CN210274976U - Micromodule arrangement structure for communication - Google Patents

Micromodule arrangement structure for communication Download PDF

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Publication number
CN210274976U
CN210274976U CN201920992886.0U CN201920992886U CN210274976U CN 210274976 U CN210274976 U CN 210274976U CN 201920992886 U CN201920992886 U CN 201920992886U CN 210274976 U CN210274976 U CN 210274976U
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heat dissipation
air
cabinet
dissipation mechanism
base
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Expired - Fee Related
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CN201920992886.0U
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Chinese (zh)
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郑木梅
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Individual
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Abstract

The utility model relates to the communication field, in particular to a micro-module arrangement structure for communication, which comprises a base, a cylindrical accelerated heat dissipation mechanism is arranged at the center of the upper surface of the base, the accelerated heat dissipation mechanism comprises an outer induced air mechanism and an inner heat dissipation mechanism, two side walls of the accelerated heat dissipation mechanism are fixedly welded with clapboards, two sides of one side clapboard are respectively provided with a power distribution cabinet, a passage door is seamlessly and fixedly connected between the power distribution cabinet and the clapboards, two sides of the other side clapboard are respectively provided with a monitoring cabinet, a passage door is seamlessly and fixedly connected between the monitoring cabinet and the clapboards, an air outlet cabinet and an inter-row air conditioner are respectively arranged between the power distribution cabinet and the monitoring cabinet, the utility model greatly improves the heat dissipation efficiency of the whole device through the arrangement of a water-cooling and accelerated airflow flowing mechanism, simultaneously realizes the diversification of heat dissipation channels, has strong practicability.

Description

Micromodule arrangement structure for communication
Technical Field
The utility model relates to a communication field, concretely relates to micromodule arrangement structure for communication.
Background
Traditional communication equipment generally adopts integration rack mounting structure, and its kind is various, and air current organizational structure is very different, has multiple integration equipment rack such as air-out behind the preceding air inlet and front and back side air inlet top air-out. With the development of communication equipment and the improvement of integration level, the power consumption of the equipment is gradually changed from low density and low power consumption to high density and high power consumption, and the heat dissipation requirement of the equipment cannot be met by the arrangement of a machine room in the original upper air supply environment. By reference to the heat dissipation mode of high-power-consumption IT equipment, the air conditioner between the row can satisfy communication equipment's heat dissipation demand in adopting the micromodule, but current micromodule arrangement structure is arranged face-to-face by two racks, the air conditioner between the row alternates wherein, cold passageway in the middle of sealing, the positive air supply of rack in the formation passageway, the air current tissue form of rack back air-out behind the passageway, only be applicable to the equipment deployment of front air inlet, back air-out air current tissue structure, the side air inlet around can't satisfying, the heat dissipation of top air-out formula integration equipment rack.
The patent number CN201820433672.5 discloses a micro-module arrangement structure for communication, which includes a mounting bracket, wherein a left cabinet column, a middle cabinet column and a right cabinet column are arranged on the mounting bracket at intervals, two rows of cold air channels are formed among the left cabinet column, the middle cabinet column and the right cabinet column, and the left cabinet column is composed of more than two front air inlet cabinets and inter-row air conditioners; although the device makes the communication micromodule be applicable to the standard cabinet type equipment of air-out behind the traditional preceding air inlet through three rows of rack arrangement modes, is suitable for the integrated cabinet type equipment of air-out in the top of two sides air inlet again, nevertheless because the device is the simple structure that has increased air inlet and air-out, can't fundamentally improve the holistic radiating efficiency of device, the whole radiating efficiency lifting range of equipment is little, can't satisfy high integrated radiating demand.
Disclosure of Invention
Technical problem to be solved
The utility model discloses a micromodule arrangement structure for communication for solve the structure of existing equipment through adding air inlet and air-out, unable fundamentally improves the holistic radiating efficiency of device, and the whole radiating efficiency lifting range of equipment is little, can't satisfy the problem of high integrated heat dissipation demand.
Second, technical scheme
A micro-module arrangement structure for communication comprises a base, wherein a cylindrical accelerated heat dissipation mechanism is arranged at the center of the upper surface of the base and comprises an outer induced air mechanism and an inner heat dissipation mechanism, partition plates are fixedly welded on two side walls of the accelerated heat dissipation mechanism, power distribution cabinets are respectively arranged on two sides of one partition plate, a channel door is seamlessly and fixedly connected between each power distribution cabinet and each partition plate, monitoring cabinets are respectively arranged on two sides of the other partition plate, a channel door is seamlessly and fixedly connected between each monitoring cabinet and each partition plate, an air outlet cabinet and an inter-row air conditioner are respectively arranged between each power distribution cabinet and each monitoring cabinet, an inter-row air conditioner is seamlessly connected on two sides of each air outlet cabinet, and a top cover is welded on the upper surface of each partition plate;
furthermore, foot pads are welded at four corners of the lower surface of the base;
furthermore, the accelerated heat dissipation mechanism comprises an outer induced air mechanism and an inner heat dissipation mechanism, the outer induced air mechanism comprises an outer cylindrical shell, the top end of the outer cylindrical shell is provided with heat dissipation holes, and the side wall of the outer cylindrical shell is uniformly provided with air induction ports; the inner heat dissipation mechanism comprises an inner cylindrical shell, an induced draft fan and a condenser pipe, wherein air inlets are uniformly formed in the side wall of the inner cylindrical shell, the induced draft fan is arranged above the inner portion of the inner cylindrical shell, the periphery of the induced draft fan is welded on the inner cylindrical shell through welding pieces, the continuous U-shaped condenser pipe is arranged on the outer side of the periphery of the inner cylindrical shell, and the condenser pipe is fixedly connected to the inner cylindrical shell through a fixing piece;
furthermore, the internal heat dissipation mechanism further comprises a refrigeration box, a mounting plate is welded on the lower surface of the refrigeration box, heat dissipation holes are formed in the mounting plate, a mounting groove is formed in the lower surface of the base, the refrigeration box is mounted in the mounting groove, the mounting plate is fixedly mounted on the base through a screw assembly, and the refrigeration box is respectively connected with a liquid inlet and a liquid outlet of the condensation pipe;
furthermore, the air outlet side of the induced draft fan is upward;
furthermore, a skylight is arranged on the top cover, and a closed cold air channel is formed among the top cover, the partition plate, the channel doors at the two ends, the air outlet cabinet, the inter-row air conditioner, the power distribution cabinet and the monitoring cabinet;
furthermore, the air outlet side of the air conditioner between the rows is arranged on one side of the cold air channel, and the air inlet side of the air outlet cabinet is arranged on one side of the cold air channel.
Third, beneficial effect
The utility model increases the whole heat dissipation efficiency of the device through the arrangement of the accelerated heat dissipation mechanism, gets rid of the heat dissipation mechanism of the traditional single cooling heat dissipation form, and greatly improves the whole heat dissipation efficiency of the device through the combination of two heat dissipation forms of water cooling and air cooling; wherein, the outer cylinder casing of heat dissipation mechanism combines the setting of draught fan with higher speed, the steam flow in the cold air passageway has been accelerated to the gathering in the outer cylinder casing, thereby the abundant contact of thermal current with the condenser pipe has been accelerated, heat dispersion has been accelerated through water-cooled mode, simultaneously through the setting of interior cylinder casing and draught fan, make remaining thermal current can follow outer cylinder casing top and discharge, the velocity of flow of air current promotes and combines together with water-cooled mode, the holistic radiating efficiency of device has been improved greatly.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1: the utility model is a three-dimensional structure schematic diagram;
FIG. 2: the utility model is not provided with a top cover structure schematic diagram;
FIG. 3: the utility model is shown in the schematic view from B-B in FIG. 2;
FIG. 4: the structure of the internal heat dissipation mechanism of the utility model is schematically shown;
FIG. 5: the utility model discloses base bottom structure schematic diagram.
The reference numbers are as follows: 1. the air conditioner comprises a base, 2, a partition plate, 3, an outer cylindrical shell, 4, a power distribution cabinet, 5, a monitoring cabinet, 6, a channel door, 7, an air outlet cabinet, 8, an inter-row air conditioner, 9, a top cover, 10, a skylight, 11, an air induction port, 12, an inner cylindrical shell, 13, an induced draft fan, 14, welding parts, 15, an air inlet, 16, a condensation pipe, 1601, a liquid inlet, 1602, a liquid outlet, 17, a fixing part, 18, a mounting groove, 19, a refrigeration box, 20 and a mounting plate; the direction of the arrows in the figure is the direction of the airflow.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to FIGS. 1-5: the utility model provides a micromodule arrangement structure for communication, the on-line screen storage device comprises a base 1, the center department of base 1 upper surface is provided with cylindrical heat dissipation mechanism with higher speed, heat dissipation mechanism with higher speed includes outer induced air mechanism and interior heat dissipation mechanism, fixed welding has baffle 2 on the both sides wall of heat dissipation mechanism with higher speed, wherein one side baffle 2's both sides are provided with switch board 4 respectively, seamless fixedly connected with passway 6 between switch board 4 and the baffle 2, the both sides of opposite side baffle 2 are provided with control cabinet 5 respectively, seamless fixedly connected with passway 6 between control cabinet 5 and the baffle 2, be provided with air-out rack 7 and air conditioner 8 between the line between switch board 4 and the control cabinet 5 respectively, the both sides of air-out rack 7 seamless connection has air conditioner 8 between the line respectively, the last surface welding of.
Specifically, foot pads are welded at four corners of the lower surface of the base 1, and heat dissipation gaps are formed between the base 1 and the supporting surface due to the foot pads, so that bottom heat dissipation of the accelerated heat dissipation mechanism is facilitated.
Specifically, the accelerated heat dissipation mechanism comprises an outer induced air mechanism and an inner heat dissipation mechanism, the outer induced air mechanism comprises an outer cylindrical shell 3, the top end of the outer cylindrical shell 3 is provided with heat dissipation holes, and the side wall of the outer cylindrical shell is uniformly provided with air induction ports 11; the inner heat dissipation mechanism comprises an inner cylindrical shell 12, an induced draft fan 13 and a condenser pipe 16, wherein air inlets 15 are uniformly formed in the side wall of the inner cylindrical shell 12, the induced draft fan 13 is arranged above the inner portion of the inner cylindrical shell 12, the air outlet side of the induced draft fan 13 is upward, the periphery of the induced draft fan 13 is welded on the inner cylindrical shell 12 through welding pieces 14, the continuous U-shaped condenser pipe 16 is installed on the outer side of the periphery of the inner cylindrical shell 12, and the condenser pipe 16 is fixedly connected to the inner cylindrical shell 12 through a fixing piece 17; interior heat dissipation mechanism still includes refrigeration case 19, the surface welding has mounting panel 20 under the refrigeration case 19, the louvre has been seted up on mounting panel 20, base 1 lower surface is provided with mounting groove 18, refrigeration case 19 is installed in mounting groove 18 and through screw subassembly with mounting panel 20 fixed mounting on base 1, refrigeration case 19 is connected with inlet 1601 and liquid outlet 1602 of condenser pipe 16 respectively, wherein, draught fan 13 and refrigeration case 19 all are connected with switch board 4 circular telegram, heat dissipation mechanism combines together through outer induced air mechanism and interior heat dissipation mechanism with higher speed, make water-cooling and forced air cooling combine together, outer induced air mechanism has accelerated the contact of thermal current with condenser pipe 16, interior heat dissipation mechanism has accelerated the discharge of surplus heat, the holistic radiating efficiency of device has been improved greatly.
Specifically, install skylight 10 on top cap 9, top cap 9 and baffle 2, the passway door 6 at both ends, air-out rack 7, air conditioner 8 between the line, form confined cold wind passageway between switch board 4 and monitoring cabinet 5, the one side at the cold wind passageway is arranged to the air-out side of air conditioner 8 between the line, one side at the cold wind passageway is arranged to the air-out side of air-out rack 7, wherein, the formation of cold wind passageway, make the device wholly can carry out both sides air inlet and air-out, the holistic heat dissipation mechanism of device has been increased, radiating efficiency has further been enlarged.
During the use, the air conditioner 8 blows into the air current to cold wind passageway inside between the line, thereby cool down the heat that switch board 4 and monitoring cabinet 5 effluvium, and through the outside discharge heat current of air-out rack 7, and simultaneously, draught fan 13 work, introduce the interior heat current of cold wind passageway inside outer cylinder casing 3 from induced air port 11, make it fully contact with condenser pipe 16, condenser pipe 16 combines together with refrigeration case 19, make the cold night circulation, thereby cool down to the liquid circulation in the condenser pipe 16, thereby thermal discharge has been accelerated, remaining heat current enters into inside inner cylinder casing 12 from air intake 15, and discharge the heat current from the louvre on outer cylinder casing 3 top by draught fan 13, thereby reach the radiating effect to the device.
The utility model discloses a water-cooling and setting of the mechanism that flows of air current with higher speed have improved the holistic radiating efficiency of device greatly, and the heat dissipation channel is diversified simultaneously, can carry out top and side air inlet, air-out heat dissipation simultaneously, have very strong practicality.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims (7)

1. A micromodule arrangement for communication, comprising: comprises a base (1), a cylindrical accelerating heat dissipation mechanism is arranged at the center of the upper surface of the base (1), the accelerating heat dissipation mechanism comprises an outer air inducing mechanism and an inner heat dissipation mechanism, a partition plate (2) is fixedly welded on two side walls of the accelerating heat dissipation mechanism, a power distribution cabinet (4) is respectively arranged on two sides of the partition plate (2) on one side, a passage door (6) is seamlessly and fixedly connected between the power distribution cabinet (4) and the partition plate (2), a monitoring cabinet (5) is respectively arranged on two sides of the partition plate (2) on the other side, a passage door (6) is seamlessly and fixedly connected between the monitoring cabinet (5) and the partition plate (2), an air outlet cabinet (7) and an air conditioner (8) are respectively arranged between the power distribution cabinet (4) and the monitoring cabinet (5), and an air conditioner (8) is seamlessly connected on two sides of the air outlet cabinet (7) respectively, a top cover (9) is welded on the upper surface of the partition plate (2).
2. A micromodule arrangement for communication according to claim 1, wherein: foot pads are welded at four corners of the lower surface of the base (1).
3. A micromodule arrangement for communication according to claim 1, wherein: the accelerated heat dissipation mechanism comprises an outer induced air mechanism and an inner heat dissipation mechanism, the outer induced air mechanism comprises an outer cylindrical shell (3), the top end of the outer cylindrical shell (3) is provided with heat dissipation holes, and the side wall of the outer cylindrical shell is uniformly provided with induced air ports (11); interior heat dissipation mechanism includes interior cylinder casing (12), draught fan (13) and condenser pipe (16), air intake (15) have evenly been seted up on the lateral wall of interior cylinder casing (12), interior cylinder casing (12) inside top is provided with draught fan (13), the draught fan (13) weld on interior cylinder casing (12) through welding piece (14) all around, continuous U type condenser pipe (16) are installed in the outside all around of interior cylinder casing (12), condenser pipe (16) are through mounting (17) fixed connection on interior cylinder casing (12).
4. A micromodule arrangement for communication according to claim 1 or 3, wherein: interior heat dissipation mechanism still includes refrigeration case (19), and the welding has mounting panel (20) under refrigeration case (19), the louvre has been seted up on mounting panel (20), base (1) lower surface is provided with mounting groove (18), refrigeration case (19) are installed in mounting groove (18) and through screw assembly with mounting panel (20) fixed mounting on base (1), refrigeration case (19) are connected with inlet (1601) and liquid outlet (1602) of condenser pipe (16) respectively.
5. A micromodule arrangement for communication according to claim 3, wherein: the air outlet side of the draught fan (13) faces upwards.
6. A micromodule arrangement for communication according to claim 1, wherein: install skylight (10) on top cap (9), form confined cold wind passageway between top cap (9) and baffle (2), the passway door (6) at both ends, air-out rack (7), air conditioner (8), switch board (4) and monitoring cabinet (5).
7. A micromodule arrangement for communication according to claim 1 or 6, wherein: the air outlet side of the air conditioner (8) is arranged on one side of the cold air channel, and the air inlet side of the air outlet cabinet (7) is arranged on one side of the cold air channel.
CN201920992886.0U 2019-06-28 2019-06-28 Micromodule arrangement structure for communication Expired - Fee Related CN210274976U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920992886.0U CN210274976U (en) 2019-06-28 2019-06-28 Micromodule arrangement structure for communication

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920992886.0U CN210274976U (en) 2019-06-28 2019-06-28 Micromodule arrangement structure for communication

Publications (1)

Publication Number Publication Date
CN210274976U true CN210274976U (en) 2020-04-07

Family

ID=70045777

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920992886.0U Expired - Fee Related CN210274976U (en) 2019-06-28 2019-06-28 Micromodule arrangement structure for communication

Country Status (1)

Country Link
CN (1) CN210274976U (en)

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20200407

Termination date: 20210628

CF01 Termination of patent right due to non-payment of annual fee