CN210225962U - Heat dissipation shell for solid-state relay - Google Patents
Heat dissipation shell for solid-state relay Download PDFInfo
- Publication number
- CN210225962U CN210225962U CN201920786190.2U CN201920786190U CN210225962U CN 210225962 U CN210225962 U CN 210225962U CN 201920786190 U CN201920786190 U CN 201920786190U CN 210225962 U CN210225962 U CN 210225962U
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- China
- Prior art keywords
- plate
- base
- heat dissipation
- state relay
- heat
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- Expired - Fee Related
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 54
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 16
- 239000007787 solid Substances 0.000 claims abstract description 14
- 230000008719 thickening Effects 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 abstract description 6
- 230000008878 coupling Effects 0.000 abstract description 2
- 238000010168 coupling process Methods 0.000 abstract description 2
- 238000005859 coupling reaction Methods 0.000 abstract description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000010411 cooking Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat dissipation casing for solid state relay, the on-line screen storage device comprises a base, the left and right sides wall rigid coupling of base has the mounting panel, both sides are opened around the top inner chamber of mounting panel has the fixed orifices, the top inner chamber center department of mounting panel opens there is the fixed slot, and the fixed slot is located between two fixed orifices, the mounting panel is equipped with the connection reinforcing plate with the junction of base, the top left and right sides symmetry of base is equipped with first thickened plate and second thickened plate, the top center of base is provided with the boss, a pedestal, the top of first thickened plate and second thickened plate is all pegged graft and is had the heating panel, the heating panel includes the fin, the outer wall of fin is equipped. The utility model provides a solid-state relay can produce a large amount of heats at the during operation, the heat needs in time to be discharged, if the untimely discharge of heat, makes the problem of relay inner element because of overheated damage easily.
Description
Technical Field
The utility model relates to a solid state relay heat dissipation technical field specifically is a heat dissipation casing for solid state relay.
Background
A solid state relay is a component of a fully electronic circuit assembly that relies on the electromagnetic and optical properties of semiconductor devices and electronic components to perform its isolation and relay switching functions. Compared with a traditional electromagnetic relay, the solid-state relay is a relay without machinery and moving parts, but has essentially the same function as the electromagnetic relay. The system is widely applied to industrial automatic control, such as electric furnace heating systems, cooking control machines, remote control machines, motors, electromagnetic valves, signal lamps, scintillators, stage lighting control systems, medical appliances, copying machines, washing machines, fire protection and security systems and the like. Reliable operation, contactless, no spark, longe-lived, noiselessness, no electromagnetic interference, switching speed is fast to the purpose that micro control signal reaches direct drive heavy current load, but solid-state relay can produce a large amount of heats at the during operation, and the heat needs in time to discharge, if the untimely discharge of heat, makes relay inner element damage because of overheated easily, for this reason, we have designed a heat dissipation casing for solid-state relay.
SUMMERY OF THE UTILITY MODEL
The utility model provides a not enough to prior art, the utility model provides a heat dissipation casing for solid state relay has solved solid state relay and can produce a large amount of heats at the during operation, and the heat needs in time discharge, if the untimely discharge of heat makes the problem of relay inner element because of overheated damage easily.
In order to achieve the above purpose, the utility model adopts the technical scheme that:
the utility model provides a heat dissipation casing for solid state relay, includes the base, the left and right sides wall rigid coupling of base has the mounting panel, both sides are opened around the top inner chamber of mounting panel has the fixed orifices, the top inner chamber center department of mounting panel opens there is the fixed slot, and the fixed slot is located between two fixed orifices, the junction of mounting panel and base is equipped with the connection reinforcing plate, the top left and right sides symmetry of base is equipped with first thickening plate and second thickening plate, the top center of base is provided with the boss, the top of base, first thickening plate and second thickening plate is all pegged graft and is had the heating panel, the heating panel includes the fin, the outer wall of fin is equipped with the heat dissipation strip.
According to the heat dissipation shell for the solid-state relay, the heat dissipation plates are provided with multiple groups and are arranged in an array shape, and the tops of the heat dissipation plates are on the same horizontal plane.
In the heat dissipation housing for the solid-state relay, the interval between every two heat dissipation plates is 25-35 MM.
In the aforementioned heat dissipation housing for a solid-state relay, the base, the mounting plate, the connection reinforcing plate, the first thickened plate, the second thickened plate, and the boss are all made of copper material or aluminum material.
In the heat dissipation housing for the solid-state relay, the base, the mounting plate, the connection reinforcing plate, the first thickened plate, the second thickened plate and the boss are integrally formed.
According to the radiating shell for the solid-state relay, the radiating strips are provided with a plurality of groups, the radiating strips are arranged at equal intervals along the side wall of the radiating fin from top to bottom, and the distance between every two radiating strips is 10-20 MM.
In the heat dissipation housing for the solid-state relay, the inner cavities of the first thickened plate and the second thickened plate are provided with mounting holes, and the mounting holes penetrate through the bottom of the base.
The utility model has the advantages that: the utility model has the advantages of reasonable structural design, the base, the mounting panel, the connection reinforcing plate, the first thickening plate, the second thickening plate and the boss are all made of copper materials or aluminum materials, the heat conductivity is good, and the corrosion-resistant function is realized, the strength between the mounting panel and the base is enhanced by the connection reinforcing plate, the inner cavities of the first thickening plate and the second thickening plate are provided with mounting holes, the mounting holes all penetrate through the bottom of the base, the fixed mounting of the heat dissipation shell is convenient, the abdicating groove is formed between the heat dissipation plates at the two sides of the boss, the abdicating effect on the elements in the relay is convenient, the heat dissipation strips are provided with a plurality of groups, the heat dissipation strips are arranged at equal intervals along the side walls of the heat dissipation fins from top to bottom, the distance between every two heat dissipation strips is 10-20MM, the heat dissipation area is increased, the heat is better dissipated, the interval between every two heat dissipation, the solid-state relay has the advantages that the heat is better taken away, the problems that the solid-state relay can generate a large amount of heat during working, the heat needs to be discharged in time, and if the heat is not discharged in time, the internal elements of the relay are easily damaged due to overheating are solved.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic structural view of the heat dissipation plate.
In the figure: 1. the base, 2, mounting panel, 3, fixed orifices, 4, fixed slot, 5, connect the reinforcing plate, 6, first thickening board, 7, second thickening board, 8, boss, 9, heating panel, 901, fin, 902, heat dissipation strip.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to FIGS. 1-2: a heat dissipation shell for a solid-state relay comprises a base 1, wherein mounting plates 2 are fixedly connected to the left side wall and the right side wall of the base 1, fixing holes 3 are formed in the front side and the rear side of a top inner cavity of each mounting plate 2, a fixing groove 4 is formed in the center of the top inner cavity of each mounting plate 2 and is located between the two fixing holes 3, a connection reinforcing plate 5 is arranged at the joint of each mounting plate 2 and the base 1, a first thickening plate 6 and a second thickening plate 7 are symmetrically arranged on the left side and the right side of the top of the base 1, mounting holes are formed in the inner cavities of the first thickening plate 6 and the second thickening plate 7 and penetrate through the bottom of the base 1, a boss 8 is arranged in the center of the top of the base 1, heat dissipation plates 9 are inserted into the tops of the first thickening plate 6 and the second thickening plate 7, each heat dissipation plate 9 comprises a heat dissipation fin 901, heat dissipation strips 902 are arranged on the, the tops of the heat dissipation plates 9 are on the same horizontal plane, the interval between every two heat dissipation plates 9 is 25-35MM, the base 1, the mounting plate 2, the connection reinforcing plate 5, the first thickened plate 6, the second thickened plate 7 and the boss 8 are all made of copper materials or aluminum materials, the base 1, the mounting plate 2, the connection reinforcing plate 5, the first thickened plate 6, the second thickened plate 7 and the boss 8 are integrally formed, the heat dissipation strips 902 are provided with a plurality of groups, the heat dissipation strips 902 are arranged at equal intervals from top to bottom along the side walls of the heat dissipation fins 901, and the distance between every two heat dissipation strips 902 is 10-20 MM.
To sum up, when the utility model is used, the base 1, the mounting plate 2, the connection reinforcing plate 5, the first thickening plate 6, the second thickening plate 7 and the boss 8 are all made of copper material or aluminum material, the heat conducting property is good, and the connection reinforcing plate has a corrosion resistant function, the connection reinforcing plate 5 reinforces the strength between the mounting plate 2 and the base 1, the inner cavities of the first thickening plate 6 and the second thickening plate 7 are provided with mounting holes, the mounting holes all penetrate through the bottom of the base 1, so as to facilitate the fixed mounting of the heat dissipation shell, a abdicating groove is formed between the heat dissipation plates 9 at two sides of the boss 8, so as to facilitate the abdicating function of elements inside the relay, and the heat dissipation strips 902 are provided with a plurality of groups, and the heat dissipation strips 902 are arranged at equal intervals from top to bottom along the side walls of the heat dissipation fins 901, the distance between every two heat dissipation strips 901 is 10-20MM, so as to increase the heat dissipation area, so as to better dissipate heat, increase the air flow, better taking away the heat, solved solid-state relay and can produce a large amount of heats at the during operation, the heat needs in time discharge, if the untimely discharge of heat, makes the problem that relay inner element damaged because of overheated easily.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (7)
1. A heat dissipation casing for solid state relay, includes base (1), its characterized in that: the left side wall and the right side wall of the base (1) are fixedly connected with mounting plates (2), fixing holes (3) are formed in the front side and the rear side of the top inner cavity of each mounting plate (2), fixing grooves (4) are formed in the center of the top inner cavity of each mounting plate (2), the fixing groove (4) is positioned between the two fixing holes (3), a connecting reinforcing plate (5) is arranged at the joint of the mounting plate (2) and the base (1), a first thickened plate (6) and a second thickened plate (7) are symmetrically arranged on the left side and the right side of the top of the base (1), a boss (8) is arranged at the center of the top of the base (1), heat dissipation plates (9) are inserted at the tops of the base (1), the first thickened plate (6) and the second thickened plate (7), the heat dissipation plate (9) comprises heat dissipation fins (901), and heat dissipation strips (902) are arranged on the outer walls of the heat dissipation fins (901).
2. A heat-dissipating housing for a solid state relay in accordance with claim 1, wherein: the heat dissipation plates (9) are provided with a plurality of groups and are arranged in an array shape, and the tops of the heat dissipation plates (9) are on the same horizontal plane.
3. A heat-dissipating housing for a solid state relay in accordance with claim 1, wherein: the interval between every two heat dissipation plates (9) is 25-35 MM.
4. A heat-dissipating housing for a solid state relay in accordance with claim 1, wherein: the base (1), the mounting plate (2), the connection reinforcing plate (5), the first thickened plate (6), the second thickened plate (7) and the boss (8) are all made of copper materials or aluminum materials.
5. A heat-dissipating housing for a solid state relay in accordance with claim 1, wherein: the base (1), the mounting plate (2), the connection reinforcing plate (5), the first thickening plate (6), the second thickening plate (7) and the boss (8) are integrally formed.
6. A heat-dissipating housing for a solid state relay in accordance with claim 1, wherein: the radiating strips (902) are provided with a plurality of groups, the radiating strips (902) are arranged along the side wall of the radiating fin (901) from top to bottom at equal intervals, and the distance between every two radiating strips (902) is 10-20 MM.
7. A heat-dissipating housing for a solid state relay in accordance with claim 1, wherein: and mounting holes are formed in the inner cavities of the first thickened plate (6) and the second thickened plate (7), and the mounting holes penetrate through the bottom of the base (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920786190.2U CN210225962U (en) | 2019-05-29 | 2019-05-29 | Heat dissipation shell for solid-state relay |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920786190.2U CN210225962U (en) | 2019-05-29 | 2019-05-29 | Heat dissipation shell for solid-state relay |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210225962U true CN210225962U (en) | 2020-03-31 |
Family
ID=69928600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920786190.2U Expired - Fee Related CN210225962U (en) | 2019-05-29 | 2019-05-29 | Heat dissipation shell for solid-state relay |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210225962U (en) |
-
2019
- 2019-05-29 CN CN201920786190.2U patent/CN210225962U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200331 |