CN210272295U - Component adjusting device of semiconductor equipment - Google Patents
Component adjusting device of semiconductor equipment Download PDFInfo
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- CN210272295U CN210272295U CN201921439572.4U CN201921439572U CN210272295U CN 210272295 U CN210272295 U CN 210272295U CN 201921439572 U CN201921439572 U CN 201921439572U CN 210272295 U CN210272295 U CN 210272295U
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- magnet assembly
- spring switch
- semiconductor
- adjustment apparatus
- button
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Abstract
The utility model provides a semiconductor equipment's subassembly adjusting device, include: a housing; at least one spring switch arranged on the shell; a plurality of output connectors connected to one end of the at least one spring switch; the power supply connector is connected to the other end of the at least one spring switch; the output connectors are connected with a plurality of locking devices of the semiconductor equipment, and the locking states of the locking devices are released by pressing the at least one spring switch so as to adjust the positions of the components of the semiconductor equipment; the utility model provides a semiconductor equipment's subassembly adjusting device reasonable in design, simple structure, work efficiency is high.
Description
Technical Field
The utility model relates to a semiconductor field, in particular to semiconductor device's subassembly adjusting device.
Background
Semiconductor devices are particularly important in semiconductor manufacturing, and in general, after a semiconductor device is used for a certain period of time, a worker is required to perform a corrective maintenance inspection on the semiconductor device. Generally, a semiconductor equipment manufacturer is provided with a corresponding adjusting device and a corresponding correcting device to correct, maintain and inspect semiconductor equipment, because the semiconductor equipment is expensive, the adjusting device provided by a factory has no any protection mechanism, such as an electric wire connector is exposed, an electric shock accident is easily caused when a worker touches the electric wire connector by mistake, meanwhile, the adjusting device provided by the factory is not provided with intermittent control, because the weight of the semiconductor equipment is large, if the descending speed of components of the semiconductor equipment cannot be controlled in time, the semiconductor equipment can be damaged, and even more seriously, the semiconductor equipment can crush staff, so the existing adjusting device needs to be improved.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned prior art's defect, the utility model provides a semiconductor device's subassembly position adjusting device to prevent the production accident, improve work efficiency.
To achieve the above and other objects, the present invention provides an assembly adjusting device of a semiconductor apparatus, including:
a housing;
at least one spring switch arranged on the shell;
a plurality of output connectors connected to one end of the at least one spring switch;
the power supply connector is connected to the other end of the at least one spring switch;
the output connectors are connected with a plurality of locking devices of the semiconductor equipment, and the locking states of the locking devices are released by pressing the at least one spring switch so as to adjust the positions of the components of the semiconductor equipment.
In one embodiment, the spring switch includes a plurality of buttons that are independent of each other.
In one embodiment, the output connectors and the power connector are respectively located at two sides of the housing, and the output connectors and the power connector are connected with the at least one spring switch through wires or data lines.
In an embodiment, the assembly of the semiconductor device includes a first magnet assembly and a second magnet assembly, the first magnet assembly being disposed above the second magnet assembly.
In one embodiment, the plurality of locking devices are coupled to the first and second magnet assemblies, respectively.
In one embodiment, the plurality of buttons control the change in position of the first and second magnet assemblies, the position of the first and second magnet assemblies decreases when the plurality of buttons are pressed, and the position of the first and second magnet assemblies does not change when the plurality of buttons are released.
In one embodiment, a power switch is further disposed between the power connector and the at least one spring switch, and the power switch is located on the housing.
In one embodiment, an indicating device is further arranged between the power switch and the spring switch, and the indicating device is positioned on the shell.
In one embodiment, a transformer is further disposed between the spring switch and the indicating device, and the transformer is located in the housing.
The utility model provides a semiconductor equipment's subassembly adjusting device, through set up a spring switch on the casing, when pressing spring switch, the position of semiconductor equipment's subassembly descends, and when loosening spring switch, semiconductor equipment's subassembly is locked. Meanwhile, the descending speed of the assembly of the semiconductor equipment can be controlled through the frequency of the pressing spring switch, and the condition that the assembly of the semiconductor equipment is injured by people in the descending process is effectively avoided. Meanwhile, the spring switch, the indicating device, the power switch and the transformer are arranged in the shell, so that the power line head can be effectively prevented from being exposed outside, and further, the electric shock accident can be avoided.
Drawings
FIG. 1: a schematic diagram of a device adjustment apparatus of a semiconductor device in this embodiment.
FIG. 2: a schematic illustration of the housing in this embodiment.
FIG. 3: the internal circuit connection diagram of the component adjustment apparatus of the semiconductor device in this embodiment.
FIG. 4: a schematic diagram of the spring switch in this embodiment.
FIG. 5: a schematic diagram of the semiconductor device in this embodiment.
FIG. 6: the working principle of the device for adjusting components of a semiconductor device in this embodiment is schematically illustrated.
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.
It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the invention in a schematic manner, and only the components related to the invention are shown in the drawings rather than being drawn according to the number, shape and size of the components in actual implementation, and the form, quantity and proportion of the components in actual implementation may be changed at will, and the layout of the components may be more complicated.
Referring to fig. 1-2, the present embodiment provides a device 100 for adjusting a device of a semiconductor apparatus, the device 100 includes a housing 110, in the present embodiment, the housing 110 may include an upper cover 110a and a lower housing 110b, and the upper cover 110a may be fixed on the lower housing 110b by a nut. In this embodiment, a plurality of ventilation holes are further provided at the bottom of the lower case 110b, and the plurality of ventilation holes are used to accelerate heat dissipation. In some embodiments, a plurality of supporting frames may be further disposed on the casing 110, and the casing 110 may be separated from the supporting surface by the plurality of supporting frames, so that heat generated by the assembly adjustment apparatus 100 during operation is dissipated in time, thereby preventing damage to components in the assembly adjustment apparatus 100 due to over-high temperature and prolonging the service life of the assembly adjustment apparatus 100. In the present embodiment, the housing 110 is, for example, a rectangular parallelepiped or other shape, and the housing 110 may be made of high-strength plastic, for example, acrylic material.
Referring to fig. 1-4, the device adjustment apparatus 100 includes at least one spring switch 111, and the spring switch 111 is disposed on the housing 110. In this embodiment, the assembly adjustment device 100 includes a spring switch 111. The spring switch 111 includes a first button 111a and a second button 111b, the first button 111a and the second button 111b have the same structure, and the first button 111a and the second button 111b operate independently of each other, and the first button 111a and the second button 111b protrude from the upper cover 110a of the housing 110. In this embodiment, the assembly adjustment apparatus 100 includes a plurality of output terminals 130 and a power supply terminal 120, the output terminals 130 are used for connecting a plurality of locking devices of a semiconductor device, the power supply terminal 120 is used for connecting an external power supply, the plurality of output terminals 130 and the power supply terminal 120 are respectively located at both sides of the housing 110, and the plurality of output terminals 130 and the power supply terminal 120 are connected to the spring switch 111 through a wire or a data line, wherein the assembly adjustment apparatus 100 includes, for example, a first output terminal 131 and a second output terminal 132. The first output connector 131 is connected to the fixed contact 111c of the first button 111a, and the second output connector 132 is connected to the fixed contact 111d of the second button 111 b. When the first button 111a is pressed and the first button 111a contacts the fixed contact 111c of the first button 111a, the first button 111a is connected to the first output connector 131 to form a connected circuit, i.e., a current flows through the first output connector 131. When the second button 111b is pressed and the second button 111b contacts the fixed contact 111d of the second button 111b, the second button 111b is connected to the second output connector 132, and a connected circuit is formed, i.e. current flows through the second output connector 132. In this embodiment, when the first button 111a or the second button 111b of the spring switch 111 is pressed, a current passes through the first output connector 131 or the second output connector 132, and when the first button 111a or the second button 111b of the spring switch 111 is released, the current cannot pass through the first output connector 131 or the second output connector 132.
In some embodiments, because the wire or data line is located outside of the housing 110, a spool may be provided within the housing 110 to wind the wire or data line onto the spool. When the assembly adjusting apparatus 100 is operated, the wires or data lines of the first output connector 131 or the second output connector 132 can be pulled out of the housing 110, and when the assembly adjusting apparatus 100 is operated, the wires or data lines of the first output connector 131 or the second output connector 132 can be collected on a reel in the housing 110.
Referring to fig. 1-5, in the present embodiment, a power switch 114 is further disposed between the spring switch 111 and the power connector 120, the power switch 114 is disposed on the housing 110, the power switch 114 includes a button 114a, the button 114a protrudes from the housing 110, specifically, the button 114a of the power switch 114 protrudes from a surface of the upper cover 110a, the power switch 114 is connected to the power connector 120 through a wire or a data line, in this embodiment, an indicating device 113 is further provided between the spring switch 111 and the power switch 114, the indicating device 113 is provided on the housing 110, when the power connector 120 is connected to an external power source, the indicating device 113 is lighted when the button 114a of the power switch 114 is pressed, it indicates that there is current flowing through the indicating means 113 and, when the button 114a of the power switch 114 is pressed again, when the indicating device 113 is off, the circuit is open and no current flows through the indicating device 113. The indication device 113 can inform the operator that the device adjustment apparatus 100 is in the working state, and prevent other people from touching the device adjustment apparatus 100 or approaching the semiconductor apparatus 200. In the present embodiment, the indicating device 113 is, for example, an indicator light. In this embodiment, a transformer 112 is further disposed between the spring switch 111 and the indicating device 113, the transformer 112 is disposed in the housing 110, specifically, the transformer 112 is fixed on the lower housing 110b, and the transformer 112 is fixed on the inner surface of the lower housing 110b through an insulating board. The transformer 112 is connected to the spring switch 111 and the indicating device 113, for example, by metal wires. The transformer 112 converts the ac power to a low voltage dc power, which is delivered to the plurality of output terminals 130 through the spring switch 111. in this embodiment, the voltage of the low voltage dc power converted by the transformer 112 is between 20-32 volts, such as 24 volts and 28 volts. In some embodiments, a voltage stabilizing circuit board may be further disposed in the housing 110, and the voltage stabilizing circuit board is connected to the transformer 112, and the output value of the transformer 112 can be stabilized by the voltage stabilizing circuit board, so that the output voltage value of the transformer 112 meets the requirements of the assembly adjusting apparatus 100. In the present embodiment, by disposing the transformer 112 inside the housing 110 and further laying an insulating partition and a heat dissipation layer on the outer surface of the transformer 112, the transformer 112 is kept in a relatively insulated and sealed environment, so that the transformer 112 is not affected by moisture or rust, thereby effectively preventing problems caused by low-voltage short circuit, such as burning out the transformer 112. In some embodiments, the transformer 112 includes a core, a high voltage winding and a low voltage winding, and the high voltage winding and the low voltage winding are symmetrically wound on the outer surface of the core.
Referring to fig. 1-3, in the present embodiment, the power connector 120 is connected to a power socket, the button 114a of the power switch 114 is pressed, the indicating device 113 is illuminated, the transformer 112 converts the ac power into the low-voltage dc power, and when the first button 111a or the second button 111b is pressed, the low-voltage dc power passes through the first output connector 131 or the second output connector 132. When the first button 111a or the second button 111b is released, the low voltage dc cannot pass through the first output connector 131 or the second output connector 132.
Referring to fig. 5, in the present embodiment, the semiconductor device 200 includes an upper board 201 and a lower board 202, wherein the upper board 201 is connected to the lower board 202 through a supporting rod 203. The semiconductor apparatus 200 further includes a first magnet assembly 211, a second magnet assembly 212, the first magnet assembly 211 being disposed above the second magnet assembly 212 by a link 213. Wherein the connecting rod 213 vertically penetrates the upper plate 201, and the first and second magnet assemblies 211 and 212 are positioned between the upper plate 201 and the lower plate 202. The semiconductor apparatus 200 further includes a plurality of locking devices, for example, a first locking device 221 and a second locking device 222, the first locking device 221 being disposed on the upper plate 201, the first locking device 221 being connectable to the first magnet assembly 211 through a data line, the second locking device 222 being disposed on the lower plate 202, the second locking device 222 being connectable to the second magnet assembly 212 through a data line. When the first locking device 221 and the second locking device 222 are not powered, the first locking device 221 and the second locking device 222 are in a locking state, the first magnet assembly 211 and the second magnet assembly 212 cannot move, when the first locking device 221 and the second locking device 222 are powered, the first locking device 221 and the second locking device 222 are unlocked, and the first magnet assembly 211 and the second magnet assembly 212 descend along the connecting rod 213 due to gravity. When the first and second magnet assemblies 211 and 212 are lowered, the semiconductor apparatus 200 is subjected to a correction maintenance by a worker.
Referring to fig. 6, the present embodiment describes the working process of the device adjustment apparatus 100: first, the first output connector 131 of the module adjusting device 100 is connected to the first locking device 221 of the semiconductor device 200, the second output connector 132 is connected to the second locking device 222 of the semiconductor device 200, then the power connector 120 of the module adjusting device 100 is connected to an external ac power outlet, then the power switch 114 is pressed, the indicating device 113 is lighted to indicate that ac power passes through, the ac power is converted into low-voltage dc power by the transformer 112 in the housing 110, then the spring switch 111 is pressed, the low-voltage dc power passes through the first locking device 221 and the second locking device 222, at this time, the first locking device 221 and the second locking device 222 are unlocked, the first magnet assembly 211 and the second magnet assembly 212 descend along the connecting rod 213 due to gravity, if the spring switch 111 is released, the circuit is disconnected, the low-voltage dc power cannot pass through the first locking device 221 and the second locking device 222, at this time, the first and second locking devices 221 and 222 are in a locked state, and the first and second magnet assemblies 211 and 212 cannot descend along the link 213, so that the descending speed of the first and second magnet assemblies 211 and 212 can be controlled by intermittently pressing the spring switch 111.
Referring to fig. 4-6, in particular, in the embodiment, the spring switch 111 includes a first button 111a and a second button 111b, the first button 111a is connected to the first locking device 221, the second button 111b is connected to the second locking device 222, when the first button 111a is pressed, the first magnet assembly 211 descends along the connecting rod 213, and the second magnet assembly 212 is in a locked state and does not descend along the connecting rod 213. When the second button 111b is pressed, the second magnet assembly 212 descends along the link 213, and the first magnet assembly 211 is in a locked state and does not descend along the link 213. In the present embodiment, the first button 111a and the second button 111b may be operated individually, and thus the first magnet assembly 211 or the second magnet assembly 212 may be controlled individually to descend according to the field situation, and then the semiconductor apparatus 200 may be subjected to the correction maintenance by the worker.
In summary, the spring switch 111, the transformer 112, the indicating device 113 and the power switch 114 are disposed on the housing 110, so that the component adjusting device 100 can be conveniently taken when the component adjusting device 100 is used, and meanwhile, the circuit can be effectively prevented from being exposed, thereby preventing safety accidents. Meanwhile, the descending speeds of the first magnet assembly 211 and the second magnet assembly 212 can be effectively controlled according to the working state of the spring switch 111 which can intermittently release the locking device 221 or the locking device 222, so that the conditions of high-speed impact of parts, personnel injury and the like can be effectively avoided.
In summary, the present embodiment provides a device for adjusting a component of a semiconductor device, which can adjust a position of the component of the semiconductor device by intermittently pressing a spring switch, and can also adjust a descending speed of the component of the semiconductor device, thereby effectively avoiding other accidents such as injuries of employees. The component adjusting device has reasonable design, can improve the working efficiency and can avoid the mutual impact of the components.
The above description is only a preferred embodiment of the present application and the explanation of the applied technical principle, and it should be understood by those skilled in the art that the scope of the present application is not limited to the technical solution of the specific combination of the above technical features, and also covers other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the inventive concept, for example, the technical solutions formed by mutually replacing the above technical features (but not limited to) having similar functions disclosed in the present application.
Besides the technical features described in the specification, other technical features are known to those skilled in the art, and further description of the other technical features is omitted here in order to highlight the innovative features of the present invention.
Claims (9)
1. A component adjustment apparatus for a semiconductor device, comprising:
a housing;
at least one spring switch arranged on the shell;
a plurality of output connectors connected to one end of the at least one spring switch;
the power supply connector is connected to the other end of the at least one spring switch;
the output connectors are respectively connected with a plurality of locking devices of the semiconductor equipment, and the locking states of the locking devices are released by pressing the at least one spring switch so as to adjust the positions of the components of the semiconductor equipment.
2. The component adjustment apparatus for semiconductor devices according to claim 1, wherein: the at least one spring switch includes a plurality of buttons that are independent of each other.
3. The component adjustment apparatus for a semiconductor device according to claim 2, wherein: the output connectors and the power connector are respectively positioned on two sides of the shell and are connected with the at least one spring switch through a lead or a data line.
4. The component adjustment apparatus for a semiconductor device according to claim 3, wherein: the assembly of the semiconductor device includes a first magnet assembly and a second magnet assembly, the first magnet assembly being disposed above the second magnet assembly.
5. The component adjustment apparatus for semiconductor devices according to claim 4, wherein: the plurality of locking devices are connected to the first magnet assembly and the second magnet assembly, respectively.
6. The component adjustment apparatus for a semiconductor device according to claim 5, wherein: the plurality of buttons control the position change of the first magnet assembly and the second magnet assembly, when the plurality of buttons are pressed, the position of the first magnet assembly and the position of the second magnet assembly are lowered, and when the plurality of buttons are released, the position of the first magnet assembly and the position of the second magnet assembly are not changed.
7. The component adjustment apparatus for semiconductor devices according to claim 1, wherein: and a power switch is also arranged between the power connector and the spring switch and is positioned on the shell.
8. The component adjustment apparatus for a semiconductor device according to claim 7, wherein: an indicating device is further arranged between the power switch and the at least one spring switch, and the indicating device is located on the shell.
9. The component adjustment apparatus for a semiconductor device according to claim 8, wherein: a transformer is further arranged between the at least one spring switch and the indicating device, and the transformer is located in the shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921439572.4U CN210272295U (en) | 2019-09-02 | 2019-09-02 | Component adjusting device of semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921439572.4U CN210272295U (en) | 2019-09-02 | 2019-09-02 | Component adjusting device of semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210272295U true CN210272295U (en) | 2020-04-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921439572.4U Active CN210272295U (en) | 2019-09-02 | 2019-09-02 | Component adjusting device of semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210272295U (en) |
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2019
- 2019-09-02 CN CN201921439572.4U patent/CN210272295U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
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Address after: 230012 No.88, xifeihe Road, Hefei comprehensive free trade zone, Xinzhan District, Hefei City, Anhui Province Patentee after: Hefei crystal integrated circuit Co.,Ltd. Address before: 230012 No.88, xifeihe Road, Hefei comprehensive free trade zone, Xinzhan District, Hefei City, Anhui Province Patentee before: HEFEI JINGHE INTEGRATED CIRCUIT Co.,Ltd. |