CN210182073U

CN210182073U - SSD (solid State disk) switching device radiating through water cooling

Info

Publication number: CN210182073U
Application number: CN201921439768.3U
Authority: CN
Inventors: Shilin Weng; 翁诗淋
Original assignee: Hainan East Coast Jiaoyang Electronic Commerce Co ltd
Current assignee: Hainan East Coast Jiaoyang Electronic Commerce Co ltd
Priority date: 2019-08-30
Filing date: 2019-08-30
Publication date: 2020-03-24
Anticipated expiration: 2029-08-30

Abstract

The utility model provides a through water-cooling's SSD switching device, including SSD switching device and water-cooling subassembly, SSD switching device includes a casing, the one side of casing is equipped with the recess, be equipped with the PCB board in the recess, the integration has the M.2 interface on the PCB board, USBC interface and transmission chip, the M.2 interface, the USBC interface is connected with the transmission chip respectively, the side of casing is equipped with the opening that communicates with the recess and is used for holding the USBC interface, the inside hollow water course that is equipped with of casing, and the casing surface is provided with water inlet and the delivery port that is linked together with the water course, water-cooling subassembly includes the water tank, it has water-cooling liquid and is equipped with miniature pump to hold in the water tank, miniature pump's delivery port is linked together through first water pipe and casing water inlet, the casing delivery port is linked together. The device avoids the heat accumulation of the SSD switching device in a water-cooling heat dissipation mode, reduces the overall temperature of the SSD during working, thereby ensuring the long-time stable operation of the SSD and facilitating the operation of a user on the SSD switching device.

Description

SSD (solid State disk) switching device radiating through water cooling

Technical Field

The utility model relates to a remove hard disk cartridge technical field, especially relate to a SSD switching device through water-cooling heat dissipation.

Background

The M.2 interface solid state hard drives are more simple and convenient to install compared with the traditional SATA interface solid state hard drives due to small size, a data connecting line and a power supply line are not needed, the solid state hard drives are popular with vast users, the solid state hard drives can generate a large amount of heat during long-time work in the prior art, when the M.2 interface solid state hard drives are used through the interface switching device, the generated heat can also cause the surface temperature of the interface switching device to rise, the SSD switching device on the market can only passively dissipate heat at present, the heat is easy to accumulate, too high temperature easily causes the transmission rate of the solid state hard drives to drop or even break down, the high temperature on the surface of the switching device is not convenient for the user to operate after long-time work.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a through water-cooling heat dissipation's SSD adapter device to solve among the prior art SSD adapter device can only dispel the heat passively, long-pending heat easily, lead to SSD performance degradation and the not convenient for user operation's problem.

The utility model provides a technical scheme is:

through radiating SSD switching device of water-cooling, including SSD switching device and water-cooling radiating component, SSD switching device includes a casing, the one side of casing is equipped with a recess, be equipped with the PCB board in the recess, it has M.2 interface, USBC interface and transmission chip to integrate on the PCB board, M.2 interface, USBC interface respectively with the transmission chip is connected, the side of casing be equipped with the opening of recess intercommunication is used for holding the USBC interface, the inside hollow water course that is equipped with of casing, and the casing surface be provided with water inlet and the delivery port that the water course is linked together, water-cooling radiating component includes a water tank, it has the water-cooling liquid and is equipped with miniature pump to hold in the water tank, miniature pump's delivery port is linked together through the water inlet of first water pipe with the casing, and the delivery port of casing is linked together through second water pipe and water tank.

Furthermore, a detachable baffle plate is arranged on the groove.

Further, the water tank includes a detachable top cap, be equipped with a plurality of opening on the top cap, the opening is used for passing first water pipe, second water pipe or miniature pump's power cord.

Furthermore, the first water pipe and the second water pipe are respectively and fixedly connected with the water inlet and the water outlet of the shell through nuts, and water leakage preventing rubber rings are arranged at the joints of the nuts and the water inlet and the water outlet.

Furthermore, the front and the back of the shell are both provided with grooves, and the grooves are both internally provided with PCB boards.

Further, the PCB is a PCB with NVMe protocol converted into USBC protocol or a PCB with SATA protocol converted into USBC protocol.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model provides a through water-cooling's SSD switching device, including SSD switching device and water-cooling subassembly two parts, SSD switching device can realize that the SSD of M.2 interface changes the USBC interface and carries out data transmission, and be equipped with hollow water course in the SSD switching device casing, the water inlet and the delivery port of water course lead to pipe to be connected with the water tank, the circulation flow between water course and the water tank of water-cooling liquid in the casing under the effect of miniature water pump, avoid SSD switching device long-pending hot through the radiating mode of initiative, reduce the SSD whole temperature at the during operation, thereby ensure the long-time even running of SSD, the user of also being convenient for operates SSD switching device.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only preferred embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive work.

Fig. 1 is a schematic view of an overall structure of an SSD adapter device with water-cooling heat dissipation according to an embodiment of the present invention.

Fig. 2 is a schematic front structure diagram of an SSD relay device according to an embodiment of the present invention.

In the figure, 11 is a housing, 12 is a groove, 13 is an opening, 14 is a water channel, 15 is a water inlet, 16 is a water outlet, 21 is a water tank, 22 is a micro water pump, 23 is a first water pipe, 24 is a second water pipe, 25 is a top cover, and 26 is a nut.

Detailed Description

It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiments of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a number" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

The principles and features of the present invention are described below in conjunction with the following drawings, the illustrated embodiments are provided to explain the present invention and not to limit the scope of the invention.

Referring to fig. 1, the present embodiment provides an SSD interface device with water-cooling, which includes an SSD interface device and a water-cooling component. The SSD switching device comprises a shell 11, wherein one surface of the shell 11 is provided with a groove 12, a PCB is arranged in the groove 12, an M.2 interface, a USBC interface and a transmission chip are integrated on the PCB, and the M.2 interface and the USBC interface are respectively connected with the transmission chip. The side of the housing is provided with an opening 13 communicating with the recess for receiving a USBC interface.

The M.2 interface is used for being connected into the solid state disk of the M.2 interface, and a plurality of fixing screw hole positions which are arranged in a straight line are arranged on the PCB and can be used for fixing the M.2 interface solid state disks with different sizes. The USBC interface is used for accessing the computer equipment to realize data interaction between the SSD switching device and the computer equipment. The transmission chip converts the transmission protocol of the m.2 interface solid state disk into the USBC protocol for data transmission, and the transmission chip realizes the conversion of the transmission protocol belongs to a well-known technical means for those skilled in the art, so the principle of the transmission chip is not described in detail herein.

In some embodiments, the PCB may be a PCB that converts NVMe protocol to USBC protocol, or a PCB that converts SATA protocol to USBC protocol. The transmission chip adopted by the PCB with the NVMe protocol converted into the USBC protocol can be a JMS583 main control chip; the transmission chip adopted by the PCB for converting the SATA protocol into the USBC protocol can be a VLI716 main control chip.

In addition, in some embodiments, the groove 12 is provided with a detachable baffle, and the baffle can play a role in dust prevention on one hand and can also play a role in auxiliary heat dissipation when the solid state disk works on the other hand.

As shown in fig. 2, the inside of the housing 11 is provided with a hollow cavity, i.e. a water channel 14, the water channel 14 surrounds the groove 12 for placing the PCB board inside the housing 11, the outer surface of the housing 11 is provided with a water inlet 15 and a water outlet 16 which are communicated with the water channel 14, and the water inlet 15 and the water outlet 16 are arranged at the side of the housing 11 in fig. 2, and it will be understood by those skilled in the art that in other embodiments, the water inlet 15 and the water outlet 16 may be arranged at other positions of the housing 11.

The water-cooling heat dissipation assembly comprises a water tank 21, wherein water-cooling liquid is contained in the water tank 21, a micro water pump 22 is arranged in the water tank 21, a water outlet of the micro water pump 22 is communicated with a water inlet 15 of the shell 11 through a first water pipe 23, and a water outlet 16 of the shell 11 is communicated with the water tank 21 through a second water pipe 24.

In some embodiments, the top cover 25 of the water tank 21 is detachably designed to facilitate users to replace the water-cooling fluid or perform maintenance on the micro-pump 22, and the top cover 25 is provided with a plurality of openings for passing through the first water pipe 23, the second water pipe 24 and the power line of the micro-pump 22.

In addition, the first water pipe 23 and the second water pipe 24 are respectively and fixedly connected with the water inlet 15 and the water outlet 16 of the shell 11 through nuts 26, and water leakage-proof rubber rings are installed at the joints of the nuts 26 with the water inlet 15 and the water outlet 16 so as to avoid the problem of leakage in the circulation process of the water cooling liquid.

The utility model discloses a theory of operation is:

when the SSD adapter device is used, a user firstly installs the solid state disk with the M.2 interface on a PCB of the SSD adapter device, the solid state disk is connected with computer equipment through a USBC interface, data are read and written through the computer equipment, the shell 11 is designed by integrally formed aluminum alloy, heat generated by the solid state disk in the working process can be transmitted to the shell 11, at the moment, water cooling liquid in the water tank 21 flows into the water channel 14 of the shell 11 through the first water pipe 23 under the driving of the micro water pump 22, the water cooling liquid flows along the water channel 14, and flows into the water tank 21 through the water outlet 16 and the second water pipe 24 under the driving of the micro water pump 22, the water cooling liquid can reduce the temperature of the shell 11 in the circulating process, meanwhile, the water cooling liquid with higher temperature flows into the water tank 21 and flows into the shell 11 again after being cooled, and active heat dissipation is realized in the circulating flow process. In addition, the SSD switching device can be used independently, and the application scene is very wide.

The utility model discloses a further embodiment, casing 11's front and back all are provided with the recess, can set up the PCB board that NVMe agreement changes USBC agreement in the recess at casing 11 front, can set up the PCB board that SATA agreement changes USBC agreement in the recess at the casing 11 back, make SSD switching device can support the SSD of two different transport protocols simultaneously.

The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.

Claims

1. An SSD switching device for dissipating heat through water cooling is characterized by comprising an SSD switching device and a water cooling heat dissipation component, the SSD switching device comprises a shell, one surface of the shell is provided with a groove, a PCB is arranged in the groove, an M.2 interface, a USBC interface and a transmission chip are integrated on the PCB, the M.2 interface and the USBC interface are respectively connected with the transmission chip, an opening communicated with the groove is formed in the side face of the shell and used for accommodating the USBC interface, a hollow water channel is arranged in the shell, and the outer surface of the shell is provided with a water inlet and a water outlet which are communicated with the water channel, the water-cooling heat dissipation component comprises a water tank, the water tank is filled with water cooling liquid and is provided with a micro water pump, the water outlet of the micro water pump is communicated with the water inlet of the shell through a first water pipe, and the water outlet of the shell is communicated with the water tank through a second water pipe.

2. The SSD adapter device using water cooling for heat dissipation according to claim 1, wherein the groove is provided with a detachable baffle.

3. The SSD adapter device using water cooling to dissipate heat according to claim 1, wherein the water tank comprises a detachable top cover, the top cover is provided with a plurality of openings, and the openings are used for allowing a power line of the first water pipe, the second water pipe or the micro water pump to pass through.

4. The SSD adapter device capable of dissipating heat through water cooling as claimed in claim 1, wherein the first water pipe and the second water pipe are respectively and fixedly connected with the water inlet and the water outlet of the housing through nuts, and water leakage-proof rubber rings are installed at the joints of the nuts with the water inlet and the water outlet.

5. The SSD adapter device using water cooling for heat dissipation according to claim 1, wherein grooves are formed in the front and back of the housing, and the PCB is disposed in the grooves.

6. The SSD transition device through water-cooling heat dissipation according to claim 1 or 5, wherein the PCB is a PCB with NVMe protocol converted into USBC protocol or a PCB with SATA protocol converted into USBC protocol.