CN210183667U - Multi-stage buffer pressing plate mechanism for multilayer circuit board - Google Patents
Multi-stage buffer pressing plate mechanism for multilayer circuit board Download PDFInfo
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- CN210183667U CN210183667U CN201920905300.2U CN201920905300U CN210183667U CN 210183667 U CN210183667 U CN 210183667U CN 201920905300 U CN201920905300 U CN 201920905300U CN 210183667 U CN210183667 U CN 210183667U
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Abstract
The utility model discloses a multi-level buffer pressing plate mechanism of a multilayer circuit board, which comprises a power mechanism, a pressing plate, a pressing seat, a first-level buffer mechanism, an adjusting buffer mechanism, a support and a second-level buffer mechanism, wherein the power mechanism comprises a hydraulic cylinder, the bottom of a piston rod of the hydraulic cylinder is fixedly connected with the top of the pressing plate, the pressing plate is fixedly arranged on an upper sliding seat, and the upper sliding seat is connected with the pressing seat through an upper guide rod; a pressing die matched with the pressing plate is arranged at the top of the pressing seat, a support is arranged below the pressing seat, and a primary buffer mechanism and an adjusting buffer mechanism are arranged between the pressing seat and the support; the secondary buffer mechanism comprises a rubber column and a limiting column, the rubber column is arranged between the support and the platform, and the upper end and the lower end of the rubber column are respectively fixed; the utility model relates to a multiple buffer gear utilizes buffer gear's reaction force to match the pressure that the circuit board receives, makes the pressure that the circuit board receives change gradually, and the range of variation is great, can prolong the pressfitting process, improves the effect of pressfitting.
Description
Technical Field
The utility model relates to a multilayer circuit board processing technology field specifically is a multistage buffering clamp plate mechanism of multilayer circuit board.
Background
PCB printed boards are also called printed circuit boards, printed circuit boards. The multilayer printed board is composed of more than two layers of connecting wires on insulating substrates and bonding pads for assembling and welding electronic elements, and has the functions of conducting the circuits of all layers and insulating the circuits.
The PCB multi-layer board refers to a multi-layer circuit board used in electric products, and the multi-layer board uses more single-sided or double-sided wiring boards. A printed circuit board with two inner layers and two outer layers or two inner layers and two outer layers is made up through alternative arrangement of positioning system and insulating adhesive material, and interconnection of conducting patterns according to design requirement.
At present, the circuit board manufacturing industry adopts one-step pressing to a multilayer circuit board, a hydraulic cylinder directly drives a pressing plate to press the circuit board, the circuit board directly receives direct pressure of the hydraulic cylinder, the process is close to the process of instantaneous stamping, the stress is lack of the process of gradual change, the deformation process of a circuit board material is short, and the pressing effect is poor.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a make the pressure that the circuit board receives change gradually, prolong the pressfitting process, improve the multistage buffering clamp plate mechanism of multilayer circuit board of pressfitting effect to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
a multi-level buffer pressing plate mechanism of a multi-layer circuit board comprises a power mechanism, a pressing plate, a pressing seat, a first-level buffer mechanism, an adjusting buffer mechanism, a support and a second-level buffer mechanism, wherein the power mechanism comprises a hydraulic cylinder, the bottom of a piston rod of the hydraulic cylinder is fixedly connected with the top of the pressing plate, the pressing plate is fixedly arranged on an upper sliding seat, an upper sliding seat is connected with the pressing seat through an upper guide rod, the lower end of the upper guide rod is fixedly connected with the pressing seat, and the upper sliding seat is provided with a through hole;
the top of the pressure seat is provided with a pressing die matched with the pressing plate, a support is arranged below the pressure seat, a primary buffer mechanism and an adjusting buffer mechanism are arranged between the pressure seat and the support, the primary buffer mechanism comprises a sliding sleeve, a sliding rod, a limiting seat and a primary spring, the sliding sleeve is fixedly arranged at the bottom of the pressure seat, the sliding sleeve is sleeved on the sliding rod, the lower end of the sliding rod is fixedly connected with the limiting seat, the limiting seat is fixedly connected with the support, and the primary spring is sleeved on the sliding rod;
the adjusting and buffering mechanism comprises an adjusting spring, a spring seat, an adjusting screw rod and adjusting nuts, the top of the adjusting spring is connected with the bottom surface of the pressing seat, the lower end of the adjusting spring is fixedly connected with the spring seat, the lower end of the spring seat is fixedly connected with the adjusting screw rod, the adjusting screw rod penetrates through the support, a through hole in clearance fit with the adjusting screw rod is formed in the support, two adjusting nuts are arranged on the adjusting screw rod, and the two adjusting nuts are respectively located on the upper side and the lower side of. The position of the two adjusting nuts at the adjusting screw rod can be adjusted by rotating the adjusting nuts, so that the height of the adjusting screw rod above the support is adjusted, the distance between the spring seat and the pressure seat is adjusted, the adjusting spring gives the elastic force for adjusting the pressure seat when the pressure seat moves downwards, the pre-compression amount of the adjusting spring is increased when the adjusting spring moves upwards, the elastic force of the pressure seat is increased, the pre-compression amount of the adjusting spring is decreased when the adjusting spring moves downwards, and the elastic force of the pressure seat is decreased.
The second-level buffer mechanism comprises a rubber column and a limiting column, the rubber column is arranged between the support and the platform, the upper end and the lower end of the rubber column are fixedly connected with the support and the platform respectively, the limiting column is arranged between the support and the platform, and the lower end of the limiting column is fixedly connected with the platform. The rubber column buffers the support, the limiting column limits the downward moving stroke of the support, and the rubber column with smaller elastic deformation is used as a secondary buffer mechanism at the bottom, so that larger elastic force can be provided by a smaller stroke while buffering is achieved.
As a further aspect of the present invention: a gap is arranged between the upper end of the limiting column and the support.
As a further aspect of the present invention: and a lower guide rod is arranged between the support and the platform, penetrates through the support, and is provided with a through hole in clearance fit with the lower guide rod.
As a further aspect of the present invention: the pressing die is provided with a cavity matched with the pressing plate, a plurality of positioning columns are arranged in the cavity, the bottoms of the positioning columns are inserted into insertion holes in the top of the pressing die, the insertion holes are blind holes, and positioning springs are arranged in the insertion holes below the positioning columns. The positioning spring jacks up the positioning column to extend out of the blind hole, and when the positioning device is used, the opening on the single-layer circuit board is aligned with the positioning column to be sleeved on the positioning column, so that the multi-layer circuit boards are sequentially sleeved on the positioning column, and the positioning benchmark among the multi-layer circuit boards is ensured. When the pressing plate is pressed downwards, the positioning column is pressed to overcome the elasticity of the spring to move downwards, and the pressing is prevented from being influenced.
As a further aspect of the present invention: and sliding blocks are arranged on two sides of the positioning column, and sliding grooves matched with the sliding blocks are formed in the inner walls of the insertion holes.
As a further aspect of the present invention: and a stop block is arranged at the upper end of the sliding groove. The jack is deviate from to dog restriction reference column, and the slider cooperation spout provides the direction to the removal of reference column.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model designs a multiple buffer mechanism, which utilizes the reaction force of the buffer mechanism to be equivalent to the pressure borne by the circuit board, so that the pressure borne by the circuit board is gradually changed, the change range is large, the pressing process can be prolonged, and the pressing effect is improved;
two, the utility model relates to an adjust buffer gear can adjust this buffer gear's elasticity through swivel nut, the speed of the pressure change that the adjustment circuit board receives.
Drawings
Fig. 1 is a schematic structural diagram of the present invention in the first embodiment.
Fig. 2 is a schematic structural view of the sliding sleeve and the sliding rod according to the first embodiment of the present invention.
Fig. 3 is a schematic structural diagram of the present invention in the second embodiment.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention; in the description of the present invention, "a plurality" or "a plurality" means two or more unless otherwise specified.
Example one
Referring to fig. 1-2, a multi-stage buffer pressing plate mechanism for a multi-layer circuit board comprises a power mechanism, a pressing plate 2, a pressing seat 5, a first-stage buffer mechanism, an adjusting buffer mechanism, a support 7 and a second-stage buffer mechanism, wherein the power mechanism comprises a hydraulic cylinder 1, the bottom of a piston rod of the hydraulic cylinder 1 is fixedly connected with the top of the pressing plate 2, the pressing plate 2 is fixedly installed on an upper sliding seat 3, the upper sliding seat 3 is connected with the pressing seat 5 through an upper guide rod 4, the lower end of the upper guide rod 4 is fixedly connected with the pressing seat 5, and the upper sliding seat 3 is provided with a through hole;
a pressing die 6 matched with the pressing plate 2 is arranged at the top of the pressing seat 5, a support 7 is arranged below the pressing seat 5, a primary buffer mechanism and an adjusting buffer mechanism are arranged between the pressing seat 5 and the support 7, the primary buffer mechanism comprises a sliding sleeve 8, a sliding rod 9, a limiting seat 10 and a primary spring 11, the sliding sleeve 8 is fixedly arranged at the bottom of the pressing seat 5, the sliding sleeve 8 is sleeved on the sliding rod 9, the lower end of the sliding rod 9 is fixedly connected with the limiting seat 10, the limiting seat 10 is fixedly connected with the support 7, and the primary spring 11 is sleeved on the sliding rod 9;
the adjusting and buffering mechanism comprises an adjusting spring 12, a spring seat 13, an adjusting screw rod 14 and an adjusting nut 15, the top of the adjusting spring 12 is connected with the bottom surface of the pressure seat 5, the lower end of the adjusting spring 12 is fixedly connected with the spring seat 13, the lower end of the spring seat 13 is fixedly connected with the adjusting screw rod 14, the adjusting screw rod 14 penetrates through the support 7, a through hole which is in clearance fit with the adjusting screw rod 14 is formed in the support 7, two adjusting nuts 15 are arranged on the adjusting screw rod 14, and the two adjusting nuts 15 are respectively located on the upper side and the lower. The positions of the two adjusting nuts 15 on the adjusting screw rods 14 can be adjusted by rotating the adjusting nuts 15, so that the height of the adjusting screw rods 14 above the support 7 is adjusted, the distance between the spring seat 13 and the pressure seat 5 is adjusted, the elastic force of the pressure seat 5 is adjusted and given by the adjusting spring 12 when the pressure seat 5 moves downwards, the pre-compression amount of the adjusting spring 12 is increased when the pressure seat moves upwards, the elastic force of the pressure seat 5 is given, the pre-compression amount of the adjusting spring 12 is decreased when the pressure seat moves downwards, and the elastic force of the pressure seat 5 is given.
Second grade buffer gear includes rubber column 16 and spacing post 17, and rubber column 16 locates between support 7 and the platform 19, and fixed connection support 7 and platform 19 are respectively distinguished at the upper and lower both ends of rubber column 16, are equipped with spacing post 17 between support 7 and the platform 19, and the lower extreme fixed connection platform 19 of spacing post 17 is equipped with the clearance between the upper end of spacing post 17 and the support 7. The rubber column 16 buffers the support 7, the limiting column 17 limits the downward moving stroke of the support 7, and the rubber column 16 with small elastic deformation is used as a secondary buffer mechanism at the bottom, so that larger elastic force can be provided by a small stroke while buffering is achieved.
Further, the top of the hydraulic cylinder 1 is fixedly arranged on the frame through a cylinder seat. The hydraulic cylinder 1 is connected to a hydraulic station through a pipeline and a valve. The structure and principle of the hydraulic cylinder 1 are prior art and will not be described in detail herein.
Further, the pressing plate 2 is fitted with a press die 6.
Further, a lower guide rod 18 is arranged between the support 7 and the platform 19, the lower guide rod 18 penetrates through the support 7, and a through hole in clearance fit with the lower guide rod 18 is formed in the support 7.
The utility model discloses a structural feature and theory of operation: the multilayer circuit board is placed in a pressing die 6, then a hydraulic cylinder 1 is started to press a pressing plate 2 downwards, the pressing plate 2 is pressed downwards, because a certain stroke is arranged below a pressing seat 5, the pressing seat 5 gradually overcomes the elastic force of a first-level buffer spring and an adjusting spring 12 to move downwards, the pressure of the circuit board is the elastic force of the spring, along with the increase of the elastic force of the spring, the pressure borne by the circuit board is gradually increased until a sliding sleeve 8 contacts a limiting seat 10, the stroke between the pressing seat 5 and a support 7 reaches the limit, the support 7 is pressed to move downwards, the rubber column 16 gives a counterforce to the support 7 and the pressing seat 5, the pressure borne by the circuit board is the elastic force of the spring plus the elastic force of the rubber column 16, the acting force is also gradually increased, then the support 7 contacts a limiting column 17, the pressing seat 5 moves to the limit, and the pressure borne by the circuit, therefore, the circuit board is subjected to a gradually changing pressure instead of the pressure of the hydraulic cylinder 1 at the beginning, so that the pressure has a changing process, and the pressing effect of the circuit board is improved;
furthermore, because the pressing plate 2 has a certain stroke, the hydraulic cylinder 1 can be controlled to move in place for a plurality of times, but stop in the middle stroke for prepressing, then move in place after reheating to complete pressing, and two times of pressing with different pressures are formed before and after heating, so that the pressing effect is improved.
Example two
Referring to fig. 3, the multi-stage buffer pressing plate mechanism for the multi-layer circuit board comprises a power mechanism, a pressing plate 2, a pressing seat 5, a first-stage buffer mechanism, an adjusting buffer mechanism, a support 7 and a second-stage buffer mechanism, wherein the power mechanism comprises a hydraulic cylinder 1, the bottom of a piston rod of the hydraulic cylinder 1 is fixedly connected with the top of the pressing plate 2, the pressing plate 2 is fixedly installed on an upper sliding seat 3, the upper sliding seat 3 is connected with the pressing seat 5 through an upper guide rod 4, the lower end of the upper guide rod 4 is fixedly connected with the pressing seat 5, and a through hole in clearance fit with the upper guide rod;
the top of pressing seat 5 is equipped with and presses 2 complex moulding-dies 6 with the clamp plate, the below of pressing seat 5 is equipped with support 7, be equipped with one-level buffer gear and adjust buffer gear between pressing seat 5 and the support 7, one-level buffer gear includes sliding sleeve 8, slide bar 9, spacing seat 10 and one- level spring 11, 8 fixed mounting of sliding sleeve are in the bottom of pressing seat 5, 8 covers of sliding sleeve are on slide bar 9, the spacing seat 10 of lower extreme fixed connection of slide bar 9, spacing seat 10 fixed connection support 7, one-level spring 11 covers on slide bar 9.
Be equipped with on the moulding-die 6 with clamp plate 2 complex cavity, be equipped with a plurality of reference column 21 in this cavity, during the jack at moulding-die 6 top was inserted to the bottom of reference column 21, this jack was the blind hole, was equipped with positioning spring 22 in the jack of reference column 21 below. The positioning spring 22 jacks up the positioning column 21 to extend out of the blind hole, and when the positioning device is used, the opening on the single-layer circuit board is aligned with the positioning column 21 and sleeved on the positioning column, so that the multi-layer circuit boards are sleeved on the positioning column in sequence, and the positioning benchmark among the multi-layer circuit boards is ensured. When the pressing plate 2 is pressed down, the positioning column 21 is pressed to overcome the elastic force of the spring to move downwards, and the pressing is prevented from being influenced.
Further, the both sides of reference column 21 are equipped with the slider, are equipped with on the inner wall of jack with slider complex spout, the upper end of spout is equipped with the dog. The stopper limits the positioning column 21 to be separated from the jack, and the sliding block is matched with the sliding groove to provide guidance for the movement of the positioning column 21.
Although the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present patent within the knowledge of those skilled in the art.
Claims (6)
1. The multi-stage buffer pressing plate mechanism of the multilayer circuit board is characterized by comprising a power mechanism, a pressing plate, a pressing seat, a first-stage buffer mechanism, an adjusting buffer mechanism, a support and a second-stage buffer mechanism, wherein the power mechanism comprises a hydraulic cylinder;
the top of the pressure seat is provided with a pressing die matched with the pressing plate, a support is arranged below the pressure seat, a primary buffer mechanism and an adjusting buffer mechanism are arranged between the pressure seat and the support, the primary buffer mechanism comprises a sliding sleeve, a sliding rod, a limiting seat and a primary spring, the sliding sleeve is fixedly arranged at the bottom of the pressure seat, the sliding sleeve is sleeved on the sliding rod, the lower end of the sliding rod is fixedly connected with the limiting seat, the limiting seat is fixedly connected with the support, and the primary spring is sleeved on the sliding rod;
the adjusting and buffering mechanism comprises an adjusting spring, a spring seat, an adjusting screw rod and adjusting nuts, the top of the adjusting spring is connected with the bottom surface of the pressing seat, the lower end of the adjusting spring is fixedly connected with the spring seat, the lower end of the spring seat is fixedly connected with the adjusting screw rod, the adjusting screw rod penetrates through the support, a through hole in clearance fit with the adjusting screw rod is formed in the support, two adjusting nuts are arranged on the adjusting screw rod, and the two adjusting nuts are respectively positioned on the upper side and the lower side of;
the second-level buffer mechanism comprises a rubber column and a limiting column, the rubber column is arranged between the support and the platform, the upper end and the lower end of the rubber column are fixedly connected with the support and the platform respectively, the limiting column is arranged between the support and the platform, and the lower end of the limiting column is fixedly connected with the platform.
2. The multi-stage buffer pressing plate mechanism of the multi-layer circuit board as claimed in claim 1, wherein a gap is provided between the upper end of the limiting column and the support.
3. The multi-stage buffer pressing plate mechanism of multi-layer circuit board as claimed in claim 1, wherein a lower guide rod is disposed between the support and the platform, the lower guide rod penetrates the support, and the support is provided with a through hole in clearance fit with the lower guide rod.
4. The multi-stage buffer pressing plate mechanism of claim 1, wherein the pressing mold has a cavity for engaging with the pressing plate, the cavity has a plurality of positioning posts, the bottom of the positioning posts are inserted into the insertion holes at the top of the pressing mold, the insertion holes are blind holes, and the insertion holes under the positioning posts are provided with positioning springs.
5. The multi-stage buffer pressing plate mechanism of multi-layer circuit board as claimed in claim 4, wherein sliding blocks are disposed on two sides of the positioning posts, and sliding grooves are disposed on inner walls of the insertion holes for engaging with the sliding blocks.
6. The multi-stage buffer pressing plate mechanism of multi-layer circuit board as claimed in claim 5, wherein the upper end of the sliding slot is provided with a stop.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920905300.2U CN210183667U (en) | 2019-06-15 | 2019-06-15 | Multi-stage buffer pressing plate mechanism for multilayer circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920905300.2U CN210183667U (en) | 2019-06-15 | 2019-06-15 | Multi-stage buffer pressing plate mechanism for multilayer circuit board |
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| CN210183667U true CN210183667U (en) | 2020-03-24 |
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| CN201920905300.2U Active CN210183667U (en) | 2019-06-15 | 2019-06-15 | Multi-stage buffer pressing plate mechanism for multilayer circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111295061A (en) * | 2020-03-25 | 2020-06-16 | 深圳捷飞高电路有限公司 | Thick copper circuit board laminating process and laminating device |
| CN112026245A (en) * | 2020-08-28 | 2020-12-04 | 徐应鹏 | Quick compression fittings of multilayer circuit board |
-
2019
- 2019-06-15 CN CN201920905300.2U patent/CN210183667U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111295061A (en) * | 2020-03-25 | 2020-06-16 | 深圳捷飞高电路有限公司 | Thick copper circuit board laminating process and laminating device |
| CN112026245A (en) * | 2020-08-28 | 2020-12-04 | 徐应鹏 | Quick compression fittings of multilayer circuit board |
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Address after: 341007 Shuixi nonferrous metallurgy base, Zhanggong District, Ganzhou City, Jiangxi Province Patentee after: Ganzhou Jinshun Technology Co.,Ltd. Address before: 341007 Shuixi nonferrous metallurgy base, Zhanggong District, Ganzhou City, Jiangxi Province Patentee before: GANZHOU JINSHUN TECHNOLOGY Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |