CN210221122U - Special-shaped sensing fabric - Google Patents
Special-shaped sensing fabric Download PDFInfo
- Publication number
- CN210221122U CN210221122U CN201920791501.4U CN201920791501U CN210221122U CN 210221122 U CN210221122 U CN 210221122U CN 201920791501 U CN201920791501 U CN 201920791501U CN 210221122 U CN210221122 U CN 210221122U
- Authority
- CN
- China
- Prior art keywords
- sensing
- fabric
- area
- conductive yarns
- special
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The utility model relates to a special-shaped sensing fabric, which comprises warp-wise conductive yarns and weft-wise conductive yarns, wherein the special-shaped sensing fabric is provided with a sensing area (204) and a peripheral wiring area (206), the warp-wise conductive yarns (202) and the weft-wise conductive yarns (203) which are mutually interwoven form the sensing area (204), and the sensing area is also provided with a wiring frame (205); a circuit board pad (207) is arranged in the routing area (206). The shaped sensing fabric is used in a variety of different products.
Description
Technical Field
The utility model relates to a sensing fabric especially relates to a dysmorphism sensing fabric.
Background
The sensing fabric is manufactured by a traditional weaving technology, and the square sensing fabric is relatively simple to manufacture, however, most of products needing the sensing fabric are not square, and the sensing fabric may need to be in other polygons, circles or other irregular shapes, and in such a case, the traditional square sensing fabric cannot be applied to the products.
Disclosure of Invention
The utility model aims to solve the technical problem that a dysmorphism sensing fabric is provided.
The utility model provides a technical scheme that its technical problem adopted is: a profiled sensing fabric is provided.
A special-shaped sensing fabric comprises warp-wise conductive yarns and weft-wise conductive yarns, the special-shaped sensing fabric is provided with a sensing area 204 and a peripheral wiring area 206, the mutually interwoven warp-wise conductive yarns 202 and weft-wise conductive yarns 203 form the sensing area 204, and the sensing area is further provided with a wiring frame 205; a circuit board pad 207 is disposed in the trace area 206. The sensing area is one of a circle, a polygon and an irregular figure.
And routing areas in the fabric, guiding each conductive yarn to a welding pad of the circuit board through the areas, and connecting the conductive yarns with the circuit board by a welding method.
The conductive yarns in the routing area are soldered to pads 207 of a circuit board, which is further connected to a motherboard for later signal processing.
Advantageous effects
Since the technical scheme is used, compared with the prior art, the utility model, have following advantage and positive effect: the utility model relates to a dysmorphism sensing fabric, this kind of sensing fabric can use in the sensing fabric that needs be some irregular shapes circular, polygon or other, enlarges the regional area of actual sensing through above-mentioned technical scheme at utmost, makes the regional area of actual sensing be close with the regional area of required sensing to use this kind of dysmorphism sensing fabric in the product of various differences.
Drawings
FIG. 1 is a drawing of a sensor web 101 of example 1; 102 are warp conductive yarns 102, 103 are weft conductive yarns;
FIG. 2 is a drawing of a sensor fabric according to embodiment 2;
FIG. 3 is a drawing of a sensor fabric of embodiment 3;
FIG. 4 is a drawing of a sensor fabric of example 4;
in the drawing, 202 is warp direction conductive yarn; 203 is weft conductive yarn; 204 is a sensing area; 205 is a sensing area frame; 206 is a wiring area; 207 are at the circuit board pads.
Detailed Description
The present invention will be further described with reference to the following specific examples. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Furthermore, it should be understood that various changes and modifications of the present invention may be made by those skilled in the art after reading the teachings of the present invention, and these equivalents also fall within the scope of the appended claims.
The utility model discloses an embodiment relates to a dysmorphism sensing fabric.
Example 1
Referring to fig. 2, in the fabric, warp conductive yarns 202 and weft conductive yarns 203 are interwoven to form a sensing region 204, the sensing region has a frame 205, the desired sensing region is circular, and the sensing region can be made polygonal in shape according to the wiring described above. If it is desired to have the sensing area more nearly circular, the number of conductive yarns in the warp and weft directions can be increased. The area 206 is a routing area through which each conductive yarn is guided to a pad of the circuit board 207, connected to the circuit board by soldering, and further connected to a motherboard for processing signals later through the circuit board. The weaving method of the oval sensing fabric is the same as the manufacturing method of the round sensing fabric.
Example 2
Referring to fig. 3, in the fabric, warp conductive yarns 202 and weft conductive yarns 203 are interwoven to form a sensing region 204, the sensing region has a frame 205, the desired sensing region is octagonal, and the octagonal-shaped sensing region can be manufactured according to the wiring. The area 206 is a routing area through which each conductive yarn is guided to a pad of the circuit board 207, connected to the circuit board by soldering, and further connected to a motherboard for processing signals later through the circuit board. The manufacturing method of the sensing fabric with other shapes and polygonal shapes is the same as the manufacturing method of the polygonal sensing fabric.
Example 3
Referring to fig. 4, in the fabric, warp conductive yarns 202 and weft conductive yarns 203 are interwoven to form a sensing region 204, the sensing region has a frame 205, the required sensing region has an irregular pattern, and the sensing region 204 having a shape similar to the irregular pattern can be manufactured according to the wiring. The area 206 is a routing area through which each conductive yarn is guided to a pad of the circuit board 207, connected to the circuit board by soldering, and further connected to a motherboard for processing signals later through the circuit board. The manufacturing method of the sensing fabric with other irregular shapes is the same as that of the irregular sensing fabric.
Comparative example 1
The sensing fabric 101 is made by interweaving conductive yarns 102 in the warp direction with conductive yarns 103 in the weft direction, using conductive yarns and ordinary yarns, as shown in fig. 1. The sensing fabric of fig. 1 described above is square.
Claims (3)
1. A special-shaped sensing fabric comprises warp-wise conductive yarns and weft-wise conductive yarns, and is characterized in that the special-shaped sensing fabric is provided with a sensing area (204) and a peripheral routing area (206), the mutually interwoven warp-wise conductive yarns (202) and weft-wise conductive yarns (203) form the sensing area (204), and the sensing area is also provided with a wiring frame (205); a circuit board pad (207) is arranged in the routing area (206).
2. The shaped sensing fabric of claim 1, wherein the sensing area is one of circular and polygonal.
3. The profiled sensing fabric of claim 1, wherein the conductive yarns of the trace area are soldered to a circuit board pad (207).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920791501.4U CN210221122U (en) | 2019-05-29 | 2019-05-29 | Special-shaped sensing fabric |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920791501.4U CN210221122U (en) | 2019-05-29 | 2019-05-29 | Special-shaped sensing fabric |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210221122U true CN210221122U (en) | 2020-03-31 |
Family
ID=69928911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920791501.4U Expired - Fee Related CN210221122U (en) | 2019-05-29 | 2019-05-29 | Special-shaped sensing fabric |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210221122U (en) |
-
2019
- 2019-05-29 CN CN201920791501.4U patent/CN210221122U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20060211276A1 (en) | Electrical contact | |
| CN101156165A (en) | Transponder-thread and application thereof | |
| US10458050B2 (en) | Methods for electrically connecting textile integrated conductive yarns | |
| CN210221122U (en) | Special-shaped sensing fabric | |
| US7443684B2 (en) | Heat sink apparatus | |
| US20110290369A1 (en) | Wire cloth | |
| CN203840633U (en) | Flexible circuit board and signal transmission device | |
| CN110978667A (en) | Silk screen material with singular Poisson ratio effect | |
| US4429179A (en) | Woven wire fanout | |
| US7829480B2 (en) | PCB supporting woven fabric and a PCB having the same | |
| US7204461B2 (en) | Wire cloth | |
| JP2016224958A (en) | Chip card inlay for contact operation and non-contact operation chip card | |
| JPH0254985A (en) | Twist transmission line of printed-circuit board | |
| CN220116782U (en) | Knitting structure | |
| CN207427565U (en) | A kind of flexible PCB grounding assembly and mobile terminal | |
| CN100585842C (en) | Chip and its manufacture method | |
| US2143552A (en) | Manufacture of paper-makers' wire cloth | |
| CN205182367U (en) | Agricultural filter cloth | |
| JPS6235474A (en) | Connector | |
| KR200422245Y1 (en) | Light emitting diode bracket structure | |
| CN216514461U (en) | Stretchable fabric wire and fabric with circuit | |
| CN209981112U (en) | Electromagnetic relay's base structure and electromagnetic relay | |
| JP6467137B2 (en) | Loop antenna pattern, antenna pattern using the same, and RFID inlay using the antenna pattern | |
| CN207427564U (en) | A kind of flexible PCB grounding assembly and mobile terminal | |
| CN217283562U (en) | Integrated circuit packaging pad, pad packaging library and PCB |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200331 Termination date: 20210529 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |