CN210257293U - 3D beats printer head temperature control device - Google Patents
3D beats printer head temperature control device Download PDFInfo
- Publication number
- CN210257293U CN210257293U CN201920853677.8U CN201920853677U CN210257293U CN 210257293 U CN210257293 U CN 210257293U CN 201920853677 U CN201920853677 U CN 201920853677U CN 210257293 U CN210257293 U CN 210257293U
- Authority
- CN
- China
- Prior art keywords
- temperature control
- needle
- heat
- needle cylinder
- heat preservation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004321 preservation Methods 0.000 claims abstract description 43
- 230000017525 heat dissipation Effects 0.000 claims abstract description 27
- 239000004065 semiconductor Substances 0.000 claims abstract description 21
- 238000010146 3D printing Methods 0.000 claims abstract description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 23
- 229910052782 aluminium Inorganic materials 0.000 claims description 23
- 238000001816 cooling Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 abstract description 9
- 238000007639 printing Methods 0.000 abstract description 6
- 238000009413 insulation Methods 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000084 colloidal system Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Abstract
The utility model provides a 3D printing head temperature control device, which comprises a needle cylinder temperature control part, a needle head temperature control part, a heat dissipation part and a heat preservation part, wherein the needle cylinder temperature control part and the needle head temperature control part are respectively fixed on one side of the heat dissipation part; the heat preservation part is arranged outside the needle cylinder temperature control part and the needle head temperature control part. 3D beats printer head temperature control device and adopts semiconductor control temperature, can realize higher temperature control precision, and the precision can reach 0.1 ℃. The 3D printing head temperature control device is used, so that the temperature of the printing material in the needle cylinder can be quickly and accurately controlled.
Description
Technical Field
The utility model belongs to the technical field of 3D prints, especially, relate to a 3D beats printer head temperature control device.
Background
The 3D printing technology is also called as a rapid prototyping technology or an additive manufacturing technology, and the basic principle of the technology is 'layer-by-layer printing and layer-by-layer superposition', firstly, a three-dimensional model is generated by three-dimensional software, then, the three-dimensional model is sliced and a path is planned by upper computer slicing software, a G-code file is generated, the file is led into a lower computer controller, and the controller controls a 3D printer to print layer-by-layer to reproduce a three-dimensional solid model.
The 3D printing process of the materials such as solution, suspension, colloid, slurry or melt has high requirements on the temperature control of the materials, and the material properties are greatly changed when the temperature deviation is several degrees centigrade, so that the printing process is difficult to control. Therefore, it is necessary to provide a 3D print head temperature control apparatus and method to solve the above problems.
Disclosure of Invention
In view of this, the utility model aims at providing a 3D beats printer head temperature control device to realize the accurate control of the temperature that materials such as solution, suspension, colloid, thick liquids or melt need when 3D prints.
In order to achieve the above purpose, the technical scheme of the utility model is realized like this:
A3D printing head temperature control device comprises a needle cylinder temperature control part, a needle head temperature control part, a heat dissipation part and a heat preservation part, wherein the needle cylinder temperature control part and the needle head temperature control part are respectively fixed on one side of the heat dissipation part; the heat preservation part is arranged outside the needle cylinder temperature control part and the needle head temperature control part.
Furthermore, the needle cylinder temperature control part is fixed on the upper part of one side of the heat dissipation part in a threaded manner, and the needle head temperature control part is fixed on the lower part of one side of the heat dissipation part in a threaded manner.
Furthermore, the needle cylinder temperature control part comprises a needle cylinder temperature control block, a needle cylinder temperature control semiconductor and a needle cylinder temperature control sensor, the needle cylinder temperature control block is arranged in the heat preservation part, a needle cylinder mounting hole is formed in the needle cylinder temperature control block and used for placing a needle cylinder, the needle cylinder temperature control sensor is mounted on one side close to the needle cylinder mounting hole, and the needle cylinder temperature control semiconductor is mounted between the needle cylinder temperature control block and the heat dissipation part.
Further, the inner diameter of the opening of the needle cylinder temperature control block is larger than the outer diameter of the needle cylinder, so that the heat transfer efficiency between the needle cylinder and the needle cylinder temperature control block is ensured.
Further, the needle temperature control part comprises a needle temperature control block, a needle temperature control semiconductor and a needle temperature control sensor; the needle head temperature control block is arranged in the heat preservation part, a needle head mounting hole is formed in the needle head temperature control block and used for placing a needle head, and the aperture of the needle head mounting hole is larger than the outer diameter of the needle head, so that the needle head temperature control block and the needle head are ensured to keep high heat transfer efficiency;
a needle cylinder temperature control sensor mounting hole is formed in the needle head temperature control block close to the needle head mounting hole; the needle temperature control semiconductor is arranged between the needle temperature control block and the heat dissipation aluminum sheet.
Further, the heat dissipation part comprises a heat dissipation aluminum plate, a heat sink and a cooling fan; the radiator and the cooling fan are sequentially fixed on one side of the heat dissipation aluminum plate, and the heat dissipation aluminum plate is fixed on one side close to the needle head temperature control portion and the needle cylinder temperature control portion in a threaded mode.
Furthermore, the heat preservation portion includes cylinder heat preservation, heat preservation bottom plate and syringe needle heat preservation. Syringe heat preservation and syringe needle heat preservation all with heat preservation bottom plate fixed connection, and the heat preservation bottom plate is located between syringe heat preservation and the syringe needle heat preservation, and it is used for separating syringe heat preservation and syringe needle heat preservation.
Further, the heat-insulating layer of the needle cylinder is fixedly connected with the heat-radiating aluminum sheet so as to form a first closed cavity, and the temperature control part of the needle cylinder is arranged in the first closed cavity; the needle head heat-insulating layer is fixedly connected with the radiating aluminum sheet so as to form a second closed cavity, the needle head temperature control part is arranged in the second closed wall, and the needle cylinder heat-insulating layer and the needle head heat-insulating layer are respectively used for reducing the heat transfer between the needle head temperature control part and the heat transfer between the needle cylinder temperature control part and the outside.
Furthermore, the top of cylinder heat preservation is equipped with a temperature control device mounting hole, and it is used for the fixed connection of this device and 3D printer.
Compared with the prior art, a 3D beats printer head temperature control device have following advantage:
3D beats printer head temperature control device and adopts semiconductor control temperature, can realize higher temperature control precision, and the precision can reach 0.1 ℃. The 3D printing head temperature control device is used, so that the temperature of the printing material in the needle cylinder can be quickly and accurately controlled.
Drawings
The accompanying drawings, which form a part hereof, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention without undue limitation. In the drawings:
fig. 1 is a schematic structural diagram according to an embodiment of the present invention;
fig. 2 is a schematic cross-sectional view according to an embodiment of the present invention.
Description of reference numerals:
1-syringe, 201-heat-insulation top plate, 202-heat-insulation right side plate, 203-heat-insulation bottom plate, 204-needle heat-insulation layer, 205-heat-insulation front side plate, 206-heat-insulation rear side plate, 301-syringe temperature control block, 302-syringe temperature control sensor, 303-syringe temperature control semiconductor, 401-needle temperature control block, 402-needle temperature control sensor, 403-needle temperature control semiconductor, 5-needle, 601-heat-dissipation aluminum plate, 602-radiator and 603-cooling fan.
Detailed Description
It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
As shown in fig. 1 and 2, a 3D printing head temperature control device includes a syringe temperature control device, a needle temperature control device, a heat dissipation device, and a thermal insulation device. The needle cylinder temperature control device is fixed on the upper side of the radiating aluminum sheet 601 through a mounting screw; the needle head temperature control device is fixed on the lower side of the radiating aluminum sheet 601 through a mounting screw; the heat preservation device is installed in the cylinder temperature control device and the syringe needle temperature control device outside, heat abstractor installs in cylinder temperature control device and syringe needle temperature control device left side.
Preferably, the syringe temperature control device comprises a syringe temperature control block 301, a syringe temperature control semiconductor 303 and a syringe temperature control sensor 302. The needle cylinder temperature control block 301 is made of a material with high heat conductivity, the inner diameter of an opening of the needle cylinder temperature control block 301 is 0.1mm larger than the single side of the outer diameter of the needle cylinder 1, and high heat transfer efficiency between the needle cylinder temperature control block 301 and the needle cylinder 1 is guaranteed; a needle cylinder temperature control sensor 302 mounting hole is formed in the needle cylinder temperature control block 301 close to the needle cylinder 1 mounting hole, and a gap between the needle cylinder temperature control sensor 302 and the mounting hole is filled with heat-conducting glue; the needle cylinder temperature control semiconductor 303 is arranged between the needle cylinder temperature control block 301 and the heat dissipation aluminum sheet 601, and gaps among the needle cylinder temperature control semiconductor 303, the heat dissipation aluminum sheet 601 and the needle cylinder temperature control block 301 are filled with heat conduction glue.
Preferably, the needle temperature control device comprises a needle temperature control block 401, a needle temperature control semiconductor 403 and a needle temperature control sensor 402. The needle head temperature control block 401 is made of a material with high heat conductivity, the needle head temperature control block 401 is provided with a needle head 5 mounting hole, the hole diameter is 0.1mm larger than the single side of the outer diameter of the needle head 2, and the needle cylinder temperature control block 401 and the needle head 1 are ensured to keep high heat transfer efficiency; a needle temperature control sensor 402 mounting hole is formed in the needle temperature control block 401 close to the needle 5 mounting hole, and a gap between the needle temperature control sensor 402 and the mounting hole is filled with heat-conducting glue; the needle temperature control semiconductor 403 is arranged between the needle temperature control block 401 and the heat dissipation aluminum sheet 601, and gaps among the needle temperature control semiconductor 403, the heat dissipation aluminum sheet 601 and the needle temperature control block 401 are filled with heat conduction glue.
Preferably, the heat sink includes an aluminum heat sink plate 601, a heat sink 602, and a cooling fan 603. The heat sink 602 and the cooling fan 603 are fixed to the left side of the aluminum heat dissipating plate 601 by mounting screws.
Preferably, the heat preservation device comprises a heat preservation top plate 201, a heat preservation front side plate 205, a heat preservation rear side plate 206, a heat preservation right side plate 202, a heat preservation bottom plate 203 and a needle heat preservation layer 204. The heat-insulating layer top plate 201, the heat-insulating layer front side plate 205, the heat-insulating layer rear side plate 206, the heat-insulating layer right side plate 202, the heat-insulating layer bottom plate 203 and the heat-radiating aluminum plate 601 are fixed together through mounting screws to form a closed cavity, and the closed cavity tightly wraps the needle cylinder temperature control device to reduce heat transfer between the needle cylinder temperature control device and the outside; the needle head heat insulation layer 204, the heat dissipation aluminum plate 601 and the heat insulation layer bottom plate 203 are fixed together through mounting screws to form another closed cavity, and the needle head temperature control device is tightly wrapped in the closed cavity, so that heat conduction between the needle head temperature control device and the outside is reduced.
Preferably, the top plate 201 of the heat insulation layer is provided with a mounting hole for fixing the 3D printing head temperature control device on a 3D printer;
the invention also provides a using method of the 3D printing head temperature control device, which comprises the following steps,
(a) installing a syringe 1 filled with printing materials and a needle head 5 in a 3D printing head temperature control device;
(b) the upper computer transmits the temperature control target value to a temperature controller, the temperature controller respectively controls the work of the needle cylinder temperature control semiconductor 303 and the work of the needle head temperature control semiconductor 403, and simultaneously, the cooling fan 603 is started;
(c) the syringe temperature control sensor 302 and the needle temperature control sensor 402 respectively monitor the temperatures of the syringe temperature control block 301 and the needle temperature control block 401 in real time, and feed the measured temperatures back to the temperature controller, and the temperature controller controls the semiconductor to heat up or cool down, so that the syringe temperature control and the needle temperature control are finally ensured to reach the standard.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. The utility model provides a 3D beats printer head temperature control device which characterized in that: the syringe temperature control part and the needle temperature control part are respectively fixed on one side of the heat dissipation part; the heat preservation part is arranged outside the needle cylinder temperature control part and the needle head temperature control part.
2. The 3D print head temperature control device of claim 1, wherein: the needle cylinder temperature control part is fixed on the upper part of one side of the heat dissipation part in a threaded manner, and the needle head temperature control part is fixed on the lower part of one side of the heat dissipation part in a threaded manner.
3. The 3D print head temperature control device of claim 2, wherein: the needle cylinder temperature control part comprises a needle cylinder temperature control block, a needle cylinder temperature control semiconductor and a needle cylinder temperature control sensor, the needle cylinder temperature control block is arranged in the heat preservation part, a needle cylinder mounting hole is formed in the needle cylinder temperature control block and used for placing a needle cylinder, the needle cylinder temperature control sensor is mounted on one side close to the needle cylinder mounting hole, and the needle cylinder temperature control semiconductor is mounted between the needle cylinder temperature control block and the heat dissipation part.
4. The 3D print head temperature control device according to claim 3, wherein: the inner diameter of the opening of the needle cylinder temperature control block is larger than the outer diameter of the needle cylinder, so that the heat transfer efficiency between the needle cylinder and the needle cylinder temperature control block is ensured.
5. The 3D printing head temperature control device according to claim 4, wherein: the needle temperature control part comprises a needle temperature control block, a needle temperature control semiconductor and a needle temperature control sensor; the needle head temperature control block is arranged in the heat preservation part, a needle head mounting hole is formed in the needle head temperature control block and used for placing a needle head, and the aperture of the needle head mounting hole is larger than the outer diameter of the needle head, so that the needle head temperature control block and the needle head are ensured to keep high heat transfer efficiency;
a needle cylinder temperature control sensor mounting hole is formed in the needle head temperature control block close to the needle head mounting hole; the needle temperature control semiconductor is arranged between the needle temperature control block and the heat dissipation aluminum sheet.
6. The 3D printing head temperature control device according to claim 5, wherein: the heat dissipation part comprises a heat dissipation aluminum plate, a heat radiator and a cooling fan; the radiator and the cooling fan are sequentially fixed on one side of the heat dissipation aluminum plate, and the heat dissipation aluminum plate is fixed on one side close to the needle head temperature control portion and the needle cylinder temperature control portion in a threaded mode.
7. The 3D print head temperature control device of claim 6, wherein: the heat preservation portion includes cylinder heat preservation, heat preservation bottom plate and syringe needle heat preservation, cylinder heat preservation and syringe needle heat preservation all with heat preservation bottom plate fixed connection, and the heat preservation bottom plate is located between cylinder heat preservation and the syringe needle heat preservation, and it is used for separating cylinder heat preservation and syringe needle heat preservation.
8. The 3D print head temperature control device of claim 7, wherein: the needle cylinder heat-insulating layer is fixedly connected with the heat-radiating aluminum sheet so as to form a first closed cavity, and the needle cylinder temperature control part is arranged in the first closed cavity; the needle head heat-insulating layer is fixedly connected with the radiating aluminum sheet so as to form a second closed cavity, the needle head temperature control part is arranged in the second closed wall, and the needle cylinder heat-insulating layer and the needle head heat-insulating layer are respectively used for reducing the heat conduction between the needle head temperature control part and the heat conduction between the needle cylinder temperature control part and the outside.
9. The 3D print head temperature control device of claim 7, wherein: the top of cylinder heat preservation is equipped with a temperature control device mounting hole, and it is used for the fixed connection of this device and 3D printer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201920853677.8U CN210257293U (en) | 2019-06-06 | 2019-06-06 | 3D beats printer head temperature control device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201920853677.8U CN210257293U (en) | 2019-06-06 | 2019-06-06 | 3D beats printer head temperature control device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN210257293U true CN210257293U (en) | 2020-04-07 |
Family
ID=70041284
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201920853677.8U Active CN210257293U (en) | 2019-06-06 | 2019-06-06 | 3D beats printer head temperature control device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN210257293U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110065235A (en) * | 2019-06-06 | 2019-07-30 | 浙江大学滨海产业技术研究院 | A kind of 3D printing head temperature control device and method |
-
2019
- 2019-06-06 CN CN201920853677.8U patent/CN210257293U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110065235A (en) * | 2019-06-06 | 2019-07-30 | 浙江大学滨海产业技术研究院 | A kind of 3D printing head temperature control device and method |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6717949B2 (en) | Bioprinter temperature control system and bioprinter | |
CN108759533A (en) | A kind of microchannel cold plates, radiator and device based on 3D bulk prints | |
CN210257293U (en) | 3D beats printer head temperature control device | |
US20110056650A1 (en) | Heat sink | |
CN105313335A (en) | Nozzle device of 3D printer | |
CN110662401B (en) | Distance adjustable type's inside and outside double-deck high-efficient radiator between radiating fin | |
CN117251036A (en) | Water-cooling heat dissipation device and temperature control system | |
WO2024082535A1 (en) | Heat sink, heat sink manufacturing method, and computer | |
CN106016207B (en) | High-power LED lamp and its processing method | |
CN110076341A (en) | A kind of increasing material manufacturing power spreading device of uniform temperature fields | |
CN105751513B (en) | A kind of liftable high temperature resistant 3D printing ejecting device | |
CN115157602A (en) | Mold core temperature difference adjustable mold flow balancing device and balancing process | |
CN215356131U (en) | Multi-layer plate-level shielding part mold | |
CN110065235A (en) | A kind of 3D printing head temperature control device and method | |
CN104441661B (en) | The 3D printer seal wire ejecting device of system without forced heat radiation | |
CN208462253U (en) | A kind of radiator that achievable muti-piece chip radiates simultaneously | |
CN209249448U (en) | Chip heat radiation structure and controller | |
CN207939923U (en) | Power tube cooling system and storage battery performance test equipment | |
CN204382668U (en) | Without the 3D printer seal wire ejecting device of forced heat radiation system | |
CN215601695U (en) | Heat radiation structure, bonding head and bonding device | |
CN214266652U (en) | Multifunctional printing head device of biological 3D printer | |
CN216506600U (en) | Injection mold with temperature controller | |
CN217064408U (en) | Laser positioning mechanism and packing machine | |
CN215421396U (en) | Airless electronic control assembly device | |
CN214562976U (en) | 3D prints with product shaping heat sink |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |