CN210221323U - Quick heat conduction mechanism of body temperature subsides and body temperature subsides - Google Patents
Quick heat conduction mechanism of body temperature subsides and body temperature subsides Download PDFInfo
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- CN210221323U CN210221323U CN201920833676.7U CN201920833676U CN210221323U CN 210221323 U CN210221323 U CN 210221323U CN 201920833676 U CN201920833676 U CN 201920833676U CN 210221323 U CN210221323 U CN 210221323U
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Abstract
The utility model relates to a quick heat conduction mechanism of body temperature subsides and body temperature subsides, including casing and the circuit board of cladding in the casing, welded on the circuit board has temperature sensor and sheetmetal probe, and a part of sheetmetal probe exposes outside the casing, and another part of sheetmetal probe forms the cavity cladding in the casing, and temperature sensor arranges in the cavity of sheetmetal probe, and the sheetmetal probe cavity packs heat conduction mud; the temperature sensor is welded on a temperature sensor bonding pad of the circuit board, the plurality of metal sheet bonding pads are respectively connected with the temperature sensor bonding pad through heat conduction copper paths, and the metal sheet probes are welded on the metal sheet bonding pads. The utility model discloses a two kinds of heat conduction ways transmit heat simultaneously, and heat transfer rate is fast, and the temperature measurement is efficient, and heat conduction route is short to heat conduction way all cladding is inside the casing, can reduce thermal loss, makes the temperature measurement accuracy higher.
Description
The technical field is as follows:
the utility model relates to a body temperature caliber utensil field specifically indicates a quick heat conduction mechanism and body temperature subsides that body temperature was pasted.
Background art:
at present, the thermometers for measuring body temperature are various in types, different in structural design and different in measuring position. The traditional thermometer is mainly a glass rod-shaped thermometer and can be used for measuring the temperature of the armpit, the temperature of the oral cavity or the temperature of the anus, the thermometer with the structure is easy to break dangerous accidents, the measurement result needs manual reading and is not visual, and the accuracy is difficult to guarantee. And the intelligent electronic thermometers are used for measuring the temperature inside the ears and reading the temperature in a digital display mode. These are all human body temperature measuring tools that are often used in daily life. Although the existing products can be used for measuring body temperature, the existing products cannot realize real-time monitoring and measuring of body temperature, are not suitable for some patients who need to pay close attention to body temperature change, and have the defect of poor temperature measurement accuracy.
In recent years, a small number of flexible body temperature patches are also put on the market, and the body temperature of a patient is monitored in real time by directly attaching the body temperature patches to the skin surface of the patient. The temperature sticker is generally internally provided with a temperature sensor probe, a control circuit board and a battery, and is also provided with a display screen for displaying temperature. The temperature conduction of these existing flexible body temperature patch structures mainly has the following two modes: first kind is as shown in fig. 1, in order to make the structure waterproof, directly with the circuit board cladding inside flexible casing, temperature sensor welds on the circuit board, human skin temperature passes through the casing and conducts to temperature sensor on, this kind of structure is because the casing adopts flexible silica gel or bubble cotton material, the heat capacity volume is great, the heat conduction efficiency is low, conduction temperature is slow, need long time just can conduct to temperature sensor on, the temperature measurement time is longer, also make the temperature measurement accuracy descend, can not reflect real body surface temperature in real time. The second structure is as shown in fig. 2, a copper sheet or other material with high heat conductivity coefficient is used as a temperature probe, the temperature probe is welded on a circuit board, part of the temperature probe is exposed outside a shell and contacts with human skin, the circuit board is coated inside the shell, the temperature sensor is welded on the other side of the circuit board, the temperature probe conducts heat to the circuit board after sensing the temperature of the human body, and then conducts the heat to the temperature sensor through a copper circuit on the circuit board, the heat conduction of the structure is superior to that of the first mode, but the conduction path is lengthened, the heat is easy to lose heat in the conduction process, and the accuracy of temperature measurement is not enough.
Accordingly, the present disclosure is directed to a method.
The utility model has the following contents:
the utility model aims at improving the temperature measurement degree of accuracy and improving the temperature measurement speed that the body temperature pasted specifically adopts following technical scheme to realize:
a quick heat conduction mechanism of a body temperature patch comprises a shell and a circuit board coated inside the shell, wherein a temperature sensor and a metal sheet probe are welded on the circuit board, one part of the metal sheet probe is exposed outside the shell, the other part of the metal sheet probe forms a cavity coated inside the shell, the temperature sensor is arranged in the cavity of the metal sheet probe, and heat conduction mud is filled in the cavity of the metal sheet probe; the temperature sensor is welded on a temperature sensor bonding pad of the circuit board, the plurality of metal sheet bonding pads are respectively connected with the temperature sensor bonding pad through heat conduction copper paths, and the metal sheet probes are welded on the metal sheet bonding pads.
As an optimized setting, the heat conductivity coefficient of the heat conduction mud is larger than 1.0 w/mk.
As an optimized setting, the shell adopts medical silica gel.
As an optimized setting, the metal sheet probe is made of a material with high heat conductivity coefficient.
As an optimized setting, the high-thermal-conductivity material adopts a copper sheet.
As an optimized setting, the circuit board adopts a flexible circuit board.
As an optimized arrangement, the thermally conductive copper path is covered by the cavity of the sheet metal probe.
The utility model also provides a body temperature subsides that has above-mentioned quick heat conduction mechanism.
The body temperature plaster provided by the utility model adopts two heat conduction ways to transfer heat simultaneously, one is to transfer the heat to the heat conduction mud through the metal sheet probe, and the heat is quickly transferred to the temperature sensor by the heat conduction mud; the other is that the metal sheet probe transfers heat to the metal sheet bonding pad, the metal sheet bonding pad transfers the heat to the temperature sensor bonding pad through the heat conduction copper path, and then the heat is transferred to the temperature sensor through the temperature sensor bonding pad, and the two heat conduction paths transfer the heat together, so that the heat transfer speed is high, and the temperature measurement efficiency is high; the heat conduction path is shorter, and the heat conduction path is wrapped in the shell, so that the loss of heat can be reduced, and the temperature measurement is more accurate and faster.
The invention is further illustrated by the figures and the detailed description below.
Description of the drawings:
FIG. 1 is a schematic structural view of a first body temperature patch in the prior art;
FIG. 2 is a schematic structural view of a second body temperature patch in the prior art;
FIG. 3 is a schematic structural diagram of a body temperature patch in an embodiment;
fig. 4 is a schematic diagram of an internal pad structure of the body temperature patch in the embodiment.
The specific implementation mode is as follows:
the embodiment discloses a quick heat conduction mechanism of body temperature subsides to and have this heat conduction mechanism's body temperature subsides, the exterior structure of body temperature subsides is shown in fig. 3, and the inner structure is shown in fig. 4, mainly includes casing and the flexible line way board 3 of cladding in the casing is inside, and wherein the casing divide into casing 1 and casing 2 down, and flexible line way board 3 is by casing 1 and casing 2 cladding down. In order to make the body temperature patch more comfortable to wear, the shell is made of medical silica gel which is skin-friendly, the specific heat capacity of the medical silica gel is 1700J/(KG. ℃), and the heat loss of heat in the heat conduction process can be well reduced. A temperature sensor bonding pad 7 is arranged on the flexible circuit board 3, and the temperature sensor 4 is welded on the temperature sensor bonding pad 7. A plurality of metal sheet bonding pads 8 are further arranged around the temperature sensor bonding pad 7 (four metal sheet bonding pads are arranged in the drawing of the embodiment), each metal sheet bonding pad 8 is connected with the temperature sensor bonding pad 7 through a heat conduction copper circuit 9, in order to reduce heat loss, the length of the heat conduction copper circuit 9 is set to be as short as possible, and therefore the heat conduction efficiency is higher. Welding a copper sheet metal probe 5 with an outer edge and a cavity formed by sinking the middle part on a sheet metal bonding pad 8, welding and fixing the outer edge of the sheet metal probe 5, wherein the cavity is over against the temperature sensor 4, so that the temperature sensor 4 and each heat conduction copper circuit 9 are covered by the cavity, and filling heat conduction mud with the heat conduction coefficient more than 1.0w/mk in the cavity of the sheet metal probe 5. The sheet metal probe 5 may be made of a high thermal conductivity material other than copper, such as copper, which is greater than 10W/m.k. The bottom of the cavity of the sheet metal probe 5 is exposed outside the housing for direct contact with the skin, so that the temperature can be directly sensed. And the other parts of the sheet metal probe 5 are covered in the shell, so that the heat loss in the heat conduction process can be reduced.
The body temperature subsides that this embodiment provided are direct with the casing subsides and apply on skin, make the end that exposes and the skin contact of sheetmetal probe 5, can pass through the heat conduction mud that the thermal conductivity is good with human heat and give temperature sensor 4 fast, because the heat conduction route is short, and the heat conductivity is high, and heat conduction piece and calorific loss are little, and the temperature measurement degree of accuracy is high and fast. The sheet metal probe 5 is welded on the sheet metal pad 8, part of heat is transferred to the sheet metal pad 8 from the sheet metal probe 5, the sheet metal pad 8 is transferred to the temperature sensor pad 7 through the heat conduction copper path 9, the temperature sensor pad 7 transfers the heat to the temperature sensor 4, which is another heat conduction path in the body temperature patch of the embodiment, the conduction paths are all wrapped inside the shell and covered by the cavity of the sheet metal probe 5, and the filling factor of the heat conduction mud is added, so that the heat loss conducted through the paths is very small. The two heat conduction paths in the embodiment jointly transmit the human body heat to the temperature sensor 4 quickly and accurately, and the effect of quick and accurate temperature measurement is achieved.
The above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting, and other modifications or equivalent replacements made by the technical solutions of the present invention by those of ordinary skill in the art should be covered within the scope of the claims of the present invention as long as they do not depart from the spirit and scope of the technical solutions of the present invention.
Claims (8)
1. The utility model provides a quick heat conduction mechanism that body temperature was pasted, includes casing and the cladding at the inside circuit board of casing, its characterized in that: the circuit board is welded with a temperature sensor and a metal sheet probe, one part of the metal sheet probe is exposed outside the shell, the other part of the metal sheet probe forms a cavity and covers the inside of the shell, the temperature sensor is arranged in the cavity of the metal sheet probe, and the cavity of the metal sheet probe is filled with heat conduction mud; the temperature sensor is welded on a temperature sensor bonding pad of the circuit board, the plurality of metal sheet bonding pads are respectively connected with the temperature sensor bonding pad through heat conduction copper paths, and the metal sheet probes are welded on the metal sheet bonding pads.
2. The rapid thermal conduction mechanism of a body temperature plaster according to claim 1, characterized in that: the heat conductivity coefficient of the heat conduction mud is more than 1.0 w/mk.
3. The rapid thermal conduction mechanism of a body temperature plaster according to claim 1, characterized in that: the shell is made of medical silica gel.
4. The rapid thermal conduction mechanism of a body temperature plaster according to claim 1, characterized in that: the metal sheet probe is made of a material with high heat conductivity coefficient.
5. The rapid thermal conduction mechanism of a body temperature plaster according to claim 4, characterized in that: the high-thermal conductivity material adopts a copper sheet.
6. The rapid thermal conduction mechanism of a body temperature plaster according to claim 1, characterized in that: the circuit board adopts a flexible circuit board.
7. The rapid thermal conduction mechanism of a body temperature plaster according to claim 1, characterized in that: the heat conducting copper path is covered by the cavity of the sheet metal probe.
8. A body temperature subsides which characterized in that: comprising a rapid thermal conduction mechanism according to any of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920833676.7U CN210221323U (en) | 2019-06-04 | 2019-06-04 | Quick heat conduction mechanism of body temperature subsides and body temperature subsides |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920833676.7U CN210221323U (en) | 2019-06-04 | 2019-06-04 | Quick heat conduction mechanism of body temperature subsides and body temperature subsides |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210221323U true CN210221323U (en) | 2020-03-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920833676.7U Active CN210221323U (en) | 2019-06-04 | 2019-06-04 | Quick heat conduction mechanism of body temperature subsides and body temperature subsides |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210221323U (en) |
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2019
- 2019-06-04 CN CN201920833676.7U patent/CN210221323U/en active Active
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