CN210294753U - High-brightness dodging backlight source structure - Google Patents
High-brightness dodging backlight source structure Download PDFInfo
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- CN210294753U CN210294753U CN201921235440.XU CN201921235440U CN210294753U CN 210294753 U CN210294753 U CN 210294753U CN 201921235440 U CN201921235440 U CN 201921235440U CN 210294753 U CN210294753 U CN 210294753U
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- diffusion
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- isosceles trapezoid
- brightness
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- 238000009792 diffusion process Methods 0.000 claims abstract description 83
- 239000011324 bead Substances 0.000 claims abstract description 32
- 239000002245 particle Substances 0.000 claims abstract description 19
- 239000011159 matrix material Substances 0.000 claims abstract description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 11
- 229910052709 silver Inorganic materials 0.000 claims description 11
- 239000004332 silver Substances 0.000 claims description 11
- 238000005192 partition Methods 0.000 claims description 9
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- 229920002545 silicone oil Polymers 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 239000004417 polycarbonate Substances 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 1
- -1 on the PCB Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
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Abstract
The utility model discloses a high-brightness dodging backlight source structure, which comprises a bottom plate, a LED light source module, a reflecting plate, a diffusion plate, a brightness enhancement film and a fixed bracket which are arranged from bottom to top in sequence; the LED light source module comprises a PCB and LED lamp beads arranged on the upper surface of the PCB in a matrix manner, the reflecting plate is bent into a plurality of isosceles trapezoid grooves with narrow lower parts and wide upper parts, the bottoms of the isosceles trapezoid grooves are opposite to the LED lamp beads in each row and provided with via holes, the LED lamp beads in each row are penetrated in the corresponding via holes, and the upper surface of the side wall of each isosceles trapezoid groove is a scattering surface; the diffusion plate comprises a diffusion plate main body and diffusion layers covering the upper surface and the lower surface of the diffusion plate main body, wherein the diffusion plate main body does not contain diffusion particles, and the diffusion layers contain the diffusion particles. The backlight source structure has high brightness and good light-emitting uniformity.
Description
Technical Field
The utility model relates to a straight following formula backlight technical field especially relates to a dodging backlight structure of hi-lite.
Background
The LED backlight source is divided into a direct type LED backlight source and a side type LED backlight source according to the position of the light source; for large-size LCD displays, the light source of the side-entry LED backlight is disposed on the side surface, and the brightness is insufficient, so the direct-illumination LED backlight is generally used.
As shown in fig. 6, a general direct type LED backlight includes a bottom plate 1 ', an LED light source module 2', a reflection plate 3 ', a diffusion plate 4', a brightness enhancement film 5 'and a fixing bracket 6' sequentially arranged from bottom to top; the reflecting plate 3 'is a flat plate, and LED lamp beads 2.1' of the LED light source module 2 'penetrate through the reflecting plate 3'; the diffusion plate 4 'is a translucent plate containing diffusion particles, and the light emitted from the LED light source module 2' is diffused by the diffusion plate 4 'to become uniform light, which requires a larger thickness of the diffusion plate 4' to obtain uniform light, thereby reducing the brightness. In addition, nowadays, the LCD display is increasingly required to be light and thin, and the diffuser plate 4 'is also required to be light and thin, but the light emission is not uniform due to the direct thinning of the diffuser plate 4'.
Accordingly, the prior art is yet to be improved and developed.
Disclosure of Invention
To the problem that exists among the above-mentioned prior art, the utility model aims to provide a luminance is higher and the even straight following formula backlight structure of light-emitting.
The technical scheme of the utility model as follows:
a high-brightness uniform light backlight source structure comprises a bottom plate, an LED light source module, a reflecting plate, a diffusion plate, a brightness enhancement film and a fixing support which are sequentially arranged from bottom to top; the LED light source module comprises a PCB and LED lamp beads arranged on the upper surface of the PCB in a matrix manner, the reflecting plate is bent into a plurality of isosceles trapezoid grooves with narrow lower parts and wide upper parts, the bottoms of the isosceles trapezoid grooves are opposite to the LED lamp beads in each row and provided with via holes, the LED lamp beads in each row are penetrated in the corresponding via holes, and the upper surface of the side wall of each isosceles trapezoid groove is a scattering surface; the diffusion plate comprises a diffusion plate main body and diffusion layers covering the upper surface and the lower surface of the diffusion plate main body, wherein the diffusion plate main body does not contain diffusion particles, and the diffusion layers contain the diffusion particles.
In the high-brightness uniform light backlight source structure, two inclined reflection baffles are respectively arranged on two sides of each LED lamp bead in the isosceles trapezoid grooves, and the two reflection baffles and the side walls of the isosceles trapezoid grooves jointly form a reflection cup with a small bottom and a large top.
In the high-brightness dodging backlight source structure, the surface of the reflection partition board facing the corresponding LED lamp beads is a smooth reflection surface.
In the high-brightness uniform light backlight source structure, the diffusion plate main body is a PC plate, the diffusion layer is a PC layer, and the diffusion particles are silicon oxide; the thickness of the diffusion layer is 60-80 microns, and the weight percentage of diffusion particles in the diffusion layer is 1.5-4%.
In the high-brightness uniform light backlight source structure, the upper surface and the lower surface of the diffusion plate are both provided with isosceles trapezoid-shaped convex edges.
In the high-brightness dodging backlight source structure, the convex edges on the upper surface and the lower surface of the diffusion plate are staggered with each other.
In the high-brightness uniform light backlight source structure, silver layers are respectively coated on the upper surface and the lower surface of a PCB of the LED light source module, through holes penetrating through the upper surface and the lower surface are respectively formed in the positions, which are opposite to each LED lamp bead, on the PCB, and silver is filled in the through holes; the bottom plate is a metal plate, and the lower surface of the PCB is attached to the bottom plate.
In the high-brightness dodging backlight source structure, heat-conducting silicone oil is coated between the lower surface of the PCB and the bottom plate.
In the high-brightness dodging backlight source structure, a copper block or a lead block is arranged between each LED lamp bead and the upper surface of the PCB.
The utility model has the advantages that:
in the high-brightness uniform light backlight source structure of the utility model, the LED lamp beads are arranged in the via holes of the isosceles trapezoid grooves in a penetrating way, part of light rays with smaller angles sent by the LED lamp beads can be directly upwards transmitted, and part of light rays with larger angles can be irradiated on the side walls of the isosceles trapezoid grooves to be scattered, so that the light rays are firstly subjected to one uniform light treatment before entering the diffusion plate, and then the uniformity of the light emitting is greatly improved through the diffusion effect of the diffusion plate; the use of a thinner diffusion plate can improve the brightness, and in addition, the diffusion plate only has the diffusion layers on the upper and lower surfaces provided with the diffusion particles, and the diffusion plate has less content of the diffusion particles under the same diffusion effect, thereby further improving the brightness. Compared with the traditional direct type LED backlight source, the backlight source structure has higher brightness and better light-emitting uniformity.
Drawings
Fig. 1 is a schematic structural view of the high-brightness uniform backlight structure of the present invention.
Fig. 2 is a schematic structural diagram of a reflection plate in the high-brightness uniform backlight structure of the present invention.
Fig. 3 is a schematic structural diagram of another reflective plate in the high-brightness uniform backlight structure of the present invention.
Fig. 4 is a schematic structural diagram of a diffuser plate in the high-brightness uniform backlight structure of the present invention.
Fig. 5 is a schematic structural diagram of an LED light source module in the high-brightness dodging backlight structure of the present invention.
Fig. 6 is a schematic structural diagram of a conventional direct-type LED backlight.
Detailed Description
In order to make the purpose, technical solution and effect of the present invention clearer and more clear, the following examples are provided for further detailed description of the present invention. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
For convenience of description, the above refers to a direction facing the user when used, i.e., upper side, lower side and upper side in fig. 1.
Referring to fig. 1-5, the high-brightness uniform light backlight source structure provided by the present invention comprises a bottom plate 1, an LED light source module 2, a reflection plate 3, a diffusion plate 4, a brightness enhancement film 5 and a fixing bracket 6, which are sequentially arranged from bottom to top;
the LED light source module 2 comprises a PCB (printed circuit board) 2.1 and LED lamp beads 2.2 which are arranged on the upper surface of the PCB in a matrix manner, the reflecting plate 3 is bent into a plurality of isosceles trapezoid grooves 3.1 which are narrow at the bottom and wide at the top, the bottoms of the isosceles trapezoid grooves are over against the LED lamp beads in each row and are provided with via holes 3.2, the LED lamp beads 2.2 in each row are penetrated in the corresponding via holes 3.2, and the upper surface of the side wall of each isosceles trapezoid groove 3.1 is a scattering surface (one or more of convex points, convex lines, concave points or concave lines are uniformly distributed on the surface); as shown in fig. 1 and 2;
the diffusion plate 4 comprises a diffusion plate main body 4.1 and diffusion layers 4.2 covering the upper and lower surfaces of the diffusion plate main body, wherein the diffusion plate main body does not contain diffusion particles, and the diffusion layers contain diffusion particles, as shown in fig. 4.
In the backlight source structure, because the LED lamp beads 2.2 are arranged in the through holes 3.2 of the isosceles trapezoid grooves in a penetrating manner, part of light rays with smaller angles emitted by the LED lamp beads can be directly upwards transmitted, and part of light rays with larger angles can irradiate the side walls (scattering surfaces) of the isosceles trapezoid grooves and be scattered, so that the light rays are firstly subjected to one-time light homogenizing treatment before entering the diffusion plate 4, and then the uniformity of light emission is greatly improved through the diffusion effect of the diffusion plate 4; the use of a thinner diffusion plate can improve the brightness, and the diffusion plate 4 has only the diffusion layers 4.2 on the upper and lower surfaces provided with diffusion particles, and thus the diffusion plate has a smaller content of diffusion particles with the same diffusion effect, and can further improve the brightness. Compared with the traditional direct type LED backlight source, the backlight source structure has higher brightness and better light-emitting uniformity.
The brightness enhancement film 5 may be a micro-prism film, a multifunctional brightness enhancement film, a micro-lens brightness enhancement film or a reflection-type polarization brightness enhancement film, which is available in the prior art and can be directly purchased from the market.
In some embodiments, referring to fig. 3, two inclined reflective partitions 3.3 are respectively disposed on two sides of each LED lamp bead 2.2 in the isosceles trapezoid-shaped groove 3.1 of the reflective plate 3, and the two reflective partitions 3.3 and the side wall of the isosceles trapezoid-shaped groove 3.1 together form a reflective cup 3.4 with a smaller bottom and a larger top. All light rays emitted by the LED lamp beads 2.2 along the circumferential direction can be reflected through the reflecting cup 3.4, so that the brightness is improved.
Preferably, the surface of the reflecting partition plate 3.3 facing the corresponding LED lamp bead 2.2 is a smooth reflecting surface. The attenuation degree of the light reflected by the reflecting partition plate 3.3 is small, and the light can be effectively scattered and the brightness can be high under the combined action of the light and the side wall of the isosceles trapezoid groove 3.1.
In order to make the comprehensive effect of the scattering effect and the brightness better, the included angle between the reflecting partition plate 3.3 and the side wall of the isosceles trapezoid-shaped groove 3.1 and the PCB 2.1 ranges from 30 degrees to 60 degrees, and is preferably 45 degrees.
In this embodiment, referring to fig. 4, the diffusion plate main body 4.1 is a PC plate (i.e., a polycarbonate resin plate), the diffusion layer 4.2 is a PC layer, and the diffusion particles are silicon oxide; the thickness of the diffusion layer 4.2 is 60-80 microns, and the weight percentage of diffusion particles in the diffusion layer is 1.5-4%. The diffusion plate 4 has a good diffusion effect, and optimally, the thickness of the diffusion layer 4.2 is 68 microns, and the weight percentage of diffusion particles in the diffusion layer is 2.4%.
Further, the upper surface and the lower surface of the diffusion plate 4 are both provided with isosceles trapezoid-shaped protruding ribs 4.3 (that is, the cross sections of the protruding ribs 4.3 are isosceles trapezoids). When the light rays pass through the convex ribs 4.3, part of the light rays can directly pass through the planes of the convex ribs 4.3, and part of the light rays can be refracted by the inclined planes of the convex ribs 4.3, so that the uniformity of emergent light can be greatly improved; and the upper surface and the lower surface are both provided with the convex ribs 4.3, so that the light rays are subjected to two scattering actions, and the uniformity can be further improved. Compared with the traditional direct type LED backlight source, the light-emitting device can further adopt a thinner diffusion plate under the condition of the same light-emitting uniformity.
Preferably, the ribs 4.3 on the upper and lower surfaces of the diffuser plate 4 are offset from each other, as shown in fig. 4, to further improve the uniformity of the emitted light.
In order to improve the brightness of the direct type LED backlight source, the brightness can be generally realized by increasing the distribution density of the LED lamp beads, but with the improvement of the distribution density, the heat dissipation problem of the backlight source becomes prominent, and the improvement of the distribution density is limited due to insufficient heat dissipation speed.
Referring to fig. 5, in order to increase the heat dissipation speed, silver layers 2.3 may be coated on the upper and lower surfaces of a PCB 2.1 of the LED light source module 2, through holes 2.1a penetrating the upper and lower surfaces may be formed in positions of the PCB 2.1 facing each LED lamp bead 2.2, and silver is filled in the through holes 2.1 a; the bottom plate 1 can be a metal plate, and the lower surface of the PCB 2.1 is attached to the bottom plate 1. The heat generated by the LED lamp beads 2.2 can be directly transmitted to the bottom plate 1 through the silver layer 2.3 on the upper layer, the silver in the through holes 2.1a and the silver layer 2.3 on the lower layer in sequence, and the metal bottom plate 1 is used for radiating heat outwards, so that the radiating speed can be greatly improved.
In order to increase the heat transfer rate between the lower silver layer 2.3 and the bottom board 1, heat conductive silicone oil may be coated between the lower surface of the PCB board 2.1 and the bottom board (i.e. between the lower silver layer 2.3 and the bottom board 1).
In some embodiments, see fig. 5, a heat sink 2.4 is disposed between each LED lamp bead 2.2 and the upper surface of the PCB 2.1, and the heat sink 2.4 may be a copper block, a lead block, or other metal block with relatively high density and specific heat capacity. The heat sink block can absorb a large amount of heat, reduce the heating rate, can improve the heating situation of the backlight structure.
It should be understood that the application of the present invention is not limited to the above examples, and that modifications and variations can be made by persons skilled in the art in light of the above teachings, and all such modifications and variations are intended to fall within the scope of the present invention.
Claims (9)
1. A high-brightness uniform light backlight source structure comprises a bottom plate, an LED light source module, a reflecting plate, a diffusion plate, a brightness enhancement film and a fixing support which are sequentially arranged from bottom to top; the LED light source module is characterized by comprising a PCB and LED lamp beads arranged on the upper surface of the PCB in a matrix manner, wherein the reflecting plate is bent into a plurality of isosceles trapezoid grooves with narrow bottoms and wide tops, the bottoms of the isosceles trapezoid grooves are over against the LED lamp beads in each row and are provided with via holes, the LED lamp beads in each row are arranged in the corresponding via holes in a penetrating manner, and the upper surface of the side wall of each isosceles trapezoid groove is a scattering surface; the diffusion plate comprises a diffusion plate main body and diffusion layers covering the upper surface and the lower surface of the diffusion plate main body, wherein the diffusion plate main body does not contain diffusion particles, and the diffusion layers contain the diffusion particles.
2. The backlight structure of claim 1, wherein two inclined reflective partitions are disposed on two sides of each LED bead in the isosceles trapezoid groove, and the two reflective partitions and the side wall of the isosceles trapezoid groove together form a reflective cup with a smaller bottom and a larger top.
3. The backlight structure of claim 2, wherein the surface of the reflective partition facing the corresponding LED bead is a smooth reflective surface.
4. The structure of claim 1, wherein the diffuser plate is a PC plate, the diffuser layer is a PC layer, and the diffusing particles are silicon oxide; the thickness of the diffusion layer is 60-80 microns.
5. The structure of claim 4, wherein the upper and lower surfaces of the diffuser plate are each provided with isosceles trapezoid-shaped ribs.
6. The structure of claim 5, wherein the ribs on the top and bottom surfaces of the diffuser are offset from each other.
7. The backlight source structure of claim 1, wherein the upper and lower surfaces of the PCB of the LED light source module are covered with silver layers, and through holes penetrating the upper and lower surfaces are formed in the PCB at positions facing each LED lamp bead, and the through holes are filled with silver; the bottom plate is a metal plate, and the lower surface of the PCB is attached to the bottom plate.
8. The structure of claim 7, wherein a heat conductive silicone oil is coated between the bottom surface of the PCB and the bottom plate.
9. The backlight structure of claim 7, wherein a copper or lead block is disposed between each LED bead and the upper surface of the PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921235440.XU CN210294753U (en) | 2019-08-01 | 2019-08-01 | High-brightness dodging backlight source structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921235440.XU CN210294753U (en) | 2019-08-01 | 2019-08-01 | High-brightness dodging backlight source structure |
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| Publication Number | Publication Date |
|---|---|
| CN210294753U true CN210294753U (en) | 2020-04-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921235440.XU Expired - Fee Related CN210294753U (en) | 2019-08-01 | 2019-08-01 | High-brightness dodging backlight source structure |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112413431A (en) * | 2020-11-30 | 2021-02-26 | 惠州市盈帆实业有限公司 | Mini LED lamp plate |
| CN116224483A (en) * | 2023-03-08 | 2023-06-06 | 惠州伟志电子有限公司 | Dual-color light guide plate and Local dimming backlight module |
| CN116592319A (en) * | 2023-04-28 | 2023-08-15 | 惠科股份有限公司 | Backlight module and display device |
| CN117663024A (en) * | 2023-12-14 | 2024-03-08 | 苏州天准科技股份有限公司 | Combined light source and imaging system for chip mounter |
-
2019
- 2019-08-01 CN CN201921235440.XU patent/CN210294753U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112413431A (en) * | 2020-11-30 | 2021-02-26 | 惠州市盈帆实业有限公司 | Mini LED lamp plate |
| CN116224483A (en) * | 2023-03-08 | 2023-06-06 | 惠州伟志电子有限公司 | Dual-color light guide plate and Local dimming backlight module |
| CN116592319A (en) * | 2023-04-28 | 2023-08-15 | 惠科股份有限公司 | Backlight module and display device |
| CN117663024A (en) * | 2023-12-14 | 2024-03-08 | 苏州天准科技股份有限公司 | Combined light source and imaging system for chip mounter |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200410 |
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| CF01 | Termination of patent right due to non-payment of annual fee |