CN210265409U - Structure for improving bonding strength - Google Patents
Structure for improving bonding strength Download PDFInfo
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- CN210265409U CN210265409U CN201920980257.6U CN201920980257U CN210265409U CN 210265409 U CN210265409 U CN 210265409U CN 201920980257 U CN201920980257 U CN 201920980257U CN 210265409 U CN210265409 U CN 210265409U
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- adherend
- adhesive
- grooves
- improving
- bonding strength
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- Standing Axle, Rod, Or Tube Structures Coupled By Welding, Adhesion, Or Deposition (AREA)
Abstract
The utility model discloses a structure for improving bonding strength, which forms micropores, grooves, bulges or gullies on the surface of an adherend. By adopting the technical scheme, the bonding is more reliable, and the weather resistance is greatly improved.
Description
Technical Field
The utility model relates to an on-vehicle accessory field, in particular to improve bond strength's structure.
Background
At present, in order to improve the requirement of high definition of the vehicle-mounted camera, more and more manufacturers use an active focusing process, and bond a (optical system) lens and a (support system) base by using an adhesive. The application of the adhesive bonding process in the vehicle-mounted high-definition camera is more and more extensive.
Although the adhesive bonding process can be an active focusing process, which is faster and simpler, when a metal or surface-treated metal or plastic part is bonded by using an adhesive, the problems of low bonding force and unstable bonding force exist, so that poor bonding between the adhesive and the adherend is easily caused, and the phenomenon of separation or cracking of the adhesive and the adherend is further caused, thereby affecting the service life of the product and the user experience.
SUMMERY OF THE UTILITY MODEL
An object of the embodiment of the utility model is to provide an improve bonding strength's structure makes the bonding more reliable, and the weatherability promotes greatly.
The embodiment of the utility model provides an improve structure of bonding strength forms micropore, recess, arch or gully on the adherend surface.
Optionally, an adhesive is located intermediate the two adherend surfaces, which adhesive penetrates into the pores, grooves or corrugations of the adherend surfaces by wetting.
Optionally, the adhesive is cured to form a pinned or mortise and tenon type fixation connection.
Optionally, the adherend surface is subjected to a laser engraving, knurling process to form micro-holes, grooves, protrusions or ravines.
Alternatively, the surface of the adherend is formed with fine holes, grooves, protrusions, or ravines in a grid, dot, or circular shape.
Optionally, the adherend is a plastic part, a metal part or a surface-treated metal part.
Therefore, by applying the technical scheme of the embodiment, the structure for improving the bonding strength between the adhesive and the adherend is provided, so that the roughness and the effective surface area of the surface of the adherend are improved, the bonding is more reliable, and the weather resistance is greatly improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a schematic view of the grid structure of the surface of an adherend for improving the bonding strength provided by the present invention;
fig. 2 is a schematic view of the structure of the surface line of the adherend for improving the bonding strength provided by the present invention;
fig. 3 is a schematic view of the present invention for increasing the contact area between the adhesive and the adherend;
fig. 4 is a schematic view of another embodiment of the present invention for increasing the contact area between an adhesive and an adherend.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Example (b):
the present embodiment provides a structure for improving the bonding strength between an adhesive and an adherend, in which micro holes, grooves, protrusions, or ravines are formed on the surface of the adherend. The adhesive is positioned between the surfaces of two adherends, and enters micropores, grooves or ravines on the surfaces of the adherends through infiltration, so that the effective contact area of the adhesion is increased, and more surface bonding force such as hydrogen bonds and the like is formed after the adhesive is cured. And the adhesive is solidified to form a fixed connection in a pin shape or a mortise and tenon shape.
The adherend may be, but is not limited to, a plastic part, a metal part or a surface-treated metal part, as shown in fig. 1 and 2, the surface of the adherend is formed with grid-shaped, dot-shaped or circular micropores, grooves, protrusions or ravines by laser engraving, knurling and other processes, so as to increase the surface roughness and effective surface area, as shown in fig. 3 and 4 (1 is the adherend a, 2 is the adhesive, and 3 is the adherend B), and the mechanical fixing connection and the chemical hydrogen bonding connection are formed after the adhesive bonding process, so as to increase the reliability of the connection. By treating the adherend with the above-described structure, the durability time of the bonded product in a high-temperature water bath at 90 ℃ is increased by 4 times or more as compared with the bonded product in which the adherend is not treated with the above-described structure.
The above-described embodiments do not limit the scope of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the above-described embodiments should be included in the protection scope of the technical solution.
Claims (6)
1. A structure for improving adhesive strength, characterized in that micro-holes, grooves, protrusions or ravines are formed on the surface of an adherend.
2. A bond strength enhancing structure as recited in claim 1, wherein adhesive is located intermediate the two adherend surfaces, said adhesive infiltrating into the pores, grooves or corrugations of the adherend surfaces.
3. A structure for improving adhesive strength according to claim 2, wherein the adhesive is cured to form a pin-like or mortise-and-tenon-like fixed connection.
4. The structure for improving bonding strength as claimed in claim 3, wherein the adherend surface is formed with micro-holes, grooves, protrusions or ravines by laser engraving or knurling process.
5. The structure for improving bonding strength according to claim 4, wherein the adherend has lattice-shaped, dot-shaped or circular micro-holes, grooves, protrusions or ravines formed on the surface thereof.
6. The structure for improving adhesion strength according to claim 5, wherein the adherend is a plastic member, a metal member or a surface-treated metal member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920980257.6U CN210265409U (en) | 2019-06-26 | 2019-06-26 | Structure for improving bonding strength |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920980257.6U CN210265409U (en) | 2019-06-26 | 2019-06-26 | Structure for improving bonding strength |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210265409U true CN210265409U (en) | 2020-04-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920980257.6U Active CN210265409U (en) | 2019-06-26 | 2019-06-26 | Structure for improving bonding strength |
Country Status (1)
| Country | Link |
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| CN (1) | CN210265409U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022068012A1 (en) * | 2020-09-29 | 2022-04-07 | 瑞声声学科技(深圳)有限公司 | Diaphragm and sound producing device |
-
2019
- 2019-06-26 CN CN201920980257.6U patent/CN210265409U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022068012A1 (en) * | 2020-09-29 | 2022-04-07 | 瑞声声学科技(深圳)有限公司 | Diaphragm and sound producing device |
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