CN210142319U

CN210142319U - Intelligent temperature control device for computer

Info

Publication number: CN210142319U
Application number: CN201920858113.3U
Authority: CN
Inventors: 王巍
Original assignee: Pingdingshan University
Current assignee: Pingdingshan University
Priority date: 2019-06-06
Filing date: 2019-06-06
Publication date: 2020-03-13
Anticipated expiration: 2029-06-06

Abstract

The utility model discloses an intelligence temperature control device for computer relates to computer equipment technical field, including upper portion heat dissipation box and lower part heat dissipation box, a plurality of fans are all installed to the two inside, and the inside hot-air pump of host computer is sent to quick-witted case outside to the upper portion heat dissipation box, inside the outside normal atmospheric temperature air pump of host computer is sent to the host computer to the lower part heat dissipation box, the wind channel of going into and going out under making the inside formation of host computer, to the not good quick-witted case of heat dispersion originally, promote heat dispersion on the basis that does not change quick-witted case structure greatly, and can not influence the original dustproof performance of quick-witted case, for computer hardware fan provides an upgrade selection.

Description

Intelligent temperature control device for computer

Technical Field

The utility model relates to a computer equipment technical field especially relates to an intelligent temperature control device for computer.

Background

Computers are information processing devices indispensable to various fields such as office work and teaching at present, and have become very popular as important products in the information age.

Fig. 1 shows a host layout of a typical desktop computer, a power supply bin 110 and a motherboard 120 are installed inside a chassis 100, a power supply module is installed inside the power supply bin 110, the power supply module converts 220V mains supply into a voltage level required by the motherboard 120, a display card 130, a fan, a hard disk, and other devices, an interface board 121 is provided on the motherboard 120, various interfaces such as audio, USB, video, and a network interface are integrated on the interface board, and a CPU (central processing unit), a memory stick, and the display card 130 are all plugged into a dedicated slot on the motherboard 120. Due to the limited space inside the enclosure 100, the space remaining after installation of the numerous electronic devices has been relatively tight. In addition, the electronic device generates heat during operation, and in order to dissipate the heat as soon as possible to ensure the normal operation of the electronic device, a chassis manufacturer needs to design a reasonable air duct so that the fan and other devices can dissipate the heat mixed in the air to the outside of the chassis as soon as possible after the air in the chassis flows.

However, heat dissipation is considered, and dust prevention is also considered. Dust protection and heat dissipation are two conflicting requirements to some extent, because dust protection requires the inside of the chassis to be isolated from the outside as much as possible, while heat dissipation is the opposite. Dust accumulation and high temperatures can lead to shorter life of electronic devices, and therefore good cabinets need to find a balance between heat dissipation and dust prevention. But the chassis with good heat dissipation and dust prevention has higher cost, which causes higher price and heavier burden on common consumers. Generally, the heat generation condition of a host used by a user is not serious, so that most of cases can place dust prevention at the first place for the sake of life and safety, and heat dissipation holes are formed in the bottom and the rear of the case only. Although the temporary heat dissipation requirement can be met, the heat productivity is obviously increased after the user upgrades the hardware, and the dustproof case is considered to be obviously insufficient for the heat dissipation requirement, so that the user can only replace the case in the case, and the financial resources and the resources are wasted.

SUMMERY OF THE UTILITY MODEL

An embodiment of the utility model provides an intelligence temperature control device for computer can solve the problem that exists among the prior art.

The utility model provides an intelligent temperature control device for a computer, which comprises a lower heat dissipation box and an upper heat dissipation box, wherein the lower heat dissipation box comprises an air outlet box and a lower air guide pipe, the air outlet box is a hollow cubic box body, a plurality of air outlet holes are formed in the top surface of the air outlet box, the lower air guide pipe is installed at one end of the top surface of the air outlet box, the lower air guide pipe is a hollow cubic box body, and the inner space of the lower air guide pipe is communicated with the inner space of the air outlet box;

the upper heat dissipation box comprises an air inlet box and an upper air guide pipe, the air inlet box is a hollow cubic box body, a plurality of air inlet holes are formed in the bottom surface of the air inlet box, the upper air guide pipe is installed at one end of the bottom surface of the air inlet box, the upper air guide pipe is a hollow cubic box body, and the inner space of the upper air guide pipe is communicated with the inner space of the air inlet box;

the air conditioner is characterized in that a plurality of lower vent holes are formed in the side face, back to the air outlet box, of the lower air guide pipe, a plurality of upper vent holes are formed in the side face, back to the air inlet box, of the upper air guide pipe, a plurality of fans are installed inside the air outlet box and the air inlet box respectively, power wires of the fans are connected to a mainboard inside the case or a power module in an inserted mode, and the lower heat dissipation box and the upper heat dissipation box are installed on the inner bottom face and the inner top face of the case respectively.

The utility model provides a pair of intelligent temperature control device for computer, including upper portion heat dissipation box and lower part heat dissipation box, a plurality of fans are all installed to the two inside, and the inside hot-air pump of host computer is sent to quick-witted case outside to the heat dissipation box in upper portion, inside the outside normal atmospheric temperature air pump of host computer is sent to the host computer to the heat dissipation box in lower part, make the inside wind channel of going into and going out under forming of host computer, to the not good quick-witted case of heat dispersion originally, promote heat dispersion greatly on the basis that does not change quick-witted case structure, and can not influence the original dustproof performance of quick-witted case, for computer hardware fan provides an upgrading selection.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic diagram of a host computer arrangement in the prior art;

FIG. 2 is a schematic structural view of a temperature control device installed in a host without a display card according to the present invention;

FIG. 3 is a schematic structural view of a temperature control device installed in a host with a display card according to the present invention;

FIG. 4 is a schematic view of the internal structure of the heat dissipation box of the lower portion of FIG. 3;

fig. 5 is a schematic view of a fan hub.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 2 and 3, the embodiment of the utility model provides an intelligence temperature control device for computer, the device include lower part heat dissipation box and upper portion heat dissipation box two parts, lower part heat dissipation box is including going out wind box 200 and lower part guide duct 210, it is hollow cube box body to go out wind box 200, has seted up a plurality of exhaust vents on its top surface, lower part guide duct 210 vertical fixation is in the one end of going out wind box 200 top surface, this lower part guide duct 210 also is hollow cube box body, its inner space with the inner space intercommunication of going out wind box 200.

The upper heat dissipation box comprises an air inlet box 300 and an upper air guide pipe 310, the air inlet box 300 is a hollow cubic box body, a plurality of air inlet holes are formed in the bottom surface of the air inlet box, the upper air guide pipe 310 is vertically fixed at one end of the bottom surface of the air inlet box 300, the upper air guide pipe 310 is also a hollow cubic box body, and the inner space of the upper air guide pipe 310 is communicated with the inner space of the air inlet box 300.

In this embodiment, the width of the upper air guiding pipe 310 in the horizontal direction is smaller than the width of the air inlet box 300, and the width difference between the two widths is at least equal to the standard width of an interface board on a main board installed in the chassis, so that the upper air guiding pipe 310 can be staggered from the interface board when the upper heat dissipation box is installed, thereby avoiding the occurrence of interference.

To facilitate the installation of the upper and lower heat-dissipating boxes, they are connected using at least one strut 400. One end of the supporting rod 400 is arranged on the top surface of the air outlet box 200 of the lower heat dissipation box, and the other end of the supporting rod 400 is arranged on the bottom surface of the air inlet box 300 of the upper heat dissipation box. In this embodiment, in order to improve the adaptability of the temperature control device, the supporting rod 400 is a telescopic structure, that is, the supporting rod is composed of a plurality of sleeves which are nested inside and outside, and a certain damping is provided between the plurality of sleeves, so that the upper heat dissipation box and the lower heat dissipation box can be kept relatively stable when the distance does not need to be adjusted. Branch 400 is detachable still installs on upper portion heat dissipation box and the lower part heat dissipation box, specifically, install the upper portion nut on the air inlet box 300 bottom surface of upper portion heat dissipation box, install the lower part nut on the play wind box 200 top surface of lower part heat dissipation box, the both ends of branch 400 have respectively with the external screw thread that the internal thread of upper portion nut and lower part nut matches. If the arrangement of the electrical devices inside the cabinet is inconvenient to install the bar 400, the bar may be removed and the upper and lower heat-dissipating boxes may be installed inside the cabinet using screws.

Because the graphics card in the host is not necessary hardware, some CPUs integrate GPUs, and the graphics card may not be installed in the host when the user does not need high-performance image processing capability. In this case, there is no block on the rear side of the inside of the chassis, and in order to further improve the stability and convenience of installation, the lower air guiding duct 210 of the lower heat-dissipating box and the upper air guiding duct 310 of the upper heat-dissipating box are abutted against each other to support the upper heat-dissipating box to a certain extent.

When a display card is installed in the host, the display card needs to be fixed on the rear side surface inside the chassis, so that the lower air guide pipe 210 and the upper air guide pipe 310 are separated by the display card and cannot be abutted together, and at this time, the lower air guide pipe 210 needs to be replaced with a shorter length so that the display card can be installed smoothly and cannot be blocked by the lower air guide pipe 210. Thus, the lower air guiding duct 210 needs to be detachably mounted on the air outlet box 200, and the detachable mounting manner can be realized by screw mounting. The upper air guide duct 310 may be detachably mounted to the inlet box 300 in the same manner.

The lower air duct 210 and the upper air duct 310 are respectively provided with a plurality of lower vent holes and a plurality of upper vent holes on the side surfaces back to the air outlet box 200 and the air inlet box 300, and after being installed inside the case, the lower vent holes are over against the display card installation position heat dissipation holes at the rear part of the case, and the upper vent holes are over against the CPU heat dissipation holes at the rear part of the case. Because lower part ventilation hole and upper portion ventilation hole are used for the air inlet respectively and the air-out, and inhale with by the wind temperature that blows out different, in order to avoid inhaling and the wind that blows out influence each other, the stand pipe is all installed to lower part ventilation hole and upper portion ventilation hole department, and two stand pipes opposite direction of orientation.

Referring to fig. 4, at least one fan is installed inside the air outlet box 200 and the air inlet box 300, taking the air outlet box 200 as an example, a mounting hole is opened on the top surface of the air outlet box 200, a cover plate 220 is detachably installed on the mounting hole, the cover plate 220 is installed by adopting devices such as screws and magnets, and the fan 230 inside the air outlet box 200 can be exposed after the cover plate 220 is opened. Every fan 230 all uses screw ann detachable to install at the bottom surface in the play wind box 200, just fan 230 in the play wind box 200 upwards drives the air, blows off from the exhaust vent on the play wind box 200 top surface, the fan in the box 300 that advances upwards drives the air, inhales the air inlet hole on the air inlet box 300 below from the bottom surface.

Since a single fan 230 has a limited air moving capability, a plurality of fans may be installed in the outlet case 200 and the inlet case 300. However, the fan needs power supply, if the number of fans is large, it will result in the fan power supply interface on the power module or the fan power supply interface on the mainboard being not enough, therefore the embodiment of the present invention discloses in the air-out box 200 and the air-in box 300 install a fan concentrator respectively, as shown in fig. 5, this fan concentrator one end has a fan power plug, and the other end has a plurality of fan power sockets, the one end that has the plug is drawn from the air-out box 200 and the air-in box 300, the one end that has the socket is then fixed inside the air-out box 200 and the air-in box 300, the plugs of all fans 230 of air-out box 200 and air-in box 300 internally mounted can all be inserted on the socket of fan concentrator, and the plug of fan concentrator is inserted on power module or mainboard, just can normally provide power supply for each. If insert the fan concentrator on the fan power interface of mainboard, because present mainstream mainboard all possesses the intelligent speed governing function to the fan, consequently go out fan 230 in fan box 200 and the air inlet box 300 and also can realize intelligent speed governing, reach the intelligent control by temperature change purpose to the computer.

The above disclosure is only for a few specific embodiments of the present invention, however, the present invention is not limited to the embodiments, and any changes that can be considered by those skilled in the art shall fall within the protection scope of the present invention.

Claims

1. An intelligent temperature control device for a computer is characterized by comprising a lower heat dissipation box and an upper heat dissipation box, wherein the lower heat dissipation box comprises an air outlet box and a lower air guide pipe, the air outlet box is a hollow cubic box body, a plurality of air outlet holes are formed in the top surface of the air outlet box, the lower air guide pipe is installed at one end of the top surface of the air outlet box, the lower air guide pipe is a hollow cubic box body, and the inner space of the lower air guide pipe is communicated with the inner space of the air outlet box;

2. The intelligent temperature control device for a computer as claimed in claim 1, wherein the upper heat dissipation box and the lower heat dissipation box are connected by at least one support rod, one end of the support rod is installed on the top surface of the air outlet box of the lower heat dissipation box, and the other end of the support rod is installed on the bottom surface of the air inlet box of the upper heat dissipation box.

3. The intelligent temperature control device for computer as claimed in claim 2, wherein said support rod is a telescopic structure.

4. The intelligent temperature control device for a computer according to claim 2, wherein an upper nut is installed on the bottom surface of the air inlet box of the upper heat dissipation box, a lower nut is installed on the top surface of the air outlet box of the lower heat dissipation box, two ends of the support rod are respectively provided with external threads matched with the internal threads of the upper nut and the lower nut, and two ends of the support rod are respectively screwed in the upper nut and the lower nut.

5. The intelligent temperature control device for a computer of claim 1, wherein the lower air duct and the upper air duct are detachably mounted on the air outlet box and the air inlet box respectively through screws.

6. The intelligent temperature control device for a computer according to claim 1, wherein guide pipes are installed at the lower vent hole and the upper vent hole, and the guide pipes installed at the lower vent hole and the upper vent hole face in opposite directions.

7. The intelligent temperature control device for the computer according to claim 1, wherein a fan hub is installed in each of the air outlet box and the air inlet box, one end of the fan hub having a plug is led out from the air outlet box and the air inlet box and is plugged in a power module or a motherboard, one end of the fan hub having a socket is fixed inside the air outlet box and the air inlet box, and the plugs of the fans in the air outlet box and the air inlet box are plugged in the socket of the fan hub.