CN210246817U

CN210246817U - Connecting structure of mobile phone motherboard

Info

Publication number: CN210246817U
Application number: CN201921785400.2U
Authority: CN
Inventors: Nan Zhou; 周南
Original assignee: Fuzhou Guangxun Chip Technology Co Ltd
Current assignee: Fuzhou Guangxun Chip Technology Co Ltd
Priority date: 2019-10-23
Filing date: 2019-10-23
Publication date: 2020-04-03
Anticipated expiration: 2029-10-23

Abstract

The utility model discloses a connection structure of mobile phone motherboard, including connection frame, the fretwork spacing groove has been seted up to the connection frame upper surface, wall surface pasting in fretwork spacing groove is connected with the rubber circle No. one, connection frame inner chamber integrated into one piece has cross support frame, connection frame upper surface edge all sets up threaded hole, and the screw hole has seted up four groups altogether. The utility model discloses a No. two shock pads contact with mobile phone motherboard lower surface, thereby effectively promote the shock attenuation effect to mobile phone motherboard, connected frame and cross support frame all adopt aluminium system material punching press preparation, aluminium system adopts and has the fast characteristics of heat absorption fast and heat dissipation fast, thereby can effectively promote the radiating effect to mobile phone motherboard, press the frame through the Z style of calligraphy, the rubber pressure disk, mutually support between reference column and the back taper plug, with the stability that further promotion adversary motherboard is connected, and also more convenient and laborsaving to mobile phone motherboard's installation and dismantlement.

Description

Connecting structure of mobile phone motherboard

Technical Field

The utility model relates to a mobile phone unit technical field specifically is a connection structure of mobile phone motherboard.

Background

A mobile phone belongs to a mobile terminal and is a mobile phone which can be held in the hand. The early age has been developed to the 4G era because the head is bigger and has a big common name. The american engineer "martin kupa" invented the first civilian mobile phone in the world, "martin kupa" was also referred to as the parent of modern mobile phones. Until now, the mobile phone becomes a very important tool in life of people, functions of the mobile phone are diversified like a Swiss army knife, and beautiful life experience is brought to people.

However, the existing mobile phone motherboard connecting structure has the following disadvantages:

1. the shock absorption effect is relatively poor after the mobile phone mainboard is installed, so that the stability of the operation of the mobile phone is greatly influenced, and the heat dissipation effect of the mobile phone mainboard is relatively poor.

2. The installation and the dismantlement of cell-phone mainboard are very inconvenient.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a connection structure of mobile phone motherboard to it is relatively poor to solve among the above-mentioned background art shock attenuation effect behind the mobile phone motherboard installation, thereby influences the stability of cell-phone operation greatly, and the radiating effect of mobile phone motherboard is relatively poor, the installation of mobile phone motherboard with dismantle very inconvenient problem

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a connection structure of mobile phone motherboard, includes linking frame, the fretwork spacing groove has been seted up to the linking frame upper surface, fretwork spacing inslot wall surface is pasted and is connected with the rubber circle No. one, linking frame inner chamber integrated into one piece has cross support frame, linking frame upper surface edge all sets up threaded hole, and the screw hole has seted up four groups altogether, the screw hole inner chamber is rotated through the bolt and is connected with Z style of calligraphy pressure frame.

Preferably, Z style of calligraphy is pressed a frame one end lower surface and is all inlayed and have the rubber pressure disk, rubber pressure disk lower surface homogeneous shaping has the reference column, the homogeneous shaping of reference column bottom has the back taper plug.

Preferably, the hollow limiting groove is provided with four groups of positioning holes at the corners, and the positioning holes are matched with the inverted cone-shaped rubber plug.

Preferably, the first damping pad is connected to the lower surfaces of the connecting frame and the cross-shaped support frame in a sticking mode.

Preferably, the upper surface of the cross-shaped support frame is provided with a groove, and a second damping pad is embedded in the inner cavity of the groove.

Preferably, the surface of the outer side wall of the connecting frame is wrapped with a second rubber ring.

The utility model provides a connection structure of mobile phone motherboard possesses following beneficial effect:

1. the utility model discloses a cross support frame can support the mainboard, and cross support frame surface is seted up flutedly, and recessed cavity inlays and has No. two shock pads, contacts through No. two shock pads and mobile phone motherboard lower surfaces to effectively promote the shock attenuation effect to mobile phone motherboard, and linking frame and cross support frame all adopt aluminium system material punching press preparation, and aluminium system adoption has the fast and fast characteristics of heat dissipation of heat absorption, thereby can effectively promote the radiating effect to mobile phone motherboard.

2. The utility model discloses a frame is pressed to rotatory Z style of calligraphy, make the rubber pressure disk, reference column and back taper plug are located the fixed orifices top of mobile phone motherboard, move the bolt through twisting, make the bolt push down Z style of calligraphy and press the frame, thereby make reference column and back taper plug pressed into in the fixed orifices on the mobile phone motherboard, fix the upper surface of mobile phone motherboard through the rubber pressure disk, and fix the lower surface of mobile phone motherboard through back taper plug top, and advance in the fixed orifices through back taper plug card, thereby make Z style of calligraphy press the frame and can't deflect, thereby will further promote the stability that mobile phone motherboard connects, and to the installation of mobile phone motherboard with dismantle also more convenient and laborsaving.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic view of the Z-shaped pressing frame of the present invention;

fig. 3 is a schematic view of the cross-shaped supporting frame of the present invention.

In the figure: 1. a connecting frame; 2. hollowing out the limit groove; 201. a first rubber ring; 202. a cross-shaped support frame; 3. a threaded hole; 301. a Z-shaped pressing frame; 302. a bolt; 4. a rubber pressure plate; 401. a positioning column; 402. an inverted conical rubber plug; 403. positioning holes; 5. a first shock pad; 501. a groove; 502. a second shock pad; 6. no. two rubber rings.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

As shown in fig. 1-3, the utility model provides a technical solution: the utility model provides a connection structure of mobile phone motherboard, includes linking frame 1, fretwork spacing groove 2 has been seted up to linking frame 1 upper surface, 2 inner wall surface pastes in fretwork spacing groove and is connected with rubber circle 201 No. one, 1 inner chamber integrated into one piece of linking frame has cross support frame 202, 1 upper surface edge of linking frame all sets up threaded hole 3, and threaded hole 3 sets up four groups altogether, 3 inner chambers in the threaded hole rotate through bolt 302 and are connected with Z style of calligraphy pressure frame 301.

Preferably, the lower surface of one end of the Z-shaped pressing frame 301 is inlaid with a rubber pressing plate 4, the lower surface of the rubber pressing plate 4 is integrally formed with a positioning column 401, the bottom of the positioning column 401 is integrally formed with an inverted cone rubber plug 402, the Z-shaped pressing frame 301 is rotated to enable the rubber pressing plate 4, the positioning column 401 and the inverted cone rubber plug 402 to be located above a fixing hole of a mobile phone motherboard, the bolt 302 is screwed to enable the bolt 302 to press the Z-shaped pressing frame 301 downwards, so that the positioning column 401 and the inverted cone rubber plug 402 are pressed into the fixing hole of the mobile phone motherboard, the upper surface of the mobile phone motherboard is fixed through the rubber pressing plate 4, the lower surface of the mobile phone motherboard is fixed through the top of the inverted cone rubber plug 402, the inverted cone rubber plug 402 is clamped into the positioning hole 403, so that the Z-shaped pressing frame 301 cannot deflect, and further improvement on the connection stability of the mobile, and the mobile phone mainboard can be mounted and dismounted more conveniently and more labor-saving.

Preferably, the corners of the hollow limiting grooves 2 are provided with four positioning holes 403, the positioning holes 403 and the inverted cone-shaped rubber plug 402 are matched with each other, and the inverted cone-shaped rubber plug 402 is clamped into the positioning holes 403, so that the Z-shaped pressing frame 301 cannot deflect.

Preferably, the lower surfaces of the connecting frame 1 and the cross-shaped supporting frame 202 are respectively adhered with a damping pad 5, and the damping effect of the mobile phone mainboard on the further promotion is achieved through the damping pad 5.

Preferably, recess 501 is seted up to cross support frame 202 upper surface, and recess 501 inner chamber is inlayed and is had No. two shock pads 502, contacts through No. two shock pads 502 and mobile phone motherboard lower surface to effectively promote the shock attenuation effect to mobile phone motherboard.

Preferably, the surface of the outer side wall of the connecting frame 1 is wrapped with a second rubber ring 6, the connecting frame 1 can be isolated through the second rubber ring 6, and the insulating effect on the connecting frame 1 and the mobile phone mainboard can be effectively improved.

It should be noted that, in the connection structure of the mobile phone mainboard, when in work, the mobile phone mainboard is placed in the hollow limiting groove 2 on the upper surface of the connection frame 1, the mobile phone mainboard is limited by the hollow limiting groove 2, so that the installation of the mobile phone mainboard is faster and the positioning is more accurate, wherein, the inner wall surface of the hollow limiting groove 2 is adhered and connected with the rubber ring 201, the rubber ring 201 is contacted with the side wall of the mobile phone mainboard, the mobile phone mainboard is wrapped by the rubber ring 201, the shaking of the mobile phone mainboard in the hollow limiting groove 2 can be effectively avoided, the stability of the mobile phone mainboard is improved, the cross-shaped support frame 202 is integrally formed in the inner cavity of the connection frame 1, the mainboard can be supported by the cross-shaped support frame 202, the surface of the cross-shaped support frame 202 is provided with the groove 501, the inner cavity of the groove 501 is inlaid with the shock pad 502, the shock pad 502 is contacted with the lower surface of, thereby effectively improving the damping effect on the mobile phone mainboard, the connecting frame 1 and the cross-shaped support 202 are made of aluminum material by stamping, the aluminum material has the characteristics of fast heat absorption and fast heat dissipation, thereby effectively improving the heat dissipation effect on the mobile phone mainboard, the rubber pressure plate 4, the positioning column 401 and the inverted cone-shaped rubber plug 402 are positioned above the fixing hole of the mobile phone mainboard by rotating the Z-shaped pressure frame 301, the bolt 302 is screwed to press the Z-shaped pressure frame 301 downwards by screwing the bolt 302, thereby the positioning column 401 and the inverted cone-shaped rubber plug 402 are pressed into the fixing hole on the mobile phone mainboard, the upper surface of the mobile phone mainboard is fixed by the rubber pressure plate 4, the lower surface of the mobile phone mainboard is fixed by the top of the inverted cone-shaped rubber plug 402, and the inverted cone-shaped rubber plug 402 is clamped into the positioning hole 403, thereby the Z-shaped pressure frame 301 can not deflect, thereby further improving the stability of the connection of the mobile, and also more convenient and laborsaving to the installation of mobile phone motherboard with dismantle, connecting frame 1 and cross support frame 202 lower surface are all pasted and are connected with a shock pad 5, will further promotion to the shock attenuation effect of mobile phone motherboard through a shock pad 5, connecting frame 1 lateral wall surface coating has No. two rubber circles 6 simultaneously, can keep apart connecting frame 1 through No. two rubber circles 6, can effectively promote the insulating effect to connecting frame 1 and mobile phone motherboard.

The utility model discloses a linking frame 1, fretwork spacing groove 2, rubber circle 201, cross support frame 202, screw hole 3, Z style of calligraphy pressure frame 301, bolt 302, rubber pressure disk 4, reference column 401, back taper plug 402, locating hole 403, shock pad 5, recess 501, shock pad 502, No. two rubber circles 6, the part that the part is universal standard or technical personnel in the field know, its structure and principle all are this technical personnel and all can learn the manual through the technique or learn through conventional experimental method.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a connection structure of mobile phone motherboard, includes connection frame (1), its characterized in that: fretwork spacing groove (2) have been seted up to linking frame (1) upper surface, fretwork spacing groove (2) inner wall surface paste is connected with rubber circle (201) No. one, linking frame (1) inner chamber integrated into one piece has cross support frame (202), linking frame (1) upper surface edge all seted up threaded hole (3), and threaded hole (3) have seted up four groups altogether, threaded hole (3) inner chamber is rotated through bolt (302) and is connected with Z style of calligraphy and presses frame (301).

2. The connection structure of a mobile phone motherboard according to claim 1, characterized in that: z style of calligraphy pressure frame (301) one end lower surface all inlays and has rubber pressure disk (4), the equal integrated into one piece of rubber pressure disk (4) lower surface has reference column (401), reference column (401) bottom integrated into one piece has back taper plug (402).

3. The connection structure of a mobile phone motherboard according to claim 1, characterized in that: locating holes (403) are formed in the corners of the hollow limiting grooves (2), four groups of locating holes (403) are formed in the hollowed limiting grooves, and the locating holes (403) are matched with the inverted cone-shaped rubber plugs (402).

4. The connection structure of a mobile phone motherboard according to claim 1, characterized in that: the lower surfaces of the connecting frame (1) and the cross-shaped support frame (202) are respectively connected with a first damping pad (5) in a sticking mode.

5. The connection structure of a mobile phone motherboard according to claim 1, characterized in that: a groove (501) is formed in the upper surface of the cross-shaped support frame (202), and a second damping pad (502) is embedded in the inner cavity of the groove (501).

6. The connection structure of a mobile phone motherboard according to claim 1, characterized in that: the outer side wall surface of the connecting frame (1) is wrapped with a second rubber ring (6).