CN210244286U - Computer CPU heat abstractor - Google Patents

Computer CPU heat abstractor Download PDF

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Publication number
CN210244286U
CN210244286U CN201921755616.4U CN201921755616U CN210244286U CN 210244286 U CN210244286 U CN 210244286U CN 201921755616 U CN201921755616 U CN 201921755616U CN 210244286 U CN210244286 U CN 210244286U
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CN
China
Prior art keywords
heat
heat dissipation
fan
supporting rod
fin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201921755616.4U
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Chinese (zh)
Inventor
Yu Hu
胡宇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Chongqing Water Resources and Electric Engineering College
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN201921755616.4U priority Critical patent/CN210244286U/en
Application granted granted Critical
Publication of CN210244286U publication Critical patent/CN210244286U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a computer CPU heat abstractor, its structure is including the heat dissipation fan, fan frame, fin, mounting panel, heat conduction silicone grease, terminal surface of working a telephone switchboard, connector lug, line contact, the utility model discloses a heat dissipation fan is installed on fan frame inside recess, and the heat conduction silicone grease on cooperation fin and the mounting panel realizes the convection current heat dissipation function, for the performance that improves the junction block, through the mounting height of support frame increase line contact, the connecting rod upper end correspondence that is connected is located between first branch and the second branch both sides space, corresponds the butt on line contact diapire for the wiring is around connecting high correspondence and is increased, then connects and hangs down mutually and correspond the elimination connection camber, and then improves and connect sensitivity and computer CPU radiating effect.

Description

Computer CPU heat abstractor
Technical Field
The utility model relates to a computer CPU heat abstractor belongs to CPU heat dissipation technical field.
Background
As the power of computer CPUs increases, the performance of the computer CPUs has been severely restricted by the heat dissipation problem. In the existing heat dissipation method, dense heat dissipation fins or heat dissipation cylinders are generally adopted for convection, most of heat dissipation devices for the computer CPU only have one bottom supporting surface, the use performance of a wiring part is easily limited, the wiring winding height is too low, the bending degree of a joint is too large, the sensitivity of the joint is easily influenced, and further the heat dissipation effect of the computer CPU is reduced.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a computer CPU heat abstractor to solve among the current heat dissipation method, the intensive heat radiation fins of general adoption or heat dissipation cylinder carry out the convection current, a bottom sprag face only for computer CPU's heat abstractor is most, restrict junction element's performance easily, the wiring is by-pass highly low excessively and lead to connecting the camber too big, influence easily and connect the sensitivity, and then reduce computer CPU radiating effect's problem.
In order to achieve the above purpose, the present invention is realized by the following technical solution: the utility model provides a computer CPU heat abstractor, its structure includes heat dissipation fan, fan frame, fin, mounting panel, heat conduction silicone grease, terminal surface, support frame, connector lug, line contact, fan frame inner chamber is equipped with the heat dissipation fan that can keep central axis position fixed unchangeable when rotating, the fin is arranged and is located on the fan frame picture drawing below installation face, the unchangeable mounting panel of fan frame bottom interval relative position, the connector lug looks spaced apart of mounting panel and horizontal one side, the connector lug is rabbeted integratively with the line contact, the installation of line contact is located on the support frame.
Further, the support frame includes crosspiece pole, first branch, insulating cover, top wall, fixed block, connecting rod, second branch, crosspiece pole inner both sides scarf joint first branch and second branch mutually, first branch and second branch outer wall hoop insulation cover, the top wall comprises protruding wall on first branch and the second branch front end, the fixed block links to each other integratively with the connecting rod, connecting rod upper end butt line touching piece bottom, crosspiece pole is installed on fin outer wall recess.
Further, the heat radiation fan is installed above the heat radiation fins.
Further, heat conduction silicone grease on the groove in the middle is embedded in the mounting plate.
Furthermore, the heat-conducting silicone grease is arranged on the wall surface below the radiating fin.
Furthermore, the insulating sleeve is made of rubber materials integrally.
Furthermore, the upper end of the connecting rod is correspondingly positioned between gaps at two sides of the first supporting rod and the second supporting rod.
Advantageous effects
The utility model relates to a computer CPU heat sink, the heat dissipation fan is installed on the internal groove of the fan frame, the heat conduction silicone grease on the cooperation fin and the mounting panel realizes the convection heat dissipation function, in order to improve the usability of the wiring component, the mounting height of the wiring contact piece is increased through the support frame, the structure uses the crosspiece pole as the installation body of the first pole support and the second pole support, the two are installed side by side and at intervals, the integrated structural pole is provided with the interval fixed block under the phase verticality, the outer wall hoop of the pole support is provided with the insulating sleeve with the anti-creepage function, the protection function is better, the top wall surface of the upward convex shape is positioned on the bottom of the wiring contact piece, the installation position of the fixed block is unchanged, the upper end of the connecting rod connected is correspondingly positioned between the gaps at the two sides of the first pole support and the second pole support, the corresponding butt is arranged on the bottom wall of the wiring contact, thereby improving the sensitivity of the joint and the heat dissipation effect of the CPU of the computer.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
fig. 1 is a schematic structural view of a computer CPU heat dissipation device of the present invention;
FIG. 2 is a schematic view of the assembly structure of the support frame of the present invention;
fig. 3 is a schematic view of the fan frame assembly according to the present invention.
In the figure: the heat radiation fan comprises a heat radiation fan-1, a fan frame-2, a heat radiation fin-3, a mounting plate-4, heat conduction silicone grease-5, a wiring end face-6, a support frame-7, a crosspiece rod-30, a first support rod-41, an insulating sleeve-52, a top wall face-63, a fixing block-74, a connecting rod-85, a second support rod-96, a wiring head-8 and a wiring contact piece-9.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
Referring to fig. 1-3, the present invention provides a technical solution: a computer CPU heat dissipating double-fuselage, its structure includes heat-dissipating fan 1, fan frame 2, heat sink 3, mounting panel 4, heat conduction silicone grease 5, terminal surface 6 of the connection, support frame 7, connector lug 8, contact element 9 of the connection, the inner chamber of the said fan frame 2 is equipped with the heat-dissipating fan 1 that can keep the central axis position fixed and unchangeable while rotating, the said heat sink 3 is arranged on the installation surface below the view picture of the fan frame 2, the said fan frame 2 bottom interval relative position unchangeable mounting panel 4, said mounting panel 4 and connector lug 8 interval of one side of level, the said connector lug 8 and contact element 9 of the connection are embedded and connected integrally, the said contact element 9 of the connection is installed on support frame 7, the said support frame 7 includes the horizontal bar 30, the first fulcrum bar 41, insulating bush 52, roof surface 63, fixed block 74, tie rod 85, the second fulcrum bar 96, the said horizontal bar 30 inner both sides are embedded and connected the first fulcrum, first branch 41 and the insulating cover 52 of 96 outer walls hooped joint of second branch, it constitutes by protruding wall on first branch 41 and the 96 front end of second branch to push up the wall 63, fixed block 74 links to each other integratively with connecting rod 85, connecting rod 85 upper end butt wiring contact 9 bottom, crosspiece pole 30 is installed on fin 3 outer wall recess, the installation of heat dissipation fan 1 is located the top department of view-map fin 3, the embedded heat conduction silicone grease 5 that is located on the recess of middle part of mounting panel 4, the installation of heat conduction silicone grease 5 is located on the wall of fin 3 below, insulating cover 52 adopts the rubber material to make integratively, connecting rod 85 upper end correspondence is located between first branch 41 and the 96 both sides space of second branch.
The first support rod 41 and the second support rod 96 are arranged side by side at intervals and are of an integral structural rod, the interval fixing blocks 74 are arranged right below the first support rod and the second support rod, and the outer wall of each support rod is hooped with the insulating sleeve 52 with the anti-creeping function.
For example: when the heat radiation fan is used, the heat radiation fan 1 is arranged on a groove in the fan frame 2 and is matched with the heat conduction silicone grease 5 on the heat radiation fin 3 and the mounting plate 4 to realize a convection heat radiation function, in order to improve the service performance of a wiring component, the mounting height of the wiring contact 9 is increased through the support frame 7, the structure takes the crosspiece rod 30 as a mounting body of the first support rod 41 and the second support rod 96, the first support rod and the second support rod are arranged side by side at intervals to form an integrated structural rod, a spaced fixing block 74 is vertically arranged below the integrated structural rod, the outer wall hoop of the support rods is provided with an insulating sleeve 52 with an electricity leakage prevention function, the integrated structural rod has a better protection function, the top wall surface 63 in an upward convex shape is positioned at the bottom of the wiring contact 9, the mounting position of the fixing block 74 is unchanged, the upper end of the connecting rod 85 which is correspondingly positioned between gaps at two sides, the joints are perpendicular to each other and the connection camber is correspondingly eliminated, so that the sensitivity of the joints and the heat dissipation effect of a computer CPU are improved.
The utility model provides an among the current heat dissipation method, generally adopt intensive heat radiation fins or heat dissipation cylinder to carry out the convection current, a heat abstractor for computer CPU has only a bottom sprag face mostly, restricts the performance of wiring part easily, and the wiring height is low excessively and leads to connecting the camber too big, influences easily and connects the sensitivity, and then reduces computer CPU radiating effect, the utility model discloses a combination of each other of above-mentioned parts increases the mounting height of wiring contact part through the support frame for the wiring height corresponds the increase, then connects to hang down mutually and correspond and eliminate the connection camber, and then improves and connect sensitivity and computer CPU radiating effect.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (5)

1. The utility model provides a computer CPU heat abstractor, its structure includes heat dissipation fan (1), fan frame (2), fin (3), mounting panel (4), heat conduction silicone grease (5), terminal surface (6), support frame (7), connector lug (8), line contact (9), its characterized in that:
fan frame (2) inner chamber is equipped with and keeps the unchangeable heat dissipation fan (1) of central axis position fixation when rotating, fin (3) are arranged and are located fan frame (2) picture below installation face, the unchangeable mounting panel (4) of fan frame (2) bottom interval relative position, mounting panel (4) and connector lug (8) looks interval of level one side, connector lug (8) and line touching piece (9) are rabbeted integratively mutually, line touching piece (9) are installed on support frame (7).
2. The heat sink of claim 1, wherein: the supporting frame (7) comprises a cross bar (30), a first supporting rod (41), an insulating sleeve (52), a top wall surface (63), a fixing block (74), a connecting rod (85) and a second supporting rod (96), wherein two sides of the inner end of the cross bar (30) are embedded with the first supporting rod (41) and the second supporting rod (96), the first supporting rod (41) and the outer wall of the second supporting rod (96) are hooped with the insulating sleeve (52), the top wall surface (63) is formed by protruding walls on the front ends of the first supporting rod (41) and the second supporting rod (96), the fixing block (74) is connected with the connecting rod (85) into a whole, the upper end of the connecting rod (85) is abutted to the bottom of the connecting line contact piece (9), and the cross bar (30) is installed on a groove in the outer wall of the radiating fin (3.
3. The heat sink of claim 1, wherein: the heat dissipation fan (1) is arranged above the view heat dissipation fins (3).
4. The heat sink of claim 1, wherein: and the mounting plate (4) is embedded with heat-conducting silicone grease (5) positioned on the groove in the middle.
5. The heat sink of claim 1, wherein: and the heat-conducting silicone grease (5) is arranged on the wall surface below the radiating fin (3).
CN201921755616.4U 2019-10-18 2019-10-18 Computer CPU heat abstractor Expired - Fee Related CN210244286U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921755616.4U CN210244286U (en) 2019-10-18 2019-10-18 Computer CPU heat abstractor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921755616.4U CN210244286U (en) 2019-10-18 2019-10-18 Computer CPU heat abstractor

Publications (1)

Publication Number Publication Date
CN210244286U true CN210244286U (en) 2020-04-03

Family

ID=69965830

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921755616.4U Expired - Fee Related CN210244286U (en) 2019-10-18 2019-10-18 Computer CPU heat abstractor

Country Status (1)

Country Link
CN (1) CN210244286U (en)

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20200403

Termination date: 20201018

CF01 Termination of patent right due to non-payment of annual fee