the heat between each plate body, better radiating effect has, and can avoid more dust to fall into to the mainboard subassembly on, reduce the life of mainboard subassembly.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic perspective view of a heat dissipation host provided in an embodiment of the present invention;

fig. 2 is an exploded schematic view of a heat dissipation main unit according to an embodiment of the present invention;

fig. 3 is a schematic perspective view of a fixed supporting plate according to an embodiment of the present invention;

fig. 4 is a schematic perspective view of another angle of the fixed supporting plate according to the embodiment of the present invention.

Description of reference numerals:

1. a housing; 2. a fan assembly; 3. a motherboard assembly; 4. fixing the frame plate; 5. filtering with a screen; 11. a base; 12. a first side plate; 13. a second side plate; 121. a first air guiding hole; 131. a second air guiding hole; 21. a fan; 22. fixing a supporting plate; 23. a column; 221. a fan fixing hole; 222. an air deflector; 223. a limiting bulge; 31. a plate body; 32. an air duct; 41. and (4) heat dissipation holes.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.

Referring to fig. 1 and fig. 2, the heat dissipation host of the present invention will now be described. The heat dissipation host comprises a shell 1 and a main board assembly 3, wherein the shell 1 comprises a base 11 and a first side board 12 and a second side board 13 which are arranged on two opposite sides of the base 11, a fan assembly 2 is arranged on the inner side of the first side board 12, the main board assembly 3 is arranged between the first side board 12 and the second side board 13, the main board assembly 3 comprises at least two board bodies 31 which are arranged in parallel, and an air duct 32 is formed between the board bodies 31.

The utility model provides a heat dissipation host computer, compared with the prior art, first curb plate 12 and second curb plate 13 are located base 11's relative both sides respectively, fan assembly 2 can accelerate the heat dissipation between first curb plate 12 and the second curb plate 13, the heat that produces between mainboard subassembly 3 distributes through the wind channel 32 between each plate body 31, first curb plate 12, wind channel 32 and second curb plate 13 are linked together in proper order, can be quick dispel the heat to the wind channel 32 between each plate body 31, thereby take away the heat between each plate body 31, better radiating effect has, and can avoid more dust to fall into to mainboard subassembly 3 on, reduce mainboard subassembly 3's life.

Further, please refer to fig. 1 and fig. 2 together, as a specific embodiment of the heat dissipating host provided by the present invention, the air duct 32 is perpendicular to the first side plate 12 and the second side plate 13. Specifically, the air duct 32 is disposed between two adjacent plate bodies 31, and can simultaneously take away heat generated on the two plate bodies 31, and the air duct 32 can be perpendicular to the first side plate 12 and the second side plate 13 to ensure that the air duct 32 is smooth, so that wind in the air duct 32 can smoothly pass through the first side plate 12 and the second side plate 13. Of course, according to practical situations and specific requirements, in other embodiments of the present invention, the air duct 32 may be disposed obliquely to the first side plate 12 and the second side plate 13, which is not limited herein.

Further, please refer to fig. 1 and fig. 2 together, as a specific embodiment of the heat dissipating host provided by the present invention, the first side plate 12 has a plurality of first air guiding holes 121, the second side plate 13 has a plurality of second air guiding holes 131, and the air duct 32 is communicated with the first air guiding holes 121 and the second air guiding holes 131. Specifically, the first side plate 12 and the second side plate 13 are respectively provided with a first air guiding hole 121 and a second air guiding hole 131, the first air guiding hole 121 and the second air guiding hole 131 are respectively located on the first side plate 121 and the second side plate 131, the first air guiding hole 121 and the second air guiding hole 131 can be used for guiding in or out wind in the air duct 32, so that an air duct 32 communicated with the outside is formed, and the first air guiding hole 121 and the second air guiding hole 131 are communicated with the air duct 32. Of course, according to the practical situation and the specific requirement, in other embodiments of the present invention, the first side plate 12 and the second side plate 13 may also directly adopt a filter screen or directly be a hollow first side plate 12 and second side plate 13, etc., and the present invention is not limited herein.

Further, please refer to fig. 1 and fig. 2, as a specific embodiment of the heat dissipation host provided by the present invention, the outer side of the main board assembly 3 is sleeved with a fixed frame plate 4, the fixed frame plate 4 is located at two opposite ends of the air duct 32 and is formed with a heat dissipation hole 41, and the heat dissipation hole 41 is opposite to the first air guiding hole 121 or the second air guiding hole 131. Specifically, fixed deckle board 4 is used for fixing a plurality of plate bodies 31 of mainboard subassembly 3, the cover is established and is injectd the outer fringe of a plurality of plate bodies 31 and the position of plate body 31 in the outside of a plurality of plate bodies 31, fixed deckle board 4 is established in the outside of a plurality of plate bodies 31 for annular or half frame type frame, set up a plurality of louvres 41 through the both sides at fixed deckle board 4, can avoid setting up of fixed deckle board 4 to influence the heat dissipation of whole heat dissipation host computer, guarantee the unobstructed nature of wind channel 32.

Further, referring to fig. 1 and fig. 2, as a specific implementation manner of the heat dissipation host provided by the present invention, the first air guiding hole 121 and the second air guiding hole 131 are both long holes. Specifically, the strip-shaped first air guiding hole 121 and the strip-shaped second air guiding hole 131 have larger air inlet area and air outlet area, so that the air inlet effect of the first air guiding hole 121 and the second air guiding hole 131 can be ensured. The length direction of the strip holes is parallel to the plate body 31, so that the first air guide holes 121 and the second air guide holes 131 can be opposite to the air duct 32, and the heat dissipation effect is better.

Further, referring to fig. 2 to 4, as a specific embodiment of the heat dissipating host provided by the present invention, the fan assembly 2 includes at least one fan 21 and a fixing supporting plate 22 for fixing the fan 21, and the fan 21 and the first side plate 12 are fixedly connected by a fixing member. Specifically, fan 21 is fixed on fixed fagging 22, and the vertical setting of fixed fagging 22 is in the inside of heat dissipation host computer, and a plurality of fans 21 are vertical in proper order to be fixed on fixed fagging 22, and one or more fans 21 dispel the heat to the inside of heat dissipation host computer jointly. The fan 21 is fixed on the fixed supporting plate 22, and the edge or periphery of the fixed supporting plate 22 is fixedly connected with the first side plate 12. Of course, according to practical situations and specific requirements, in other embodiments of the present invention, the fixed supporting plate 22 and the fan 21 may also be fixed on the second side plate 13, or the fixed supporting plate 22 and the fan 21 are fixed on both the first side plate 12 and the second side plate 13, which is not limited herein.

Further, referring to fig. 2 to 4, as a specific embodiment of the heat dissipation host provided by the present invention, a fan fixing hole 221 is formed on the fixing supporting plate 22, and the fan 21 is embedded in the fan fixing hole 221. Specifically, fan 21 inlays and establishes in fan fixed orifices 221, can effectually save the space of heat dissipation host computer, and only set up several fan fixed orifices 221 on fixed fagging 22, can guarantee that all air all can be followed through fan fixed orifices 221 discharge, plays the effect of air-ducting for the wind speed in the wind channel 32 is faster, can accelerate the radiating efficiency effectively. Of course, according to practical situations and specific requirements, in other embodiments of the present invention, the fan 21 may also be directly fixed on the fixed supporting plate 22, which is not limited herein.

Further, referring to fig. 2 to 4, as a specific embodiment of the heat dissipation host provided by the present invention, an air deflector 222 is disposed on one side of the fixed supporting plate 22, one end of the air deflector 222 is fixed on the fixed supporting plate 22, and the other end of the air deflector 222 abuts against an outer edge of the main board assembly 3. Specifically, the air deflector 222 is connected with the fixed supporting plate 22 and the main board assembly 3, and the air entering the main board assembly 3 can be discharged through the fan fixing hole 221 by the air deflector 222, so that the air is guided out of the first side plate 12, the air entering the inside of the case is prevented from being blown out from other directions, and the utilization rate of the air is ensured. The air deflector 222 and the fixed supporting plate 22 are integrally formed, and the air deflector 222 is annularly arranged on the outer edge of the fixed supporting plate 22.

Further, please refer to fig. 2 to fig. 4, as a specific embodiment of the heat dissipation host provided by the present invention, an upright column 23 is disposed between the fixed supporting plate 22 and the first side plate 12, a limiting protrusion 223 is disposed on the fixed supporting plate 22, and the limiting protrusion 223 abuts against the upright column 23. Specifically, the stand 23 sets up perpendicular to base 11, can fix fixed fagging 22, can guarantee simultaneously that fixed fagging 22 can be perpendicular to base 11 and set up. The quantity of stand 23 is two, and two stands 23 set up respectively in the both sides of fixed fagging 22, and spacing arch 223 is located the outside of two stands 23, not only can realize fixing fagging 22 and stand 23 through spacing arch 223, can also prescribe a limit to the position of fixed fagging 22 simultaneously, guarantees stand 23, the position between the fixed fagging 22.

Further, referring to fig. 1 and fig. 2, as a specific embodiment of the heat dissipation main unit of the present invention, a filter screen 5 is disposed inside the second side plate 13. Specifically, can filter the wind that enters into the inside in wind channel 32 from second curb plate 13 through filter screen 5, avoid great granule or dust etc. to enter into the inside of heat dissipation host computer, influence the life of heat dissipation host computer.

Referring to fig. 1 to 4, the present invention further provides an ultrasonic diagnostic apparatus, which includes the heat dissipation main unit in any of the above embodiments.

The utility model provides an ultrasonic diagnosis equipment, first curb plate 12 and second curb plate 13 are located base 11's relative both sides respectively, fan assembly 2 can accelerate the heat dissipation between first curb plate 12 and the second curb plate 13, the heat that produces between mainboard subassembly 3 distributes through the wind channel 32 between each plate body 31, first curb plate 12, wind channel 32 and second curb plate 13 are linked together in proper order, can be quick dispel the heat to the wind channel 32 between each plate body 31, thereby take away the heat between each plate body 31, better radiating effect has, and can avoid more dust to fall into to mainboard subassembly 3 on, reduce mainboard subassembly 3's life.

It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.

Claims (12)

1. The heat dissipation host computer, its characterized in that: comprises that

The fan assembly comprises a shell (1), wherein the shell (1) comprises a base (11) and a first side plate (12) and a second side plate (13) which are positioned on two opposite sides of the base (11), and a fan assembly (2) is arranged on the inner side of the first side plate (12); and

mainboard subassembly (3), mainboard subassembly (3) are located first curb plate (12) with between second curb plate (13), mainboard subassembly (3) are including at least two parallel arrangement's plate body (31), and are adjacent be formed with wind channel (32) between plate body (31).

2. The heat-dissipating host of claim 1, wherein: the air duct (32) is perpendicular to the first side plate (12) and the second side plate (13).

3. The heat-dissipating host of claim 1, wherein: the first side plate (12) is provided with a plurality of first air guide holes (121), the second side plate (13) is provided with a plurality of second air guide holes (131), and the air duct (32) is communicated with the first air guide holes (121) and the second air guide holes (131).

4. The heat-dissipating host of claim 3, wherein: the main board assembly (3) is sleeved with a fixed frame plate (4), heat dissipation holes (41) are formed at two opposite ends of the air duct (32) of the fixed frame plate (4), and the heat dissipation holes (41) are opposite to the first air guide holes (121) or the second air guide holes (131).

5. The heat-dissipating host of claim 3, wherein: the first air guide hole (121) and the second air guide hole (131) are both long holes.

6. The heat-dissipating host of any one of claims 1 to 5, wherein: the fan assembly (2) comprises at least one fan (21) and a fixing supporting plate (22) used for fixing the fan (21), and the fan (21) is fixedly connected with the first side plate (12) through a fixing piece.

7. The heat-dissipating host of claim 6, wherein: the fixed supporting plate (22) is provided with a fan fixing hole (221), and the fan (21) is embedded in the fan fixing hole (221).

8. The heat-dissipating host of claim 6, wherein: one side of the fixed supporting plate (22) is provided with an air deflector (222), one end of the air deflector (222) is fixed on the fixed supporting plate (22), the other end of the air deflector (222) faces the air duct (32), and the second air guide hole (131) is communicated with the air duct (32) through the air deflector (222).

9. The heat-dissipating host of claim 6, wherein: still be equipped with a plurality of stands (23) in casing (1), stand (23) perpendicular to base (11) set up, and a plurality of stand (23) are respectively first curb plate (12) with second curb plate (13) are connected.

10. The heat-dissipating host of claim 9, wherein: the both sides of fixed fagging (22) all are equipped with spacing arch (223), both sides spacing arch (223) all are located the outside of stand (23).

11. The heat-dissipating host of any one of claims 1 to 5, wherein: and a filter screen (5) is arranged on the inner side of the second side plate (13).

12. An ultrasonic diagnostic apparatus characterized in that: comprising a heat sink host as claimed in any one of claims 1 to 11.

Images