CN210183583U - Heating control circuit and induction cooker - Google Patents

Heating control circuit and induction cooker Download PDF

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Publication number
CN210183583U
CN210183583U CN201920994273.0U CN201920994273U CN210183583U CN 210183583 U CN210183583 U CN 210183583U CN 201920994273 U CN201920994273 U CN 201920994273U CN 210183583 U CN210183583 U CN 210183583U
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circuit
heating
power supply
processing module
respectively connected
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CN201920994273.0U
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Chinese (zh)
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Yu Zhou
周宇
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Zhejiang Shaoxing Supor Domestic Electrical Appliance Co Ltd
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Zhejiang Shaoxing Supor Domestic Electrical Appliance Co Ltd
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Abstract

The embodiment of the utility model provides a heating control circuit and electromagnetism stove, this heating control circuit includes: the device comprises a power supply processing module, an operation panel, at least two heating loops and at least two microcontrollers; the power supply processing module is respectively connected with the at least two heating loops and is used for providing a first power supply for each heating loop; the power supply processing module is also respectively connected with at least two microcontrollers and is also used for providing a second power supply for each microcontroller; each microcontroller is also connected with the corresponding heating loop, and the microcontrollers correspond to the heating loops one by one; the operation board is respectively connected with at least two microcontrollers. The embodiment realizes the structure of a part shared by a plurality of heating areas of the induction cooker, and reduces the structural complexity and the cost of the induction cooker.

Description

Heating control circuit and induction cooker
Technical Field
The embodiment of the utility model provides a relate to household electrical appliances technical field, especially relate to a heating control circuit and electromagnetism stove.
Background
The induction cooker is a common household appliance for heating, and when the induction cooker works, high-frequency alternating current is utilized to pass through the coil panel so as to enable the bottom of a pot placed on the induction cooker to generate eddy current, so that the pot arranged on the induction cooker is heated.
In the prior art, an induction cooker may include a plurality of heating regions, and each heating region is separately provided with a main control board, a coil panel, and an operation board. The main control board is provided with a filter circuit, a rectifying circuit, an IGBT driving circuit, a resonance heating circuit and a microcontroller, and the main control board can control heating of the heating area. The user can select the heating area to cook by operating the operation panel corresponding to each heating area, the operation panel sends an instruction to the main control panel corresponding to the heating area, and the main control panel controls the heating area corresponding to the instruction to heat.
However, each heating zone is separately arranged, which results in a complex structure and higher cost of the induction cooker.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a heating control circuit and electromagnetism stove to reduce the structure complexity and the cost of electromagnetism stove.
In a first aspect, the present invention provides a heating control circuit, including: the device comprises a power supply processing module, an operation panel, at least two heating loops and at least two microcontrollers; wherein
The power supply processing module is respectively connected with the at least two heating loops and is used for providing a first power supply for each heating loop;
the power supply processing module is also respectively connected with the at least two microcontrollers and is also used for providing a second power supply for each microcontroller;
each microcontroller is also connected with the corresponding heating loop respectively, and the microcontrollers correspond to the heating loops one to one;
the operation board is respectively connected with the at least two microcontrollers.
The utility model provides a heating control circuit, which comprises a power supply processing module, an operation panel, at least two heating loops and at least two microcontrollers; the power supply processing module is respectively connected with the at least two heating loops and used for providing a first power supply for each heating loop; the power supply processing module is also respectively connected with at least two microcontrollers and used for providing a second power supply for each microcontroller; each microcontroller is also respectively connected with the corresponding heating loop, and the operation panel is respectively connected with at least two microcontrollers, namely the heating loops corresponding to the multiple heating areas share the power supply processing module and the operation panel, so that the circuit complexity is reduced, and the cost is saved.
In one possible design, the power supply processing module includes an EMC filter circuit, a first rectifier circuit, and a second rectifier circuit; wherein
The EMC filter circuit is respectively connected with the first rectifying circuit and the second rectifying circuit;
the first rectifying circuit is respectively connected with the at least two heating loops;
the second rectifying circuit is respectively connected with the at least two microcontrollers.
The heating circuit is powered by rectification through the first rectification circuit, and the second rectification circuit is powered by rectification for the microcontroller, so that independent work of the heating circuit and the microcontroller is realized, the rectification circuit can be designed in a targeted manner, and the rectification effect is guaranteed.
In one possible design, the power supply processing module further includes: a DC voltage stabilizing circuit; wherein
The second rectifying circuit is connected with the direct current voltage stabilizing circuit;
the direct current voltage stabilizing circuit is further connected with the at least two microcontrollers.
The direct current voltage stabilizing circuit can perform voltage stabilizing treatment, so that 18V voltage is provided for fan control, 5V working voltage is provided for the microcontroller, and different voltages are provided for different devices.
In one possible design, the power supply processing module further includes: a fuse F1 and a varistor RZ1, wherein
The piezoresistor RZ1 is respectively connected with the fuse F1 and the EMC filter circuit;
the fuse F1 is used for connecting with the mains supply.
This fuse F1 can play overload protection effect, and when the current rose to certain height and heat unusually, self fusing cut off current, protected the circuit safe operation. The piezoresistor RZ1 can absorb the surge interference of the power grid to perform surge protection.
In one possible design, the heating circuit includes: a resonant heating circuit and a drive circuit; wherein
The driving circuit is respectively connected with the resonance heating circuit and the microcontroller corresponding to the heating loop;
the resonance heating circuit is also connected with the power supply processing module.
The resonant heating circuit is driven by the driving circuit to work, so that the resonant heating circuit generates a periodically-changed magnetic field, and the cookware is heated.
In one possible design, the heating circuit further includes: the current sampling circuit, the power processing module still includes: a voltage sampling circuit, wherein
The current sampling circuit is respectively connected with the first rectifying circuit and the microcontroller corresponding to the heating loop;
the voltage sampling circuit is connected with the second rectifying circuit and is also respectively connected with the at least two microcontrollers.
The heating power of the heating loops can be obtained by setting the independent current sampling circuits for the common voltage sampling circuit and each heating loop, so that the work of the heating loops can be independently controlled according to the heating power, and the independent work of each heating area is realized.
In one possible design, the heating circuit further includes a synchronization circuit, the resonant heating circuit including: coil panel, resonance capacitor and IGBT, wherein
The IGBT is respectively connected with the driving circuit, the resonance capacitor and the coil panel;
the resonance capacitor and the coil panel are also respectively connected with the power supply processing module;
the synchronous circuit is respectively connected with the resonance capacitor and the microcontroller.
In a possible design, the operation panel is provided with a selection key and a function key, the selection key is used for selecting a heating area corresponding to the heating circuit, and the function key is used for inputting a control parameter corresponding to the selected heating circuit.
The selection key and the function key are arranged on the operation panel, the selection key is used for selecting the heating area corresponding to the heating loop, and the function key is used for inputting the control parameter corresponding to the selected heating loop, so that one operation panel can control a plurality of heating areas, and the complexity and the cost of the induction cooker are reduced.
In one possible design, the selection key is a touch key, and the selection key includes a plurality of touch buttons, each corresponding to one of the heating circuits. The selection key is a touch key, so that the space is saved, and the operation of a user is facilitated.
In a second aspect, the present invention provides an induction cooking hob including a heating control circuit as described above in the first aspect or in various possible designs of the first aspect.
The utility model provides an electromagnetic oven, which comprises a power supply processing module, an operation panel, at least two heating loops and at least two microcontrollers; the power supply processing module is respectively connected with the at least two heating loops and used for providing a first power supply for each heating loop; the power supply processing module is also respectively connected with at least two microcontrollers and used for providing a second power supply for each microcontroller; each microcontroller is also respectively connected with the corresponding heating loop, and the operation board is respectively connected with at least two microcontrollers, namely the heating loops corresponding to the multiple heating areas share the power supply processing module and the operation board, so that the complexity of the induction cooker is reduced, and the cost of the induction cooker is saved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive labor.
Fig. 1 is a schematic structural diagram of a heating control circuit according to the present invention;
fig. 2 is a schematic structural diagram of a heating control circuit according to the present invention;
fig. 3 is a schematic structural diagram of a heating control circuit according to the present invention;
fig. 4 is a schematic structural diagram of the operation panel provided by the present invention.
Description of reference numerals:
10-a power supply processing module; 11-EMC filter circuit;
12-a first rectifying circuit; 13-a second rectifying circuit;
14-a direct current voltage stabilizing circuit; 15-a voltage sampling circuit;
16-a voltage surge sampling circuit; 20-an operation panel;
21-a selection key; 22-function key;
30-a heating circuit; 31-a resonant heating circuit;
32-a drive circuit; 33-a current sampling circuit;
34-a synchronization circuit; 35-a current surge sampling circuit;
40-a microcontroller.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
An electromagnetic heating household appliance mainly applies the high-frequency electromagnetic induction principle to heat. When the household appliance works, the high-frequency alternating current is utilized to pass through the coil panel so as to enable the bottom of a pot placed on the household appliance to generate eddy current, and therefore the pot arranged on the household appliance is heated.
In order to meet various requirements of users, household appliances with a plurality of cooking ranges, namely heating areas, namely the same household appliance, are available on the market at present, and can perform electromagnetic heating on a plurality of cookers. The household appliance may be, for example, an induction cooker, an electromagnetic heating pan, or the like, and this embodiment is not described herein again. In this embodiment, the household appliance is taken as an example for description, and for other types of household appliances, the description of this embodiment is omitted here.
In the present embodiment, in order to reduce the complexity of the induction cooker and save the cost, the present embodiment adopts a structure of a part shared by a plurality of heating zones, so as to reduce the complexity and the cost. Therefore, the utility model provides a heating control circuit, this heating control circuit can set up in foretell household electrical appliances.
Fig. 1 is a schematic structural diagram of a heating control circuit according to the present invention; as shown in fig. 1, the heating control circuit includes: a power processing module 10, a dashboard 20, at least two heating circuits 30, and at least two Microcontrollers (MCU) 40.
In the present embodiment, the power supply processing module 10 and the operation panel 20 are shared by a plurality of heating zones. A heating circuit 30 is provided in each heating zone, which heating circuit 30 is used for electromagnetic heating.
Specifically, the power processing module 10 is respectively connected to at least two heating circuits 30, and the power processing module 10 is configured to provide a first power to each heating circuit 30. The power processing module 10 is further connected to at least two microcontrollers 40, respectively, and the power processing module 10 is further configured to provide a second power supply to each microcontroller 40. The operation panel 20 is respectively connected with at least two microcontrollers 40, each microcontroller 40 is also respectively connected with a corresponding heating loop 30, and the microcontrollers 40 are in one-to-one correspondence with the heating loops 30.
The power processing module 10 may be connected to a mains supply, and may perform an electromagnetic compatibility (EMC) filtering process on the mains supply, and then may respectively provide a first power, i.e., a dc high-voltage pulse power, to the heating circuit 30 after the EMC filtering process, and may also provide a second power, i.e., a dc regulated power, to the microcontroller 40.
The plurality of heating loops 30 and the microcontroller 40 are all powered by the same power processing module 10, and each heating loop 30 and the corresponding microcontroller 40 are not required to adopt a separate power processing module, so that the induction cooker is simple in structure and low in cost.
When the operation panel 20 is shared by a plurality of heating zones, the operation panel 20 can be used by the plurality of heating zones in a time-sharing manner. The operation panel 20 may be provided with a knob, a touch key, and the like to indicate a heating area corresponding to the current operation panel 20, for example, the current heating area may be determined by the heating area aligned with the knob, or the current heating area may be determined by operating an identifier of the heating area on the touch key, and after the current heating area is determined, the operations on the operation panel 20 are all directed to the current heating area.
After the operation panel 20 determines the current heating area, the acquired operation instruction is sent to the microcontroller 40 corresponding to the current heating area, and the microcontroller 40 controls the heating process of the heating circuit 30. By sharing the operation board, the space occupied by the operation board is saved, the complexity of the induction cooker is reduced, and the cost is saved.
The utility model provides a heating control circuit, which comprises a power supply processing module, an operation panel, at least two heating loops and at least two microcontrollers; the power supply processing module is respectively connected with the at least two heating loops and used for providing a first power supply for each heating loop; the power supply processing module is also respectively connected with at least two microcontrollers and used for providing a second power supply for each microcontroller; each microcontroller is also respectively connected with the corresponding heating loop, and the operation panel is respectively connected with at least two microcontrollers, namely the heating loops corresponding to the multiple heating areas share the power supply processing module and the operation panel, so that the circuit complexity is reduced, and the cost is saved.
Fig. 2 is a schematic structural diagram of a heating control circuit according to the present invention, and as shown in fig. 2, the power processing module 10 includes an EMC filter circuit 11, a first rectifier circuit 12 and a second rectifier circuit 13; the EMC filter circuit 11 is connected with the first rectifying circuit 12 and the second rectifying circuit 13 respectively; the first rectifying circuit 12 is respectively connected with at least two heating loops 30; the second rectifier circuits 13 are connected to at least two microcontrollers 40, respectively.
This EMC filter circuit 11 can connect mains supply, and the alternating current of commercial power input disturbs the filtration through this EMC filter circuit 11 to avoid electromagnetism stove during operation and electric wire netting mutual interference. After the filtering of the ac interference is completed, the EMC filter circuit 11 rectifies the ac interference by the first rectifier circuit 12, converts the ac interference into dc interference, and provides a dc high-voltage pulse power supply for the heating circuit 30. After the filtering of the alternating current interference by the EMC filter circuit 11 is completed, the alternating current interference can be rectified by the second rectifier circuit 13 to convert the alternating current into direct current, so as to provide a direct current stabilized voltage power supply for the microcontroller 40.
In this embodiment, the first rectifying circuit 12 and the second rectifying circuit 13 respectively perform rectifying power supply for the heating circuit 30 and the microcontroller 40, so that the heating circuit 30 and the microcontroller 40 can work independently, the rectifying circuits can be designed in a targeted manner, and the rectifying effect is also ensured.
As shown in fig. 2, the power supply processing module 10 further includes: a dc voltage regulator circuit 14 and a voltage sampling circuit 15; the second rectifying circuit 13 is respectively connected with the direct current voltage stabilizing circuit 14 and the voltage sampling circuit 15; the direct current voltage stabilizing circuit 14 is respectively connected with at least two microcontrollers 40; the voltage sampling circuits 15 are connected to at least two microcontrollers 40, respectively.
The direct current rectified by the second rectifying circuit 13 can be further subjected to voltage stabilization processing by the direct current voltage stabilizing circuit 14, so that 18V voltage is provided for fan control, and 5V working voltage is provided for the microcontroller 40.
For each heating circuit 30, as shown in fig. 2, the heating circuit 30 comprises: a resonance heating circuit 31 and a drive circuit 32; the driving circuit 32 is respectively connected with the resonant heating circuit 31 and the microcontroller 40; the resonant heating circuit 31 is also connected to the power supply processing module 10. The heating circuit 30 further comprises a synchronization circuit 34, the synchronization circuit 34 being connected to the microcontroller 40 and the resonant heating circuit 31, respectively.
The microcontroller 40 can control the operation of the driving circuit 32, so that the driving circuit 32 drives the operation of the resonant heating circuit 31, so that the resonant heating circuit 31 generates a periodically changing magnetic field, thereby heating the pot. The synchronization circuit 34 may track the resonant waveform and issue a pulse width modulated signal to the resonant heating circuit 31 under control of the microcontroller 40, providing a reasonable turn-on starting point for the resonant heating circuit 31.
The heating circuit 30 further includes a current sampling circuit 33, wherein the current sampling circuit 33 is connected to the power supply processing module 10 and the microcontroller 40 corresponding to the heating circuit 30.
As shown in fig. 2, the voltage sampling circuit 15 is shared by a plurality of heating loops 30, each heating loop 30 having a separate current sampling circuit 33. Both the voltage sampling circuit 15 and the current sampling circuit 33 are connected to the microcontroller 40.
For the microcontroller 40 corresponding to each heating circuit 30, the microcontroller 40 may obtain the heating power of the heating circuit 30 according to the voltage sampled by the common voltage sampling circuit 15 and the current sampled by the current sampling circuit 33, and control the operation of the heating circuit 30 according to the difference between the heating power and the power set by the user, for example, control the resonant frequency of the resonant heating circuit 31 by controlling the driving circuit 32.
In this embodiment, the heating power of the heating loops can be obtained by sharing the voltage sampling circuit and setting an individual current sampling circuit for each heating loop, so that the operation of the heating loops can be individually controlled according to the heating power, and the independent operation of each heating area is realized.
Fig. 3 is a schematic structural diagram of a heating control circuit, as shown in fig. 3, the power processing module 10 further includes: the fuse F1 and the piezoresistor RZ1, wherein the piezoresistor RZ1 is respectively connected with the fuse F1 and the EMC filter circuit 11; the fuse F1 is used for connection to the mains supply.
As shown in fig. 3, the fuse F1 is disposed on the live line (L) and upstream of the varistor RZ1, and both ends of the varistor RZ1 are connected to the live line (L) and the neutral line (N), respectively. The fuse F1 can play a role in overload protection, and when the current rises to a certain height and heat abnormally, the fuse F1 can cut off the current by itself, so that the safe operation of the circuit is protected. The piezoresistor RZ1 can absorb the surge interference of the power grid to perform surge protection. The alternating current through the piezo-resistor RZ1 will be transmitted to the EMC filter circuit 11.
The EMC filter circuit 11 includes a capacitor C1, a differential mode inductor L1, a common mode inductor L2, and a capacitor C2, thereby performing an EMC function. The power processing module 10 may further include a resistor R1 and a resistor R2, the resistor R1 and the resistor R2 are energy release resistors, and when the induction cooker is powered off, the electric energy in the EMC filter circuit 11 may be released through the resistor R1 and the resistor R2, so as to avoid interference to the power grid.
The alternating current is transmitted to a rectifier bridge BG1 (first rectifier circuit) through the EMC filter circuit 11, so as to form a direct current high voltage pulse power supply for supplying power to the heating circuit 30 and the current sampling circuit 33. The alternating current passing through the EMC filter circuit 11 also passes through rectifier diodes D1 and D2 (second rectifier circuit) to supply power to the direct current voltage regulator circuit 14 and the voltage sampling circuit, respectively.
In this embodiment, the power processing module 10 may further include a voltage surge sampling circuit 16, and the heating circuit 30 may further include a current surge sampling circuit 35. The voltage surge sampling circuit 16 and the current surge sampling circuit 35 are connected to the microcontroller 40, respectively. The current sampling circuit 33 and the current surge sampling circuit 35 may sample through constantan wires.
Microcontroller 40 may control the operation of heating circuit 30 based on the results of sampling by voltage surge sampling circuit 16 and current surge sampling circuit 35, e.g., when the re-surge is too great, heating circuit 30 may cease operation.
In the present embodiment, as shown in fig. 3, the resonance heating circuit 31 includes: a coil panel, a resonant capacitor, and an Insulated Gate Bipolar Transistor (IGBT), wherein the IGBT is connected to the driving circuit 32, the resonant capacitor, and the coil panel, respectively; the resonance capacitor and the coil panel are also respectively connected with the power supply processing module 10; the synchronization circuit 34 is connected to the resonance capacitor and the microcontroller 40, respectively.
The dc high-voltage pulse power supply output by the rectifier bridge BG1 can supply power to the resonant heating circuit 31. Microcontroller 40 controls pulse width modulation signal output through synchronizing circuit 34, and then passes through drive circuit 32 control IGBT and switches on, and coil panel and resonance electric capacity produce resonance heating, convert direct current high voltage pulse electric energy into pan heat energy.
Fig. 4 is a schematic structural diagram of the operation panel provided by the present invention, as shown in fig. 4, the operation panel 20 is provided with a selection key 21 and a function key 22, the selection key 21 is used for selecting a heating region corresponding to the heating circuit 30, and the function key 22 is used for inputting a control parameter corresponding to the selected heating circuit 30.
In the present embodiment, a possible implementation manner of the selection key 21 is shown, the selection key 21 is a touch key, and the selection key 21 includes a plurality of touch buttons, and each touch button corresponds to one heating circuit 30.
The function key 22 may be, for example, a mode selection key, a temperature option key, a timing key, etc., and the embodiment does not particularly limit the specific implementation manner of the function key 22.
As shown in fig. 4, the selection key 21 includes 3 touch buttons, which are a heating area 1, a heating area 2, and a heating area 3. When the user touches the heating area 1, the subsequent operation is the operation for the heating area 1, and when the user selects to boil water in the function key 22, the operation panel 20 sends an instruction to the microcontroller corresponding to the heating area 1, so that the microcontroller controls the heating circuit corresponding to the heating area 1 to operate in the water boiling mode. When the user then touches the heating area 2 and the frying button, the operation panel 20 sends an instruction to the microcontroller corresponding to the heating area 2, so that the microcontroller controls the heating circuit corresponding to the heating area 2 to operate in the frying mode, and thus the two heating areas can operate simultaneously.
When the user touches the heating area 1 again, the operation panel 20 sends an instruction to the microcontroller corresponding to the heating area 1, so that the microcontroller controls the heating circuit corresponding to the heating area 1 to stop working. The heating zone 2 stops working in a similar manner, and the description of this embodiment is omitted here.
In the embodiment, the operation panel is provided with the selection key and the function key, the selection key is used for selecting the heating area corresponding to the heating loop, and the function key is used for inputting the control parameter corresponding to the selected heating loop, so that one operation panel can control a plurality of heating areas, and the complexity and the cost of the induction cooker are reduced.
The utility model also provides an electromagnetism stove, this electromagnetism stove include as above figure 1 to figure 4 arbitrary heating control circuit, can refer to above-mentioned embodiment, this embodiment here is no longer repeated.
The utility model provides an electromagnetic oven can realize heating circuit sharing power supply processing module and operation panel that a plurality of heating regions correspond to reduced electromagnetic oven's complexity, saved electromagnetic oven's cost.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the embodiments of the present invention, and not to limit the same; although embodiments of the present invention have been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the embodiments of the present invention.

Claims (10)

1. A heating control circuit, comprising: a power supply processing module (10), an operation panel (20), at least two heating circuits (30) and at least two microcontrollers (40); wherein
The power supply processing module (10) is respectively connected with the at least two heating loops (30), and the power supply processing module (10) is used for providing a first power supply for each heating loop (30);
the power supply processing module (10) is further connected with the at least two microcontrollers (40), and the power supply processing module (10) is further used for providing a second power supply for each microcontroller (40);
each microcontroller (40) is also connected with the corresponding heating loop (30), and the microcontrollers (40) correspond to the heating loops (30) one by one;
the operating panel (20) is connected to the at least two microcontrollers (40) in each case.
2. The circuit according to claim 1, characterized in that the power supply processing module (10) comprises an EMC filter circuit (11), a first rectifier circuit (12) and a second rectifier circuit (13); wherein
The EMC filter circuit (11) is respectively connected with the first rectifying circuit (12) and the second rectifying circuit (13);
the first rectifying circuit (12) is respectively connected with the at least two heating loops (30);
the second rectifying circuit (13) is respectively connected with the at least two microcontrollers (40).
3. The circuit according to claim 2, characterized in that the power supply processing module (10) further comprises: a DC voltage regulator circuit (14); wherein
The second rectifying circuit (13) and the direct current voltage stabilizing circuit (14);
the direct current voltage stabilizing circuit (14) is also respectively connected with the at least two microcontrollers (40).
4. The circuit according to claim 2, characterized in that the power supply processing module (10) further comprises: a fuse F1 and a varistor RZ1, wherein
The piezoresistor RZ1 is respectively connected with the fuse F1 and the EMC filter circuit (11);
the fuse F1 is used for connecting with the mains supply.
5. The circuit according to claim 2, characterized in that the heating circuit (30) comprises: a resonant heating circuit (31) and a drive circuit (32); wherein
The driving circuit (32) is respectively connected with the resonant heating circuit (31) and a microcontroller (40) corresponding to the heating circuit (30);
the resonance heating circuit (31) is also connected with the power supply processing module (10).
6. The circuit according to claim 5, wherein the heating circuit (30) further comprises: a current sampling circuit (33), the power processing module (10) further comprising: a voltage sampling circuit (15), wherein
The current sampling circuit (33) is respectively connected with the first rectifying circuit (12) and a microcontroller (40) corresponding to the heating loop (30);
the voltage sampling circuit (15) is connected with the second rectifying circuit (13), and the voltage sampling circuit (15) is also connected with the at least two microcontrollers (40) respectively.
7. The circuit according to claim 5, wherein the heating circuit (30) further comprises a synchronization circuit (34), the resonant heating circuit (30) comprising: coil panel, resonance capacitor and IGBT, wherein
The IGBT is respectively connected with the drive circuit (32), the resonance capacitor and the coil panel;
the resonance capacitor and the coil panel are also respectively connected with the power supply processing module (10);
the synchronization circuit (34) is connected to the resonance capacitor and the microcontroller (40), respectively.
8. The circuit according to any one of claims 1 to 7, wherein a selection key (21) and a function key (22) are arranged on the operation panel (20), the selection key (21) is used for selecting a heating region corresponding to the heating circuit (30), and the function key (22) is used for inputting a control parameter corresponding to the selected heating circuit (30).
9. The circuit according to claim 8, wherein the selection key (21) is a touch key, and the selection key (21) comprises a plurality of touch buttons, each touch button corresponding to one of the heating circuits (30).
10. An induction cooker comprising a heating control circuit according to any one of claims 1 to 9.
CN201920994273.0U 2019-06-28 2019-06-28 Heating control circuit and induction cooker Active CN210183583U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920994273.0U CN210183583U (en) 2019-06-28 2019-06-28 Heating control circuit and induction cooker

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920994273.0U CN210183583U (en) 2019-06-28 2019-06-28 Heating control circuit and induction cooker

Publications (1)

Publication Number Publication Date
CN210183583U true CN210183583U (en) 2020-03-24

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920994273.0U Active CN210183583U (en) 2019-06-28 2019-06-28 Heating control circuit and induction cooker

Country Status (1)

Country Link
CN (1) CN210183583U (en)

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