CN210192317U

CN210192317U - Packaging assembly of semiconductor laser module

Info

Publication number: CN210192317U
Application number: CN201920786485.XU
Authority: CN
Inventors: Qingyi Zhang; 张庆一; Beichao Kai; 开北超; Chuanshang Fu; 付传尚; Sujuan Sun; 孙素娟
Original assignee: Weifang Huaguang Photoelectron Co Ltd
Current assignee: Weifang Huaguang Photoelectron Co Ltd
Priority date: 2019-05-28
Filing date: 2019-05-28
Publication date: 2020-03-27
Anticipated expiration: 2029-05-28

Abstract

The utility model discloses a package assembly of semiconductor laser module relates to packing product technical field. This package assembly includes outer box and set up in lower floor's blotter and upper blotter in the outer box body, the upper blotter on be provided with the spacing hole of a plurality of, one side that the lower surface of upper blotter is located spacing hole is provided with the recess. The upper-layer buffer cushion is reversely buckled with an inner box body, the inner box body is provided with a first concave part corresponding to the limiting hole, the limiting hole and the first concave part jointly form a cavity for accommodating the laser module, and the shape of the first concave part is matched with the part of the laser module exposed above the upper-layer buffer cushion. The inner box body is made of transparent materials. The packaging assembly can not only guarantee the vibration reduction and buffering effects of the packaging, but also can be very large, so that the packaging assembly is convenient for customers to visually check and use.

Description

Packaging assembly of semiconductor laser module

Technical Field

The utility model belongs to the technical field of the packaging product technique and specifically relates to a packaging assembly of semiconductor laser module.

Background

The laser module is a relatively precise photoelectric product, and because the structure of the laser module is relatively fine and the capability of bearing external impact is small, the problem of vibration reduction and buffering is mainly considered in the packaging process.

For this reason, in the conventional package for the laser module, buffering pads are generally disposed on the upper and lower sides of the laser module, respectively, and a groove for limiting the degree of freedom of the laser module in the horizontal plane is disposed on the inner side surface (the inner side surface facing to the opposite side) of the buffering pad, so as to achieve complete positioning of the laser module.

Although this structure can ensure a good vibration damping effect, in the course of actual sales, customers often require the appearance of the laser module to be seen by opening the package. The conventional structure has no direct view of the laser module after opening the outer package, requiring the entire package to be disassembled. Is cumbersome and inconvenient for direct observation of customers.

SUMMERY OF THE UTILITY MODEL

To the above problem, the utility model provides a package assembly of semiconductor laser module, this package assembly not only can guarantee the damping buffering effect of packing itself, and convenience of customers that moreover can be very big looks over directly perceived, and is more convenient in the use.

The utility model provides a technical scheme that its technical problem adopted is:

a packaging assembly of a semiconductor laser module comprises an outer box body, a lower-layer cushion pad and an upper-layer cushion pad, wherein the lower-layer cushion pad and the upper-layer cushion pad are arranged in the outer box body;

an inner box body is reversely buckled on the upper-layer cushion pad, a first concave part corresponding to the limiting hole is arranged on the inner box body, the limiting hole and the first concave part jointly form a cavity for accommodating the laser module, and the shape of the first concave part is matched with the part of the laser module exposed above the upper-layer cushion pad;

the inner box body is made of transparent materials.

Furthermore, a wiring groove corresponding to the groove is arranged on the lower buffer cushion.

Furthermore, a limiting groove for accommodating the laser module is arranged on the lower buffer pad.

Furthermore, one side of the limiting hole is provided with an extending part for accommodating a laser module lead, and one side of the first concave part is provided with a second concave part for accommodating the laser module lead.

Furthermore, a hand buckling hole is formed in the upper-layer buffer cushion.

Furthermore, the upper layer buffer cushion and the lower layer buffer cushion are both made of static foam.

Further, the depth of the inner box body is equal to the sum of the thicknesses of the upper cushion pad and the lower cushion pad.

Furthermore, the limiting holes are arranged in a matrix of three rows and two columns, and the groove is arranged between the two columns of limiting holes.

The utility model has the advantages that:

1. the packaging assembly can ensure the vibration reduction buffering effect of the packaging body, and the laser module can be seen after the cover of the outer box body is opened, so that the packaging assembly is convenient for customers to visually check and is more convenient to use.

2. Through setting up upper and lower two-layer blotter to hide the wire of laser instrument module and between upper and lower floor's blotter, even place a plurality of laser instrument modules in a packing carton like this, also can guarantee neatly, pleasing to the eye, avoid making whole chaotic owing to the unordered state of wire.

3. Through setting up interior box body to in-box body including injecing upper and lower floor's blotter, can effectually prevent dust on the one hand, on the other hand also can avoid taking place the friction at the in-process laser instrument module of transport, transportation with outer box body, thereby causes wearing and tearing, fish tail etc. of laser instrument module surface.

4. The packaging process and the dismounting process of the packaging assembly are simple, the operation is convenient, and extra workload can not be increased.

Drawings

FIG. 1 is a perspective view of a packaging assembly;

FIG. 2 is an exploded view of FIG. 1;

FIG. 3 is a schematic perspective view of the inner case;

FIG. 4 is a perspective view of the upper cushion;

FIG. 5 is a perspective view of the lower cushion;

FIG. 6 is a schematic perspective view of a laser module;

fig. 7 is a schematic view showing the structural relationship between the laser module, the inner case, and the upper and lower cushions.

In the figure: 1-outer box, 2-inner box, 21-first concave part, 22-second concave part, 3-upper buffer, 31-limiting hole, 311-extension part, 32-hand-buckling hole, 33-groove, 4-lower buffer, 41-limiting groove, 42-wiring groove, 5-laser module, 51-wire.

Detailed Description

For convenience of description, a coordinate system is defined as shown in fig. 1, and rows are defined in the front-rear direction and in the left-right direction.

As shown in fig. 1 and 2, a package assembly of a semiconductor laser module includes an outer case 1, as a specific embodiment, the outer case 1 is made of hard corrugated paper, the outer case 1 includes a main case with an upper side opening, and an upper cover is disposed on an upper edge of a side wall of the main case and can be folded. The suspension end (namely, the end far away from the end connected with the main box body) of the upper cover is provided with a foldable locking plate, and the locking plate and the main box body are respectively provided with a magnet for locking the upper cover.

The inner part of the outer box body 1 is sequentially provided with a lower cushion pad 4 and an upper cushion pad 3 from top to bottom. The upper cushion 3 is provided with a plurality of limiting holes 31 for accommodating the laser modules 5, and as shown in fig. 4, a groove 33 for accommodating the laser module lead 51 is provided on one side of each limiting hole 31 on the lower surface of the upper cushion 3.

As a specific embodiment, the upper cushion 3 and the lower cushion 4 in this embodiment are both made of electrostatic foam.

An inner box body 2 with an opening at the lower side is arranged above the upper cushion pad 3, the inner box body 2 is buckled on the upper cushion pad 3 in an inverted mode, and the depth of the inner box body 2 is equal to the sum of the thicknesses of the upper cushion pad 3 and the lower cushion pad 4. The upper side surface of the inner box body 2 is provided with a plurality of first concave parts 21 which are concave upwards to form a cavity for accommodating the laser module 5, and the shape of the first concave parts 21 is matched with the part of the laser module 5 exposed above the upper-layer cushion pad 3. The inner box body 2 is made of transparent materials.

As a specific implementation manner, the inner case 2 in this embodiment is made of transparent plastic.

Further, as shown in fig. 2 and 5, a routing groove 42 for accommodating the laser module wire 51 is provided on the lower cushion pad 4 at a position corresponding to the groove 33.

Here, the installation of the cabling duct 42 mainly has two aspects, namely, installation indication and enlargement of the accommodation space for the wires 51. The enlargement of the accommodation space is easy to understand and will not be described in much detail here. For installation indication, the lower cushion 4 is first placed in the outer housing 1 and then the laser module 5 is placed in the package, but it is not clearly indicated on which side the laser module lead 51 is located, and it is necessary to place the laser module in an appropriate manner according to the position of the groove 33 on the upper cushion 3. If the orientation of the laser module 5 is confirmed by the grooves 33 on the upper cushion 3 during the packaging process, the packaging efficiency is affected due to the inadvertent inconvenience. Therefore, the wiring groove 42 is formed in the lower-layer cushion pad 4, so that a clear indication effect can be achieved, and the wiring groove 42 can be directly placed conveniently and quickly.

Further, as shown in fig. 2 and 5, the lower cushion pad 4 is provided with a limiting groove 41 for accommodating the laser module 5. When the lower surface of the laser module 5 has a convex portion, only the stopper groove 41 for receiving the convex portion may be provided, as shown in fig. 2 and 5.

Further, in order to avoid the package from forming the extrusion bending on the laser module conducting wire 51, as shown in fig. 2 and 7, one side of the limiting hole 31 is provided with an extending portion 311 for accommodating the laser module conducting wire 51, and the limiting hole 31 and the extending portion 311 together form a convex structure.

Correspondingly, as shown in fig. 2 and 3, a second recess 22 for accommodating the laser module lead 51 is disposed on the upper side of the inner case 2 at one side of the first recess 21, and the second recess 22 is communicated with the first recess 21 to form a unified cavity.

Further, for the convenience of disassembly, as shown in fig. 2, the upper cushion 3 is provided with a long-strip-shaped handle hole 32.

Preferably, the plurality of limiting holes 31 are arranged in a matrix, and at least one of the number of rows and the number of columns is an even number.

As a specific implementation manner, the limiting holes 31 in this embodiment are arranged in a matrix of three rows and two columns, the groove 33 is disposed between the two columns of limiting holes 31, and the groove 33 communicates with the limiting holes 31 on both sides. Correspondingly, the wiring groove 42 is disposed between two rows of limiting holes 31, the extending portion 311 is located inside the limiting holes 31 (the side opposite to the two limiting holes 31 is the inner side), and the second recessed portion 22 is located inside the first recessed portion 21 (the side opposite to the two first recessed portions 21 is the inner side). Thus, the leads 51 of two laser modules 5 in the same row share one wiring groove 42, so that the volume of the package can be smaller, and the production cost can be reduced.

Claims

1. The utility model provides a package assembly of semiconductor laser module, includes outer box and set up in lower floor's blotter and upper blotter in the outer box body, its characterized in that: the upper-layer buffer cushion is provided with a plurality of limiting holes, and the lower surface of the upper-layer buffer cushion, which is positioned at one side of the limiting holes, is provided with a groove;

the inner box body is made of transparent materials.

2. A package assembly for a semiconductor laser module as defined in claim 1, wherein: and a wiring groove corresponding to the groove is arranged on the lower buffer cushion.

3. A package assembly for a semiconductor laser module as defined in claim 1, wherein: and the lower buffer pad is provided with a limit groove for accommodating the laser module.

4. A package assembly for a semiconductor laser module as defined in claim 1, wherein: one side of the limiting hole is provided with an extending part used for accommodating a laser module lead, and one side of the first concave part is provided with a second concave part used for accommodating the laser module lead.

5. A package assembly for a semiconductor laser module as defined in claim 1, wherein: and the upper-layer buffer cushion is provided with a hand buckling hole.

6. A package assembly for a semiconductor laser module as defined in claim 1, wherein: the upper layer buffer cushion and the lower layer buffer cushion are both made of static foam.

7. A package assembly for a semiconductor laser module as defined in claim 1, wherein: the depth of the inner box body is equal to the sum of the thicknesses of the upper cushion pad and the lower cushion pad.

8. A package assembly for a semiconductor laser module as defined in claim 1, wherein: the limiting holes are arranged in a matrix of three rows and two columns, and the groove is arranged between the two columns of limiting holes.