CN210202307U

CN210202307U - Electronic equipment heat dissipation support

Info

Publication number: CN210202307U
Application number: CN201920441537.XU
Authority: CN
Inventors: Yicheng Luo; 罗宜成; Longkou Chen; 陈龙扣; Dengyu Gui; 桂登宇
Original assignee: Shenzhen Shishang Creative Development Technology Co Ltd
Current assignee: Shenzhen Baseus Technology Co Ltd
Priority date: 2019-04-02
Filing date: 2019-04-02
Publication date: 2020-03-27
Anticipated expiration: 2029-04-02

Abstract

The utility model relates to an electronic equipment heat dissipation support, electronic equipment heat dissipation support includes locating component, flexible subassembly and base, flexible subassembly has flexible effect, and is adjustable locating component with distance between the base, the one side that is close to in the locating component and contacts with electronic equipment is equipped with the semiconductor heat dissipation piece for give the electronic equipment heat dissipation. The electronic equipment heat dissipation bracket can adjust the height of the electronic equipment, meets the requirements of different users, and is provided with the semiconductor heat dissipation part, so that the heat dissipation effect of the electronic equipment is improved.

Description

Electronic equipment heat dissipation support

[ technical field ] A method for producing a semiconductor device

The utility model relates to an electronic equipment support field, in particular to electronic equipment heat dissipation support.

[ background of the invention ]

In modern life, many electronic devices such as mobile phones, tablet computers and the like need an electronic device support to support when in use, so as to liberate both hands.

In the existing electronic equipment support, height adjustment can be performed, for example, when watching a movie, the height of the electronic equipment support needs to be adjusted to adapt to the visual angle of a user.

But in current height-adjustable's electronic equipment heat dissipation support, mostly be with the fan heat extraction, it is limited to electronic equipment's cooling, and the cooling effect is not good.

[ Utility model ] content

In order to overcome the problem that present height-adjustable's electronic equipment heat dissipation support cooling effect is not good, the utility model provides an electronic equipment heat dissipation support.

The utility model solves the technical problem, and provides a technical scheme as follows: a heat dissipation support for electronic equipment is used for supporting the electronic equipment and dissipating heat of the electronic equipment and comprises a positioning assembly, a telescopic assembly and a base, wherein the positioning assembly is used for being in contact with the electronic equipment and fixing the electronic equipment, and the base is used for bearing the telescopic assembly and the positioning assembly; the telescopic component has a telescopic function and can adjust the distance between the positioning component and the base; and a semiconductor heat dissipation part is arranged on one surface, close to the electronic equipment, of the positioning component and used for dissipating heat for the electronic equipment.

Preferably, the telescopic assembly comprises a first telescopic part and a second telescopic part, the first telescopic part is a hollow cylinder, the first telescopic part is sleeved outside the second telescopic part, and the second telescopic part can relatively move in the first telescopic part; one end of the first telescopic piece, which is far away from the second telescopic piece, is fixedly connected with the base, and one end of the second telescopic piece, which is far away from the first telescopic piece, is fixedly connected with the positioning assembly; the first telescopic piece and the second telescopic piece move mutually through any form of a spring, a thread, a buckle, an air cylinder or a hydraulic cylinder.

Preferably, the semiconductor heat dissipation element comprises a refrigeration surface and a heat dissipation surface which are opposite, and one surface of the positioning assembly, which is close to the surface in contact with the electronic equipment, is in contact with the refrigeration surface and used for dissipating heat for the electronic equipment; the positioning assembly is connected with one end, far away from the base, of the second telescopic piece in a rotating mode.

Preferably, the positioning assembly further comprises a first clamping piece and a second clamping piece which are oppositely arranged, and the first clamping piece and the second clamping piece are arranged on two adjacent side surfaces of the positioning assembly; the first and second clamping members may be movable toward and away from each other relative to the positioning assembly.

Preferably, the positioning assembly includes a backrest and a limiting member, the backrest is configured to contact with a back surface of the electronic device, and the limiting member is configured to support an edge of the electronic device to position the electronic device; the limiting part is a protruding structure protruding out of the surface of the backrest part contacting with the electronic equipment, and the limiting part is arranged on one side of the backrest part close to the base.

Preferably, the electronic device heat dissipation bracket further comprises a wireless charging piece, and the wireless charging piece is arranged on the backrest piece and used for wirelessly charging the electronic device; the wireless charging piece and the semiconductor radiating piece are arranged in the backrest piece, and the semiconductor radiating piece is close to one surface of the backrest piece, which is contacted with the electronic equipment.

Preferably, the surface of the limiting part abutting against the edge of the electronic device is provided with an anti-skid pad.

Preferably, the base is further provided with a first interface and an electric storage element, the first interface is arranged on the surface of the base, the electric storage element is arranged in the base, and the electric storage element is electrically connected with the wireless charging element and the semiconductor heat dissipation element so as to supply power to the wireless charging element and the semiconductor heat dissipation element; the power storage part is electrically connected with the first interface and can be charged by an external power supply.

Preferably, the base further comprises a second interface, and the second interface is electrically connected with the power storage component, so that the power storage component can charge the electronic device in a wired manner through the second interface.

Preferably, the second interface is a USB interface, and the first interface includes any one of a Micro-USB interface, a Type-C interface, and a Lightning interface.

Compared with the prior art, the utility model provides a pair of electronic equipment heat dissipation support has following advantage:

1. electronic equipment heat dissipation support includes locating component, flexible subassembly and base, the relative both ends of flexible subassembly can be close to relatively or keep away from, the relative both ends of flexible subassembly respectively with locating component with base fixed connection makes the locating component is adjustable relative the distance of base, the one side that is close to in the locating component and contacts with electronic equipment is equipped with the semiconductor heat dissipation spare for give the electronic equipment heat dissipation, make adjustable electronic equipment's height, adapt to different users' needs, set up the semiconductor heat dissipation spare simultaneously, improved the radiating effect to electronic equipment.

2. Through set up wireless charging piece in backing the piece for electronic equipment heat dissipation support can provide wireless charging function for electronic equipment, has improved the convenience that electronic equipment used.

3. Through the arrangement of the limiting part, the edge of the electronic equipment can be abutted against the limiting part, so that the electronic equipment is prevented from being damaged due to falling.

4. Through set up first interface and electric storage component on the base for semiconductor radiating element with wireless charging component accessible electric energy or directly obtain the electric energy through external power source.

5. Through set up the second interface on the base for the electricity storage part can give electronic equipment wired charging, has improved the convenience that electronic equipment used.

6. Through setting up locating component with the one end that the base was kept away from to flexible subassembly rotates and is connected, adjustable locating component for the angle of flexible subassembly makes locating component drives the use of electronic equipment adaptation multi-angle.

7. The anti-slip mat is arranged on the surface where the limiting part abuts against the edge of the electronic equipment, so that the stability of positioning the electronic equipment is improved, and the electronic equipment is prevented from accidentally falling.

8. Through set up first holder and second holder on the piece of backing to through first holder and second holder centre gripping electronic equipment, further improved the positional stability to electronic equipment, make electronic equipment safer when using.

[ description of the drawings ]

Fig. 1 is a schematic view of an overall structure of a heat dissipation bracket for electronic equipment according to a first embodiment of the present invention.

Fig. 2a is a schematic structural diagram of a positioning assembly in a heat dissipation bracket of an electronic device according to a first embodiment of the present invention.

Fig. 2b is a schematic side view of a positioning assembly in a heat dissipation bracket of an electronic device according to a first embodiment of the present invention.

Fig. 3a is a schematic structural diagram of a telescopic assembly in a heat dissipation bracket of an electronic device according to a first embodiment of the present invention.

Fig. 3b is a schematic structural view illustrating the rotation of the clamping assembly relative to the telescopic assembly in the heat dissipation bracket of the electronic device according to the first embodiment of the present invention.

Fig. 4a is a schematic structural diagram of a base in a heat dissipation bracket of an electronic device according to a first embodiment of the present invention.

Fig. 4b is a block diagram of a power storage device, a first interface, a second interface, a wireless charging device, and a heat dissipation device in a heat dissipation bracket of an electronic device according to a first embodiment of the present invention.

Fig. 5 is a schematic structural view of a first clamping member and a second clamping member in a heat dissipation bracket of an electronic device according to a second embodiment of the present invention.

Description of reference numerals:

1. an electronic device heat dissipation support;

11. a positioning assembly; 111. a semiconductor heat sink; 112. a backrest member; 113. a limiting member; 1131. a step; 114. a wireless charging element; 115. a first clamping member; 116. a second clamping member;

12. a telescoping assembly; 121. a first telescoping member; 122. a second telescoping member;

13. a base; 131. a first interface; 132. an electricity storage member; 133. a second interface.

[ detailed description ] embodiments

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and the embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Referring to fig. 1, a first embodiment of the present invention provides a heat dissipation bracket 1 for electronic equipment, which is generally placed on a horizontal plane to support the electronic equipment and dissipate heat from the electronic equipment. The electronic equipment heat dissipation support 1 comprises a positioning component 11, a telescopic component 12 and a base 13, wherein the positioning component 11 is used for fixing electronic equipment, and the base 13 is used for bearing the telescopic component 12 and the positioning component 11.

The telescopic assembly 12 has a telescopic function, and can well adjust the distance of the positioning assembly 11 relative to the base 13, for example, move along the direction a in fig. 1.

When the electronic equipment heat dissipation support 1 is used, the base 13 is placed on a horizontal plane, the electronic equipment is placed on the positioning component 11 for positioning, and the height of the electronic equipment is adjusted through the telescopic component 12.

Referring to fig. 1 and fig. 2a, specifically, the positioning assembly 11 includes a backrest 112 and a limiting member 113, the backrest 112 is used for contacting the electronic device, and the limiting member 113 is used for abutting against an edge of the electronic device to position the electronic device.

The backrest 112 is provided with a semiconductor heat sink 111 for dissipating heat from the electronic device. Alternatively, the semiconductor heat sink 111 is disposed at a position opposite to the back surface of the electronic device after the electronic device is placed on the positioning member 11, which can improve the heat dissipation effect of the semiconductor heat sink 111 to the electronic device.

It can be understood that the semiconductor heat dissipation element 111 is a semiconductor refrigeration piece, and the working principle of the semiconductor refrigeration piece is as follows: semiconductor cooling fins are a means of heat transfer. When a current passes through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer can be generated between the two ends, and the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold end and a hot end. When an N-type semiconductor material and a P-type semiconductor material are connected into a galvanic couple pair, energy transfer can be generated after direct current is switched on in the circuit, and the current flows to the joint of the P-type element from the N-type element to absorb heat to form a cold end; the junction from the P-type element to the N-type element releases heat to become the hot end. In this embodiment, the semiconductor heat dissipation element 111 includes a cooling surface and a heat dissipation surface opposite to each other, and one surface of the backrest 111, which is close to and in contact with the electronic device, is in contact with the cooling surface, and is used for dissipating heat for the electronic device. The semiconductor refrigerating sheet can be used for cooling the electronic equipment by 10-30 ℃ so as to have good heat dissipation effect. The cooling end of the semiconductor heat sink 111 is disposed near one side of the electronic device, so that the heat dissipation effect of the electronic device can be improved.

The limiting member 113 is a protruding structure on a side of the surface of the backrest 112 contacting the electronic device, which is close to the base 13. It should be understood that the number of the stoppers 113 may be two, or may be multiple.

Optionally, a non-slip pad is disposed on a surface of the limiting member 113 abutting against an edge of the electronic device.

It can be understood that, referring to fig. 1 and fig. 2b, the end of the limiting member 113 away from the backrest 112 is provided with a step 1131 protruding away from the base 13, so that the edge of the electronic device can be supported by the step 1131, and the electronic device is prevented from falling.

With reference to fig. 2a, the positioning assembly 11 further includes a wireless charging element 114 for wirelessly charging the electronic device. The wireless charging element 114 and the semiconductor heat dissipation element 111 are disposed in the backrest 112, and the semiconductor heat dissipation element 111 is disposed near a surface of the backrest 112 contacting with an electronic device.

It is understood that the wireless charging element 114 may be disposed near a side of the back rest 112 that contacts the electronic device, i.e., on the same surface as the semiconductor heat sink 111. Or the wireless charging element 114 is disposed on a side of the semiconductor heat dissipation element 111 away from the limiting element 113, that is, the wireless charging element 114 and the semiconductor heat dissipation element 111 are stacked, so that the cold end of the semiconductor heat dissipation element 111 contacts with the electronic device in as much area as possible, thereby increasing the heat dissipation effect, as long as the electronic device can be cooled and wirelessly charged at the same time.

Referring to fig. 3a, the telescopic assembly 12 includes a first telescopic member 121 and a second telescopic member 122, the first telescopic member 121 is a hollow cylinder structure, and the second telescopic member 122 is sleeved in the first telescopic member 121. The first telescopic member 121 and the second telescopic member 122 are in interference fit, so that the second telescopic member 122 can be fixed after moving to any position relative to the first telescopic member 121 in the first telescopic member 121 (e.g. moving in the direction b in fig. 3 a). The end of the first telescopic member 121 far from the second telescopic member 122 is fixedly connected with the base 13, and the end of the second telescopic member 122 far from the first telescopic member 121 is fixedly connected with the backrest 112.

It is understood that in some other embodiments, the first telescopic member 121 and the second telescopic member 122 can move relative to each other in the form of a spring, a thread, a buckle, an air cylinder or a hydraulic cylinder, etc., as long as the first telescopic member 121 and the second telescopic member 122 can be fixed at any position after moving relative to each other.

Optionally, referring to fig. 3b, the backrest 112 is rotatably connected to the second extensible member 122, specifically, a connecting plate protruding toward the second extensible member 122 is disposed on a surface of the backrest 112 opposite to a surface contacting with the electronic device, and the second extensible member 122 is also provided with a same connecting plate, and after being attached, the two connecting plates pass through the two connecting plates through a rotating shaft, so that the two connecting plates can rotate with the rotating shaft as an axis (e.g., an axis d in fig. 3 b).

The backrest 112 is made to be adjustable in angle (e.g. rotated in the direction c in fig. 3 b) relative to the second telescopic member 122, so that when the positioning assembly 11 positions an electronic device, the angle of the electronic device relative to a user can be adjusted, and the heat dissipation bracket 1 of the electronic device can be adapted to be used in multiple angles.

Referring to fig. 4a and 4b, the base 13 further includes a first interface 131 and an electrical storage component 132, the first interface 131 is disposed on a surface of the base 13, the electrical storage component 132 is disposed in the base 13, the electrical storage component 132 is electrically connected to the wireless charging component 114 and the semiconductor heat sink 111 to supply power to the wireless charging component 114 and the semiconductor heat sink 111, and the electrical storage component 132 is electrically connected to the first interface 131 to charge the electrical storage component 132 through an external power source. The first interface 131 includes any one of a Micro-USB interface, a Type-C interface, and a Lightning interface.

Alternatively, the first interface 131 may be directly electrically connected to the wireless charging element 114 and the semiconductor heat dissipation element 111, and an external power source may be connected to the first interface 131 to directly electrically supply power to the wireless charging element 114 and the semiconductor heat dissipation element 111, as long as power can be supplied to the wireless charging element 114 and the semiconductor heat dissipation element 111.

Optionally, please continue to combine fig. 4a and fig. 4b, the base 13 further includes a second interface 133, and the second interface 133 is a USB interface. The second interface 133 is electrically connected to the power storage member 132, so that the power storage member 132 can charge the electronic device through the second interface 133.

Referring to fig. 5, the second embodiment of the present invention is different from the first embodiment mainly in that: the positioning assembly 11 further includes a first clamping member 115 and a second clamping member 116 disposed oppositely, and the first clamping member 115 and the second clamping member 116 are disposed in two side surfaces of the backrest 112 adjacent to the limiting member 113.

It is understood that the first clamping member 115 and the second clamping member 116 are partially exposed from the backrest 112, and the first clamping member 115 and the second clamping member 116 can move toward or away from each other relative to the backrest 112, for example, in fig. 5, the first clamping member 115 moves along the direction d, and the second clamping member 116 moves along the direction e to move away from each other.

Specifically, the first clamping member 115 and the second clamping member 116 are spread apart to be away from each other, the back surface of the electronic device is attached to the backrest 112, the edge of the electronic device abuts against the limiting member 113, the first clamping member 115 and the second clamping member 116 are close to each other to clamp the edge of the electronic device, and the electronic device is fixed on the positioning assembly 11, so that the positioning effect on the electronic device is improved.

It is understood that the first clamping member 115 and the second clamping member 116 are connected by a spring (not shown), and both clamp the electronic device by the elastic force of the spring.

Alternatively, the first clamping member 115 and the second clamping member 116 may also move relative to each other through a screw thread, a snap, an air cylinder or a hydraulic cylinder, etc., as long as the first clamping member 115 and the second clamping member 116 can move relative to each other to clamp the electronic device.

The above is only a preferred embodiment of the present invention, and should not be limited to the present invention, and any modifications, equivalent replacements, and improvements made within the principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides an electronic equipment heat dissipation support which characterized in that: the electronic equipment heat dissipation support comprises a positioning component, a telescopic component and a base, wherein the positioning component is used for contacting with the electronic equipment and fixing the electronic equipment, and the base is used for bearing the telescopic component and the positioning component;

the telescopic component has a telescopic function and can adjust the distance between the positioning component and the base;

and a semiconductor heat dissipation part is arranged on one surface, close to the electronic equipment, of the positioning component and used for dissipating heat for the electronic equipment.

2. A heat dissipating support for an electronic device as recited in claim 1, further comprising: the telescopic assembly comprises a first telescopic piece and a second telescopic piece, the first telescopic piece is a hollow cylinder, the first telescopic piece is sleeved outside the second telescopic piece, and the second telescopic piece can move relatively in the first telescopic piece;

one end of the first telescopic piece, which is far away from the second telescopic piece, is fixedly connected with the base, and one end of the second telescopic piece, which is far away from the first telescopic piece, is fixedly connected with the positioning assembly;

the first telescopic piece and the second telescopic piece move mutually through any form of a spring, a thread, a buckle, an air cylinder or a hydraulic cylinder.

3. A heat dissipating support for an electronic device as recited in claim 2, further comprising:

the semiconductor radiating element comprises a refrigerating surface and a radiating surface which are opposite, and one surface of the positioning assembly, which is close to the surface in contact with the electronic equipment, is in contact with the refrigerating surface and used for radiating heat for the electronic equipment;

the positioning assembly is connected with one end, far away from the base, of the second telescopic piece in a rotating mode.

4. A heat dissipating support for an electronic device as recited in claim 1, further comprising: the positioning assembly further comprises a first clamping piece and a second clamping piece which are oppositely arranged, and the first clamping piece and the second clamping piece are arranged on two adjacent side surfaces of the positioning assembly;

the first and second clamping members may be movable toward and away from each other relative to the positioning assembly.

5. The electronic device heat dissipation mount of any of claims 1-4, wherein: the positioning assembly comprises a backrest part and a limiting part, the backrest part is used for being in contact with the back of the electronic equipment, and the limiting part is used for supporting the edge of the electronic equipment so as to position the electronic equipment;

the limiting part is a protruding structure protruding out of the surface of the backrest part contacting with the electronic equipment, and the limiting part is arranged on one side of the backrest part close to the base.

6. A heat dissipating support for an electronic device as recited in claim 5, further comprising: the electronic equipment heat dissipation support further comprises a wireless charging piece, and the wireless charging piece is arranged on the backrest piece and used for wirelessly charging the electronic equipment;

the wireless charging piece and the semiconductor radiating piece are arranged in the backrest piece, and the semiconductor radiating piece is close to one surface of the backrest piece, which is contacted with the electronic equipment.

7. A heat dissipating support for an electronic device as recited in claim 5, further comprising: and the surfaces of the limiting part and the edge of the electronic equipment, which are abutted against each other, are provided with anti-slip pads.

8. A heat dissipating support for an electronic device as recited in claim 6, further comprising: the base is further provided with a first interface and an electric storage element, the first interface is arranged on the surface of the base, the electric storage element is arranged in the base, and the electric storage element is electrically connected with the wireless charging element and the semiconductor heat radiating element so as to supply power to the wireless charging element and the semiconductor heat radiating element;

the power storage part is electrically connected with the first interface and can be charged by an external power supply.

9. A heat dissipating support for an electronic device as recited in claim 8, further comprising: the base further comprises a second interface, and the second interface is electrically connected with the power storage component, so that the power storage component can charge electronic equipment in a wired mode through the second interface.

10. A heat dissipating support for an electronic device as recited in claim 9, further comprising: the second interface is a USB interface, and the first interface comprises any one of a Micro-USB interface, a Type-C interface and a Lightning interface.