CN210157566U - Two-way heat dissipation cooling integrated circuit power module - Google Patents
Two-way heat dissipation cooling integrated circuit power module Download PDFInfo
- Publication number
- CN210157566U CN210157566U CN201920721925.3U CN201920721925U CN210157566U CN 210157566 U CN210157566 U CN 210157566U CN 201920721925 U CN201920721925 U CN 201920721925U CN 210157566 U CN210157566 U CN 210157566U
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- China
- Prior art keywords
- integrated circuit
- power module
- circuit power
- heat dissipation
- radiator fan
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- Expired - Fee Related
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 34
- 238000001816 cooling Methods 0.000 title claims description 18
- 230000035939 shock Effects 0.000 claims abstract description 22
- 230000005540 biological transmission Effects 0.000 abstract description 5
- 238000013016 damping Methods 0.000 abstract description 4
- 230000002457 bidirectional effect Effects 0.000 description 8
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
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Abstract
The utility model discloses a two-way heat dissipation refrigerated integrated circuit power module belongs to electronic equipment technical field, including integrated circuit power module main part, the first base of the equal fixedly connected with in integrated circuit power module main part top surface both sides, first base top fixed surface is connected with first damping spring frame, first damping spring frame top fixed surface is connected with first stand, the equal fixedly connected with second base in integrated circuit power module main part bottom surface both sides. The utility model discloses a first shock attenuation spring frame and second shock attenuation spring frame can slow down the vibrations that first radiator fan and second radiator fan come in the transmission of during operation to adjusting bolt and bolt hole can adjust first radiator fan and second radiator fan position according to the demand again, make first radiator fan and second radiator fan carry out two-way heat dissipation simultaneously to integrated circuit power module main part both sides surface, have improved the radiating homogeneity of equipment.
Description
Technical Field
The utility model relates to an electronic equipment technical field especially relates to a two-way heat dissipation refrigerated integrated circuit power module.
Background
The power supply module is a power supply device which can be directly attached to a printed circuit board and is characterized by supplying power to an Application Specific Integrated Circuit (ASIC), a Digital Signal Processor (DSP), a microprocessor, a memory, a Field Programmable Gate Array (FPGA) and other digital or analog loads.
The traditional integrated circuit power module adopts single-side heat dissipation in most of heat dissipation, but the heat dissipation effect of the other side is poor, so that the heat dissipation of the integrated circuit power module is uneven, and the service life of the integrated circuit power module or the service life of parts can be shortened. Therefore, the integrated circuit power module with bidirectional heat dissipation and cooling is provided.
Disclosure of Invention
The utility model provides a two-way radiating and cooling's integrated circuit power module, through first shock attenuation spring frame and second shock attenuation spring frame, can slow down the vibrations that first radiator fan and second radiator fan come in the transmission of during operation, and adjusting bolt and bolt hole can adjust first radiator fan and second radiator fan position according to the demand again, make first radiator fan and second radiator fan carry out two-way heat dissipation simultaneously to integrated circuit power module main part both sides surface, the radiating homogeneity of equipment has been improved.
The utility model provides a specific technical scheme as follows:
the utility model provides a pair of two-way heat dissipation refrigerated integrated circuit power module, including integrated circuit power module main part, the first base of the equal fixedly connected with in integrated circuit power module main part top surface both sides, first base top fixed surface is connected with first shock attenuation spring frame, first shock attenuation spring frame top fixed surface is connected with first stand, the equal fixedly connected with second base in integrated circuit power module main part bottom surface both sides, second base bottom fixed surface is connected with second shock attenuation spring frame, second shock attenuation spring frame bottom fixedly connected with second stand, first support is installed to first stand one side, first support surface mounting has first radiator fan, second stand installs the second support in one side, second support surface mounting has second radiator fan.
Optionally, bolt holes have all been seted up on first stand and second stand surface, and the bolt hole specifically is provided with a plurality of groups.
Optionally, the two ends of the first support are detachably connected with the first upright post through bolt holes and adjusting bolts.
Optionally, the two ends of the second support are detachably connected with the second upright column through bolt holes and adjusting bolts.
The utility model has the advantages as follows:
1. the utility model discloses a first base and second base, can effectually provide stable basis for two-way heat dissipation cooling arrangement, through first shock attenuation spring holder and second shock attenuation spring holder, can effectually slow down vibrations that first radiator fan and second radiator fan come in the transmission of during operation, thereby reduce vibrations to the destruction of integrated circuit power module main part, the life of integrated circuit power module main part has been improved, and first stand and second stand, can provide the support for first support and second support again, the multiunit bolt hole can be seted up again simultaneously.
2. Through adjusting bolt and bolt hole, thereby the operating position of regulation and control first support and second support that can be nimble, and then can be close to integrated circuit power module main part bottom and top surface with first radiator fan and second radiator fan according to the demand, through the operation of first radiator fan and second radiator fan, thereby can carry out two-way heat dissipation simultaneously to integrated circuit power module main part both sides surface, the radiating homogeneity of integrated circuit power module main part has been improved, further reinforcing integrated circuit power module main part's life.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic diagram of an overall structure of a bidirectional heat dissipation cooled integrated circuit power module according to an embodiment of the present invention;
fig. 2 is a schematic top view of a bi-directional heat dissipation cooled power supply module according to an embodiment of the present invention;
fig. 3 is a schematic diagram of an overall structure of a second bracket of an integrated circuit power module with bidirectional heat dissipation and cooling according to an embodiment of the present invention.
In the figure: 1. an integrated circuit power module body; 2. a first base; 201. a first shock-absorbing spring mount; 202. a first upright post; 3. a second base; 301. a second shock-absorbing spring mount; 302. a second upright post; 4. bolt holes; 5. adjusting the bolt; 6. a first bracket; 601. a first heat dissipation fan; 7. a second bracket; 701. a second heat dissipation fan.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
A power module of an integrated circuit with bidirectional heat dissipation and cooling according to an embodiment of the present invention will be described in detail with reference to fig. 1 to 3.
Referring to fig. 1, 2 and 3, a bidirectional heat dissipation cooled integrated circuit power module according to an embodiment of the present invention includes an integrated circuit power module main body 1, wherein a first base 2 is fixedly connected to both sides of a top surface of the integrated circuit power module main body 1, a first shock absorbing spring bracket 201 is fixedly connected to a top surface of the first base 2, a first upright 202 is fixedly connected to a top surface of the first shock absorbing spring bracket 201, a second base 3 is fixedly connected to both sides of a bottom surface of the integrated circuit power module main body 1, a second shock absorbing spring bracket 301 is fixedly connected to a bottom surface of the second base 3, a second upright 302 is fixedly connected to a bottom of the second shock absorbing spring bracket 301, a first bracket 6 is mounted on one side of the first upright 202, a first heat dissipation fan 601 is mounted on a surface of the first bracket 6, a second bracket 7 is mounted on one side of the second upright 302, the second heat dissipation fan 701 is surface-mounted on the second bracket 7. Wherein, through first shock attenuation spring frame 201 and second shock attenuation spring frame 301, can slow down the vibrations that first radiator fan 601 and second radiator fan 701 come in the transmission of during operation to adjusting bolt 5 and bolt hole 4 can adjust first radiator fan 601 and second radiator fan 701 position according to the demand again, make first radiator fan 601 and second radiator fan 701 carry out two-way heat dissipation to integrated circuit power module main part 1 both sides surface simultaneously, have improved the radiating homogeneity of equipment.
Referring to fig. 1, an embodiment of the present invention provides a bidirectional heat dissipation and cooling integrated circuit power module, bolt holes 4 have been all opened on the surfaces of the first column 202 and the second column 302, and the bolt holes 4 are specifically provided with a plurality of groups. Wherein, through bolt hole 4, can be effectual for adjusting bolt 5 provides installation space.
Referring to fig. 1 and fig. 2, in the integrated circuit power module with bidirectional heat dissipation and cooling provided by the embodiment of the present invention, two ends of the first bracket 6 are detachably connected to the first column 202 through the bolt holes 4 and the adjusting bolts 5. Wherein, the working position of the first bracket 6 can be flexibly adjusted through the bolt hole 4 and the adjusting bolt 5 on the first upright 202.
Referring to fig. 1 and fig. 2, in the integrated circuit power module with bidirectional heat dissipation and cooling provided by the embodiment of the present invention, two ends of the second bracket 7 are detachably connected to the second column 302 through the bolt holes 4 and the adjusting bolts 5. Wherein, through bolt hole 4 and adjusting bolt 5 on second stand 302, the operating position of second support 7 can be adjusted in a flexible way.
The embodiment of the utility model provides a two-way heat dissipation refrigerated integrated circuit power module, through first base 2 and second base 3, can effectually provide stable basis for two-way heat dissipation cooling arrangement, through first damping spring frame 201 and second damping spring frame 301, can effectually slow down vibrations that first radiator fan 601 and second radiator fan 701 come in the transmission of during operation, thereby reduce vibrations to integrated circuit power module main part 1's destruction, integrated circuit power module main part 1's life has been improved, and first stand 202 and second stand 302, can provide the support for first support 6 and second support 7 again, multiunit bolt hole 4 has been seted up again simultaneously, through adjusting bolt 5 and bolt hole 4, thereby the operating position of regulation and control first support 6 and second support 7 that can be nimble, and then can be close to integrated circuit power module main part 1 bottom and top surface with first radiator fan 601 and second radiator fan 701 according to the demand Through the operation of the first cooling fan 601 and the second cooling fan 701, the two-way cooling can be simultaneously performed on the surfaces of the two sides of the integrated circuit power module main body 1, the uniformity of the cooling of the integrated circuit power module main body 1 is improved, and the service life of the integrated circuit power module main body 1 is further prolonged.
It should be noted that the utility model relates to a two-way heat dissipation refrigerated integrated circuit power module, including integrated circuit power module main part 1, first base 2, first shock attenuation spring frame 201, first stand 202, second base 3, second shock attenuation spring frame 301, second stand 302, bolt hole 4, adjusting bolt 5, first support 6, the model is JIESAMMY's first radiator fan 601, second support 7 and the model is JIESAMMY's second radiator fan 701, the part is general standard component or the part that technical staff in the field knows, and its structure and principle all can all be known or can be known through conventional experimental method for this technical staff.
It is apparent that those skilled in the art can make various changes and modifications to the embodiments of the present invention without departing from the spirit and scope of the embodiments of the present invention. Thus, if such modifications and variations of the embodiments of the present invention fall within the scope of the claims and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (4)
1. The utility model provides a two-way heat dissipation refrigerated integrated circuit power module, includes integrated circuit power module main part, its characterized in that, the equal first base of fixedly connected with in integrated circuit power module main part top surface both sides, first base top fixed surface is connected with first shock attenuation spring frame, first shock attenuation spring frame top fixed surface is connected with first stand, the equal fixedly connected with second base in integrated circuit power module main part bottom surface both sides, second base bottom fixed surface is connected with second shock attenuation spring frame, second shock attenuation spring frame bottom fixedly connected with second stand, first support is installed to first stand one side, first support surface mounting has first radiator fan, second stand installs the second support in one side, second support surface mounting has second radiator fan.
2. The bi-directional heat dissipation and cooling integrated circuit power module of claim 1, wherein bolt holes are formed in the surfaces of the first and second columns, and the bolt holes are specifically provided in a plurality of groups.
3. The bi-directional heat dissipation and cooling integrated circuit power module as recited in claim 1, wherein two ends of the first support are detachably connected to the first vertical pillar through bolt holes and adjusting bolts.
4. The bi-directional heat dissipation and cooling integrated circuit power module as recited in claim 1, wherein the two ends of the second bracket are detachably connected to the second pillar through bolt holes and adjusting bolts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920721925.3U CN210157566U (en) | 2019-05-20 | 2019-05-20 | Two-way heat dissipation cooling integrated circuit power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920721925.3U CN210157566U (en) | 2019-05-20 | 2019-05-20 | Two-way heat dissipation cooling integrated circuit power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210157566U true CN210157566U (en) | 2020-03-17 |
Family
ID=69759660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920721925.3U Expired - Fee Related CN210157566U (en) | 2019-05-20 | 2019-05-20 | Two-way heat dissipation cooling integrated circuit power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210157566U (en) |
-
2019
- 2019-05-20 CN CN201920721925.3U patent/CN210157566U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200317 |
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| CF01 | Termination of patent right due to non-payment of annual fee |