CN210142639U - Device for vacuum pumping and pressurizing bubble-free laminating of semiconductor wafer and ceramic disc - Google Patents
Device for vacuum pumping and pressurizing bubble-free laminating of semiconductor wafer and ceramic disc Download PDFInfo
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- CN210142639U CN210142639U CN201921108927.1U CN201921108927U CN210142639U CN 210142639 U CN210142639 U CN 210142639U CN 201921108927 U CN201921108927 U CN 201921108927U CN 210142639 U CN210142639 U CN 210142639U
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Abstract
The utility model relates to a semiconductor material processing technology field, in particular to device of evacuation pressurization bubble-free laminating semiconductor wafer and ceramic dish. Comprises a closed cavity consisting of an upper housing and a lower housing; the lower housing is fixedly connected with the fixed plate and is also connected with an external vacuum pump; the upper cover shell is connected with a swing arm, the swing arm is connected with a vacuum chamber cylinder through a hinge arranged on a fixed plate, and a vacuum sensor is arranged on the upper cover shell; a wafer support frame is arranged at the center in the lower housing, a wafer support plate is arranged on the top surface of the wafer support frame, and a bearing seat is arranged at the center of the bottom of the wafer support frame; the bearing is arranged in the bearing seat, and a spring is arranged between the bearing seat and the top surface of the wafer support frame; the cylinder is connected with the top of the upper housing, and a piston rod of the cylinder penetrates through the housing to be connected with the pressing plate. The utility model discloses the semiconductor wafer that obtains has better qualification rate, has improved work efficiency.
Description
Technical Field
The utility model relates to a semiconductor material processing technology field, in particular to device of evacuation pressurization bubble-free laminating semiconductor wafer and ceramic dish.
Background
The semiconductor refers to a material having electrical conductivity between a conductor and an insulator at normal temperature. The semiconductor has wide application in radio, television and temperature measurement. Such as diodes, are devices fabricated using semiconductors. Semiconductor refers to a material whose conductivity can be controlled, ranging from an insulator to a conductor. The importance of semiconductors is enormous, both from a technological and economic point of view.
In semiconductor material processing, a process of bonding a semiconductor wafer and a ceramic disk to each other is indispensable due to process restrictions. At present, wax is mainly used for bonding the two in the bonding process, but bubbles are often generated after bonding.
In order to solve the problem of bubbles generated during the bonding process of the semiconductor wafer and the ceramic disc, it is necessary to provide a technology for bonding the ceramic disc and the semiconductor wafer without bubbles by vacuumizing and pressurizing.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to overcome not enough among the prior art, provide a device of evacuation pressurization bubble-free laminating semiconductor wafer and ceramic dish.
In order to solve the technical problem, the utility model discloses a solution is:
the device for attaching the semiconductor wafer and the ceramic disc without bubbles by vacuumizing and pressurizing comprises a pressurizing assembly and a vacuumizing assembly;
the vacuumizing assembly comprises a closed cavity consisting of an upper housing and a lower housing; the lower housing is fixedly connected with the fixed plate and is also connected with an external vacuum pump; the upper cover shell is connected with a swing arm, the swing arm is connected with a vacuum chamber cylinder through a hinge arranged on a fixed plate, and a vacuum sensor is arranged on the upper cover shell; a wafer support frame is arranged at the center in the lower housing, a wafer support plate is arranged on the top surface of the wafer support frame, and a bearing seat is arranged at the center of the bottom of the wafer support frame; the bearing is arranged in the bearing seat, and a spring is arranged between the bearing seat and the top surface of the wafer support frame;
the pressurizing assembly comprises an air cylinder, the air cylinder is connected with the top of the upper housing through a flange plate, and an air cylinder piston rod penetrates through the housing to be connected with the pressing plate.
As an improvement, the upper cover shell and the lower cover shell are sealed through an O-shaped ring.
As an improvement, the lower end surface of the pressure plate is provided with a pressure plate gasket.
As an improvement, a circular plate is adhered to the upper end face of the wafer supporting plate.
As an improvement, the cylinder is arranged at the center of the upper cover shell, so that the pressure applied when the cylinder is pressed down can be ensured to be most effective.
As an improvement, a self-aligning bearing is arranged between a cylinder and a pressing plate of the pressurizing assembly and used for ensuring the uniform stress of the ceramic disc in the pressing process.
Compared with the prior art, the utility model has the technical effects that:
the technology for attaching the ceramic disc and the semiconductor wafer without bubbles through vacuumizing and pressurizing is realized, the semiconductor wafer obtained by the semiconductor material processing equipment has better qualification rate, and the working efficiency is improved; the vacuum gauge detects the vacuum degree in the vacuum chamber, so that the consistency of the vacuum environment is ensured during each lamination, and the success rate of bubble-free lamination is ensured; the combination design of the spring and the ceramic disc support supports the ceramic disc, so that the ceramic disc is slowly descended after being pressed and then is contacted with the semiconductor wafer to play a role in buffering; the pressurizing process that the ceramic disc is arranged on the upper part and the semiconductor wafer is arranged on the lower part is adopted in the pressurizing process, so that the semiconductor wafer is subjected to equal force in the attaching process, and the damage of the semiconductor wafer in the attaching process is avoided; the design of the vacuum chamber for independently distributing the vacuum pump ensures the efficiency and stability of vacuum pumping of the vacuum chamber.
Drawings
FIG. 1 is a general schematic view of the present invention;
fig. 2 is a schematic view of the structure of the present invention.
The reference numbers in the figures are: 2-a vacuum-pumping assembly; 3-a pressurizing assembly; 4-vacuum chamber cylinder; 5-swinging arm; 6, fixing a plate; 7-lower cover shell; 8, an upper cover shell; 9-a vacuum sensor; 10-a wafer support plate; 11-circular plate; 12-a platen; 13-platen gasket; 14-a cylinder; 15-a bearing; 16-a bearing seat; 17-a spring; 18-a flange plate; 19-a bearing; 20-a bearing seat; 21-wafer support.
Detailed Description
The invention will be further elucidated with reference to the drawings and the detailed description. Modifications of various equivalent forms of the invention, which would occur to persons skilled in the art after reading this disclosure, are intended to be within the scope of the invention as defined by the claims appended hereto.
As shown in fig. 1-2, the present invention provides a device for vacuum-pumping and pressurizing a semiconductor wafer and a ceramic plate without bubbles, which comprises a pressurizing assembly 3 and a vacuum-pumping assembly 2.
The vacuum pumping assembly 2 comprises a closed cavity consisting of an upper housing 8 and a lower housing 7. The upper cover shell 8 and the lower cover shell 7 are sealed through an O-shaped ring.
The lower housing 7 is fixedly connected with the fixing plate 6, the lower housing 7 is also connected with an external vacuum pump, a wafer support frame 21 is arranged in the lower housing 7 of the lower end face of the fixing plate 6, and a bearing seat is arranged in the center of the bottom of the wafer support frame 21. The bearing is arranged in the bearing seat, and a spring 17 is arranged between the bearing seat and the top surface of the wafer support frame 21. A wafer support plate 10 is disposed on the top surface of the wafer support frame 21, and a circular plate 11 is attached to the upper end surface of the wafer support plate 10. The upper cover 8 is connected with the swing arm 5, the swing arm 5 is connected with the vacuum chamber cylinder 4 through a hinge arranged on the fixed plate 6, and the upper cover 8 is provided with a vacuum sensor 9. The upper cover 8 is controlled by the swing arm 5 and the vacuum chamber cylinder 4 to be closed to form a closed cavity after the ceramic disc and the semiconductor wafer are placed in the vacuum chamber. Bearing 19 installs inside bearing frame 20, plays the axial positioning effect, has connect a spring 17 between bearing frame 20 and the wafer support frame 21 simultaneously, makes wafer support frame 21 support ceramic dish and wafer at the laminating in-process, and at the in-process that the ceramic dish received pressure, spring 17 can be fine plays the effect of buffering, makes the in-process of ceramic dish and semiconductor wafer contact, and the effectual impact of alleviating between the two to protection semiconductor wafer.
The pressurizing assembly 3 comprises an air cylinder 14, the air cylinder 14 is connected with the top of the upper housing 8 through a flange, a piston rod of the air cylinder 14 penetrates through the housing and is connected with the pressure plate 12 through a bearing 15, and the bearing 15 is arranged in a bearing seat 16. The lower end surface of the pressure plate 12 is provided with a pressure plate gasket 13. The whole pressurizing assembly 3 adopts a pressurizing process that the ceramic disc is arranged on the upper part and the semiconductor wafer is arranged on the lower part to apply pressure to the direct ceramic disc, at this time, the semiconductor wafer is only stressed by the force of the wafer supporting plate 10 and the ceramic disc in the attaching process, the pressure of the wafer supporting plate and the ceramic disc is relatively uniform, and the function of protecting the semiconductor wafer can be achieved.
The cylinder 14 is arranged at the center of the upper housing 8, so that the cylinder 14 can be pressed most effectively.
The utility model discloses a working process does: when the ceramic disc and the semiconductor wafer need to be attached without bubbles, the ceramic disc dripped with the wax is heated at first, and then the heated ceramic disc and the heated semiconductor wafer are placed in the cavity of the vacuumizing assembly 2 and are placed on the wafer support frame. After the cavity is closed, a closed space is formed, and vacuum pumping is carried out to form a vacuum low-pressure environment; then the ceramic disc and the semiconductor wafer are pressed tightly by the air cylinder 14 of the pressurizing assembly, so that no air exists between the ceramic disc and the semiconductor wafer, and finally the ceramic disc and the semiconductor wafer are jointed without air bubbles.
Finally, it is to be noted that the above-mentioned embodiments are only specific embodiments of the present invention. Obviously, the present invention is not limited to the above embodiments, and many variations are possible. All modifications which can be derived or suggested by a person skilled in the art from the disclosure of the invention should be considered as within the scope of the invention.
Claims (6)
1. A device for attaching a semiconductor wafer and a ceramic disc without bubbles by vacuumizing and pressurizing is characterized by comprising a pressurizing assembly and a vacuumizing assembly;
the vacuumizing assembly comprises a closed cavity consisting of an upper housing and a lower housing; the lower housing is fixedly connected with the fixed plate and is also connected with an external vacuum pump; the upper cover shell is connected with a swing arm, the swing arm is connected with a vacuum chamber cylinder through a hinge arranged on a fixed plate, and a vacuum sensor is arranged on the upper cover shell; a wafer support frame is arranged at the center in the lower housing, a wafer support plate is arranged on the top surface of the wafer support frame, and a bearing seat is arranged at the center of the bottom of the wafer support frame; the bearing is arranged in the bearing seat, and a spring is arranged between the bearing seat and the top surface of the wafer support frame;
the pressurizing assembly comprises an air cylinder, the air cylinder is connected with the top of the upper housing through a flange plate, and an air cylinder piston rod penetrates through the housing to be connected with the pressing plate.
2. The apparatus of claim 1, wherein the upper and lower housings are sealed by an O-ring.
3. The apparatus of claim 1, wherein the platen lower end surface is provided with a platen shim.
4. The apparatus as claimed in claim 1, wherein a circular plate is attached to an upper end surface of the wafer supporting plate.
5. The apparatus of claim 1, wherein the cylinder is centrally located in the upper housing to ensure that the cylinder is depressed most effectively to apply pressure.
6. The apparatus of claim 1, wherein a self-aligning bearing is disposed between the cylinder and the pressing plate of the pressing assembly for ensuring uniform stress on the ceramic plate during pressing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921108927.1U CN210142639U (en) | 2019-07-16 | 2019-07-16 | Device for vacuum pumping and pressurizing bubble-free laminating of semiconductor wafer and ceramic disc |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921108927.1U CN210142639U (en) | 2019-07-16 | 2019-07-16 | Device for vacuum pumping and pressurizing bubble-free laminating of semiconductor wafer and ceramic disc |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210142639U true CN210142639U (en) | 2020-03-13 |
Family
ID=69736520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921108927.1U Active CN210142639U (en) | 2019-07-16 | 2019-07-16 | Device for vacuum pumping and pressurizing bubble-free laminating of semiconductor wafer and ceramic disc |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210142639U (en) |
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2019
- 2019-07-16 CN CN201921108927.1U patent/CN210142639U/en active Active
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