CN210151219U - Etching equipment for producing lead frame - Google Patents
Etching equipment for producing lead frame Download PDFInfo
- Publication number
- CN210151219U CN210151219U CN201920913924.9U CN201920913924U CN210151219U CN 210151219 U CN210151219 U CN 210151219U CN 201920913924 U CN201920913924 U CN 201920913924U CN 210151219 U CN210151219 U CN 210151219U
- Authority
- CN
- China
- Prior art keywords
- etching
- lead frame
- rotating shaft
- base
- bearing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005530 etching Methods 0.000 title claims abstract description 74
- 239000007788 liquid Substances 0.000 claims description 23
- 230000003028 elevating effect Effects 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000007787 solid Substances 0.000 abstract description 5
- 238000002791 soaking Methods 0.000 abstract description 4
- 230000002146 bilateral effect Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000004649 discoloration prevention Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Landscapes
- ing And Chemical Polishing (AREA)
Abstract
The utility model relates to a production technical field of lead frame specifically is an etching equipment for producing lead frame for solve the problem that the etching equipment of current lead frame can not fully soak the lead frame. The utility model discloses a base, vertical board, etching case, elevating system and lifter plate, rotary mechanism is installed to the bottom surface of lifter plate, the last first pivot that is connected with of rotary mechanism, first bearing is installed on the upper portion of first pivot, install solid fixed cylinder on the surface of first bearing, gu fixed cylinder's surface mounting has the placement machine to construct, it has the adapter sleeve still to overlap in the first pivot, install a plurality of leeward pieces on the adapter sleeve. The utility model discloses a rotary mechanism drives the fresh air piece rotation, and the fresh air piece rotation can drive the etching solution of etching incasement and flow to can make etching solution more abundant and lead frame contact, and then the soaking lead frame that can be more abundant.
Description
Technical Field
The utility model relates to a production technical field of lead frame, more specifically relate to an etching equipment for producing lead frame.
Background
The lead frame is used as a chip carrier of an integrated circuit, is a key structural member for realizing the electrical connection between a lead-out end of an internal circuit of a chip and an external lead by means of bonding and welding wires to form an electrical circuit, plays a role of a bridge connected with an external lead, is required to be used in most semiconductor integrated blocks and automobile parts needing chips, and is an important basic material in the electronic information industry. The production and manufacturing process of the lead frame generally comprises the production steps of feeding, cleaning, drying, film pasting, exposure, development, etching, film removing, cleaning, discoloration prevention, automatic inspection, material receiving and the like. Wherein, the etching is to form a layer of etching solution on the outer surface of the lead frame.
In the prior art, the etching equipment for the lead frame comprises a base, an etching box arranged on the base, a bilateral support fixed on the ground, a pick-and-place mechanism arranged on the bilateral support, and a control system for controlling the operation of the etching box and the pick-and-place mechanism; the etching box is filled with etching liquid; the pick and place mechanism comprises: the slide rail is arranged on the brackets at the two sides, the slide block is arranged on the slide rail in a sliding way, the electric hydraulic rod is fixed on the brackets at the two sides and connected with the slide block, the movable rod is connected with the slide block through a bearing, and the slide box is arranged on the movable rod and can be turned; the outer wall of the slide box is provided with a through hole. The etching equipment provides convenience for taking and placing in the etching of the lead frame through the lifting of the taking and placing mechanism and the overturning of the wafer carrying box, and improves the etching efficiency of the lead frame.
However, when the wafer cassette is immersed in the etching solution together with the lead frame, the etching solution and the lead frame holder are relatively stationary, which results in the lead frame not being more sufficiently immersed by the etching solution. Therefore, there is a strong need for an etching apparatus that can more fully immerse the lead frame.
SUMMERY OF THE UTILITY MODEL
Based on above problem, the utility model provides an etching equipment for producing lead frame for solve the problem that the current etching equipment that is used for the lead frame can not fully soak the lead frame. The utility model discloses a rotary mechanism drives the fresh air piece rotation, and the fresh air piece rotation can drive the etching solution of etching incasement and flow to can make etching solution more abundant and lead frame contact, and then the soaking lead frame that can be more abundant.
The utility model discloses a realize above-mentioned purpose and specifically adopt following technical scheme:
the utility model provides an etching equipment for producing lead frame, includes hollow base, two vertical boards that set up relatively are installed to the top surface of base, the etching case that is located two vertical inter-plates is installed to the top surface of base, install elevating system on the vertical board, the last lifter plate that is located etching case top that is connected with of elevating system, rotary mechanism is installed to the bottom surface of lifter plate, the last first pivot that is connected with of rotary mechanism, first bearing is installed on the upper portion of first pivot, install the solid fixed cylinder of taking out the liquid hole on the surface of first bearing, the surface mounting of solid fixed cylinder has the placement machine who can place a plurality of lead frames to construct, it has the adapter sleeve that is located the solid fixed cylinder still to overlap in the first pivot, install a plurality of leeward pieces along the axial of first pivot on the adapter sleeve.
The working principle is as follows: when the lead frames need to be soaked and etched, the lead frames can be placed in the placing mechanism at the same time, then the placing mechanism moves downwards through the lifting mechanism, the lifting mechanism stops moving downwards again until the lead frames are soaked in etching liquid of the etching box, the rotating mechanism is started at the same time, the rotating mechanism drives the first rotating shaft to rotate, the first rotating shaft drives the connecting sleeve in sequence, the wind generating piece rotates, the wind generating piece drives the etching liquid entering the fixing cylinder through the liquid outlet hole to flow when rotating, then the etching liquid in the etching box is driven to flow, therefore, the etching liquid can be more fully contacted with the lead frames, and the lead frames can be more fully soaked.
As a preferable mode, the upper portions and the lower portions of the two vertical plates are respectively provided with a second bearing, the lifting mechanism comprises sliding grooves formed in the side surfaces of the two vertical plates, two sliding grooves are respectively provided with a screw rod penetrating through the second bearing and extending into the base, two screw rods are respectively provided with a sliding block connected with the screw rod through a thread, the two ends of the lifting plate are connected with the sliding blocks, the lower ends of the two screw rods are respectively provided with a first bevel gear positioned in the base, the base is internally provided with a supporting mechanism, the supporting mechanism is penetrated by a second rotating shaft, the second rotating shaft can rotate in the supporting mechanism, the two ends of the second rotating shaft are respectively provided with a second bevel gear capable of being meshed with the first bevel gear, and the end surface of the second bevel gear is further connected with a rotating mechanism extending out of the base.
As a preferable mode, the supporting mechanism includes a supporting plate installed in the base, a third bearing is installed in the supporting plate, and the second rotating shaft passes through the third bearing.
Preferably, the rotating mechanism is a handle or a foot pedal.
As a preferred mode, the placing mechanism comprises a plurality of placing boxes arranged on the outer surface of the fixed cylinder, a containing cavity capable of containing the lead frame is formed in each placing box, and a plurality of liquid inlet holes are formed in each placing box.
As a preferable mode, the number of the wind generating pieces is four, and the four wind generating pieces are parallel to each other and are uniformly arranged on the first rotating shaft.
As a preferable mode, the rotating mechanism is a rotating motor, and the rotating motor is connected with a power supply through a wire.
The utility model has the advantages as follows:
(1) the utility model discloses a rotary mechanism drives the fresh air piece rotation, and the fresh air piece rotation can drive the etching solution of etching incasement and flow to can make etching solution more abundant and lead frame contact, and then the soaking lead frame that can be more abundant.
(2) In the utility model, when the placing mechanism needs to move downwards, only the rotating mechanism needs to be rotated, the rotating mechanism rotates to drive the second rotating shaft and the second bevel gear to rotate, the second bevel gear drives the first bevel gear to rotate, the first bevel gear drives the screw to rotate, and the screw is connected with the slider through the thread, so the screw can drive the slider to rotate and move downwards along the screw during rotation, the slider slides downwards to drive the lifting plate to move downwards, and the lifting plate sequentially drives the rotating mechanism, the fixed cylinder, the placing mechanism and the lead frame to move downwards until the lead frame is soaked in the etching solution; if the placing mechanism needs to move upwards, the rotating mechanism only needs to rotate towards the opposite direction.
(3) The utility model discloses well placement machine constructs including installing a plurality of boxes of placing at the solid fixed cylinder surface, places to open on the box and has the chamber that holds that can hold the lead frame, places and still opens on the box and has a plurality of feed liquor holes. Place the lead frame in placing the chamber that holds of box, during etching solution can get into through the feed liquor hole and place the box to soak the etching to the lead frame.
(4) The utility model discloses the quantity of well endogenous wind piece is four, and four endogenous wind pieces are parallel to each other and evenly set up in first pivot. Therefore, the etching liquid in the etching box can flow more uniformly and stably, and the lead frame can be soaked more fully.
Drawings
FIG. 1 is a schematic front sectional view of the storage box of the present invention above the etching chamber;
FIG. 2 is a schematic front sectional view of the storage box of the present invention in an etching chamber;
FIG. 3 is a schematic cross-sectional view taken along line A-A of FIG. 1 according to the present invention;
FIG. 4 is an enlarged schematic view of the present invention at B of FIG. 1;
FIG. 5 is an enlarged schematic view of the present invention at C of FIG. 1;
reference numerals: the device comprises a base 1, a second bevel gear 2, a first bevel gear 3, a vertical plate 4, a sliding chute 41, an etching box 5, a screw rod 6, a sliding block 7, a second bearing 8, a rotating motor 9, a first rotating shaft 10, a connecting sleeve 11, a wind generating sheet 12, a fixed cylinder 13, a liquid outlet hole 131, a placing box 14, a liquid inlet hole 141, a rotating mechanism 15, a second rotating shaft 16, a supporting plate 17, a third bearing 171, a lifting plate 18 and a first bearing 19.
Detailed Description
For a better understanding of the present invention, the present invention will be described in further detail with reference to the accompanying drawings and the following embodiments.
Example 1:
as shown in fig. 1-5, an etching apparatus for producing lead frames includes a hollow base 1, two vertical plates 4 arranged oppositely are installed on the top surface of the base 1, an etching box 5 located between the two vertical plates 4 is installed on the top surface of the base 1, an elevating mechanism is installed on each vertical plate 4, an elevating plate 18 located above the etching box 5 is connected to each elevating mechanism, a rotating mechanism is installed on the bottom surface of each elevating plate 18, a first rotating shaft 10 is connected to each rotating mechanism, a first bearing 19 is installed on the upper portion of each first rotating shaft 10, a fixed cylinder 13 with a liquid outlet hole 131 is installed on the outer surface of each first bearing 19, a placing mechanism capable of placing a plurality of lead frames is installed on the outer surface of each fixed cylinder 13, a connecting sleeve 11 located in each fixed cylinder 13 is further sleeved on each first rotating shaft 10, and a plurality of wind generating sheets 12 are installed on each connecting sleeve 11 in the axial direction of.
The working principle is as follows: when the lead frames need to be soaked and etched, the lead frames can be placed in the placing mechanism at the same time, then the placing mechanism moves downwards through the lifting mechanism, the lifting mechanism stops moving downwards until the lead frames are soaked in the etching liquid of the etching box 5, the rotating mechanism is started at the same time, the rotating mechanism drives the first rotating shaft 10 to rotate, the first rotating shaft 10 sequentially drives the connecting sleeve 11 and the wind generating sheet 12 to rotate, the wind generating sheet 12 drives the etching liquid entering the fixed cylinder 13 through the liquid outlet hole 131 to flow when rotating, then the etching liquid in the etching box 5 is driven to flow, so that the etching liquid can be more fully contacted with the lead frames, the lead frames can be soaked more fully, and in addition, the lower part of the etching box 5 is provided with a liquid outlet pipe capable of placing the etching liquid.
Example 2:
as shown in fig. 1 to 5, this embodiment provides a preferable mechanism of the lifting mechanism on the basis of the above embodiments. Second bearing 8 is installed to the upper portion and the lower part of two vertical boards 4 promptly all, elevating system is including opening the spout 41 in two vertical board 4 sides, all install the screw rod 6 that passes second bearing 8 and extend to in the base 1 in two spouts 41, all install the slider 7 that passes through threaded connection with screw rod 6 on two screw rods 6, the both ends and the slider 7 of lifter plate 18 are connected, first bevel gear 3 that is located the base 1 is all installed to the lower extreme of two screw rods 6, install supporting mechanism in the base 1, supporting mechanism is passed by second pivot 16, and second pivot 16 can be at the supporting mechanism internal rotation, second pivot 16's both ends all install can with first bevel gear 3 engaged with second bevel gear 2, second bevel gear 2's terminal surface still is connected with the slewing mechanism 15 that extends to the base 1 outside.
Preferably, the supporting mechanism includes a supporting plate 17 installed in the base 1, a third bearing 171 is installed in the supporting plate 17, and the second rotating shaft 16 passes through the third bearing 171. Thus, the second rotary shaft 16 rotates in the third bearing 171, and the support plate 17 is not affected by the rotation of the second rotary shaft 16.
Preferably, the rotating mechanism 15 is a handle or a foot pedal, although not limited thereto
When the placing mechanism needs to move downwards, only the rotating mechanism 15 needs to be rotated, the rotating mechanism 15 rotates to drive the second rotating shaft 16 and the second bevel gear 2 to rotate, the second bevel gear 2 drives the first bevel gear 3 to rotate, the first bevel gear 3 drives the screw 6 to rotate, and the screw 6 is in threaded connection with the slider 7, so that the slider 7 is driven by the screw 6 to rotate while moving downwards along the screw 6, the slider 7 slides downwards to drive the lifting plate 18 to move downwards, and the lifting plate 18 drives the rotating mechanism, the fixed cylinder 13, the placing mechanism and the lead frame to move downwards in sequence until the lead frame is soaked in the etching solution; if the placing mechanism needs to move upwards, the rotating mechanism 15 only needs to rotate in the opposite direction, so that the lifting mechanism can control the lifting and the falling of the lead frame more conveniently.
The rest is the same as example 1, and therefore, will not be described herein.
Example 3:
as shown in fig. 1 to 5, this embodiment gives a preferable structure of the placing mechanism on the basis of embodiment 1. That is, the placing mechanism comprises a plurality of placing boxes 14 arranged on the outer surface of the fixed cylinder 13, a containing cavity capable of containing the lead frame is arranged on the placing box 14, and a plurality of liquid inlet holes 141 are also arranged on the placing box 14. The lead frame is placed in the containing cavity of the placing box 14, and the etching solution enters the placing box 14 through the liquid inlet hole 141, so that the lead frame is subjected to soaking etching.
Preferably, the number of the wind generating pieces 12 is four, and the four wind generating pieces 12 are parallel to each other and uniformly arranged on the first rotating shaft 10. This makes the flow of the etching solution in the etching chamber 5 more uniform and smooth, so that the lead frame can be soaked more sufficiently.
Preferably, the rotating mechanism is a rotating motor 9, the rotating motor 9 is connected with a power supply through a wire, the rotating motor 9 is conventional and can be easily purchased in the market, the model can be selected from but is not limited to YT57B2R0510, and the circuit connection is not described in detail.
The rest is the same as example 1, and therefore, will not be described herein.
The embodiment of the present invention is the above. The specific parameters in the above embodiments and examples are only for the purpose of clearly showing the verification process of the present invention, and are not used to limit the protection scope of the present invention, which is still subject to the claims, and all the equivalent structural changes made by using the contents of the specification and drawings of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. An etching apparatus for producing lead frames, comprising a hollow base (1), wherein two oppositely arranged vertical plates (4) are mounted on the top surface of the base (1), characterized in that: the top surface of the base (1) is provided with an etching box (5) positioned between two vertical plates (4), the vertical plate (4) is provided with a lifting mechanism, the lifting mechanism is connected with a lifting plate (18) positioned above the etching box (5), the bottom surface of the lifting plate (18) is provided with a rotating mechanism, the rotating mechanism is connected with a first rotating shaft (10), a first bearing (19) is arranged at the upper part of the first rotating shaft (10), a fixed cylinder (13) with a liquid outlet hole (131) is arranged on the outer surface of the first bearing (19), the outer surface of the fixed cylinder (13) is provided with a placing mechanism which can place a plurality of lead frames, a connecting sleeve (11) positioned in the fixed cylinder (13) is also sleeved on the first rotating shaft (10), the connecting sleeve (11) is provided with a plurality of wind generating sheets (12) along the axial direction of the first rotating shaft (10).
2. Etching apparatus for producing lead frames according to claim 1, characterized in that: the upper part and the lower part of the two vertical plates (4) are respectively provided with a second bearing (8), the lifting mechanism comprises sliding grooves (41) formed in the side surfaces of the two vertical plates (4), the two sliding grooves (41) are internally provided with a screw (6) which penetrates through the second bearing (8) and extends into the base (1), the two screw (6) are respectively provided with a sliding block (7) which is in threaded connection with the screw (6), the two ends of the lifting plate (18) are connected with the sliding blocks (7), the lower ends of the two screw (6) are respectively provided with a first bevel gear (3) which is positioned in the base (1), the base (1) is internally provided with a supporting mechanism, the supporting mechanism is penetrated by a second rotating shaft (16), the second rotating shaft (16) can rotate in the supporting mechanism, the two ends of the second rotating shaft (16) are respectively provided with a second bevel gear (2) which can be meshed with the first bevel gear (3), the end face of the second bevel gear (2) is also connected with a rotating mechanism extending out of the base (1).
3. Etching apparatus for producing lead frames according to claim 2, characterized in that: the supporting mechanism comprises a supporting plate (17) installed in the base (1), a third bearing (171) is installed in the supporting plate (17), and the second rotating shaft (16) penetrates through the third bearing (171).
4. Etching apparatus for producing lead frames according to claim 2, characterized in that: the rotating mechanism (15) is a handle or a pedal.
5. Etching apparatus for producing lead frames according to claim 1, characterized in that: the placing mechanism comprises a plurality of placing boxes (14) arranged on the outer surface of the fixed cylinder (13), a containing cavity (141) capable of containing the lead frame is formed in each placing box (14), and a plurality of liquid inlet holes (142) are formed in each placing box (14).
6. Etching apparatus for producing lead frames according to claim 1, characterized in that: the number of the wind generating sheets (12) is four, and the four wind generating sheets (12) are parallel to each other and are uniformly arranged on the first rotating shaft (10).
7. Etching apparatus for producing lead frames according to claim 1, characterized in that: the rotating mechanism is a rotating motor (9), and the rotating motor (9) is connected with a power supply through a wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920913924.9U CN210151219U (en) | 2019-06-17 | 2019-06-17 | Etching equipment for producing lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920913924.9U CN210151219U (en) | 2019-06-17 | 2019-06-17 | Etching equipment for producing lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210151219U true CN210151219U (en) | 2020-03-17 |
Family
ID=69763249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920913924.9U Expired - Fee Related CN210151219U (en) | 2019-06-17 | 2019-06-17 | Etching equipment for producing lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210151219U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111447751A (en) * | 2020-04-25 | 2020-07-24 | 深圳市科路迪机械设备有限公司 | Precision etching device and etching spray frame thereof |
| CN113675095A (en) * | 2021-08-04 | 2021-11-19 | 泰兴市龙腾电子有限公司 | Semiconductor high-precision lead frame etching processing equipment |
| CN114050117A (en) * | 2021-11-17 | 2022-02-15 | 天水华洋电子科技股份有限公司 | Semi-etching equipment for lead frame of integrated circuit |
-
2019
- 2019-06-17 CN CN201920913924.9U patent/CN210151219U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111447751A (en) * | 2020-04-25 | 2020-07-24 | 深圳市科路迪机械设备有限公司 | Precision etching device and etching spray frame thereof |
| CN113675095A (en) * | 2021-08-04 | 2021-11-19 | 泰兴市龙腾电子有限公司 | Semiconductor high-precision lead frame etching processing equipment |
| CN113675095B (en) * | 2021-08-04 | 2024-04-02 | 泰兴市龙腾电子有限公司 | Semiconductor high-precision lead frame etching processing equipment |
| CN114050117A (en) * | 2021-11-17 | 2022-02-15 | 天水华洋电子科技股份有限公司 | Semi-etching equipment for lead frame of integrated circuit |
| CN114050117B (en) * | 2021-11-17 | 2022-05-03 | 天水华洋电子科技股份有限公司 | Semi-etching equipment for lead frame of integrated circuit |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN210151219U (en) | Etching equipment for producing lead frame | |
| CN112008301A (en) | Electronic components welding equipment is used in circuit board production | |
| CN214228778U (en) | Chip mounter for electronic components | |
| CN113819728A (en) | Online automatic drying equipment is used in circuit board production | |
| CN212356006U (en) | Flat enameled wire vertical winding machine | |
| CN219324853U (en) | Full-automatic tin dipping machine | |
| CN219871419U (en) | Chip testing device | |
| CN208922061U (en) | Wafer handling equipment and the litho machine for applying it | |
| CN212041254U (en) | Glue homogenizing machine with automatic glue dripping function | |
| CN206336780U (en) | Crystal-vibration-chip detection machine magazine-type feed mechanism | |
| CN113650404B (en) | Solder paste printing equipment for mini-LED and mini-LED preparation process | |
| CN106113922B (en) | A kind of workbench of photovoltaic solar silicon plate printing machine | |
| CN218049138U (en) | Workbench glue removing device for dispensing electronic components | |
| CN210381512U (en) | Steel wire mesh plate lifting equipment | |
| CN113369872A (en) | Press mounting device for assembling semiconductor element | |
| CN208385364U (en) | A kind of wafer production automatic machining device | |
| JP2000022322A (en) | Soldering equipment | |
| CN221869541U (en) | Integrated circuit packaging box cleaning equipment | |
| CN218618650U (en) | Loading attachment is used in integrated circuit production | |
| CN111863642A (en) | Automatic pressing mechanism for soft solder packaging chip of carrier core plate | |
| CN218917457U (en) | Integrated circuit test die for SMT (surface mounted technology) packaged product | |
| CN221314476U (en) | PCB board drilling is with preventing kinking device | |
| CN220679453U (en) | High-voltage soft start cabinet support drilling device | |
| CN220858818U (en) | Circuit board processingequipment based on SMT technique | |
| CN220189608U (en) | Loading and unloading fixture between processes |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200317 |