CN210225954U - Hybrid integrated circuit module - Google Patents
Hybrid integrated circuit module Download PDFInfo
- Publication number
- CN210225954U CN210225954U CN201920621396.XU CN201920621396U CN210225954U CN 210225954 U CN210225954 U CN 210225954U CN 201920621396 U CN201920621396 U CN 201920621396U CN 210225954 U CN210225954 U CN 210225954U
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- arc
- housing
- integrated circuit
- wall
- circuit module
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Abstract
A hybrid integrated circuit module comprises a shell, a main PCB board arranged in the shell, and a secondary PCB board arranged on the side surface of the shell and exposed out of the shell; the auxiliary PCB comprises a binding post, and the main PCB is connected with the auxiliary PCB and is electrically connected with an external circuit through the binding post; the housing includes: the side plates and the arc-shaped parts are connected with two adjacent side plates; the inner wall of the arc-shaped part is arc-shaped, the outer wall of the arc-shaped part is two planes which are vertical to each other, the inner wall of the side plate is tangent to the inner wall of the arc-shaped part, and the outer wall of the side plate and the outer wall of the arc-shaped part are positioned on the same plane; the housing includes a damascene slot in which the sub PCB is partially mounted; the embedding groove penetrates through the side plate, and two ends of the embedding groove are embedded into the arc-shaped part.
Description
Technical Field
The utility model relates to a circuit board technical field especially relates to a hybrid integrated circuit module.
Background
The circuit structure of the existing hybrid integrated circuit module is already mature, however, the problem that the housing for accommodating the circuit board is damaged in the using, disassembling, installing and moving processes is often caused by low stability, and how to improve the installing stability of the integrated circuit module becomes a great problem to be solved urgently in the industry.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem that the structural stability of hybrid integrated circuit module is not high among the prior art, the utility model provides a hybrid integrated circuit module, for being suitable for the high stability shell, corresponding design has also been carried out to PCB's structure.
The utility model discloses a following technical scheme realizes:
a hybrid integrated circuit module comprises a shell, a main PCB board arranged in the shell, and a secondary PCB board arranged on the side surface of the shell and exposed out of the shell; the auxiliary PCB comprises a binding post, and the main PCB is connected with the auxiliary PCB and is electrically connected with an external circuit through the binding post;
the housing includes: the side plates and the arc-shaped parts are connected with two adjacent side plates; the inner wall of the arc-shaped part is arc-shaped, the outer wall of the arc-shaped part is two planes which are vertical to each other, the inner wall of the side plate is tangent to the inner wall of the arc-shaped part, and the outer wall of the side plate and the outer wall of the arc-shaped part are positioned on the same plane;
the housing includes a damascene slot in which the sub PCB is partially mounted; the embedding groove penetrates through the side plate, and two ends of the embedding groove are embedded into the arc-shaped part.
Further, the arc-shaped part and the side plate are integrally formed.
Furthermore, the embedding groove comprises mounting holes, the mounting holes are positioned at two ends inside the embedding groove, and the mounting holes penetrate through the arc-shaped part; and the auxiliary PCB is fixed in the embedding groove through the mounting hole.
Further, the hybrid integrated circuit module includes a cover plate and a base plate, which are mounted on the housing to close the housing.
Further, the shell includes a fixing hole, the fixing hole is located arc portion top and bottom, the apron with the bottom plate passes through the fixing hole is installed on the shell.
Further, the cover plate includes a boss, and when the cover plate is mounted on the housing, the boss is embedded in the housing to fix the cover plate to the housing.
Further, the shell comprises a boss, the boss is located between two adjacent side plates on the inner side of the shell, and the main PCB is installed inside the shell through the boss.
Further, the shell comprises a mounting foot, and the shell is mounted to the outside through the mounting foot.
The beneficial effects of the utility model reside in that:
the utility model discloses a set up the arc part between adjacent both sides board, arc part cross-section outer wall is the vertical state, and the cross-section inner wall is the arc, can increase the stability of structure between hybrid integrated circuit module curb plate and the curb plate;
the embedded groove penetrates through the side plate and is a through hole for providing connection for the main PCB and the auxiliary PCB;
compare in installing vice PCB board at the curb plate surface, vice PCB board can make vice PCB board fixed mounting in the shell more steadily when installing in inlaying the groove, prevents that vice PCB board from damaging or droing.
Drawings
Fig. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic view of the exploded structure of the present invention;
fig. 3 is a schematic view of a three-dimensional structure of the middle cover plate of the present invention.
Detailed Description
For a more clear and complete description of the technical solution of the present invention, the following description is made with reference to the accompanying drawings.
Referring to fig. 1 to 3, a hybrid integrated circuit module includes a housing 1, a main PCB 3 mounted in the housing 1, and a sub PCB 2 mounted on a side surface of the housing 1 and exposed out of the housing 1; the auxiliary PCB 2 comprises a binding post 21, and the main PCB 3 is connected with the auxiliary PCB 2 and is electrically connected with an external circuit through the binding post 21;
the housing 1 includes: the side plates 11 and the arc-shaped parts 12 connecting the two adjacent side plates 11; the inner wall of the arc-shaped part 12 is arc-shaped, the outer wall of the arc-shaped part is two planes which are vertical to each other, the inner wall of the side plate 11 is tangent to the inner wall of the arc-shaped part 12, and the outer wall of the side plate 11 and the outer wall of the arc-shaped part 12 are positioned on the same plane;
the housing 1 includes a mounting groove 110, and the sub PCB 2 is partially mounted in the mounting groove 110; the insertion groove 110 partially penetrates the side plate 11, and both ends of the insertion groove 110 are inserted into the arc-shaped portion 12.
The utility model discloses a set up arc portion 12 between adjacent both sides board 11, arc portion 12 cross-section outer wall is the vertical state, and the cross-section inner wall is the arc, and the interior outer wall of arc portion 12 is tangent or compare with curb plate 11 again, and the thickness of arc portion 12 must be higher than curb plate 11, can increase the stability of the structure between hybrid integrated circuit module curb plate 11 and curb plate 11;
the embedding groove 110 penetrates through the side plate 11 to be a through hole for providing connection between the main PCB 3 and the auxiliary PCB 2;
compared with the case where the sub PCB 2 is mounted on the surface of the side plate 11, the sub PCB 2 can be more stably and fixedly mounted in the case 1 when the sub PCB 2 is mounted in the mounting groove 110, thereby preventing the sub PCB 2 from being damaged or falling off.
The embedding groove 110 comprises mounting holes 111, the mounting holes 111 are positioned at two ends inside the embedding groove 110, and the mounting holes 111 penetrate through the arc-shaped part 12; the sub PCB 2 is fixed in the mounting groove 110 through the mounting hole 111.
In the present embodiment, the mounting hole 111 penetrating the arc-shaped portion 12 may increase a mounting length between the mounting hole 111 and the screw, and improve stability of the screw mounted in the mounting hole 111, and since the sub PCB 2 is mounted in the mounting hole 111 by the screw penetrating, the longer the mounting length between the screw and the mounting hole 111, the higher the mounting stability of the sub PCB 2.
The hybrid integrated circuit module includes a cover plate 13 and a base plate 14, and the cover plate 13 and the base plate 14 are mounted on the housing 1 so as to close the housing 1.
The housing 1 includes fixing holes 120, the fixing holes 120 are located at the top and bottom ends of the arc portion 12, and the cover plate 13 and the base plate 14 are mounted on the housing 1 through the fixing holes 120.
The sectional area of the arc portion 12 is inevitably larger than that of the side plate 11 due to the difference in sectional shape and the mutual connection relationship of the arc portion 12 and the side plate 11. Compared with the fixing holes 120 located on the side plates 11, the fixing holes 120 located on the top surface of the arc-shaped portion 12 and the bottom surface of the arc-shaped portion 12 can effectively reduce the influence of screws on the installation stress of the housing 1, and increase the structural stability when the housing 1 is externally connected with parts.
The cover plate 13 includes a boss 130, and when the cover plate 13 is mounted on the housing 1, the boss 130 is embedded in the housing 1 to fix the cover plate 13 on the housing 1.
The cover plate 13 is embedded into the housing 1 through the boss 130, that is, when the cover plate 13 is mounted on the housing 1, the side wall of the boss 130 is attached to the inner wall of the housing 1, so that the stability of the cover plate 13 for covering the housing 1 is increased, and dust or liquid is prevented from entering the hybrid integrated circuit module from between the housing 1 and the cover plate 13, thereby playing roles of water resistance and dust resistance.
The shell 1 comprises a boss 130, the boss 130 is positioned between two adjacent side plates 11 on the inner side of the shell 1, and the main PCB 3 is mounted inside the shell 1 through the boss 130.
Because arc portion 12 and boss 130 all are located between adjacent both sides board 11, boss 130 all is located the one end of arc portion 12 and all boss 130 all are located the same one end of arc portion 12, and main PCB board 3 installs and can prevent main PCB board 3 and bottom plate 14 contact each other on boss 130.
The housing 1 comprises mounting feet 15, by means of which mounting feet 15 the housing 1 is mounted to the outside.
Of course, the present invention can also have other various embodiments, and based on the embodiments, those skilled in the art can obtain other embodiments without any creative work, and all of them belong to the protection scope of the present invention.
Claims (9)
1. A hybrid integrated circuit module is characterized by comprising a shell, a main PCB arranged in the shell, and an auxiliary PCB arranged on the side surface of the shell and exposed out of the shell;
the housing includes: the side plates and the arc-shaped parts are connected with two adjacent side plates; the inner wall of the arc-shaped part is arc-shaped, the outer wall of the arc-shaped part is two planes which are vertical to each other, the inner wall of the side plate is tangent to the inner wall of the arc-shaped part, and the outer wall of the side plate and the outer wall of the arc-shaped part are positioned on the same plane;
the housing includes a damascene slot in which the sub PCB is partially mounted; the embedding groove penetrates through the side plate, and two ends of the embedding groove are embedded into the arc-shaped part.
2. The hybrid integrated circuit module of claim 1, wherein the arcuate portion is integrally formed with the side plate.
3. The hybrid integrated circuit module of claim 1, wherein the damascene trench includes mounting holes at both ends of the interior of the damascene trench, the mounting holes extending through the curved portion; and the auxiliary PCB is fixed in the embedding groove through the mounting hole.
4. The hybrid integrated circuit module of claim 1, comprising a cover plate and a base plate, the cover plate and the base plate being mounted on the housing to enclose the housing.
5. The hybrid integrated circuit module of claim 4, wherein the housing includes securing holes at top and bottom ends of the arcuate portion through which the cover plate and the base plate are mounted to the housing.
6. The hybrid integrated circuit module of claim 4, wherein the cover plate includes a boss that is embedded in the housing when the cover plate is mounted on the housing to secure the cover plate to the housing.
7. The hybrid integrated circuit module of claim 1, wherein the housing includes a boss between adjacent side plates inside the housing, the main PCB being mounted inside the housing via the boss.
8. The hybrid integrated circuit module of claim 1, wherein the housing includes mounting feet by which the housing is externally mounted.
9. The hybrid integrated circuit module of claim 1, wherein the secondary PCB includes posts, and the primary PCB is connected to the secondary PCB and electrically connected to external circuitry through the posts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920621396.XU CN210225954U (en) | 2019-04-30 | 2019-04-30 | Hybrid integrated circuit module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920621396.XU CN210225954U (en) | 2019-04-30 | 2019-04-30 | Hybrid integrated circuit module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210225954U true CN210225954U (en) | 2020-03-31 |
Family
ID=69924677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920621396.XU Active CN210225954U (en) | 2019-04-30 | 2019-04-30 | Hybrid integrated circuit module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210225954U (en) |
-
2019
- 2019-04-30 CN CN201920621396.XU patent/CN210225954U/en active Active
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