CN210222792U

CN210222792U - Electronic label structure

Info

Publication number: CN210222792U
Application number: CN201921199992.XU
Authority: CN
Inventors: Jianfeng Wang; 王建峰; Meifang Pan; 潘妹芳; Shan Chen; 陈珊
Original assignee: Huizhou Yabo Juli Technology Co Ltd
Current assignee: Huizhou Yabo Juli Technology Co Ltd
Priority date: 2019-07-26
Filing date: 2019-07-26
Publication date: 2020-03-31
Anticipated expiration: 2029-07-26

Abstract

The utility model discloses an electronic tags structure, through setting up casing external member, RFID antenna external member and top cap external member. In the practical application process, the isolation ring body is arranged, and the height of the chip is smaller than that of the isolation ring body, so that when the top cover is covered on the sealing groove body, the top cover is prevented from directly contacting the chip, and the top cover is prevented from being damaged due to overlarge physical contact with the chip; in addition, the arrangement of the positioning columns, the arrangement of the through holes and the arrangement of the positioning holes can well prevent the top cover from generating relative displacement relative to the shell during assembly, so that assembly errors are prevented, and the subsequent glue sealing efficiency is further influenced; moreover, the setting of a plurality of heat dissipation sand grips can strengthen the area of contact between top cap and the air, has strengthened the radiating efficiency of electronic tags structure promptly, prevents that inside from accumulating too high heat and damaging.

Description

Electronic label structure

Technical Field

The utility model relates to a label technical field especially relates to an electronic tags structure.

Background

At present, electronic tags are also called radio frequency tags, transponders, data carriers; the reader is also called a reading device, a scanner, a reading head, a communicator, a reader/writer. The electronic tag and the reader realize the spatial coupling of radio frequency signals through a coupling element; and in the coupling channel, energy transfer and data exchange are realized according to a time sequence relation. The core technology used by the electronic tag is the RFID technology, the RFID technology is a non-contact automatic identification technology, the target object is automatically identified and relevant data is obtained through a radio frequency signal, manual intervention is not needed in identification work, and the electronic tag can work in various severe environments. The RFID technology can identify high-speed moving objects and can identify a plurality of labels simultaneously, and the operation is quick and convenient. The RFID electronic tag is a breakthrough technology: first, a single, very specific object can be identified, rather than just one type of object as with a bar code; secondly, radio frequency is adopted, data can be read through external materials, and the bar code must be read by laser; thirdly, a plurality of objects can be read at the same time, and the bar code can be read only one by one. In addition, the amount of information stored is also very large.

The existing electronic tag mainly comprises a shell, a top cover and an RFID antenna. In the process of assembling the electronic tag, the RFID antenna is arranged in the shell, the top cover is covered on the shell, and the top cover is sealed by glue, so that the electronic tag is assembled. However, the above process is prone to cause a problem, in the process that the top cover is covered on the housing, because the top cover contacts the chip on the RFID antenna, and the top cover is further subjected to a subsequent sealing operation, the top cover after sealing has a certain acting force on the chip, and if the acting force is too large, the top cover may damage the chip, and the electronic tag cannot normally operate; in addition, when the top cover is covered on the shell, due to the problem of inaccurate positioning, the top cover cannot be accurately covered on the shell, namely when the top cover is covered on the shell, the top cover can generate certain position deviation relative to the shell, so that subsequent glue sealing operation is influenced, operators cannot correct the position deviation, and the glue sealing efficiency is undoubtedly greatly reduced; furthermore, because the conventional electronic tag is a small electronic component, the heat generation amount is often ignored, and if too much heat is accumulated in the electronic tag, the built-in chip is damaged, so that the electronic tag cannot work normally.

SUMMERY OF THE UTILITY MODEL

The utility model aims at overcoming the weak point among the prior art, provide one kind and can prevent that top cap and chip from taking place too big physical contact and damaging, guarantee chip life, the relative casing of top cap can not take place relative displacement in the assembling process, guarantee to glue efficiency, the heat-sinking capability is stronger, can prevent inside to save too much heat and the electronic tags structure of damage.

The purpose of the utility model is realized through the following technical scheme:

an electronic label structure comprising:

the shell sleeve comprises a shell and two positioning columns, a sealing groove body is formed in the shell, and the two positioning columns are arranged in the sealing groove body;

the RFID antenna kit comprises a substrate, an isolation ring body and a chip, wherein two through holes are formed in the substrate, the isolation ring body is arranged on the substrate, the isolation ring body and the substrate jointly enclose a chip placing area, the chip is arranged in the chip placing area, the height of the chip is smaller than that of the isolation ring body, and when the substrate is covered in the sealing groove body, the positioning cylinders correspondingly penetrate through the through holes one by one, so that the substrate is in contact with the bottom of the sealing groove body; and

the top cover external member, the top cover external member includes top cover and a plurality of heat dissipation sand grips, seted up two locating holes on the top cover, each heat dissipation sand grip all set up in on the top cover, and adjacent two all be provided with the interval between the heat dissipation sand grip, the top cover is used for the lid to locate when the seal groove is internal, so that each is worn to establish by each location cylinder one-to-one each the locating hole, and then makes the top cover with keep apart the ring body and contact.

In one embodiment, the casing kit further includes two magnetic attraction pieces, wherein the two magnetic attraction pieces are disposed on the casing and are axially symmetrically distributed with the central axis of the casing.

In one embodiment, the top cover further has a groove, the housing has a first via hole and a second via hole, the groove is respectively communicated with the first via hole and the second via hole when the top cover is disposed in the sealing groove, and each of the heat dissipation protruding strips is located in the groove.

In one embodiment, the sidewall of each positioning hole is provided with an auxiliary glue sealing hole.

In one embodiment, the housing kit further includes a fluorescent member disposed on a side of the housing away from the sealed slot.

In one embodiment, the RFID antenna assembly further includes a buffering ring disposed on the isolation ring.

In one embodiment, the isolation ring and the cushion ring are integrally formed.

In one embodiment, a drainage arc groove is formed in the side wall of the sealing groove body.

In one embodiment, the housing is provided with a rounded annular edge.

In one embodiment, the cap assembly includes four heat dissipation ribs.

The utility model discloses compare in prior art's advantage and beneficial effect as follows:

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of an electronic tag structure according to an embodiment of the present invention;

FIG. 2 is an enlarged schematic view of FIG. 1 at A;

FIG. 3 is an enlarged schematic view of FIG. 1 at B;

fig. 4 is an enlarged schematic view at C of fig. 1.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1, an electronic tag structure 10 includes a housing assembly 100, an RFID antenna assembly 200, and a cover assembly 300.

Thus, it should be noted that the housing assembly 100 and the cap assembly 300 both function as protection and encapsulation; the RFID antenna assembly 200 functions as a radio frequency identification.

Referring to fig. 1 again, the housing assembly 100 includes a housing 110 and two positioning posts 120, a sealing groove 111 is formed on the housing 110, and the two positioning posts 120 are disposed in the sealing groove 111.

Thus, it should be noted that the sealing groove 111 plays a role of sealing; the two positioning columns 120 both play a role in positioning, so as to prevent subsequent glue sealing operation from being influenced due to inaccurate positioning in the assembling process.

Referring to fig. 1 and fig. 2, the RFID antenna assembly 200 includes a substrate 210, an isolation ring 220, and a chip 230, wherein two through holes 211 are formed in the substrate 210, the isolation ring 220 is disposed on the substrate 210, the isolation ring 220 and the substrate 210 together enclose a chip placement area 240, the chip 230 is disposed in the chip placement area 240, and the height of the chip 230 is smaller than the height of the isolation ring 220, when the substrate 210 is disposed in the sealed tank 111, the positioning posts 120 correspondingly penetrate through the through holes 211, so that the substrate 210 contacts with the bottom of the sealed tank 111.

Referring to fig. 1 and 3, the top cover assembly 300 includes a top cover 310 and a plurality of heat dissipation ribs 320, the top cover 310 is provided with two positioning holes 311, each heat dissipation rib 320 is disposed on the top cover 310, and a space is disposed between two adjacent heat dissipation ribs 320, when the top cover 310 is disposed in the sealing groove 111, the positioning posts 120 correspondingly penetrate through the positioning holes 311, so that the top cover 310 contacts the isolation ring 220.

Therefore, it should be noted that, in the actual assembling process, an operator firstly covers the base 210 in the sealed groove 111, and the positioning columns 120 penetrate through the through holes 211 in a one-to-one correspondence manner, so that the base 210 contacts with the bottom of the sealed groove 111, and then covers the top cover 310 in the sealed groove 111, so that the positioning columns 120 penetrate through the positioning holes 311 in a one-to-one correspondence manner, and the top cover 310 contacts with the isolation ring 220.

It should be noted that, due to the arrangement of the isolation ring body 220 and the height of the chip 230 is smaller than that of the isolation ring body 220, when the top cover 210 is covered on the sealed slot body, the top cover 310 is prevented from directly contacting the chip 230, which results in the damage of the top cover 310 and the chip 230 due to excessive physical contact.

It should be further noted that, the arrangement of the positioning column 120, the arrangement of the through hole 211, and the arrangement of the positioning hole 311 can well prevent the top cover 310 from generating relative displacement with respect to the housing 110 during assembly, which results in assembly errors, and further affects subsequent sealing efficiency.

It should be noted that the plurality of heat dissipation ribs 320 can increase the contact area between the top cover 310 and the air, that is, the heat dissipation efficiency of the electronic tag structure 10, and prevent the electronic tag from being damaged due to excessive heat accumulation inside the electronic tag.

Further, referring to fig. 1 again, in an embodiment, the casing assembly 100 further includes two magnetic attraction pieces 130, the two magnetic attraction pieces 130 are disposed on the casing 110, and the two magnetic attraction pieces 130 are axially symmetrically distributed around a central axis of the casing 110.

Thus, it should be noted that, the two magnetic attraction pieces 130 are arranged so that when the object to be installed has an iron shell, the electronic tag structure 10 can be attracted to the object to be installed by means of the magnetic attraction force of the magnetic attraction pieces 130.

Further, referring to fig. 1 again, in an embodiment, the top cover 310 is further provided with a groove 312, the housing 100 is provided with a first via hole 112 and a second via hole 113, when the top cover 310 is covered in the sealed groove body 111, the groove 312 is respectively communicated with the first via hole 112 and the second via hole 113, and each heat dissipation protruding strip 320 is located in the groove 312.

Therefore, it should be noted that, when the housing of the object to be mounted is not made of an iron material, the groove 312 is formed in the top cover 310, and the groove 312 is respectively communicated with the first via hole 112 and the second via hole 113, so that an installer can use the tie to sequentially penetrate through the first via hole 112, the groove 312 and the second via hole 113, and then can bind the electronic tag structure 10 to the object to be mounted.

Further, referring to fig. 1 and fig. 3, in an embodiment, the sidewall of each positioning hole 311 is provided with an auxiliary glue sealing hole 311 a.

Thus, it should be noted that, when the positioning column 120 penetrates the positioning hole 311, since a gap is formed between the positioning column 120 and the positioning hole 311, the positioning column 120 needs to be sealed, but because the gap is often small, the glue solution does not easily flow into the gap, and therefore, the sidewall of each positioning hole 311 is provided with an auxiliary sealing hole 311a, when the positioning column 120 needs to be sealed, the glue solution can flow into the gap through the auxiliary sealing hole 311a, a sealing glue layer is formed in the gap, and the sealing performance of the electronic tag structure 10 is ensured.

Further, in an embodiment, the housing kit 100 further includes a fluorescent member disposed on a side of the housing 110 away from the sealing groove 111.

Thus, it should be noted that the fluorescent member can make the electronic tag structure 10 emit light at night, so that the user can quickly locate the electronic tag structure 10.

Further, referring to fig. 2 again, in an embodiment, the RFID antenna assembly 200 further includes a buffering ring body 250, and the buffering ring body 250 is disposed on the isolation ring body 220.

In this way, it should be noted that the arrangement of the buffering ring body 250 can play a certain buffering role to prevent the isolation ring body 220 from being damaged. Specifically, the isolation ring 220 and the cushion ring 250 are an integrally formed structure. Thus, it should be noted that the design of the isolation ring body 220 and the cushion ring body 250 as an integral structure can enhance the overall mechanical strength.

Further, referring to fig. 1 and fig. 4, in one embodiment, a drainage arc groove 111a is formed on a side wall of the sealing groove 111.

Therefore, it should be noted that the opening of the arc drainage groove 111a enables the glue solution to better flow into the sealing groove body 111, so as to complete the sealing operation of the top cap 310.

Further, referring again to fig. 1, in one embodiment, the housing 110 is provided with a rounded annular edge 114.

In this way, it should be noted that the provision of the fillet 114 can prevent the electronic tag structure 10 from being damaged by the excessive physical contact between the housing 110 and the external object.

Further, in one embodiment, the cap kit 300 includes four heat dissipation ribs 320.

As described above, it is not preferable to design the heat dissipation ribs 320 too many, and four heat dissipation ribs 320 are preferable.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. An electronic label structure, comprising:

2. The electronic tag structure of claim 1, wherein the housing assembly further includes two magnetic attracting elements, the two magnetic attracting elements are disposed on the housing, and the two magnetic attracting elements are axially symmetrically distributed around a central axis of the housing.

3. The electronic tag structure of claim 1, wherein the top cover further defines a groove, the housing defines a first via hole and a second via hole, when the top cover is disposed in the sealing groove, the groove is respectively communicated with the first via hole and the second via hole, and each of the heat dissipating ribs is disposed in the groove.

4. The electronic tag structure of claim 1, wherein the sidewall of each positioning hole is provided with an auxiliary glue sealing hole.

5. The electronic tag structure according to claim 1, wherein the housing kit further comprises a fluorescent member disposed on a side of the housing away from the sealed housing.

6. The electronic tag structure of claim 1, wherein the RFID antenna assembly further comprises a cushion ring disposed on the isolation ring.

7. The electronic tag structure of claim 6, wherein the isolation ring and the cushion ring are integrally formed.

8. The electronic tag structure according to claim 1, wherein a drainage arc groove is formed on a side wall of the sealing groove body.

9. The electronic label structure according to claim 1, characterized in that a fillet is arranged on the shell.

10. The electronic tag structure of claim 1, wherein the top cover assembly comprises four heat dissipation ribs.