CN210272268U

CN210272268U - Plate feeding machine for semiconductor processing

Info

Publication number: CN210272268U
Application number: CN201921017211.0U
Authority: CN
Inventors: 姜传明; 王辛茹; 罗西安
Original assignee: Anhui Tiantong Jingdian New Technology Co ltd
Current assignee: Anhui Tiantong Jingdian New Technology Co ltd
Priority date: 2019-07-02
Filing date: 2019-07-02
Publication date: 2020-04-07
Anticipated expiration: 2029-07-02

Abstract

The utility model discloses a go up trigger for semiconductor processing, including base, loading plate and roof, the top horizontally connected with roof of base, and the bottom of roof all be connected with the bracing piece all around with the top of base between all around, top one side horizontally mounted of base has the transport board, transports cushion and base fixed connection that the board passes through bottom one end, the top middle-end horizontally connected with of base loads the board, the top one end of loading the board is provided with places the hole. The return spring pushes the moving rod to move outwards, and then the plate is pushed to enter the upper part of the through hole to be clamped. Panel can be automatic remove, need not manual operation, and work efficiency is higher. And panel is when removing with being pressed, and the fan passes through the pipeline and carries wind-force to tuber pipe and wind hole, and tuber pipe and wind hole blow the upper and lower two sides of panel, get rid of outside dust for panel is cleaner.

Description

Plate feeding machine for semiconductor processing

Technical Field

The utility model relates to a go up the trigger, concretely relates to go up trigger for semiconductor processing belongs to semiconductor processing application.

Background

During processing, a semiconductor is usually installed on the outer portion of a plate, and the plate is usually installed by a plate installing machine, so that the working efficiency and the accuracy are improved.

Chinese patent application No. 201510558459.8 discloses a VCP board feeding machine, which comprises a frame, an upper bracket, a magazine, an X-axis assembly, a Y-axis assembly, and a soft board positioning platform. The material box and the soft board positioning platform are arranged adjacently, and both the material box and the soft board positioning platform are arranged on the working platform of the frame and are positioned below the inner sides of the two suspended right-angle arms of the upper bracket; the X-axis assembly is arranged on the X-axis module fixing plate and is positioned above the material box and the soft plate positioning platform, and the Y-axis assembly is arranged on the Y-axis module fixing plate and is positioned above the soft plate positioning platform. The position accuracy rate of article can only be improved in this patent, but article are inconvenient when the installation is got and is put, and is inefficient.

The existing plate feeding machine is complex in structure and troublesome to use, and cannot meet the requirements of plates with different sizes. The plates need manual control in the moving process, and the working efficiency is low. And the plate cannot be cleaned during installation, external dust is not removed, and the quality of the semiconductor is affected after installation. And the included angle between the semiconductor and the plate cannot be adjusted in the processing process, so that the semiconductor processing device cannot adapt to different working requirements.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a go up trigger for semiconductor processing, it is complicated to solve current last trigger structure, uses comparatively troublesome, can not adapt to the demand of unidimensional panel. The plates need manual control in the moving process, and the working efficiency is low. And the plate cannot be cleaned during installation, external dust is not removed, and the quality of the semiconductor is affected after installation. And the included angle between the semiconductor and the plate cannot be adjusted in the processing process, so that the semiconductor processing device cannot adapt to the technical problem of different working requirements.

The purpose of the utility model can be realized by the following technical scheme:

the utility model provides a go up trigger for semiconductor processing, includes base, loading plate and roof, the top horizontally connected with roof of base, and all be connected with the bracing piece around the bottom of roof and the top of base between all around, top one side horizontally mounted of base has the transport board, transports cushion and base fixed connection that the board passes through bottom one end, the top middle-end horizontally connected with of base loads the board, the top one end of loading the board is provided with places the hole.

The inside middle-end of transport board is provided with the loading hole along length direction, is close to the one end middle part of loading board runs through and is provided with the perforation, the equal parallel connection in fenestrate both sides has the limiting plate, is connected with a plurality of damping spring between the side of limiting plate and the top side of transport board, the other end middle part of transport board is connected with the sleeve along length direction, and telescopic inside movable sleeve is equipped with the carriage release lever, is connected with return spring between the one end of carriage release lever and the telescopic inner, and the one end inboard that the limiting plate is close to the carriage release lever is convex setting.

The bottom of roof is connected with the hydraulic pressure post of vertical setting, and the bottom of hydraulic pressure post is connected with the cushion, and the cushion sets up directly over fenestrate, the inside middle-end of cushion is provided with the tuber pipe, and the downthehole portion of loading is close to fenestrate one end and is provided with the wind hole.

Preferably, the upper part of the top plate is provided with a fan, and the fan is connected with the air pipe and the air hole through a pipeline.

Preferably, the middle end of the bottom of the loading plate is vertically connected with a rotating shaft, and the bottom of the rotating shaft is rotatably connected with the base through a bearing.

Preferably, the periphery of the loading plate is movably inserted with a positioning rod in a penetrating manner, and the bottom of the positioning rod is connected with the top of the base through a sucking disc.

Preferably, one end of the moving rod, which is close to the through hole, is connected with a push plate, and the length of the push plate is smaller than that of the air hole.

The utility model has the advantages that:

1. through setting up the limiting plate in fenestrate both sides for the panel that a plurality of was treated processing is put in the inside of transporting the loading hole on board upper portion, and panel promotes the carriage release lever, and then extrudees return spring, and the carriage release lever shrink enters into telescopic inside, makes the inside in loading hole once can place a plurality of panels, and the panel of one end can be promoted the joint by the push pedal on fenestrate upper portion, makes things convenient for follow-up hydraulic column to press downwards. When panel was on fenestrate upper portion, the limiting plate of both sides under damping spring's promotion with the both sides butt of panel, make panel can not drop downwards, stability can be good, and can adapt to not unidimensional panel.

2. The rotating shaft is connected to the bottom of the loading plate, so that the loading plate can be pushed to rotate through the rotating shaft in work, included angles between the placing hole and the semiconductor and the through hole are changed, and the mounting requirements of different plates can be met. After the included angle is adjusted, the positioning rod is pressed downwards, the sucking disc is bonded with the base, and the position of the loading plate is limited and cannot move.

3. The bottom of the top plate is connected with the hydraulic column, and the top of the top plate is provided with the fan. The hydraulic column can drive the elastic pad to move downwards in work, the elastic pad is in contact with the plate, the plate is pressed downwards to be separated from the through hole, enters the upper part of the semiconductor below and is connected with the semiconductor. The return spring pushes the moving rod to move outwards, and then the plate is pushed to enter the upper part of the through hole to be clamped. Panel can be automatic remove, need not manual operation, and work efficiency is higher. And panel is when removing with being pressed, and the fan passes through the pipeline and carries wind-force to tuber pipe and wind hole, and tuber pipe and wind hole blow the upper and lower two sides of panel, get rid of outside dust for panel is cleaner.

Drawings

In order to facilitate understanding for those skilled in the art, the present invention will be further described with reference to the accompanying drawings.

Fig. 1 is a schematic view of the overall structure of the present invention.

Fig. 2 is a schematic view of the structure of the elastic cushion of the present invention.

Fig. 3 is a schematic view of the inside of the conveying plate of the present invention.

Fig. 4 is a schematic diagram of the loading plate structure of the present invention.

Fig. 5 is a side view of the present invention shown in fig. 4.

In the figure: 1. a base; 2. a loading plate; 3. a conveyance board; 4. a fan; 5. a hydraulic column; 6. an elastic pad; 7. a top plate; 8. an air duct; 9. a rotating shaft; 10. a damping spring; 11. a limiting plate; 12. a wind hole; 13. perforating; 14. pushing the plate; 15. a sleeve; 16. a return spring; 17. a travel bar; 18. placing holes; 19. positioning a rod; 20. and (4) sucking discs.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1-5, a plate loading machine for semiconductor processing comprises a base 1, a loading plate 2 and a top plate 7, wherein the top of the base 1 is horizontally connected with the top plate 7, supporting rods are connected between the periphery of the bottom of the top plate 7 and the periphery of the top of the base 1, a conveying plate 3 is horizontally arranged on one side of the top of the base 1, the conveying plate 3 is fixedly connected with the base 1 through a cushion block at one end of the bottom, the middle end of the top of the base 1 is horizontally connected with the loading plate 2, and a placing hole 18 is formed at one end of the top of the loading plate 2;

a loading hole is formed in the middle end of the interior of the conveying plate 3 along the length direction, a through hole 13 penetrates through the middle of one end, close to the loading plate 2, of the through hole 13, limiting plates 11 are connected to two sides of the through hole 13 in parallel, a plurality of damping springs 10 are connected between the side face of each limiting plate 11 and the side face of the top of the conveying plate 3, a sleeve 15 is connected to the middle of the other end of the conveying plate 3 along the length direction, a moving rod 17 is movably sleeved in the sleeve 15, a return spring 16 is connected between one end of the moving rod 17 and the inner end of the sleeve 15, and the inner side of one end, close;

the bottom of roof 7 is connected with the hydraulic pressure post 5 of vertical setting, and the bottom of hydraulic pressure post 5 is connected with cushion 6, and cushion 6 sets up directly over perforation 13, and the inside middle-end of cushion 6 is provided with tuber pipe 8, and the one end that the inside of loading hole is close to perforation 13 is provided with wind hole 12.

As the utility model discloses a technical optimization scheme, fan 4 is installed on the upper portion of roof 7, and fan 4 passes through pipe connection tuber pipe 8 and wind hole 12, and panel is removing and when being pressed down, and fan 4 carries wind-force to tuber pipe 8 and wind hole 12 through the pipeline, and tuber pipe 8 and wind hole 12 blow the upper and lower two sides of panel, get rid of the dust of outside for panel is cleaner.

As a technical optimization scheme of the utility model, the vertical pivot 9 that is connected with in the bottom of loading plate 2, the bottom of pivot 9 is passed through the bearing and is connected with base 1 rotation, and loading plate 2 can rotate on base 1's upper portion through pivot 9, adjusts the contained angle between semiconductor and the panel.

As a technical optimization scheme of the utility model, loading plate 2 all runs through the activity all around and pegs graft and have locating lever 19, and locating lever 19's bottom is passed through sucking disc 20 and is connected with base 1's top, and locating lever 19 passes through sucking disc 20 and is connected with base 1, can conveniently dismantle the installation, can fix spacingly again loading plate 2, makes its job stabilization.

As a technical optimization scheme of the utility model, the one end that carriage release lever 17 is close to perforation 13 is connected with push pedal 14, and push pedal 14's length is less than the length of wind hole 12, and push pedal 14 promotes panel more stable, and can not influence the cleanness in wind hole 12.

The utility model discloses when using, the panel of treating processing with a plurality of is put in the inside of transporting the loading hole on 3 upper portions of board, and panel promotes carriage release lever 17, and then extrudees return spring 16, and the carriage release lever 17 shrink enters into the inside of sleeve 15 for a plurality of panels can once be placed to the inside in loading hole, and the panel of one end can be promoted the joint by push pedal 14 on perforation 13's upper portion, and convenient follow-up hydraulic column 5 is pressed downwards. When panel was on the upper portion of perforation 13, the limiting plate 11 of both sides under damping spring 10's promotion with the both sides butt of panel, make panel can not drop downwards, stability can be good, and can adapt to the panel of unidimensional not.

The semiconductor to be processed is placed inside the placing hole 18, the positioning rod 19 is pulled upward, and the suction cup 20 is detached from the base 1. The loading plate 2 is pushed to rotate through the rotating shaft 9, so that the included angle between the placing hole 18 and the semiconductor and the through hole 13 is changed, and the mounting requirements of different plates can be met. After the included angle is adjusted, the positioning rod 19 is pressed downwards, the suction cup 20 is adhered to the base 1, and the position of the loading plate 2 is limited and cannot move.

Finally, the hydraulic column 5 at the bottom of the top plate 7 drives the elastic pad 6 to move downwards, the elastic pad 6 is in contact with the plate, the plate is pressed downwards to be separated from the through hole 13, enters the upper part of the semiconductor below and is connected with the semiconductor. And taking out the processed semiconductor and replacing the semiconductor to be processed. The return spring 16 pushes the moving rod 17 to move outwards, and further pushes the plate material to enter the upper portion of the through hole 13 to be clamped. Panel can be automatic remove, need not manual operation, and work efficiency is higher. When panel is removing and being pressed, fan 4 carries wind-force through the pipeline to tuber pipe 8 and wind hole 12, and tuber pipe 8 and wind hole 12 blow the upper and lower two sides of panel, get rid of the dust of outside for panel is cleaner.

The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. The plate loading machine for semiconductor processing is characterized by comprising a base (1), a loading plate (2) and a top plate (7), wherein the top of the base (1) is horizontally connected with the top plate (7), supporting rods are connected between the periphery of the bottom of the top plate (7) and the periphery of the top of the base (1), a conveying plate (3) is horizontally arranged on one side of the top of the base (1), the conveying plate (3) is fixedly connected with the base (1) through a cushion block at one end of the bottom, the loading plate (2) is horizontally connected to the middle end of the top of the base (1), and a placing hole (18) is formed in one end of the top of the loading plate (2);

the conveying device is characterized in that a loading hole is formed in the middle end inside the conveying plate (3) along the length direction, a through hole (13) penetrates through the middle of one end, close to the loading plate (2), of the middle of the through hole (13), limiting plates (11) are connected to the two sides of the through hole (13) in parallel, a plurality of damping springs (10) are connected between the side face of each limiting plate (11) and the side face of the top of the conveying plate (3), a sleeve (15) is connected to the middle of the other end of the conveying plate (3) along the length direction, a moving rod (17) is movably sleeved inside the sleeve (15), a return spring (16) is connected between one end of the moving rod (17) and the inner end of the sleeve (15), and the inner side, close to the;

the bottom of roof (7) is connected with hydraulic pressure post (5) of vertical setting, and the bottom of hydraulic pressure post (5) is connected with cushion (6), and cushion (6) set up directly over perforation (13), the inside middle-end of cushion (6) is provided with tuber pipe (8), and the inside one end that is close to perforation (13) of loading hole is provided with wind hole (12).

2. A plate feeder for semiconductor processing according to claim 1, characterized in that the blower (4) is installed on the upper part of the top plate (7), and the blower (4) is connected to the air duct (8) and the air hole (12) through a pipe.

3. The plate loading machine for semiconductor processing according to claim 1, characterized in that the middle end of the bottom of the loading plate (2) is vertically connected with a rotating shaft (9), and the bottom of the rotating shaft (9) is rotatably connected with the base (1) through a bearing.

4. The plate loading machine for semiconductor processing according to claim 1, wherein positioning rods (19) are movably inserted around the loading plate (2), and the bottoms of the positioning rods (19) are connected with the top of the base (1) through suction cups (20).

5. A plate feeder for semiconductor processing according to claim 1, characterised in that a push plate (14) is attached to the end of the moving bar (17) near the perforation (13), the length of the push plate (14) being less than the length of the wind hole (12).