CN210222798U

CN210222798U - High temperature resistant RFID label

Info

Publication number: CN210222798U
Application number: CN201921477768.2U
Authority: CN
Inventors: Zewen Rao; 饶泽文; Lin Wang; 王林; Ying Wang; 王莹
Original assignee: Shenzhen Ruichi Iot Technology Co Ltd
Current assignee: Shenzhen Ruichi Iot Technology Co Ltd
Priority date: 2019-09-06
Filing date: 2019-09-06
Publication date: 2020-03-31
Anticipated expiration: 2029-09-06

Abstract

The utility model discloses a high temperature resistant RFID label, including last encapsulation casing, the bottom of going up encapsulation casing is provided with down the encapsulation casing, the bottom surface edge of going up the encapsulation casing is provided with protruding snap ring, the top surface edge of lower encapsulation casing is provided with the concatenation groove with protruding snap ring junction, protruding snap ring and concatenation groove block fixed connection, be provided with the RFID chip between last encapsulation casing and the lower encapsulation casing, the outside of the upper encapsulation casing and lower encapsulation casing in the utility model has increased upper glass fiber heat insulating board and lower glass fiber heat insulating board respectively, has thermal-insulated effect, makes the RFID chip between last encapsulation casing and the lower encapsulation casing can not receive the influence of outside high temperature, has avoided the condition that the RFID chip appears damaging because outside high temperature; and the upper glass fiber heat insulation plate and the lower glass fiber heat insulation plate are respectively positioned in the upper mounting groove and the lower mounting groove, so that the integral flatness of the label is ensured.

Description

High temperature resistant RFID label

Technical Field

The utility model belongs to the technical field of the RFID label, concretely relates to high temperature resistance RFID label.

Background

The RFID is a non-contact automatic identification technology, which automatically identifies a target object and obtains related data through a radio frequency signal, does not need manual intervention in identification work, and can work in various severe environments. The RFID technology can identify high-speed moving objects and can identify a plurality of electronic tags at the same time, the operation is fast and convenient, the RFID technology is frequently used in supermarkets, and the RFID electronic tags are as follows: active tags, passive tags, semi-active and semi-passive tags. The RFID working principle is as follows: after the tag enters a magnetic field, receiving a radio frequency signal sent by the reader, and sending product information stored in a chip by virtue of energy obtained by the induction current or actively sending a signal with a certain frequency; the information is read and decoded by the interpreter and then sent to the central information system for relevant data processing. The existing RFID label is generally adhered to some products, some products are often in a high-temperature environment, the damage of an internal RFID chip can be caused, in addition, the chip of the existing RFID label is placed in a shell through the adhesion of an external shell, the degumming condition can occur after a long time, and the shell adhesion part is cracked.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high temperature resistance RFID label to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a high-temperature-resistant RFID label comprises an upper packaging shell, wherein a lower packaging shell is arranged at the bottom of the upper packaging shell, a raised snap ring is arranged at the edge of the surface of the bottom of the upper packaging shell, a splicing groove is formed at the joint of the edge of the surface of the top of the lower packaging shell and the raised snap ring, the raised snap ring is fixedly connected with the splicing groove in a clamping manner, an RFID chip is arranged between the upper packaging shell and the lower packaging shell, an upper positioning groove is formed in the position, attached to the RFID chip, in the middle of the bottom of the upper packaging shell, a lower positioning groove is formed in the position, attached to the RFID chip, in the middle of the top of the lower packaging shell, an upper mounting groove is formed in the top of the upper packaging shell, an upper glass fiber heat-insulating plate is arranged on the inner side of the upper mounting groove, and a lower glass fiber thermal insulation plate is arranged between the lower packaging shell and the back glue layer, and a lower mounting groove is arranged in the middle of the bottom of the lower packaging shell and at the joint position of the lower glass fiber thermal insulation plate.

Preferably, the outer surface of the printing bar code layer is provided with a polyurethane film layer.

Preferably, the size of the upper glass fiber heat insulation plate is consistent with that of the upper mounting groove, and the size of the lower mounting groove is consistent with that of the lower glass fiber heat insulation plate.

Preferably, the cross section of the bottom end of the raised snap ring is of a circular arc structure, the width of the bottom end of the raised snap ring is 3mm larger than that of the upper end of the raised snap ring, and the shape and the size of the raised snap ring are consistent with those of the splicing groove.

Preferably, the size of the closed state of the upper positioning groove and the lower positioning groove is consistent with the size of the RFID chip.

Compared with the prior art, the beneficial effects of the utility model are that: the outer sides of the upper packaging shell and the lower packaging shell in the utility model are respectively added with the upper glass fiber heat-insulating plate and the lower glass fiber heat-insulating plate, which has the function of heat insulation, so that the RFID chip between the upper packaging shell and the lower packaging shell can not be influenced by external high temperature, and the condition that the RFID chip is damaged due to the external high temperature is avoided; the upper glass fiber thermal insulation board and the lower glass fiber thermal insulation board are respectively positioned in the upper mounting groove and the lower mounting groove, so that the integral flatness of the label is ensured;

the utility model provides an go up the encapsulation casing and designed protruding snap ring and splice groove respectively with lower encapsulation casing for go up the encapsulation casing and splice together through protruding snap ring and splice groove block with lower encapsulation casing, the fastness of concatenation has been guaranteed in the adhesive effect of cooperation glue, has avoided the tradition to rely on the easy condition of fracture of adhesive bonding to take place alone.

Drawings

Fig. 1 is a schematic top view of the present invention;

fig. 2 is a schematic diagram of the explosion structure of the present invention;

in the figure: 1. an upper package housing; 2. printing a bar code layer; 3. a glass fiber thermal baffle is arranged; 4. mounting a mounting groove; 5. a raised snap ring; 6. an RFID chip; 7. a lower package housing; 8. a back glue layer; 9. a lower positioning groove; 10. splicing grooves; 11. an upper positioning groove; 12. a lower mounting groove; 13. a lower fiberglass insulation panel.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-2, the present invention provides a technical solution: a high-temperature resistant RFID label comprises an upper packaging shell 1, wherein the bottom of the upper packaging shell 1 is provided with a lower packaging shell 7, the edge of the bottom surface of the upper packaging shell 1 is provided with a raised snap ring 5, the joint of the edge of the top surface of the lower packaging shell 7 and the raised snap ring 5 is provided with a splicing groove 10, the raised snap ring 5 is fixedly connected with the splicing groove 10 in a clamping manner, an RFID chip 6 is arranged between the upper packaging shell 1 and the lower packaging shell 7, the joint of the middle of the bottom of the upper packaging shell 1 and the RFID chip 6 is provided with an upper positioning groove 11, the joint of the middle of the top of the lower packaging shell 7 and the RFID chip 6 is provided with a lower positioning groove 9, the top of the upper packaging shell 1 is provided with an upper mounting groove 4, the inner side of the upper mounting groove 4 is provided with an upper glass fiber heat insulation board 3, the top surface of the, a lower glass fiber thermal insulation board 13 is arranged between the lower packaging shell 7 and the back glue layer 8, and a lower mounting groove 12 is arranged at the joint position of the middle of the bottom of the lower packaging shell 7 and the lower glass fiber thermal insulation board 13.

In this embodiment, it is preferable that the outer surface of the printed barcode layer 2 is provided with a polyurethane film layer in order to prevent damage caused by high temperature.

In this embodiment, it is preferable that the size of the upper glass fiber thermal insulation board 3 is the same as the size of the upper mounting groove 4, and the size of the lower mounting groove 12 is the same as the size of the lower glass fiber thermal insulation board 13, so as to achieve the fixing effect and ensure the thermal insulation effect.

In this embodiment, preferably, the cross section of the bottom end of the protruding snap ring 5 is of a circular arc-shaped structure, the width of the bottom end of the protruding snap ring 5 is 3mm larger than the width of the upper end of the protruding snap ring 5, the shape and the size of the protruding snap ring 5 are consistent with the shape and the size of the splicing groove 10, and the clamping and fastening are ensured.

In this embodiment, it is preferable that the size of the closed state of the upper positioning groove 11 and the lower positioning groove 9 is consistent with the size of the RFID chip 6, in order to ensure the firm installation.

The utility model discloses a theory of operation and use flow: the upper glass fiber thermal insulation board 3 and the lower glass fiber thermal insulation board 13 are respectively positioned in the upper mounting groove 4 and the lower mounting groove 12, so that external heat is blocked outside, and a thermal insulation effect is achieved, the RFID chip 6 between the upper packaging shell 1 and the lower packaging shell 7 cannot be influenced by external high temperature, and the condition that the RFID chip 6 is damaged due to the external high temperature is avoided; go up encapsulation casing 1 and encapsulation casing 7 down and pass through protruding snap ring 5 and splice groove 10 block concatenation together, cooperation glue adhesive effect makes going up

encapsulation casing

1 and 7 concatenation of encapsulation casing more firm and sealed down.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A high temperature resistant RFID tag comprising an upper package housing (1), characterized in that: the bottom of the upper packaging shell (1) is provided with a lower packaging shell (7), the bottom surface edge of the upper packaging shell (1) is provided with a raised snap ring (5), the joint of the top surface edge of the lower packaging shell (7) and the raised snap ring (5) is provided with a splicing groove (10), the raised snap ring (5) is fixedly connected with the splicing groove (10) in a clamping manner, an RFID chip (6) is arranged between the upper packaging shell (1) and the lower packaging shell (7), the joint of the middle of the bottom of the upper packaging shell (1) and the RFID chip (6) is provided with an upper positioning groove (11), the joint of the middle of the top of the lower packaging shell (7) and the RFID chip (6) is provided with a lower positioning groove (9), the top of the upper packaging shell (1) is provided with an upper mounting groove (4), and the inner side of the upper mounting groove (4) is provided with an upper glass fiber, go up the top surface of glass fiber heat insulating board (3) and be provided with printing bar code layer (2), the bottom surface of encapsulation casing (7) is provided with (18) down, be provided with down glass fiber heat insulating board (13) down between encapsulation casing (7) and gum layer (8), be provided with down mounting groove (12) with lower glass fiber heat insulating board (13) laminating position department in the middle of the bottom of encapsulation casing (7) down.

2. The high temperature resistant RFID tag of claim 1, wherein: and a polyurethane film layer is arranged on the outer surface of the printing bar code layer (2).

3. The high temperature resistant RFID tag of claim 1, wherein: the size of the upper glass fiber thermal insulation board (3) is consistent with that of the upper mounting groove (4), and the size of the lower mounting groove (12) is consistent with that of the lower glass fiber thermal insulation board (13).

4. The high temperature resistant RFID tag of claim 1, wherein: the cross section of the bottom end of each protruding clamping ring (5) is of a circular arc-shaped structure, the width of the bottom end of each protruding clamping ring (5) is 3mm larger than that of the upper end of each protruding clamping ring (5), and the shape and the size of each protruding clamping ring (5) are consistent with those of the splicing groove (10).

5. The high temperature resistant RFID tag of claim 1, wherein: the size of the closed state of the upper positioning groove (11) and the lower positioning groove (9) is consistent with that of the RFID chip (6).