CN210136861U

CN210136861U - Wafer cutting feed arrangement

Info

Publication number: CN210136861U
Application number: CN201921104702.9U
Authority: CN
Inventors: 黄宗伟; 刘欣; 戚传斌
Original assignee: Dongguan Shunshuo Communication Technology Co Ltd
Current assignee: Dongguan Shunshuo Communication Technology Co Ltd
Priority date: 2019-07-15
Filing date: 2019-07-15
Publication date: 2020-03-10
Anticipated expiration: 2029-07-15

Abstract

The utility model discloses a wafer cutting and feeding device, which comprises a guide rail and a feeding mechanism connected with the guide rail in a sliding way, wherein the feeding mechanism comprises a sliding frame, a cylinder, a telescopic rod, a gas storage box, a sucker and an air pump, the sliding frame is connected with the guide rail in a sliding way, the cylinder is fixedly arranged on the lower surface of the sliding frame, the telescopic rod is fixedly welded with a piston rod of the cylinder, the gas storage box is fixedly arranged at the lower end of the telescopic rod, and the sucker is fixedly arranged on the lower surface of the gas storage box, thereby preventing the wafer surface from being damaged.

Description

Wafer cutting feed arrangement

Technical Field

The utility model relates to a wafer cutting technical field, more specifically say, in particular to wafer cutting feed arrangement.

Background

With the development of technology, the integrated level of integrated circuits is higher and higher, the types of integrated circuits are more and more, and the wafers used are more and more, the wafers refer to silicon wafers used for manufacturing silicon semiconductor integrated circuits, and the wafers are called wafers because the wafers are circular, the wafers are basic materials for manufacturing semiconductor chips, the wafers are products obtained by cutting and polishing wafer cylinders through a cutting machine, the existing wafer feeding mechanism is complex in structure, the placement positions of the wafers cannot be controlled stably, and the wafers are easily damaged in the conveying process.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a wafer cutting feed arrangement to overcome the defect that prior art exists.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a wafer cutting feed arrangement, include the guide rail and with guide rail sliding connection's feeding mechanism, feeding mechanism includes sliding frame, cylinder, telescopic link, gas storage box, sucking disc and air pump, sliding frame and guide rail sliding connection, cylinder fixed mounting is at the sliding frame lower surface, and the piston rod of cylinder is towards below, the telescopic link is with the piston rod fixed welding of cylinder, gas storage box fixed mounting is at the telescopic link lower extreme, sucking disc fixed mounting is at gas storage box lower surface, and the sucking disc is connected with the gas storage box intercommunication, air pump fixed mounting is at the sliding frame side surface, and the gas port intercommunication of air pump is connected with the hose, and the hose other end intercommunication is connected in the gas storage box, telescopic link surface cover.

Further, a sliding groove opening is formed in the upper surface of the guide rail along the length direction, a connecting plate is fixedly mounted on the top surface of the inside of the sliding frame and movably inserted into the sliding groove opening, a sliding plate is slidably arranged inside the guide rail and fixedly connected with the lower end of the connecting plate, a threaded hole is formed in the surface of the sliding plate, a lead screw motor is fixedly mounted at one end of the guide rail, and the sliding plate is connected with a lead screw shaft of the lead screw motor in a matched mode through the threaded hole

Further, the slide has all been seted up along the long direction on the guide rail both sides surface, the equal fixed mounting of two inside walls of sliding frame has the stopper, the stopper all with the slide sliding connection who corresponds the position.

Further, the upper end of the spring is attached to the lower surface of a piston rod of the air cylinder, and the lower end of the spring is attached to the upper surface of the air storage box.

Compared with the prior art, the utility model has the advantages of: the utility model discloses simple structure, the sliding frame passes through the lead screw motor and rotates and can remove on the guide rail, makes the sucking disc press on the wafer surface through the cylinder is flexible, breathes in through the air pump, and the absorption that the wafer can be stable is on the sucking disc, moves to the suitable position of blowing through the sliding frame this moment, then the air pump gassing, and the wafer can break away from the sucking disc, can realize the stable transport of wafer, through the spring action of spring, can reduce the effort of sucking disc or gas storage box collision wafer to avoid the wafer surface to receive the damage.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a structural diagram of a wafer cutting and feeding device according to the present invention;

fig. 2 is a sectional view of the guide rail of the present invention.

In the figure: the device comprises a guide rail 1, a sliding frame 2, a screw rod motor 3, a sliding groove opening 4, a connecting plate 5, a sliding plate 6, a threaded hole 7, a slideway 8, a limiting block 9, an air cylinder 10, an expansion link 11, an air storage box 12, a sucker 13, a spring 14, an air pump 15 and a hose 16.

Detailed Description

The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, and the scope of the present invention can be more clearly and clearly defined.

Referring to fig. 1 and fig. 2, the utility model provides a wafer cutting feed arrangement, including guide rail 1 and with 1 sliding connection's of guide rail feeding mechanism, feeding mechanism includes smooth frame 2, cylinder 10, telescopic link 11, gas storage box 13, sucking disc 13 and air pump 15,

smooth frame

2 and 1 sliding connection of guide rail, cylinder 10 fixed mounting is at smooth frame 2 lower surface, the piston rod of cylinder 10 is towards below, telescopic link 11 and cylinder 10's piston rod fixed welding, gas storage box 13 fixed mounting is at telescopic link 11 lower extreme, sucking disc 13 fixed mounting is at gas storage box 13 lower surface, and sucking disc 13 is connected with gas storage box 13 intercommunication, 15 fixed mounting of air pump is at smooth frame 2 side surfaces, the gas port intercommunication of air pump 15 is connected with hose 16, the hose 16 other end intercommunication is connected in gas storage box 13, 11 surface covers of telescopic link are equipped with spring.

In this embodiment, a sliding groove opening 4 is formed in the upper surface of the guide rail 1 along the length direction, a connecting plate 5 is fixedly mounted on the top surface inside the sliding frame 2, the connecting plate 5 is movably inserted into the sliding groove opening 4, a sliding plate 6 is slidably disposed inside the guide rail 1, the sliding plate 6 is fixedly connected with the lower end of the connecting plate 5, a threaded hole 7 is formed in the surface of the sliding plate 6, a lead screw motor 3 is fixedly mounted at one end of the guide rail 1, and the sliding plate 6 is in fit connection with a lead screw shaft of the.

In this embodiment, slide 8 has all been seted up along the long direction on the surface of 1 both sides of guide rail, and the equal fixed mounting of two inside walls of smooth frame 2 has stopper 9, and stopper 9 all with the slide 8 sliding connection who corresponds the position, has guaranteed the stability of smooth frame 2 on guide rail 1 removal.

In this embodiment, 14 upper ends of the springs are attached to the lower surface of the piston rod of the cylinder 10, 14 lower ends of the springs are attached to the upper surface of the gas storage box 12, and the acting force of the suction disc 13 or the gas storage box 12 colliding with the wafer can be reduced through the elastic action of the springs 14, so that the surface of the wafer is prevented from being damaged.

The utility model discloses a theory of operation does: firstly, the guide rail 1 is installed at a proper position of a wafer feeding route, the sliding frame 2 can move on the guide rail 1 through the rotation of the screw rod motor 3, the sucking disc 13 is pressed on the surface of a wafer through the expansion and contraction of the air cylinder 10, the air pump 15 sucks air at the moment, the wafer can be stably adsorbed on the sucking disc 13, the sliding frame 2 moves to a proper position of discharging at the moment, then the air pump 15 exhausts air, and the wafer can be separated from the sucking disc, so that the wafer is conveyed.

Although the embodiments of the present invention have been described with reference to the accompanying drawings, various changes and modifications can be made by the owner within the scope of the appended claims, and the protection scope of the present invention should not be exceeded by the claims.

Claims

1. The utility model provides a wafer cutting feed arrangement, includes the guide rail and with guide rail sliding connection's feeding mechanism, its characterized in that: feeding mechanism includes sliding frame, cylinder, telescopic link, gas storage box, sucking disc and air pump, sliding frame and guide rail sliding connection, cylinder fixed mounting is at the sliding frame lower surface, and the piston rod of cylinder is towards below, the telescopic link is with the piston rod fixed welding of cylinder, gas storage box fixed mounting is at the telescopic link lower extreme, sucking disc fixed mounting is at the gas storage box lower surface, and the sucking disc is connected with the gas storage box intercommunication, air pump fixed mounting is at the sliding frame side surface, and the gas port intercommunication of air pump is connected with the hose, and the hose other end intercommunication is connected in the gas storage box, telescopic link surface cover is equipped with the spring.

2. The wafer cutting and feeding device as set forth in claim 1, wherein: the guide rail is characterized in that a sliding groove opening is formed in the upper surface of the guide rail along the length direction, a connecting plate is fixedly mounted on the top surface of the inside of the sliding frame and movably inserted into the sliding groove opening, a sliding plate is slidably arranged inside the guide rail and fixedly connected with the lower end of the connecting plate, a threaded hole is formed in the surface of the sliding plate, a lead screw motor is fixedly mounted at one end of the guide rail, and the sliding plate is connected with a lead screw shaft of the lead screw motor.

3. The wafer cutting and feeding device as set forth in claim 1, wherein: the slide has all been seted up along the long direction in guide rail both sides surface, the equal fixed mounting of two inside walls of smooth frame has the stopper, and the stopper all with the slide sliding connection who corresponds the position.

4. The wafer cutting and feeding device as set forth in claim 1, wherein: the upper end of the spring is attached to the lower surface of a piston rod of the air cylinder, and the lower end of the spring is attached to the upper surface of the air storage box.