CN210202005U

CN210202005U - Heat abstractor and audio amplifier

Info

Publication number: CN210202005U
Application number: CN201921296154.4U
Authority: CN
Inventors: Donghua Liu; 刘东华; Li Wang; 王丽
Original assignee: Shenzhen Horn Audio Co Ltd
Current assignee: Shenzhen Horn Audio Co Ltd
Priority date: 2019-08-07
Filing date: 2019-08-07
Publication date: 2020-03-27
Anticipated expiration: 2029-08-07

Abstract

The utility model belongs to the technical field of the audio amplifier, especially, relate to a heat abstractor and audio amplifier. A heat sink for diffusing heat generated by the heat source, the heat sink comprising: the shell structure is provided with an accommodating cavity for heat supply, and is also provided with a radiating surface for radiating heat outwards; the sound source structure is used for generating sound waves and is arranged relative to the shell structure, the sound source structure is provided with a sound outlet surface used for transmitting the sound waves outwards, the sound outlet surface and the heat dissipation surface are arranged at a preset interval and form a heat dissipation interval together; the heat radiation surface radiates heat in the heat radiation section and is provided with a heat radiation hole which is communicated with the containing cavity and allows heat supply to flow into the heat radiation section from the containing cavity, and the sound output surface spreads sound waves to the heat radiation surface so as to disturb gas in the heat radiation section. The utility model discloses a vibration of sound wave and disturbance heat dissipation interval internal gas make the internal gas initiative of heat dissipation and the external strong convection current that produces to accelerate the heat outward diffusion in the heat dissipation interval.

Description

Heat abstractor and audio amplifier

Technical Field

The utility model belongs to the technical field of the audio amplifier, especially, relate to a heat abstractor and audio amplifier.

Background

At present, with the development of society, the living standard of people is improved, and the requirements on the quality of sound box products are higher and higher.

The inside main part that produces heat of audio amplifier is the circuit board, in order to distribute away in time the heat on the circuit board, sets up the mesh of large tracts of land on the shell of audio amplifier among the prior art to dispel the heat through the natural convection of air.

However, the passive heat dissipation method relying on the flow of the air in the use place has poor heat dissipation effect.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a heat abstractor aims at solving and how to carry out the produced heat of audio amplifier circuit board problem that effectively dispels the heat.

The utility model provides a heat abstractor for spread the produced heat of heat source, heat abstractor includes:

the shell structure is provided with an accommodating cavity for the heat source to be arranged, and the shell structure is also provided with a radiating surface for radiating the heat outwards; and

the sound source structure is used for generating sound waves and is arranged opposite to the shell structure, the sound source structure is provided with a sound outlet surface used for outwards spreading the sound waves, and the sound outlet surface and the heat dissipation surface are arranged at a preset interval and form a heat dissipation interval together;

the heat dissipation surface radiates the heat in the heat dissipation section, the heat dissipation hole which is communicated with the accommodating cavity and is used for allowing the heat to flow into the heat dissipation section from the accommodating cavity is formed in the heat dissipation surface, and the sound wave is transmitted to the heat dissipation surface to disturb the gas in the heat dissipation section.

The technical effects of the utility model are that: the heat generated by the heat source is transferred to the heat dissipation area from the heat dissipation surface and the heat dissipation hole respectively, wherein the heat dissipation hole can accelerate the rate of the heat entering the heat dissipation area from the accommodating cavity. The sound source structure simultaneously generates sound waves in the heat dissipation interval, and the gas in the heat dissipation interval is disturbed through the vibration of the sound waves, so that the gas in the heat dissipation interval actively generates strong convection with the outside, the outward diffusion of heat in the heat dissipation interval is accelerated, and the heat dissipation efficiency of the heat dissipation device is improved.

Drawings

Fig. 1 is a three-dimensional structure diagram of a sound box provided by an embodiment of the present invention;

FIG. 2 is an exploded view of the enclosure of FIG. 1;

FIG. 3 is a cross-sectional view of the enclosure of FIG. 1;

FIG. 4 is a perspective view of one direction of the sound cone of FIG. 2;

fig. 5 is a perspective view of the sound cone of fig. 2 in another direction.

The correspondence between reference numbers and names in the drawings is as follows:

100. a sound box; 10. a sound source structure; 20. a housing structure; 21. a sound guide cone; 22. a base; 30. connecting columns; 23. an air inlet; 101. a heat sink; 211. a heat dissipating surface; 212. a heat conductive member; 40. a circuit board; 221. an accommodating cavity; 11. a sound source housing; 12. a horn; 121. a sound output surface; 213. heat dissipation holes; 50. a heat dissipation interval; 214. reinforcing ribs;

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "thickness", "upper", "lower", "vertical", "parallel", "bottom", "angle", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted" and "connected" are to be construed broadly, e.g., as meaning either a fixed connection or a removable connection, or as an integral part; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship.

Referring to fig. 1 to 3, an embodiment of the invention provides a heat dissipation apparatus 101, in which the heat dissipation apparatus 101 is used for diffusing heat generated by a heat source, optionally, the heat source is a circuit board 40 generating heat in a conductive state in the embodiment. The heat sink 101 includes: a housing structure 20 and a sound source structure 10. The housing structure 20 is provided with a receiving cavity 221 for heat supply, and the housing structure 20 is further provided with a heat dissipating surface 211 for dissipating heat outwards. Alternatively, a heat source disposed within the receiving cavity 221 conducts heat to the housing structure 20 and radiates heat outward through the heat radiating surface 211. The sound source structure 10 is used for generating sound waves and is arranged opposite to the shell structure 20, the sound source structure 10 is provided with a sound outlet surface 121, the sound outlet surface 121 and the heat dissipation surface 211 are arranged at a preset interval and jointly form a heat dissipation area 50, and the heat dissipation surface 211 radiates heat into the heat dissipation area 50. Alternatively, the sound source structure 10 includes a sound source housing 11 disposed opposite to the housing structure 20 and a speaker 12 disposed in the sound source housing 11, the sound outlet surface 121 is disposed on the speaker 12, and the sound wave generated by the speaker 12 is transmitted from the sound outlet surface 121. The heat dissipating hole 213 is disposed on the heat dissipating surface 211 and communicates with the accommodating cavity 221, and heat flows from the accommodating cavity 221 to the heat dissipating section 50, and the sound emitting surface 121 radiates sound waves to the heat dissipating surface 211 to disturb the gas in the heat dissipating section 50.

The heat generated by the heat source is transferred into the heat dissipation area 50 from the heat dissipation surface 211 and the heat dissipation holes 213, wherein the heat dissipation holes 213 can increase the rate of heat entering the heat dissipation area 50 from the accommodating cavity 221. The sound source structure 10 generates sound waves into the heat dissipation area 50 at the same time, and the vibration of the sound waves disturbs the gas in the heat dissipation area 50, so that the gas in the heat dissipation area 50 actively generates strong convection with the outside, thereby accelerating the outward diffusion of heat in the heat dissipation area 50 and further improving the heat dissipation efficiency of the heat dissipation device 101.

Optionally, the diameter of the heat dissipation hole 213 is five millimeters.

Referring to fig. 1 to 3, in an embodiment, a plurality of heat dissipation holes 213 are formed, and each heat dissipation hole 213 is disposed on the heat dissipation surface 211 at intervals.

In one embodiment, the housing structure 20 includes a base 22 disposed opposite to the sound source structure 10 and a sound cone 21 located between the base 22 and the sound source structure 10, the receiving cavity 221 is opened on the base 22 and has an open cavity structure, the sound cone 21 is located at the opening of the receiving cavity 221, and the heat dissipation surface 211 is located on a surface of the sound cone 21 facing the sound source structure 10. The circuit board 40 is disposed between the bottom of the accommodating cavity 221 and the sound cone 21, and heat generated by the circuit board 40 can be transferred to the sound cone 21 and further transferred to the heat dissipation surface 211 on the sound cone 21.

In one embodiment, the heat dissipating surface 211 is a conical surface, and the heat dissipating holes 213 are opened at the center of the heat dissipating surface 211. Specifically, the projection of the heat dissipation surface 211 on the bottom of the accommodating cavity 221 is circular, and the center of the heat dissipation surface 211 is protruded toward the sound outlet surface 121. The heat dissipation holes 213 located at the center of the heat dissipation surface 211 can make the heat flow uniformly and distribute in the heat dissipation area 50 after flowing out of the accommodation cavity 221 through the heat dissipation holes 213.

In one embodiment, the heat dissipating device 101 further includes a heat conducting member 212 located in the receiving cavity 221 and used for conducting heat from the heat source to the sound cone 21, one end of the heat conducting member 212 abuts against the heat source, and the other end of the heat conducting member 212 abuts against the sound cone 21. Alternatively, the heat conducting member 212 is made of a cylindrical heat conducting material with good heat conductivity, such as copper or silver. The heat generated by the circuit board 40 is rapidly conducted to the sound cone 21 through the heat conduction member 212.

Referring to fig. 1 to 3, in one embodiment, a plurality of heat conducting members 212 are disposed, and each heat conducting member 212 is disposed in the accommodating cavity 221 at intervals. Providing a plurality of thermal conductive members 212 further improves the efficiency of heat transfer.

In one embodiment, the air inlet 23 is formed between the outer edge of the sound cone 21 and the opening edge of the accommodating cavity 221. The air in the heat dissipation area 50 continuously forms convection with the outside air under the action of the sound waves, so that the hot air in the accommodating cavity 221 continuously flows out of the accommodating cavity 221 through the heat dissipation holes 213, and the outside cold air can continuously enter the accommodating cavity 221 through the air inlet 23, so that the air in the accommodating cavity 221 forms a circulation of cold and hot air, and the heat dissipation efficiency of the heat dissipation device 101 is further improved.

In one embodiment, the air inlets 23 are arranged around the circumference of the sound cone 21 and are in an annular configuration. The air inlet 23 of the ring structure may maximize the passage of air into the receiving chamber 221, thereby increasing the amount of intake of cold air.

Referring to fig. 4 to 5, in an embodiment, the heat dissipating device 101 further includes a rib 214, and the rib 214 is located on a surface of the sound cone 21 facing away from the heat dissipating surface 211. Optionally, the ribs 214 are annular and are provided in a plurality and the inner diameters of the ribs 214 are not equal, so that the ribs 214 can be arranged annularly inside. It will be appreciated that the ribs 214 may reinforce the structural strength of the sound cone 21.

In one embodiment, the heat dissipating device 101 further comprises a connecting column 30 located in the heat dissipating section 50, one end of the connecting column 30 is connected to the sound source structure 10, and the other end of the connecting column 30 is connected to the casing structure 20. The connecting columns 30 are provided in plurality, and the connecting columns 30 are uniformly arranged in the circumference.

Alternatively, the connecting post 30 is integrally formed with the sound cone 21.

The utility model also provides an audio amplifier 100, this audio amplifier 100 includes heat abstractor 101, and this audio amplifier 100's concrete structure refers to above-mentioned embodiment, because this audio amplifier 100 has adopted the whole technical scheme of above-mentioned all embodiments, consequently has all beneficial effects that the technical scheme of above-mentioned embodiment brought equally, and the repeated description is no longer given here.

In one embodiment, the sound box 100 further includes a circuit board 40 generating heat in a conductive state, and the circuit board 40 is disposed in the accommodating cavity 221.

The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. A heat dissipating device for dissipating heat generated by a heat source, the heat dissipating device comprising:

2. The heat dissipating device of claim 1, wherein: the shell structure is including relative the base that the sound source structure set up and being located the base with lead the sound awl between the sound source structure, the holding chamber is seted up in the base just is opening cavity structure, it is located to lead the sound awl the opening part in holding chamber, just the cooling surface is located lead the sound awl orientation the surface of sound source structure.

3. The heat dissipating device of claim 2, wherein: the radiating hole is arranged at the central position of the radiating surface.

4. The heat dissipating device of claim 2, wherein: the heat dissipation device further comprises a heat conduction piece which is located in the accommodating cavity and used for conducting the heat from the heat source to the sound guide cone, one end of the heat conduction piece is abutted to the heat source, and the other end of the heat conduction piece is abutted to the sound guide cone.

5. The heat dissipating device of claim 4, wherein: the heat conducting pieces are arranged in a plurality of numbers, and each heat conducting piece is arranged in the containing cavity at intervals.

6. The heat dissipating device of any one of claims 2-5, wherein: an air inlet is formed between the outer edge of the sound guide cone and the opening edge of the accommodating cavity.

7. The heat dissipating device of claim 6, wherein: the air inlets are arranged around the circumferential direction of the sound guide cone and are of an annular structure.

8. The heat dissipating device of any one of claims 2-5, wherein: the heat dissipation device further comprises a reinforcing rib, and the reinforcing rib is located on the surface, deviating from the heat dissipation surface, of the sound guide cone.

9. The heat dissipating device of any one of claims 1-5, wherein: the heat dissipation device further comprises a connecting column located between the heat dissipation sections, one end of the connecting column is connected with the sound source structure, and the other end of the connecting column is connected with the shell structure.

10. An acoustic enclosure, comprising: the heat dissipating device as claimed in any one of claims 1 to 9, and a circuit board disposed in the receiving cavity and generating the heat in an electrically conductive state.