CN210142328U - Optical image acquisition unit, optical image acquisition system, and electronic apparatus - Google Patents

Optical image acquisition unit, optical image acquisition system, and electronic apparatus Download PDF

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CN210142328U
CN210142328U CN201920914764.XU CN201920914764U CN210142328U CN 210142328 U CN210142328 U CN 210142328U CN 201920914764 U CN201920914764 U CN 201920914764U CN 210142328 U CN210142328 U CN 210142328U
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optical image
light
layer
image capturing
unit
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龙卫
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Shenzhen Goodix Technology Co Ltd
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Shenzhen Goodix Technology Co Ltd
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Abstract

The embodiment of the application discloses an optical image acquisition unit, an optical image acquisition system and electronic equipment. The optical image pickup unit includes: a micro-lens; the first light blocking layer is arranged below the micro lens, wherein the first light blocking layer is provided with a window; the second light blocking layer is arranged on the side of the micro lens; and the photosensitive unit is arranged below the first light blocking layer. According to the technical scheme, the performance of the optical image acquisition product can be improved.

Description

Optical image acquisition unit, optical image acquisition system, and electronic apparatus
The application is a divisional application of the utility model with application date of 2018, 9 and 21, application number of 201821556519.8, and name of optical image acquisition unit, optical image acquisition system and electronic equipment.
Technical Field
The present embodiments relate to the field of information technology, and more particularly, to an optical image capturing unit, an optical image capturing system, and an electronic device.
Background
With the rapid development of the terminal industry, biometric identification technology, such as fingerprint identification technology, is receiving more and more attention.
In the biometric identification technology, the optical image acquisition mode is an important implementation mode. With the development of end products, the requirements for biometric identification are higher and higher, for example, a larger identification area and a smaller assembly space are required, and accordingly, the requirements for optical image capturing products are also higher and higher.
Therefore, how to improve the performance of the optical image capturing product becomes a technical problem to be solved urgently.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides an optical image acquisition unit, an optical image acquisition system and electronic equipment, and the performance of an optical image acquisition product can be improved.
In a first aspect, an optical image acquisition unit is provided, comprising: a micro-lens; the first light blocking layer is arranged below the micro lens, wherein the first light blocking layer is provided with a window; the second light blocking layer is arranged on the side of the micro lens; and the photosensitive unit is arranged below the first light blocking layer. The micro lens is used for converging the optical signal from the upper part of the micro lens to the window, and the optical signal is transmitted to the photosensitive unit through the window.
The optical image acquisition unit of the embodiment of the application can be arranged in the display screen, so that the assembly space of an optical image acquisition product can be saved, in addition, the optical signal is converged by the micro lens, the imaging quality can be improved, and the performance of the optical image acquisition product can be improved.
In some possible implementations, the optical image acquisition unit is disposed within a display screen.
In some possible implementations, the display screen is an Organic Light Emitting Diode (OLED) screen, and the optical image capturing unit is disposed between adjacent color units of pixels of the OLED screen.
In some possible implementations, the optical image capture unit is disposed between an anode and a cathode of the OLED screen.
In some possible implementations, the light sensing unit multiplexes the anode and the cathode of the OLED screen to form a light signal detection circuit.
In some possible implementations, the display screen is a Liquid Crystal Display (LCD) screen, and the optical image capturing unit is disposed at a position of a part of color units of pixels of the LCD screen.
In some possible implementations, the photosensitive unit is disposed on a Thin Film Transistor (TFT) layer of the LCD screen.
In some possible implementations, the photosensitive unit multiplexes a circuit of the TFT layer to form an optical signal detection circuit.
In some possible implementations, the photosensitive unit includes a photodiode connected in parallel with a storage capacitor of the circuit of the TFT layer.
In some possible implementations, a light leakage channel is disposed above the optical image capturing unit within the LCD screen, and the light leakage channel is in an open state when the light sensing unit detects the optical signal.
In some possible implementations, the light signal detected by the light sensing unit is used to form one pixel of the captured image.
In some possible implementations, the focal point of the micro-lens is located within the window.
In some possible implementations, the window is cylindrical.
In some possible implementations, the window has a diameter greater than 100 nm.
In some possible implementations, the number of windows is one or more.
In some possible implementations, the first light-blocking layer and the second light-blocking layer have a transmittance of less than 20% for visible light or light in a wavelength band of 610nm or more.
In some possible implementations, the optical image acquisition unit further includes: the medium layer is used for transmitting the optical signal and is arranged at least one of the following positions: the micro lens is arranged between the first light blocking layer, in the window or between the first light blocking layer and the photosensitive unit.
In some possible implementations, the material of the micro lens is transparent glue.
In some possible implementations, the optical image acquisition unit further includes: and the filter layer is arranged in a light path from the micro lens to the photosensitive unit and used for filtering optical signals of non-target wave bands and transmitting the optical signals of the target wave bands.
In some possible implementations, the light sensitivity of the light sensing unit to the optical signal of the target wavelength band is greater than a first predetermined threshold, and the quantum efficiency is greater than a second predetermined threshold.
In a second aspect, there is provided an optical image acquisition system comprising: the array of optical image acquisition units of the first aspect or any possible implementation form of the first aspect.
In some possible implementation manners, the optical image capturing unit is disposed in the display screen, and a setting period of the optical image capturing unit in the display screen is greater than or equal to a setting period of pixels of the display screen.
In some possible implementations, the optical image acquisition system further includes: and the light incident angle screening unit is arranged above the optical image acquisition unit and used for transmitting light in a specific incident angle range and blocking light outside the specific incident angle range.
In some possible implementations, the optical image acquisition system further includes: and the supporting structure is used for supporting the optical image acquisition unit.
In some possible implementations, the support structure is disposed below the display screen.
In a third aspect, an electronic device is provided, including: a display screen and the optical image capturing system of the second aspect or any possible implementation manner of the second aspect, wherein the optical image capturing system is disposed within the display screen.
Drawings
FIG. 1 is a schematic view of an optical image acquisition unit according to an embodiment of the present application.
Fig. 2 is a schematic diagram of an OLED display unit.
Fig. 3 is a schematic diagram of an OLED color cell.
Fig. 4 is a schematic diagram of an arrangement position of an optical image capturing unit according to an embodiment of the present application.
FIG. 5 is a schematic view of an optical image capture unit according to another embodiment of the present application.
Fig. 6 is a schematic view of the arrangement position of an optical image capturing unit according to another embodiment of the present application.
Fig. 7 is a schematic diagram of an optical signal detection circuit according to an embodiment of the present application.
Fig. 8 is a diagram illustrating fingerprint original values formed by the array of optical image capturing units according to an embodiment of the present application.
Fig. 9 is a schematic view of an optical image capturing unit according to yet another embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.
The technical solution of the embodiment of the present application may be applied to various electronic devices, for example, portable or mobile computing devices such as smart phones, notebook computers, tablet computers, and game devices, and other electronic devices such as electronic databases, automobiles, and Automated Teller Machines (ATMs), but the embodiment of the present application is not limited thereto.
The technical solution of the embodiment of the present application may be used for optical biometric identification or other optical image acquisition, where the optical biometric identification may be other biometric identification besides optical fingerprint identification, for example, living body identification, and the like, and the embodiment of the present application is not limited thereto. In order to facilitate understanding of the technical solutions of the embodiments of the present application, the following first describes an optical biometric identification technology.
Optical biometric identification technology uses light returned from the top surface of the device display assembly for fingerprint sensing and other sensing operations. The returning light carries information of an object (e.g., a finger) in contact with the top surface, and a specific optical sensor module is implemented by collecting and detecting the returning light. The design of the optical sensor module may be such that the desired optical imaging is achieved by appropriately configuring the optical elements for collecting and detecting the returned light.
Optical biometric identification module, such as optical fingerprint module, it mainly used gathers user's biometric information (for example fingerprint image information). As an example, the biometric identification module may specifically include an optical biometric sensor having an optical sensing array, such as an optical fingerprint sensor; the optical sensing array comprises a plurality of optical sensing units (photosensitive units), and the area of the optical sensing array corresponds to the biological characteristic acquisition area of the biological characteristic identification module. For example, the biometric feature acquisition area is located in the display area of the display screen, so that when a user needs to unlock or verify other biometric features of the electronic device, the user only needs to press a finger on the biometric feature acquisition area located on the display screen, and thus the biometric feature input operation can be achieved. Because the biological characteristic acquisition and detection can be realized in the display area of the display screen, the electronic equipment adopting the structure does not need to specially reserve space on the front surface to set a fingerprint key (such as a Home key), and therefore, a comprehensive screen scheme can be adopted. Thus, the display area of the display screen may extend substantially over the entire front side of the electronic device.
The display screen may be a self-luminous display screen which uses display units having self-luminous properties as display pixels. For example, the display screen may be an Organic Light-Emitting Diode (OLED) display screen, an Active-Matrix Organic Light-Emitting Diode (AMOLED) display screen, or a Micro-LED (Micro-LED) display screen. In other alternative embodiments, the Display screen may also be a Liquid Crystal Display (LCD) or other passive light emitting Display screens, which is not limited in this embodiment of the present application.
On the other hand, the display screen is specifically a touch display screen, which not only can perform image display, but also can detect touch or pressing operation of a user, thereby providing a human-computer interaction interface for the user. For example, in one embodiment, the electronic device may include a Touch sensor, which may be embodied as a Touch Panel (TP), which may be disposed on a surface of the display screen, or may be partially or entirely integrated within the display screen, thereby forming the Touch display screen.
Taking the display screen as an example, the light-emitting layer of the display screen has an array of OLED display units arranged in an array, and the biometric identification module can use the OLED display units (i.e., OLED light sources) of the biometric acquisition area of the OLED display screen as the excitation light sources for biometric detection and identification. Of course, it should be understood that in other alternative implementations, the biometric identification module may also use an internal light source or an external light source to provide the light signal for biometric detection and identification. In this case, the optical image capturing unit may be applied not only to a self-luminous display screen such as an OLED display screen, but also to a non-self-luminous display screen such as a liquid crystal display screen or other passive luminous display screen. Moreover, the optical sensing array of the biometric identification module is specifically a Photo detector (or called Photo detector array, or called photosensitive cell array), and includes a plurality of Photo detector/photosensitive cells distributed in an array, and the Photo detector/photosensitive cells can be used as the optical sensing units.
When a finger touches, presses or approaches (for convenience of description, collectively referred to as pressing) a biometric acquisition area, light emitted by a display unit of the biometric acquisition area is reflected at the finger and forms reflected light, wherein the reflected light can carry biometric information of the finger of the user. For example, after the light is reflected by the fingerprint on the surface of the finger of the user, the reflected light carries the fingerprint information of the user because the reflected light of the ridges and the valleys of the fingerprint is different. The reflected light returns to the display screen and is received by the photodetector array of the biometric identification module below the display screen and converted into a corresponding electrical signal, i.e., a biometric detection signal. The electronic device can obtain the biological feature information of the user based on the biological feature detection signal, and can further perform biological feature matching verification, so that the identity verification of the current user is completed, and whether the user has the right to perform corresponding operation on the electronic device is convenient to confirm.
It should be understood that in a specific implementation, the electronic device further includes a protective cover plate, which may be a transparent cover plate, such as a glass cover plate or a sapphire cover plate, located above the display screen and covering the front surface of the electronic device, and the protective cover plate may be further provided with a protective layer. Therefore, in the embodiment of the present application, the pressing of the display screen by the finger may actually mean that the finger presses the cover plate above the display screen or the surface of the protective layer covering the cover plate.
In one embodiment, the optical biometric identification module may be disposed below the display screen to form an off-screen biometric identification module. With the increasing demand for identification areas, the thickness of the modules increases accordingly, which in turn takes up more space. In view of this, the embodiment of the present application provides an improved optical image capturing scheme, which can dispose the module in the display screen, thereby improving the performance of the optical image capturing product.
Fig. 1 shows a schematic view of an optical image acquisition unit 100 according to an embodiment of the present application.
The optical image pickup unit 100 in fig. 1 may constitute one pixel unit of the optical image pickup system.
As shown in fig. 1, the optical image pickup unit 100 may include: a micro lens 110, a first light-blocking layer 120, a second light-blocking layer 130, and a photosensitive unit 140.
The first light blocking layer 120 is disposed below the micro lens 110; the second light blocking layer 130 is disposed on a side of the micro lens 110; the photosensitive unit 140 is disposed under the first light blocking layer 120.
The first light blocking layer 120 is provided with a window 121. An optical signal can pass through the window 121 but cannot pass through the first light blocking layer 120.
The second light blocking layer 130 at the side of the micro-lens 110 may prevent light signals at the side of the micro-lens 110 from entering the micro-lens 110, and thus may prevent mutual crosstalk between image pickup units.
For example, the first light-blocking layer 120 and the second light-blocking layer 130 have a transmittance of less than 20% for visible light or light in a wavelength band of 610nm or more, which prevents the corresponding light from passing therethrough. Alternatively, the first light-blocking layer 120 and the second light-blocking layer 130 may be metal layers.
It is to be understood that the same light-blocking material may be used for the first light-blocking layer 120 and the second light-blocking layer 130, or different light-blocking materials may be used, as long as the light-blocking effect is satisfied.
The micro lens 110 is configured to converge the light signal from above the micro lens 110 to the window 121, and the light signal is transmitted to the light sensing unit 140 through the window 121.
Due to the presence of the first light-blocking layer 120 and the second light-blocking layer 130, only light signals from above the micro-lens 110 can be transmitted to the light-sensing unit 140 through the window 121.
The micro lens 110 may be various lenses having a convergence function. Optionally, the focus point of the micro-lens 110 is located within the window 121. The material of the micro lens may be an organic material, such as resin or transparent adhesive.
The window 121 is used for light condensed by the micro lens 110. Alternatively, the number of the windows 121 in the first light blocking layer 120 may be one or more. Alternatively, the window 121 is cylindrical, i.e., the window 121 may be a small hole in the light blocking layer 120. Optionally, the window 121 has a diameter greater than 100nm to facilitate transmission of the light required for imaging. The diameter of the window 121 is also smaller than a predetermined value to ensure that the first light blocking layer 120 can block unwanted light. That is, the parameters of the window 121 are set such that the optical signal required for the optical image pickup unit 100 to image is maximally transmitted to the light sensing unit 140, while the undesired light is maximally blocked. For example, the parameters of the window 121 may be set to maximize the transmission of the light signal incident substantially vertically downward on the corresponding region above the optical image capturing unit 100 to the light sensing unit 140, and maximize the blocking of other light signals.
Through the arrangement of the second light-blocking layer 130, the micro-lens 110, the first light-blocking layer 120, the window 121, and the photosensitive unit 140, the optical signal from above the micro-lens 110 is converged to the window 121, and transmitted to the photosensitive unit 140 through the window 121. In this way, the light sensing unit 140 can detect the light signal from the corresponding region above the micro-lens 110, and can further obtain the pixel value according to the light intensity of the light signal.
The light signal detected by the light sensing unit 140 can be used to form a pixel of the captured image, which represents a characteristic value of the corresponding area above the optical image capturing unit 100. That is, a signal collected by one optical image collection unit 100 forms one pixel of an image, so that one image can be obtained by a plurality of optical image collection units 100.
The light sensing unit 140 is used for converting an optical signal into an electrical signal. Alternatively, the light sensing unit 140 may employ a Complementary Metal Oxide Semiconductor (CMOS) device, and a Semiconductor device composed of a PN junction, for example, a photodiode, has a unidirectional conductive characteristic. Optionally, the light sensitivity of the light sensing unit 140 for a light signal in a target wavelength band, such as blue light, green light, red light or infrared light, is greater than a first predetermined threshold, and the quantum efficiency is greater than a second predetermined threshold. For example, the first predetermined threshold may be 0.5v/lux-sec and the second predetermined threshold may be 40%. That is, the light sensing unit 140 has high light sensitivity and quantum efficiency for blue light (wavelength of 460 ± 30nm), green light (wavelength of 540 ± 30nm), red light or infrared light (wavelength ≧ 610nm) so as to detect the corresponding light.
Optionally, the photosensitive material of the photosensitive unit 140 may be hafnium oxide or other materials, that is, materials with high sensitivity and stable structure, but the embodiment of the present application is not limited thereto.
It should be understood that the above parameters of the photosensitive unit 140 may correspond to light required for optical image capturing, for example, if the light required for optical image capturing is only light of one wavelength band, the above parameters of the photosensitive unit 140 only need to satisfy the requirement of the light of the wavelength band.
The optical image acquisition unit 100 designed as above can be arranged in a display screen, so that the assembly space of an optical image acquisition product can be saved, and in addition, the optical signal is converged by the micro lens, and the imaging quality can be improved, so that the performance of the optical image acquisition product can be improved.
In the embodiment of the present application, the optical image capturing unit 100 may adopt a corresponding design for different display screens, which are described below separately.
Optionally, in an embodiment of the present application, when the display screen is an OLED screen, the optical image capturing unit 100 may be disposed at a position between adjacent color units of pixels of the OLED screen.
An OLED screen is made up of a number of display cells. As shown in fig. 2, each display unit mainly includes a glass substrate, a hole transport layer, an organic light emitting layer, an electron transport layer, an anode, a cathode, and the like, wherein the organic light emitting layer is located between the electron transport layer and the hole transport layer, and the hole transport layer and the electron transport layer are correspondingly connected to the anode and the cathode, respectively. When the organic light-emitting layer emits light after current passes through the organic light-emitting layer after being electrified, the organic light-emitting layer is made of different materials and can respectively emit red light, green light and blue light, the light-emitting units (color units) with different colors are arranged according to a certain pattern rule to form a fixed light-emitting unit period (pixel period), and each period at least comprises one red color unit, one green color unit and one blue color unit.
As shown in fig. 3, the distances between the red, green and blue color cells are usually at a certain distance according to different resolutions, e.g. 570ppi, the distance between adjacent color cells is about 45um, the pixel cell distance for fingerprint collection is only less than 50um, and the arrangement size of the photosensitive cells is usually below 12.5 um. 12.5umx12.5um is arranged below the area 45umx45um, the light leakage ratio is still about 75 percent, the sensitivity of human eyes is close to 80 percent, and the display effect of the display screen is not influenced if the size of the photosensitive unit is smaller. Therefore, the gap existing in the middle of the fixed period of the OLED screen is utilized, the proper optical image acquisition unit is arranged, signal acquisition, such as signal detection of fingerprints, is achieved, and meanwhile the gap is small enough and does not affect the display effect. Fig. 4 is a diagram illustrating a white light lighting effect of an OLED screen under a microscope, and as shown in fig. 4, an optical image capturing unit 100 may be disposed at a position between adjacent color units.
Optionally, the optical image capturing unit 100 is disposed between the anode and the cathode of the OLED panel in the thickness direction of the display panel. In addition, optionally, the light sensing unit 140 may multiplex the anode and the cathode of the OLED screen to form an optical signal detection circuit.
As shown in fig. 5, when the optical image capturing unit 100 is integrated in the OLED panel, the original structure in the OLED panel, for example, the metal cathode or anode of the OLED panel, can be multiplexed to the maximum extent, and only the original hole transport layer, organic light emitting layer and electron layer are replaced for transport.
Optionally, the optical signal detection circuit may also adopt a separate circuit, that is, a circuit that does not multiplex the light emitting unit of the OLED panel may also be adopted, which is not limited in this embodiment of the application.
Taking fingerprint identification as an example, when a finger presses a display area, information of the area is fed back to a processor, namely a fixed OLED light emitting area is arranged in the center of the area, the light emitting area provides a light source for fingerprint identification, and the position, shape, color and wave band of the light source can be set as required. The light intensity of light reflected by the peak or the valley to the photosensitive unit can be different when the illumination information is fed back to the pressed fingerprint, so that the photosensitive unit can feel different light intensities to form different earth leakage currents, and the magnitude or the magnitude of the current is in direct proportion to the light intensity fed back by the peak or the valley, so that the fingerprint information can be obtained.
It should be understood that the above design is applicable to all Light Emitting Diode (LED) type screens, such as OLED, AMOLED, Micro-LED, etc.
Optionally, in an embodiment of the present application, when the display screen is an LCD screen, the optical image capturing unit 100 is disposed at a position of a part of color units of pixels of the LCD screen.
As shown in fig. 6, the optical image pickup unit 100 may occupy a partial position of one color cell in a pixel.
Alternatively, the light sensing unit 140 may be disposed on a Thin Film Transistor (TFT) layer of the LCD panel. In addition, alternatively, the light sensing unit 140 may multiplex circuits of the TFT layer to form an optical signal detection circuit.
For example, as shown in fig. 7, the light sensing unit 140 may be a photodiode as shown in the figure, which has a light sensing material and can generate a ground leakage current when encountering light. The photodiode is connected in parallel with an energy storage capacitor of a circuit of a TFT layer of the LCD screen. The triode and the energy storage capacitor in the circuit of the TFT layer form a detection circuit, and when the photodiode is detected to have leakage current, corresponding comparison current data is transmitted. The light intensity is in direct proportion to the leakage current. The circuit feeds back corresponding coordinate information and corresponding leakage current information through corresponding channels for current detection, so that corresponding position information and fingerprint information can be obtained.
When the optical image capturing unit 100 is integrated in the LCD screen, a light leakage channel is to be disposed above the optical image capturing unit 100 in the LCD screen, and the light leakage channel is in an open state when the photosensitive unit 140 detects an optical signal.
Specifically, in order to ensure that the light sensing unit on the TFT layer can sense the light intensity variation above the TFT layer to the maximum extent, the structure above the TFT layer needs to be specially configured for the light sensing unit so that sufficient light signals can be transmitted during the light sensing unit detecting the light signals. For example, a light leakage channel may be provided in each layer above the TFT layer, such as a color filter layer, at a position corresponding to the light sensing unit, the light leakage channel being in an open state at least when the light sensing unit detects the optical signal.
In the embodiment of the present application, the information acquired by each optical image pickup unit 100 may be used to form one pixel of the picked-up image. The entire captured image can be obtained by an array formed by a plurality of optical image capturing units 100.
Taking fingerprint sensing as an example, each optical image capturing unit 100 will sense the light intensity converged above it, and then convert the light intensity into an electrical signal through the light sensing unit 140 to form an original value of the fingerprint. The array of the optical image pickup units 100 obtains the original value of the fingerprint of the entire identification area as shown in fig. 8, thereby finally obtaining the fingerprint image.
Optionally, in an embodiment of the present application, the optical image capturing unit 100 may further include:
the medium layer is used for transmitting the optical signal and is arranged at least one of the following positions:
between the micro-lens 110 and the first light blocking layer 120, within the window 121, or between the first light blocking layer 120 and the photosensitive unit 140.
The dielectric layer may connect the micro lens 110, the first light blocking layer 120, and the light sensing unit 140. The dielectric layer is used for transmitting the optical signal, namely the optical signal can be transmitted through the dielectric layer.
Optionally, in an embodiment of the present application, as shown in fig. 9, the dielectric layer may include:
a transparent dielectric layer 150 disposed in the window 121 and above the first light blocking layer 120;
and a passivation layer 160 disposed between the micro lens 110 and the transparent dielectric layer 150.
Optionally, the transparent dielectric layer 150 includes a first transparent dielectric layer 151 and a second transparent dielectric layer 152, wherein the second transparent dielectric layer 152 is used for connecting the first transparent dielectric layer 151 and the passivation layer 160.
The first transparent medium layer 151 covers the first light blocking layer 120, so that the first light blocking layer 120 can be protected. In the case where the first transparent dielectric layer 151 is not well bonded to the passivation layer 160, the second transparent dielectric layer 152, which is well bonded to the passivation layer 160, may be used to connect the first transparent dielectric layer 151 and the passivation layer 160.
For example, the passivation layer 160 may be made of the same organic material as the microlens, the first transparent dielectric layer 151 may be silicon oxide, and the second transparent dielectric layer 152 may be silicon nitride, so as to achieve the connection therebetween.
Alternatively, the micro lens 110 and the passivation layer 160 may be a unitary structure. That is, the micro lens 110 and the passivation layer 160 may be processed from an integrated organic material.
Alternatively, the microlens 110 and the passivation layer 160 may not be an integral structure, and different materials may be used. In the case that the micro-lens 110 and the passivation layer 160 are not well bonded, other connection layers may be used to connect therebetween.
Optionally, in an embodiment of the present application, the optical image capturing unit 100 may further include:
and a filter layer disposed in an optical path from the micro lens 110 to the light sensing unit 140, for filtering out optical signals in a non-target wavelength band and transmitting optical signals in a target wavelength band (i.e., optical signals in a wavelength band required for optical image acquisition).
For example, the filter layer may be formed by plating an arbitrary dielectric layer in the middle of the optical path. Optionally, the transmittance of the filter layer for light in a target wavelength band is greater than or equal to 80%, and the cut-off rate for light in a non-target wavelength band is greater than or equal to 80%.
The embodiment of the present application also provides an optical image acquisition system, which includes the array of the optical image acquisition units 100 of the embodiment of the present application.
In the optical image capturing system, each optical image capturing unit 100 corresponds to one pixel of a captured image, and the optical image capturing system obtains the captured image by an array of a plurality of optical image capturing units 100.
The optical image acquisition unit is disposed in the display screen, for example, in the display screen in the foregoing various manners. Optionally, a setting period of the optical image capturing unit 100 in the display screen is greater than or equal to a setting period of pixels of the display screen.
Optionally, the number of optical image capturing units 100 in each row or each column of the array is not less than 10.
It should be understood that the setting period or number of the optical image capturing units 100 may be set according to the requirements of image resolution, the size of the image capturing area, and other factors, and the embodiments of the present application are not limited thereto.
Optionally, the optical image acquisition system further comprises:
and a light incident angle screening unit disposed above the optical image capturing unit 100, for transmitting light within a specific incident angle range and blocking light outside the specific incident angle range.
The light incidence angle screening unit is used for screening angles. For example, the light incident angle screening unit may require a very small incident angle to select a light signal that is incident substantially vertically downward.
Optionally, the optical image acquisition system may further include: and the supporting structure is used for supporting the optical image acquisition unit. In addition, optionally, the support structure may be disposed under the display screen to support the optical image capturing unit.
It should be understood that the optical image capturing system may further include a corresponding processing chip, etc., which is not limited in this application.
The embodiment of the present application further provides an electronic device, which may include a display screen and the optical image capturing system according to the embodiment of the present application, wherein the optical image capturing system is disposed in the display screen.
The electronic device may be any electronic device having a display screen.
The display screen may be the one described above, such as an OLED screen or an LCD screen. For the description of the display screen and the arrangement of the optical image capturing unit, reference may be made to the description above, and for brevity, the description is omitted here.
It should be understood that the specific examples in the embodiments of the present application are for the purpose of promoting a better understanding of the embodiments of the present application and are not intended to limit the scope of the embodiments of the present application.
It is to be understood that the terminology used in the embodiments of the present application and the appended claims is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments of the present application. For example, as used in the examples of this application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
Those of ordinary skill in the art will appreciate that the elements of the examples described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the components and steps of the examples have been described above generally in terms of their functionality in order to clearly illustrate the interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
In the several embodiments provided in the present application, it should be understood that the disclosed system and apparatus may be implemented in other manners. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the units is only one logical division, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may also be an electric, mechanical or other form of connection.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiments of the present application.
In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.
The integrated unit, if implemented in the form of a software functional unit and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present application may be substantially or partially contributed by the prior art, or all or part of the technical solution may be embodied in a software product, which is stored in a storage medium and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
While the invention has been described with reference to specific embodiments, the scope of the invention is not limited thereto, and those skilled in the art can easily conceive various equivalent modifications or substitutions within the technical scope of the invention. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (28)

1. The utility model provides an optical image acquisition unit, is applicable to inside in order to realize that optical fingerprint detects in the screen of display screen, its characterized in that, optical image acquisition unit includes:
a micro-lens;
the first light blocking layer is arranged below the micro lens and provided with a window;
the photosensitive unit is arranged below the first light blocking layer;
the micro lens is used for converging an optical signal formed by a finger above the display screen to a window of the first light blocking layer and transmitting the optical signal to the photosensitive unit through the window, and the photosensitive unit is used for receiving the optical signal to acquire fingerprint information of the finger.
2. The optical image capturing unit of claim 1, wherein the display screen is an Organic Light Emitting Diode (OLED) display screen, and the optical image capturing unit is disposed between the display units of the OLED display screen.
3. The optical image capturing unit of claim 2, wherein the OLED display comprises a hole transport layer, an organic light emitting layer, an electron transport layer, an anode, and a cathode, and wherein the light sensing unit of the optical image capturing unit is configured to multiplex the anode and the cathode of the OLED display to form the optical signal detecting circuit.
4. The optical image capturing unit of claim 2, wherein the optical image capturing unit is configured to use a portion of the display unit of the OLED display screen as an excitation light source; the light signal received by the photosensitive unit is reflected light formed by irradiating the light signal emitted by the display unit to a finger above the OLED display screen.
5. The optical image capturing unit of claim 1, wherein the display screen is a Liquid Crystal Display (LCD) display screen, and the optical image capturing unit is configured to be disposed at a portion of one of the color cells of the LCD display screen.
6. The optical image capturing unit of claim 5, wherein the LCD display is configured with a light leakage channel above the optical image capturing unit, the light leakage channel being in an open state when the light sensing unit detects the light signal.
7. The optical image capturing unit of claim 5, wherein the photosensitive unit is disposed on a thin film transistor layer of the LCD, and multiplexes a circuit of the thin film transistor layer to form an optical signal detecting circuit.
8. The optical image capturing unit of claim 7, wherein the photosensitive unit comprises a photodiode, and the photodiode and the storage capacitor of the thin-film transistor layer are connected in parallel.
9. The optical image capturing unit as claimed in claim 5, wherein the light signal received by the light sensing unit is a reflected light formed by a finger above the LCD screen being irradiated by a light signal from an external light source.
10. The optical image capturing unit of claim 1, further comprising:
and the second light blocking layer is arranged on the side of the micro lens and used for blocking light signals on the side of the micro lens from entering the micro lens so as to reduce crosstalk between adjacent optical image acquisition units.
11. The optical image capturing unit of any one of claims 1 to 10, wherein the first light blocking layer is a metal layer, and the window is a small hole formed in the metal layer.
12. The optical image capturing unit of claim 11, wherein the focal point of the micro-lens is located at the window of the first light blocking layer.
13. The optical image capturing unit of claim 11, wherein the window is a cylindrical aperture formed in the metal layer, and the diameter of the cylindrical aperture is greater than 100 nm.
14. The optical image capturing unit of any one of claims 1 to 10, wherein the light sensing unit is a complementary metal oxide semiconductor device having a light sensitivity to a light signal of a specific wavelength band greater than a first predetermined threshold and a quantum efficiency greater than a second predetermined threshold.
15. The optical image capturing unit of any one of claims 1 to 10, further comprising:
the transparent medium layer is arranged above the first light blocking layer and fills the window of the first light blocking layer.
16. The optical image capturing unit of claim 15, further comprising:
and the passivation layer is formed between the micro lens and the first transparent medium layer.
17. The optical image capturing unit of claim 16, further comprising:
and the second transparent medium layer is arranged between the first transparent medium layer and the passivation layer and is used for connecting the first transparent medium layer and the passivation layer so as to enable the first transparent medium layer and the passivation layer to be tightly combined.
18. The optical image capturing unit of claim 17, wherein the first transparent dielectric layer is a silicon oxide layer and the second transparent dielectric layer is a silicon nitride layer.
19. The optical image capturing unit of claim 16, wherein the micro-lens is a resin lens, and the passivation layer and the micro-lens are integrated by using the same organic material.
20. The optical image capturing unit of claim 16, wherein a connection layer is formed between the micro-lens and the passivation layer, the connection layer connecting the micro-lens and the passivation layer to make them tightly bonded.
21. The optical image capturing unit of claim 1, further comprising:
and the filter layer is arranged on a light path from the micro lens to the photosensitive unit and used for filtering optical signals of non-target wave bands and transmitting the optical signals of the target wave bands.
22. The optical image capturing unit of claim 21, further comprising a first transparent dielectric layer disposed over the first light blocking layer and filling the window of the first light blocking layer; the filter layer is a coating film formed on the surface of the first transparent medium layer.
23. The optical image capturing unit of claim 21, further comprising:
the first transparent medium layer is arranged above the first light blocking layer;
the passivation layer is arranged between the micro lens and the first transparent medium layer; and the number of the first and second groups,
the second transparent medium layer is arranged between the first transparent medium layer and the passivation layer;
the filter layer is a coating film formed on the surface of the second transparent dielectric layer or the passivation layer.
24. The optical image capturing unit of claim 1, further comprising:
and the light incident angle screening unit is arranged above the micro lens and is used for screening light signals in a specific incident angle range and transmitting the light signals to the micro lens.
25. An optical image acquisition system comprising an optical image acquisition array disposed inside a display screen, the optical image acquisition array comprising a plurality of optical image acquisition units, the optical image acquisition units being as claimed in any one of claims 1 to 24.
26. The optical image capturing system of claim 25, wherein the period of the optical image capturing units within the display screen is greater than or equal to the pixel period of the display screen, and the number of optical image capturing units per row or column in the optical image capturing array is greater than or equal to 10.
27. The optical image acquisition system of claim 25, further comprising:
and the supporting structural part is used for supporting the optical image acquisition unit and is arranged below the display screen.
28. An electronic device with an on-screen fingerprint recognition function, comprising a display screen and an optical image acquisition system formed inside the display screen, wherein the optical image acquisition system has a plurality of optical image acquisition units, and the optical image acquisition units are the optical image acquisition units according to any one of claims 1 to 24.
CN201920914764.XU 2018-09-21 2018-09-21 Optical image acquisition unit, optical image acquisition system, and electronic apparatus Active CN210142328U (en)

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CN201821556519.8U CN209103317U (en) 2018-09-21 2018-09-21 Optical image acquisition unit, optical image acquisition system and electronic equipment

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