CN210242128U

CN210242128U - Semiconductor refrigerator with local thermalization contact

Info

Publication number: CN210242128U
Application number: CN201920690296.2U
Authority: CN
Inventors: Zhichuan Lin; 林志川
Original assignee: Nan'an Jinyu Commerce And Trade Co ltd
Current assignee: Nan'an Jinyu Commerce And Trade Co ltd
Priority date: 2019-05-15
Filing date: 2019-05-15
Publication date: 2020-04-03
Anticipated expiration: 2029-05-15

Abstract

The utility model discloses a semiconductor fridge of local thermalization contact, its structure includes storage tank, support pedestal foot, opens and close the door leaf, packs strip, glass inner panel, control button, temperature display screen in, the support pedestal foot is equipped with four and the vertical welding is in four angles of storage tank below, structurally set up the separation contact device, can let the breathing pipe at both ends cover radiating steam in its food with it and with, and through the continuous air conditioning that provides of air conditioning bag, it is cold-stored gradually with food, reduce the influence to refrigerating device, structurally set up the counterpoint hammer, can remove on the position that food corresponds through the semiconductor refrigeration stick, the effect of freezing through the cold dish carries out quick cooling to food, let the cooling rate of food obtain improving, let semiconductor refrigeration device obtain sufficient protection.

Description

Semiconductor refrigerator with local thermalization contact

Technical Field

The utility model relates to a semiconductor fridge of local thermalization contact belongs to the semiconductor field.

Background

Compared with common refrigerating equipment, the semiconductor refrigerating box does not produce Freon, does not produce harmful substances during operation, has good internal refrigerating effect, but is not suitable for placing some hot foods or articles in the semiconductor refrigerating box, otherwise, the semiconductor refrigerating box is easy to damage the inside of the refrigerating box.

The prior art can not place some hotter food, and when placing, the hot gas that the food produced can let inside refrigeration effect worsen to easily damage inside refrigerating device, make whole equipment easily receive the damage.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a semiconductor fridge of local thermalization contact to solve prior art and can not place some hotter food, when placing, the steam that food produced can let inside refrigeration effect worsen, and damage the refrigeration device of inside easily, make whole equipment receive the problem of damage easily.

In order to achieve the above purpose, the present invention is realized by the following technical solution: the utility model provides a semiconductor fridge of local thermalization contact, its structure includes storage tank, support column base, opens and close the door leaf, intussuseption strip, glass inner panel, control button, temperature display screen, the support column base is equipped with four and the perpendicular welding is in four angles of storage tank below, it passes through hinge swing joint in the place ahead of storage tank to open and close the door leaf, intussuseption strip is located the inside of opening and close the door leaf and adopts gluey to connect, the inside of filling strip including the laminating of glass inner panel is and with open and close the door leaf gluey link together, control button is equipped with three and the top of inlaying on and close the door leaf surface, temperature display screen is located control button's left side and is connected with the surface glue of opening and close the door leaf, control button, temperature display screen are.

As a preferable scheme of the semiconductor refrigerating box with local thermalization contact, the storage box body comprises an inner frame body, three separating contact devices, storage cavities, an inner dredging cavity and a drain pipe, wherein the three separating contact devices are welded in the inner frame body, the storage cavities are arranged between the two separating contact devices, the inner dredging cavity is connected to the bottom of the inner frame body in an adhesive manner, and the three drain pipes are connected to the inner dredging cavity in a threaded manner.

As a preferable embodiment of the semiconductor refrigeration container with local thermalization contact, the separation contact device comprises trusses, an air suction pipe, semiconductor refrigeration sheets, cold air bags, alignment hammers and a placing plate, wherein the placing plate is welded inside the inner frame, the trusses are provided with two air suction pipes and fastened to the left end and the right end of the placing plate through fasteners, the air suction pipe is provided with more than two air suction pipes and respectively nailed inside the two trusses, the semiconductor refrigeration sheets are provided with two air suction pipes and welded to the bottom inside the trusses, the cold air bags are fastened to the bottom inside the placing plate, and the alignment hammers are located above the cold air bags and are in sliding connection with the placing plate.

As a preferred embodiment of the above semiconductor refrigeration container with localized thermalization contact, the alignment hammer is composed of two or more hot steam counterpunches, a cold plate, and semiconductor refrigeration rods, the hot steam counterpunches are provided on the surface of the cold plate, and the semiconductor refrigeration rods are vertically welded below the cold plate.

As a preferable scheme of the semiconductor refrigerating box with local thermalization contact, the inner dredging cavity can treat water bottom and some other liquid generated in cooling, and the cleaning effect in the refrigerating box is ensured.

As a preferable scheme of the semiconductor refrigerating box with local thermalization contact, the glass inner plate is made of tempered glass, and compared with the traditional refrigerating equipment, the freshness of food inside can be seen.

Advantageous effects

The utility model relates to a semiconductor fridge of local thermalization contact has structurally set up the partition contact device, can let the breathing pipe at both ends cover the neutralization with radiating steam in its food to through the continuous air conditioning that provides of air conditioning bag, gradually refrigerate food, reduce the influence to refrigerating plant.

The utility model relates to a semiconductor fridge of local thermalization contact has structurally set up the counterpoint hammer, can carry out quick cooling to food through the freezing effect of cold dish on the position that food corresponds is removed to the semiconductor refrigeration stick, lets the cooling rate of food obtain improving, lets semiconductor refrigeration device obtain sufficient protection.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:

FIG. 1 is a schematic view of a semiconductor cooler with localized thermalization contact according to the present invention;

FIG. 2 is a schematic view of the structure inside the semiconductor cooler with local thermalization contact according to the present invention.

Fig. 3 is a detailed structural diagram of the semiconductor refrigeration container contact isolating device with local thermalization contact according to the present invention.

Fig. 4 is a schematic three-dimensional structure diagram of the aligning hammer of the semiconductor refrigerator with local thermalization contact according to the present invention.

In the figure: the device comprises a storage box body-1, supporting column feet-2, an opening and closing door leaf-3, inner filling strips-4, a glass inner plate-5, a control button-6, a temperature display screen-7, an inner frame body-11, a separation contact device-22, a storage cavity-33, an inner dredging cavity-44, a drain pipe-55, a truss-222, an air suction pipe-333, a semiconductor refrigerating sheet-444, an air conditioning bag-555, an alignment hammer-666, a placing plate-777, a hot steam counter-flushing opening-71, a cold plate-72 and a semiconductor refrigerating rod-73.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

Referring to fig. 1-4, the present invention provides a semiconductor refrigerator with local thermalization contact, which comprises: the structure of the door comprises a storage box body 1, supporting column feet 2, an opening and closing door leaf 3, inner filling strips 4, glass inner plates 5, a control button 6 and a temperature display screen 7, wherein the supporting column feet 2 are arranged at four corners vertically welded below the storage box body 1, the opening and closing door leaf 3 is movably connected in front of the storage box body 1 through hinges, the inner filling strips 4 are located inside the opening and closing door leaf 3 and are connected through glue, the glass inner plates 5 are attached to the inside of the inner filling strips 4 and are connected with the opening and closing door leaf 3 through glue, the control button 6 is arranged at three positions and are embedded above the surface of the opening and closing door leaf 3, the temperature display screen 7 is located on the left side of the control button 6 and is connected with the surface glue of the opening and closing door leaf 3, the control button 6 and the temperature display screen 7 are electrically connected with the inside of the storage, The partition contact device 22, the storage cavity 33, the inner dredging cavity 44, the drain pipe 55, the partition contact device 22 is provided with three and welded inside the inner frame 11, the storage cavity 33 is disposed in the middle of the two partition contact devices 22, the inner dredging cavity 44 is glued at the bottom inside the inner frame 11, the drain pipe 55 is provided with three and screwed inside the inner dredging cavity 44, the partition contact device 22 is composed of a truss 222, an air suction pipe 333, a semiconductor refrigeration sheet 444, a cold air bag 555, a pair hammer 666 and a placing plate 777, the placing plate 777 is welded inside the inner frame 11, the truss 222 is provided with two and is buckled at the left and right ends of the placing plate 777 by snapping, the air suction pipe 333 is provided with more than two and is nailed inside the two trusses 222 respectively, the semiconductor refrigeration sheet 444 is provided with two and is welded at the bottom inside the trusses 222, cold gasbag 555 lock is placing the inside bottom of board 777, counterpoint hammer 666 is located cold gasbag 555's top and with place board 777 sliding connection, counterpoint hammer 666 comprises hot vapour to blurting mouthful 71, cold dish 72, semiconductor refrigeration stick 73, hot vapour is equipped with more than two and sets up the surface at cold dish 72 to blunting mouthful 71, the perpendicular welding of semiconductor refrigeration stick 73 is in the below of cold dish 72, interior dredging chamber 44 produces submarine and some other liquid when can handling the cooling, guarantees the clean effect in the fridge, glass inner panel 5 is toughened glass, compares in traditional refrigeration plant can see the freshness of inside food.

When the refrigeration case need be put into to hot food, open earlier and open and close door leaf 3, place food on placing board 777, close again and open and close door leaf 3, after closing the door, semiconductor refrigeration piece 444 and semiconductor refrigeration stick 73 can get the electricity and begin the function, semiconductor refrigeration piece 444 produces air conditioning and gives off in breathing pipe 333 and cold gasbag 555, breathing pipe 333 at both ends can directly spout and carry out quick cooling to it on food, semiconductor refrigeration stick 73 drives the bottom that cold dish 72 removed food simultaneously, attached in the bottom of food, spout 71 through hot vapour and spray air conditioning, can carry out quick cooling.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The utility model provides a semiconductor fridge of local thermalization contact, its structure includes storing box (1), support column foot (2), opens and close door leaf (3), interior filler strip (4), glass inner panel (5), control button (6), temperature display screen (7), its characterized in that:

the support column feet (2) are four and are perpendicularly welded at four corners below the storage box body (1), the opening and closing door leaf (3) is movably connected in front of the storage box body (1) through hinges, the inner filling strips (4) are located inside the opening and closing door leaf (3) and are connected through glue, the inner filling strips (4) inside the glass inner plate (5) are attached and are connected with the opening and closing door leaf (3) through glue, the control buttons (6) are three and are embedded above the surface of the opening and closing door leaf (3), the temperature display screen (7) is located on the left side of the control buttons (6) and is connected with the surface of the opening and closing door leaf (3) through glue, and the control buttons (6) and the temperature display screen (7) are electrically connected with the inner portion of the storage box body (1).

2. The localized thermalizing contact semiconductor cooler of claim 1, further comprising: storing box (1) is by interior framework (11), separate contact means (22), storing chamber (33), in dredge lead chamber (44), drain pipe (55) and constitute, it is equipped with threely and welds the inside at interior framework (11) to separate contact means (22), the centre at two separate contact means (22) is installed in storing chamber (33), in dredge chamber (44) glue connection in the inside bottom of interior framework (11), drain pipe (55) are equipped with threely and threaded connection in the inside of dredging lead chamber (44).

3. The localized thermalizing contact semiconductor cooler of claim 2, further comprising: the separation contact device (22) comprises a truss (222), an air suction pipe (333), semiconductor refrigeration sheets (444), an air cooling bag (555), a pair of hammers (666) and a placement plate (777), wherein the placement plate (777) is welded in the inner frame body (11), the truss (222) is provided with two ends which are buckled on the left end and the right end of the placement plate (777) through buckles, the air suction pipe (333) is provided with more than two ends which are respectively nailed in the two trusses (222), the semiconductor refrigeration sheets (444) are provided with two ends which are welded at the bottom of the inner part of the truss (222), the cold air bag (555) is buckled at the bottom of the inner part of the placement plate (777), and the pair of hammers (666) are positioned above the cold air bag (555) and are connected with the placement plate (777) in a sliding mode.

4. The localized thermalizing contact semiconductor cooler of claim 3, wherein: counterpoint hammer (666) are to dashing mouthful (71), cold dish (72), semiconductor refrigeration stick (73) by hot vapour and constitute, hot vapour is equipped with more than two and sets up the surface at cold dish (72) to dashing mouthful (71), semiconductor refrigeration stick (73) vertical welding is in the below of cold dish (72).

5. The localized thermalizing contact semiconductor cooler of claim 2, further comprising: the inner dredging cavity (44) can process water bottom and other liquids generated during cooling, and the cleaning effect in the refrigerating box is guaranteed.