CN210270902U

CN210270902U - PCB ground wire block design circuit

Info

Publication number: CN210270902U
Application number: CN201921509637.8U
Authority: CN
Inventors: 蔡丹丹; 方利志; 何葵; 蒋继东; 王洪涛
Original assignee: Dongfeng Motor Corp
Current assignee: Dongfeng Motor Corp
Priority date: 2019-09-11
Filing date: 2019-09-11
Publication date: 2020-04-07
Anticipated expiration: 2029-09-11

Abstract

The utility model relates to a circuit board design technical field, concretely relates to PCB ground wire piecemeal design circuit. The high-power driving circuit comprises a sensor, an AD conversion module, an MCU, a digital signal processing module, a high-power driving circuit and a plurality of power supplies which are integrated on a PCB circuit board, wherein a plurality of independent grounding points are arranged on the PCB circuit board, and are respectively and electrically connected with the sensor, the AGND end of the AD conversion module, the DGND end of the AD conversion module, the MCU, the digital signal processing module, the high-power driving circuit and each power supply. All the grounds are physically isolated, the power circuit and the digital signal ground current cannot flow through an analog ground, and all the ground levels are not interfered with each other.

Description

PCB ground wire block design circuit

Technical Field

The utility model relates to a circuit board design technical field, concretely relates to PCB ground wire piecemeal design circuit.

Background

The electric control product is in the operation process, the complex working condition and the severe electric environment state often appear, the power supply system is often not stable enough, the design of the electric control product ground wire is very important at this time, and the grounding signal is clean, so that the stability and the accuracy of the signal transmission of the electric control product are stably and directly determined. Signal disorder or message frame loss can occur in the operation process of many electric control products, and are related to the pollution of grounding signals.

Fig. 1 is a schematic diagram of a grounding circuit of a controller PCB of a conventional electronic control product, in which Rs1, Rs2, Rs3, Rs4 and Rs5 are equivalent resistances of a grounding connection, and although the equivalent resistance of a ground line is small (10-3 levels), the equivalent resistances are all true. It can be seen that the power ground, the digital ground, the MCU ground current is conducted to the total ground level via the analog ground level. Power ground, digital ground level is unstable, and millivolt (10-3) and even ground level voltage signals of volt (100) often occur, which directly results in the analog signal sampling reference ground level being shifted. Thus, the analog signal sampling is inaccurate, and the ground level voltage even covers the analog sampling signal. Therefore, the conventional single point grounding causes system disorder.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a PCB ground wire piecemeal design circuit that stability is high, each between the ground level mutually noninterference to the defect to prior art.

The utility model adopts the technical proposal that: the utility model provides a PCB ground wire piecemeal design circuit, including integrated sensor on the PCB circuit board, AD conversion module, MCU, digital signal processing module, high-power drive circuit and a plurality of power, be provided with a plurality of independent ground point on the PCB circuit board, a plurality of independent ground point is connected with sensor, AD conversion module's AGND end, AD conversion module's DGND end, MCU, digital signal processing module, high-power drive circuit and each power electricity respectively.

Preferably, the PCB further comprises a lower cover plate, the independent grounding points are exposed copper foils arranged at the edge positions of two sides of the PCB, and metal bosses for electrically contacting the exposed copper foils are respectively arranged at the positions of the lower cover plate corresponding to the exposed copper foils.

Preferably, the independent grounding point includes a 5V power ground, a 12V power ground, a sensor analog ground, an AD conversion module digital ground, an MCU digital ground, a controller digital ground and a high power circuit signal ground, which are disposed on the PCB, the 5V power is electrically connected to the 5V power ground, the 12V power is electrically connected to the 12V power ground, the sensor is electrically connected to the sensor analog ground, the AGND terminal of the AD conversion module is electrically connected to the AD conversion module analog ground, the DGND terminal of the AD conversion module is electrically connected to the AD conversion module digital ground, the MCU is electrically connected to the MCU digital ground, the digital signal processing module is electrically connected to the controller digital ground, and the high power driving circuit is electrically connected to the high power circuit signal ground.

Preferably, the 5V power ground, the 12V power ground, the sensor analog ground and the AD conversion module are disposed at one side edge of the PCB in an analog manner, and the AD conversion module is disposed at the other side edge of the PCB in a digital manner, the MCU digital manner, the controller digital manner and the high power circuit signal manner.

The utility model has the advantages that:

1. the PCB is provided with a 5V power ground, a 12V power ground, a sensor analog ground, an AD conversion module digital ground, an MCU digital ground, a controller digital ground and a high-power circuit signal ground which are independently arranged, and the 5V power ground, the 12V power, the sensor, the AGND end of the AD conversion module, the DGND end of the AD conversion module, the MCU, the digital signal processing module and the high-power driving circuit are respectively connected with the 5V power ground, the 12V power, the sensor, the AGND end of the AD conversion module, the DGND end of the AD conversion module, the MCU, the digital signal processing module and the high-power circuit signal ground, so.

2. The mode of clamping the exposed copper foil by the metal boss is utilized, each independent grounding point directly flows into the total ground level through the shell, unstable interference signals on the power ground and the digital ground are directly led into the total ground level, and interference to the analog ground can be avoided.

Drawings

FIG. 1 is a schematic diagram of a PCB grounding circuit of a conventional electric control product controller;

FIG. 2 is the PCB ground wire block design circuit of the present invention;

FIG. 3 is a schematic diagram of the PCB ground wire bare copper foil arrangement of the present invention;

fig. 4 is a schematic view of the exposed copper foil and the lower cover plate of the PCB ground wire of the present invention.

Detailed Description

The invention will be further described in detail with reference to the drawings and the following detailed description, which are provided for the purpose of clearly understanding the invention and are not intended to limit the invention.

As shown in fig. 2 and 3, the utility model discloses a PCB circuit board 17 center integration has 5V power, 12V power, sensor, AD conversion module, MCU, digital signal processing module and high-power drive circuit. Two side edge positions of the PCB 17 are provided with 8 independent grounds, namely a 5V power ground 1, a 12V power ground 2, a sensor analog ground 3, an AD conversion module analog ground 4, an AD conversion module digital ground 5, an MCU digital ground 6, a controller digital ground 7 and a high-power circuit signal ground 8 in a bare copper foil mode. The sensor of the present embodiment is an AD sampling sensor among external sensors. The 5V power supply is electrically connected with a 5V power supply ground 1, the 12V power supply is electrically connected with a 12V power supply ground 2, the sensor is electrically connected with a sensor analog ground 3, an AGND end of the AD conversion module is electrically connected with an AD conversion module analog ground 4, a DGND end of the AD conversion module is electrically connected with an AD conversion module digital ground 5, the MCU is electrically connected with an MCU digital ground 6, the digital signal processing module is electrically connected with a controller digital ground 7, and the high-power driving circuit is electrically connected with a high-power circuit signal ground 8.

In this embodiment, the 5V power ground 1, the 12V power ground 2, the sensor analog ground 3, and the AD conversion module analog ground 4 are disposed on the left side of the PCB 17, and the AD conversion module digital ground 5, the MCU digital ground 6, the controller digital ground 7, and the high power circuit signal ground 8 are disposed on the right side of the PCB 17.

As shown in FIG. 4, the electric control product controller further comprises an upper cover plate and a lower cover plate 18 for sealing the PCB, wherein metal bosses 9-12 and metal bosses 13-16 for corresponding to power supply grounds at the left side and the right side of the PCB 17 are respectively arranged at two sides of the lower cover plate 18. After the upper cover plate and the lower cover plate are assembled, the metal bosses 9-16 on two sides of the lower cover plate are in conductive contact with 8 exposed copper foils (namely 8 independent grounding points) on the PCB 17, and ground wire signals of the 8 independent grounding points are directly led into the ground level through the shell, so that mutual interference among the ground levels is prevented.

Details not described in this specification are within the skill of the art that are well known to those skilled in the art.

Claims

1. The utility model provides a PCB ground wire blocking design circuit, includes sensor, AD conversion module, MCU, digital signal processing module, high-power drive circuit and a plurality of power of integration on PCB circuit board, its characterized in that: the PCB circuit board (17) is provided with a plurality of independent grounding points which are respectively and electrically connected with the sensor, the AGND end of the AD conversion module, the DGND end of the AD conversion module, the MCU, the digital signal processing module, the high-power drive circuit and each power supply.

2. The PCB ground segment design circuit of claim 1, wherein: the PCB grounding structure is characterized by further comprising a lower cover plate (18), the independent grounding points are exposed copper foils arranged at the edge positions of two sides of the PCB (17), and metal bosses (9-16) used for being in conductive contact with the exposed copper foils are respectively arranged at the positions, corresponding to the exposed copper foils, of the lower cover plate (18).

3. The PCB ground segment design circuit of claim 1, wherein: the independent grounding point comprises a 5V power ground (1), a 12V power ground (2), a sensor analog ground (3), an AD conversion module analog ground (4), an AD conversion module digital ground (5), an MCU digital ground (6), a controller digital ground (7) and a high-power circuit signal ground (8) which are arranged on a PCB (17), a plurality of power supplies comprise a 5V power supply and a 12V power supply, the 5V power supply is electrically connected with the 5V power ground (1), the 12V power supply is electrically connected with the 12V power ground (2), the sensor is electrically connected with the sensor analog ground (3), an AGND end of the AD conversion module is electrically connected with the AD conversion module analog ground (4), a DGND end of the AD conversion module is electrically connected with the AD conversion module digital ground (5), the MCU is electrically connected with the MCU digital ground (6), and the digital signal processing module is electrically connected with the controller digital ground (7), the high-power driving circuit is electrically connected with a high-power circuit signal ground (8).

4. The PCB ground segment design circuit of claim 3, wherein: the power supply system is characterized in that a 5V power supply ground (1), a 12V power supply ground (2), a sensor analog ground (3) and an AD conversion module analog ground (4) are arranged at the edge of one side of a PCB (17), and the AD conversion module digital ground (5), the MCU digital ground (6), the controller digital ground (7) and the high-power circuit signal ground (8) are arranged at the edge of the other side of the PCB (17).