CN210129901U

CN210129901U - Electronic equipment and TOF module of making a video recording thereof

Info

Publication number: CN210129901U
Application number: CN201920613669.6U
Authority: CN
Inventors: 陈飞帆; 魏罕钢; 王晓锋; 皇甫贵珍
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2019-04-30
Filing date: 2019-04-30
Publication date: 2020-03-06
Anticipated expiration: 2029-04-30

Abstract

The utility model provides a TOF camera module, wherein the TOF camera module comprises a receiving module, a floodlight module, at least one electronic component part and a supporting piece, wherein at least one of the electronic component parts is arranged on the support member, and the electronic component part on the support member is conductively connected to the receiving module and/or the floodlight module, wherein the receiving module comprises a first photosensitive element and a first circuit board, wherein the first photosensitive element is conductively connected to the first circuit board, the first lens assembly is kept on a light sensing path where the first light sensing element is located, the floodlight module is supported on at least part of the first circuit board through the supporting piece, the support member is mounted on the first circuit board, and the size of the TOF camera module can be reduced by the arrangement position of the electronic component part.

Description

Electronic equipment and TOF module of making a video recording thereof

Technical Field

The utility model relates to degree of depth information module field of making a video recording especially involves an electronic equipment and TOF module of making a video recording.

Background

The TOF camera module, i.e. Time of Flight, is to use a sensor to emit modulated light, and then, after encountering an object to be reflected, the sensor obtains depth information about the object by calculating a Time difference or a phase difference between the emitted light and the received light reflected from the object.

At present in the electronic equipment field especially mobile electronic equipment field, along with the progress of science and technology and the upgrading of consumer's demand, also more and more to the requirement of camera, the consumer not only wants to obtain clear image through the camera, still wants whole electronic equipment to possess more functions, say that the camera of beginning is rearmounted, be used for shooing the object, increased the flash light again afterwards, in order to satisfy that the consumer conveniently uses the camera under the darker condition of light, afterwards, the leading camera has been increased again for the consumer can directly shoot own image at the in-process of using electronic equipment.

Mobile electronic equipment develops to today, from the beginning, carries on a camera and upgrades to two cameras or even three cameras gradually, probably carries on the module of making a video recording that is used for acquireing the degree of depth information in the future, and whole electronic equipment's function is more and more powerful, and inside structure and design are also more and more complicated.

Obviously, the space available for carrying the functional module of the whole electronic device is limited, the TOF camera module itself occupies more space than a single camera, because for a single TOF camera module, it includes a floodlight for emitting light and a receiving module for receiving light, the size of the receiving module is similar to that of a normal camera, and the floodlight further occupies at least part of the installation space of the electronic device.

How to leave more installation space for the electronic device equipped with the TOF camera module when other functional modules are to be installed in the future or how to enable the electronic device to be equipped with more functional modules is a problem that needs attention.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an electronic equipment and TOF module of making a video recording thereof, wherein TOF module of making a video recording has less height dimension.

Another object of the utility model is to provide an electronic equipment and TOF module of making a video recording thereof, wherein through the adjustment a floodlight of module and a relative dimension who receives the module are made a video recording in order to improve space utilization to the TOF.

Another object of the utility model is to provide an electronic equipment and TOF module of making a video recording thereof, wherein an electronic components portion position of TOF module of making a video recording can be planned to be favorable to dwindling the size of TOF module of making a video recording.

Another object of the utility model is to provide an electronic equipment and TOF module of making a video recording thereof, wherein the module is made a video recording to the TOF the position of electronic components portion can be set up according to the demand.

Another object of the utility model is to provide an electronic equipment and TOF module of making a video recording thereof, wherein the module is made a video recording to the TOF the figure of electronic components portion can be increased and do not influence wholly the size of module is made a video recording to the TOF.

According to an aspect of the utility model provides a TOF module of making a video recording, it includes:

a receiving module;

a floodlight module;

at least one electronic component part; and

a support member, wherein at least one of the electronic component parts is accommodated in the support member, and the electronic component part positioned on the support member is conductively connected to the receiving module and/or the floodlight module, wherein the receiving module comprises a first photosensitive element and a first circuit board, the first photosensitive element is conductively connected to the first circuit board, and the floodlight module is positioned above the first circuit board and is supported on at least part of the first circuit board through the support member.

According to an embodiment of the present invention, the support member has at least one accommodation hole, and the electronic component part is accommodated in the accommodation hole.

According to the utility model discloses an embodiment, support piece integrated into one piece in electronic components portion.

According to the utility model discloses an embodiment, the TOF module of making a video recording further includes a connecting circuit, wherein electronic components portion passes through connecting circuit switch on in first circuit board and/or the floodlight module.

According to the utility model discloses an embodiment, support piece is installed respectively in first circuit board with the floodlight module group.

According to an embodiment of the present invention, the floodlight module comprises a light emitting element, a bracket and a second circuit board, wherein the light emitting element is conductively connected to the second circuit board, the bracket is supported by the second circuit board and surrounds the light emitting element, and the supporting member is integrally formed on the second circuit board.

According to an embodiment of the present invention, at least a part of a circuit portion of the second circuit board forms at least one of the electronic component parts.

According to the utility model discloses an embodiment, support integrated into one piece in the second circuit board.

According to the utility model discloses an embodiment, electronic components portion is embedded in support piece.

According to an embodiment of the present invention, the supporting member is a ceramic substrate.

According to the utility model discloses an embodiment, the upper surface of floodlight module with the difference in height of receiving the module is no longer than 0.15 mm.

According to an embodiment of the present invention, the supporting member is integrally formed on the first circuit board.

According to the utility model discloses an on the other hand, the utility model provides an electronic equipment, it includes:

an electronic device main body; and

according to the above TOF camera module, the TOF camera module is disposed on the electronic device main body.

Drawings

Fig. 1 is a schematic diagram of a TOF camera module according to a preferred embodiment of the present invention.

Fig. 2 is a schematic diagram of an electronic device according to a preferred embodiment of the present invention.

Fig. 3 is a schematic diagram of a TOF camera module according to another preferred embodiment of the invention.

Fig. 4 is a schematic diagram of a TOF camera module according to another preferred embodiment of the invention.

Fig. 5 is a schematic diagram of a TOF camera module according to another preferred embodiment of the invention.

Fig. 6 is a schematic diagram of a TOF camera module according to another preferred embodiment of the invention.

Fig. 7 is a schematic diagram of a TOF camera module according to another preferred embodiment of the invention.

Fig. 8 is a schematic diagram of a TOF camera module according to another preferred embodiment of the invention.

Fig. 9 is a schematic diagram of a TOF camera module according to another preferred embodiment of the invention.

Fig. 10 is a schematic diagram of a TOF camera module according to another preferred embodiment of the invention.

Fig. 11 is a schematic diagram of a TOF camera module according to another preferred embodiment of the invention.

Detailed Description

The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents and other technical solutions without departing from the spirit and scope of the invention.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in a generic and descriptive sense only and not for purposes of limitation, as the terms are used in the description to indicate that the referenced device or element must have the specified orientation, be constructed and operated in the specified orientation, and not for the purpose of limitation.

It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.

Referring to fig. 1, a TOF camera module 1 according to a preferred embodiment of the invention is illustrated. The TOF camera module 1 has a small size, in particular a small height size. Fig. 2 shows an electronic device 1000 with the TOF camera module 1, wherein the electronic device 1000 comprises an electronic device main body 2 and the TOF camera module 1, wherein the TOF camera module 1 is arranged on the electronic device 1000 main body. The electronic device 1000 main body may also be provided with other camera modules, such as a short-focus camera shaft, a middle-focus camera module, a long-focus camera module, and the like. TOF module 1 and other make a video recording the module cooperation work to can acquire depth information when shooing the image.

When the TOF camera module 1 is small in size, the main body of the electronic device 1000 can have more accommodating spaces for installation

The TOF camera module 1 comprises a floodlight module 10, a receiving module 20 and a plurality of electronic component parts 30, wherein at least one of the electronic component parts 30 is conductively connected to the floodlight module 10, and at least one of the electronic component parts 30 is conductively connected to the receiving module 20. The electronic component part 30 is turned on, which means that at least a part of the electronic component part 30 is used for supporting the corresponding floodlight module 10 or the receiving module 20 to work.

It should be noted that the electronic component part 30 may include an electronic component 31 and/or an electronic component 32, the electronic component 32 may be a passive component such as a resistor, a capacitor, etc., and the electronic component 31 may be an active component such as an IC controller, etc., wherein the size of the driving IC is larger, and occupies more space than the electronic component such as a common resistor, capacitor, etc.

The TOF camera module 1 may include a floodlight assembly conductively connected to the receiving module assembly, and a receiving module assembly for radiating light outwardly, the light being reflected after encountering the object, the receiving module assembly receiving the reflected light, thereby obtaining depth information about the object based on a time difference or a phase difference between the emitted light and the reflected light. The floodlight assembly comprises the floodlight module 10 and at least one electronic component part 30, wherein the electronic component part 30 is conductively connected with the floodlight module 10. The receiving module assembly comprises the receiving module 20 and at least one electronic component part 30, wherein the electronic component part 30 is conductively connected to the receiving module 20.

The size of the TOF camera module 1 is reduced by the arrangement of the electronic component part 30.

Specifically, the receiving module 20 includes a first lens assembly 21, a first light sensing element 22 and a first circuit board 23, wherein the first lens assembly 21 provides an optical path for light to pass through and reach the first light sensing element 22 for photoelectric conversion, and the first light sensing element 22 is conductively connected to the first circuit board 23. It will be appreciated that in some fingerprint modules, the first lens assembly 21 is not required.

The first lens assembly 21 includes a first lens 211 and a base 212, wherein the base 212 surrounds and forms an optical window, the first lens 211 is supported by the base 212 and is held in a light sensing path of the first light sensing element 22, so that light passes through the first lens 211 and then reaches the first light sensing element 22 through the optical window.

The floodlight module 10 comprises a projecting component 11 and a second circuit board 12, wherein the projecting component 11 is conductively connected to the second circuit board 12, and the second circuit board 12 is conductively connected to the first circuit board 23 of the receiving module 20. The second circuit board 12 may be a ceramic substrate, a rigid-flex board, or a circuit board.

In this embodiment, at least a portion of the second circuit board 12 of the floodlight module 10 is located above at least a portion of the first circuit board 23 of the receiving module 20, that is, when the second circuit board 12 of the floodlight module 10 is orthographically projected on the first circuit board 23 along the height direction, at least a portion of the second circuit board 12 is located inside the first circuit board 23.

It is also possible that at least part of the second circuit board 12 of the luminaire module 10 overlaps at least part of the first circuit board 23 of the receiving module 20 in the height direction.

In this way, not only the area size of the whole TOF camera module 1 is reduced, but also a light emitting surface of the floodlight module 10 and a light receiving surface of the receiving module 20 are located on approximately the same plane, so as to facilitate the processing of obtaining information for the TOF camera module 1.

Further, the TOF camera module 1 includes a supporting component 40, wherein the supporting component 40 includes a supporting component 41, and the supporting component 41 supports the projecting component 11 of the floodlight module 10 on the first circuit board 23 of the receiving module 20. By means of the support 41, the projecting assembly 11 can be superimposed on the first circuit board 23 of the receiving module 20, and the upper surface of the floodlight module 10 and the upper surface of the receiving module 20 can be as flush as possible. Optionally, the height difference between the upper surface of the floodlight module and the receiving module is not more than 0.15 mm.

The height of the supporting member 41 can be set according to the requirement, for example, when the height difference between the projecting module 11 and the receiving module 20 of the floodlight module 10 is large, the height of the supporting member 41 can be set to be high, so that the upper surface of the projecting module 11 and the upper surface of the receiving module 20 are as flush as possible. For example, when the height difference between the projecting assembly 11 and the receiving module 20 of the floodlight module 10 is small, the height of the supporting member 41 can be set to be low, so that the upper surface of the projecting assembly 11 supported by the supporting member 41 can be lifted to be located on the same plane as the upper surface of the receiving module 20 as much as possible.

The projecting assembly 11 can be mounted on the supporting member 41, and then the supporting member 41 is mounted on the first circuit board 23 of the receiving module 20. Alternatively, the supporting member 41 may be mounted on the first circuit board 23 of the receiving module 20, and then the projecting assembly 11 may be mounted on the supporting member 41.

The supporting member 41 may be independent from the projecting component 11 and the first circuit board 23 of the receiving module 20, for example, the supporting member 41 may be selectively mounted on the projecting component 11 or the receiving module 20 according to the user's requirement. The supporting member 41 may be mounted to the projecting assembly 11 and the receiving module 20 by means of adhesion. The user can select the support 41 with a proper height according to the requirement based on the height difference between the projecting component 11 and the receiving module 20, and also can select the support 41 with a proper size according to the size of the area of the second circuit board 12 exposed to be used for mounting the projecting component 11 and the size of the area occupied by the projecting component 11 required to be mounted on the second circuit board 12.

According to other embodiments of the present invention, the supporting member 41 may be formed on the first circuit board 23 of the receiving module 20 by an integral molding method. The supporting member 41 may be formed by injection molding or molding.

According to other embodiments of the present invention, the supporting member 41 may be formed on the second circuit board 12 of the projecting assembly 11 by an integral molding method. The supporting member 41 may be formed by injection molding or molding.

The supporting member 41 may be a solid supporting base or a hollow supporting frame.

The electronic component part 30 may be accommodated in the support 41, thereby facilitating the size reduction of the whole TOF camera module 1. The electronic component part 30 may be accommodated in a space formed by the supporting member 41, and the electronic component part 30 may be disposed on the supporting member 41, for example, but not limited to, being mounted on the supporting member 41, or the electronic component part 30 and the supporting member 41 may be integrally formed.

Further, the supporting member 41 has at least one receiving hole 400, wherein at least one electronic component part 30 is received in the receiving hole 400 of the supporting member 41. In this way, the area size of the TOF camera module 1 can be advantageously reduced.

Specifically, in the TOF camera module 1, the electronic component part 30 is generally disposed on the upper surface of the first circuit board 23 of the receiving module 20, and the first circuit board 23 needs to be designed to have a larger area size for supporting the electronic component part 30. When at least a part of the electronic component part 30 is mounted on the support 41, the first circuit board 23 does not need to reserve a space for the electronic component part 30, so that the area size of the first circuit board 23 can be reduced, and the electronic component part 30 located on the support 41 does not increase the area size of the support 41 and does not affect the height size of the support 41, thereby facilitating the reduction of the size of the whole TOF camera module 1.

Further, the size and the position of the receiving hole 400 can be set according to the requirement, for example, the position of the receiving hole 400 on the upper surface of the supporting member 41 can be preset, so that when the electronic component part 30 is installed in the receiving hole 400, it can be directly aligned with the second circuit board 12 of the floodlight module 10.

The depth of the accommodating hole 400 can be set according to requirements, for example, when the depth of the electronic component part 30 corresponding to the accommodating hole 400 is deeper, the depth of the accommodating hole 400 can be set to be deeper, so that after the electronic component part 30 is installed in the accommodating hole 400, the electronic component part 30 does not protrude from the accommodating hole 400. The height of the accommodating hole 400 may be the same as that of the electronic component section 30, or the accommodating hole 400 may be slightly higher than that of the electronic component section 30.

In some embodiments of the present invention, the electronic component part 30 placed in the accommodating hole 400 is directly contacted to the second circuit board 12 of the floodlight module 10, and the electronic component part 30 is conductively connected to the second circuit board 12.

When the number of the electronic component parts 30 located on the support member 41 is plural, the electronic component parts 30 may be arranged in at least one column or at least one row. Here, for example only, the position of the electronic component part 30 on the supporting member 41 may be set according to the requirement by setting the position of the receiving hole 400. When the number of the electronic component parts 30 is large, a plurality of the electronic component parts 30 may be placed in one of the accommodating holes 400, that is, the accommodating hole 400 may be designed to have a deep depth, for example, the accommodating hole 400 directly penetrates the supporting member 41 from top to bottom, or the accommodating hole 400 directly penetrates the supporting member 41 in a horizontal direction.

In other words, the positions, sizes, depths and positions, numbers and sizes of the electronic component parts 30 of the receiving holes 400 can be set according to the requirements of users or the operation requirements of the receiving module 20 and the floodlight module 10.

Further, the supporting component 40 includes the supporting component 41 and at least one connecting circuit 42, wherein the connecting circuit 42 is located in the supporting component 41, the connecting circuit 42 has a plurality of connecting points 421, one of the connecting points 421 is located on an upper surface of the supporting component 41, one of the connecting points 421 is located on a lower surface of the supporting component 41, the projecting component 11 is located on the upper surface of the supporting component 41, and the supporting component 41 is supported on an upper surface of the first circuit board 23. The connection point 421 located on the upper surface of the supporting member 41 can be used for conducting the projection assembly 11, and the connection point 421 located on the lower surface of the supporting member 41 is used for conducting the second circuit board 12.

It should be noted that the connection circuit 42 may be a linear wire, so that the electronic component part 30 is respectively conducted to the receiving module 20 and the projecting assembly 11. The connecting circuit 42 may also be implemented as a multilayer circuit disposed inside the supporting member 41 to achieve the mutual conduction between the electronic component part 30 and the receiving module 20 and the projecting assembly 11, respectively.

The supporting member 41 has at least one receiving hole 400, and the receiving hole 400 is used for receiving the electronic component part 30. At least one of the connection points 421 may be located in the receiving hole 400, and when the electronic component part 30 is placed in the receiving hole 400, the electronic component part 30 may be conducted to the outside through the connection point 421. That is, the electronic component part 30 placed in the receiving hole 400 of the supporting member 41 can be conducted to the projecting assembly 11 and the second circuit board 12 of the receiving module 20 through the connecting circuit 42.

The supporting member 41 may form the receiving hole 400 during molding, that is, the receiving hole 400 may be previously provided even when the supporting member 41 is manufactured, i.e., the receiving hole 400 is formed. After the support member 41 is molded, a hole may be drilled in the surface of the support member 41 for placing the electronic component part 30.

The receiving hole 400 may be formed on the upper surface of the supporting member 41, on the lower surface of the supporting member 41, or on the side surface of the supporting member 41.

In the present embodiment, the supporting member 41 is a solid structure, and the connecting circuit 42 is embedded in the supporting member 41.

The receiving hole 400 is formed on the upper surface of the supporting member 41 for illustration, but it should be understood by those skilled in the art that the receiving hole is only for illustration and is not intended to limit the present invention.

After the supporting member 41 with the receiving hole 400 is obtained, the electronic component part 30 is placed in the receiving hole 400, so that the electronic component part 30 is conductively connected to the connection point 421 of the connection circuit 42 exposed to the receiving hole 400. Then, a connection medium, such as conductive silver paste, may be filled inward, so that the electronic component part 30 is stably received in the receiving hole 400, so as to maintain stable connection between the electronic component part 30 and the connection point 421. The upper surface of the electronic component part 30 may be directly contacted to the second circuit board 12 of the projecting component 11 and conductively connected to the second circuit board 12 of the projecting component 11. Of course, the electronic component part 30 can also be electrically connected to the second circuit board 12 of the projection module 11 through the connection circuit 42, so that the projection module 11 can operate with the aid of the electronic component part 30.

It is noted that in this example, the connection circuit 42 is located inside the support 41. In other embodiments of the present invention, the connection circuit 42 may be located outside the supporting member 41, for example, the connection circuit 42 is implemented as a flexible board, and then the electronic component part 30 and the first circuit board 23 of the receiving module 20, and the second circuit board 12 of the projecting assembly 11 are respectively conducted outside the supporting member 41.

By arranging the electronic component part 30 in the accommodating hole 400 of the support member 41, the area size of the TOF camera module 1 can be effectively reduced, and meanwhile, because the electronic component part 30 is arranged in the accommodating hole 400 of the support member 41, the electronic component part 30 can be prevented from being exposed, so that the possibility that the electronic component part 30 is polluted is reduced.

It should be noted that, in the TOF camera module 1, the electronic component parts 30 are disposed on the first circuit board 23 of the receiving module 20, and on one hand, due to process limitations of the first circuit board 23, and on the other hand, in order to prevent mutual interference between adjacent electronic component parts 30, the interval between the electronic component parts 30 needs to be maintained to be greater than or equal to 0.25 mm.

The present invention provides an embodiment, the supporting member 41 not only can provide a larger accommodating space in the height direction, but also can provide a larger accommodating space in the area size direction, and when the electronic component part 30 is disposed, more selecting spaces are available. Further, the material for manufacturing the supporting member 41 of the supporting member 41 is selected according to the requirement, for example, the material capable of reducing the mutual interference of the electronic component parts 30 is selected, so that the arrangement of the electronic component parts 30 located on the supporting member 41 can be more compact.

In the embodiment of the present invention, at least part of the electronic component part 30 is disposed on the supporting member 41, making full use of the height difference between the receiving module 20 and the projecting component 11, so that the electronic component part 30 can be disposed at different heights, and the electronic component part 30 can be disposed more compactly, which is beneficial to the miniaturization of the TOF camera module 1.

Further, the projection assembly 11 includes a light emitting element 111 and a bracket 112, wherein the light emitting element 111 is conductively supported on the second circuit board 12, the bracket 112 is supported on the second circuit board 12, and the bracket 112 forms a receiving cavity, wherein the light emitting element 111 is received in the receiving cavity.

The projection assembly 11 may further include an optical auxiliary element 113, wherein the optical auxiliary element 113 is supported by the bracket 112 and is held in a light emitting path of the light emitting element 111. After the light emitting element 111 emits light, the light is radiated outward again through the optical auxiliary element 113.

The optical auxiliary element 113 may be an optical diffraction element, the optical auxiliary element 113 is used for assisting the light emitting element 111 to radiate light outwards, and the type of the optical auxiliary element 113 is not limited to the above examples.

Further, the bracket 112 may be formed on the second circuit board 12 by an integral molding method, such as ceramic sintering integral molding. The bracket 112 may also be assembled to the second circuit board 12.

The height of the floodlight module 10 is generally lower than that of the receiving module 20 for the whole TOF camera module 1, and the height of the floodlight module 10 can be adjusted by the height of the bracket 112. The higher the height of the bracket 112, the higher the height of the floodlight module 10, and the lower the height of the bracket 112, the lower the height of the floodlight module 10.

The height of the upper surface of the floodlight module 10 can be adjusted by adjusting the heights of the bracket 112 and the supporting member 41, and the higher the heights of the bracket 112 and the supporting member 41 are, the higher the position of the upper surface of the floodlight is. When the number of the supporting members 41 required to accommodate the electronic component parts 30 is large, the height of the supporting members 41 can be set to be high, and the height of the bracket 112 can be set to be low, so that the upper surface of the floodlight module 10 is flush with the upper surface of the receiving module 20.

Further, according to some embodiments of the present invention, at least a portion of the electronic component part 30 received in the receiving hole 400 is conductively connected to the first circuit board 23 of the receiving module 20, and at least a portion of the electronic component part 30 received in the receiving hole 400 is conductively connected to the second circuit board 12 of the projection assembly 11.

Referring to fig. 3, there is shown another embodiment of the TOF camera module 1 according to the present invention. The present embodiment is different from the above-described embodiments in the support 41A of the support assembly 40A.

In this embodiment, the supporting member 41A is implemented as a hollow structure. The supporting members 41A are independently installed on the projecting assembly 11 and the receiving module 20, respectively.

The electronic component section 30 is accommodated in the accommodation hole 400 of the support member 41A.

Specifically, the supporting member 41A includes a supporting platform 411A and two supporting arms 412A extending downward from two ends of the supporting platform 411A, wherein the supporting arms 412A support the supporting platform 411A on the first circuit board 23.

A space exists between the support base 411A and the support arm 412A, and the electronic component unit 30 may be placed in the space surrounded by the support base 411A and the support arm 412A.

The support arm 412A may be attached to the first circuit board 23 by bonding, and the support arm 412A and the support base 411A are integrally formed. The number of the support arms 412A is not limited to one, and even the shape of the support member 41 is not limited thereto. The electronic component section 30 may be accommodated in a hollow portion of the support 41A.

In the present embodiment, at least one electronic component part 30 is accommodated in the supporting platform 411A of the supporting member 41A, and preferably, the supporting member 41A provides an accommodating position corresponding to the second circuit board 12 of the floodlight module 10. The electronic component part 30 in the accommodated position can be directly conductively connected to the second circuit board 12 of the luminaire module 10.

Further, at least one of the electronic component parts 30 is accommodated in the supporting arm 412A of the supporting member 41A, and preferably, the accommodating position provided by the supporting arm 412A corresponds to the first circuit board 23 of the receiving module 20. The electronic component part 30 located at the accommodating position of the support arm 412A can be directly conductively connected to the first circuit board 23 of the receiving module 20.

In the present embodiment, the accommodating position of the supporting member 41A is preset by the form of the accommodating hole 400, and in other embodiments of the present invention, the supporting member 41A does not need to preset the accommodating hole 400.

It should be noted that, by being pre-disposed in the accommodating hole 400 of the supporting member 41A, at least a part of the mounted electronic component part 30 may be exposed, for example, in the present embodiment, at least a part of the electronic component part 30 may be directly contacted with the first circuit board 23 or the second circuit board 12. The electronic component part 30 may be completely embedded in the support 41. For example, after the electronic component part 30 is placed in the accommodating hole 400, a material may be filled in the accommodating hole 400 to cover the surface of the electronic component part 30. The filling material may or may not be the same as the material used to form the support member 41A.

Referring to fig. 4, there is shown another embodiment of the TOF camera module 1 according to the above preferred embodiment of the present invention. The present embodiment is different from the above-described embodiments mainly in the support member 41 and the electronic component section 30.

In this embodiment, the electronic component part 30 may be directly embedded in the supporting member 41.

Specifically, in the manufacturing process, the electronic component part 30 may be arranged on the connection circuit 42, and then the supporting member 41 may be formed outside the electronic component part 30 and the connection circuit 42, for example, by injection molding or molding the supporting member 41. In this way, the electronic component part 30 can be directly embedded in the support 41. The supporting member 41 does not need to reserve the accommodating hole 400 for subsequent installation of the electronic component part 30.

Alternatively, the supporting member 41 may be formed directly around the electronic component part 30 by injection molding, die pressing or molding, and at least a portion of the electronic component part 30 is not covered by the manufacturing material. When the supporting member 41 is formed, at least a portion of the electronic component part 30 is exposed to the outside and can be directly conducted to the first circuit board 23 or the second circuit board 12.

According to other embodiments of the present invention, the supporting member 41 may be formed outside the connecting circuit 42 by injection molding or molding, the accommodating hole 400 is formed, and the electronic component part 30 is mounted in the accommodating hole 400, wherein the electronic component part 30 is conductively connected to the connecting circuit 42. Alternatively, the supporting member 41 may be formed outside the electronic component part 30 by injection molding or molding, and then the connecting circuit 42 may be mounted on the supporting member 41 after forming the hole, so that the electronic component part 30 is conductively connected to the connecting circuit 42.

Referring to fig. 5, there is shown another embodiment of the TOF camera module 1 according to the above preferred embodiment.

The present embodiment differs from the above embodiments mainly in the support 41, the second circuit board 12, and the bracket 112.

In this embodiment, the supporting member 41 is integrally formed on the second circuit board 12 of the projecting assembly 11. For example, the support 41 and the second circuit board 12 of the projection assembly 11 may be a ceramic substrate. The bracket 112 of the projecting assembly 11 is supported by the support 41 and the second circuit board 12. The holder 112 is used for supporting the optical auxiliary element 113. Further, the bracket 112 is integrally formed with the second circuit board 12.

The support assembly 40 includes the support member 41 and the connection circuit 42, and the electronic component part 30 located on the support member 41 is conductively connected to the first circuit board 23 and/or the second circuit board 12, respectively. For example, one of the electronic component parts 30 is conductively connected to the second circuit board 12 of the projection assembly 11, and the other electronic component part 30 is conductively connected to the first circuit board 23 of the receiving module 20. Optionally, the electronic component part 30 located on the supporting member 41 is respectively conducted to the first circuit board 23 and the second circuit board 12 through the connecting circuit 42. The connection circuit 42 may be located inside the supporting member 41, or may be located outside the supporting member 41.

Further, the supporting member 41 may be pre-reserved with the receiving hole 400, the connection point 421 of the connection circuit 42 is exposed to the receiving hole 400, and the electronic component part 30 is conductively connected to the connection circuit 42 when the electronic component part 30 is placed in the receiving hole 400. The electronic component section 30, the connection circuit 42, and the circuit portion of the second circuit board 12 may be provided in advance, the electronic component section 30 may be conductively connected to the connection circuit 42, and the connection circuit 42 may be conductively connected to the circuit portion of the second circuit board 12. After the electronic component part 30, the connection circuit 42 and the circuit portion of the second circuit board 12 are fixed, the supporting member 41 and the second circuit board 12 are formed around the electronic component part 30 and the connection circuit 42 by injection molding, press molding or molding.

Referring to fig. 6, there is shown another embodiment of the TOF camera module 1 according to the above preferred embodiment.

The difference between this embodiment and the above embodiments is mainly that the supporting member 41 is a ceramic substrate.

Specifically, the supporting member 41 includes a conductive layer 410, a circuit layer 420, an insulating layer 430 and a heat sink portion 440, wherein the insulating layer 430 is connected to the conductive layer 410 and the circuit layer 420, respectively, and the heat sink portion 440 is formed on the conductive layer 410 and the circuit layer 420. Preferably, one end of the connection circuit 42 is located on an upper surface of the heat dissipation portion 440, and the other end of the connection circuit 42 is located on the lower surface of the heat dissipation portion 440. The conductive layer 410 and the wiring layer 420 are developed by a light irradiation, and then formed by plating. Alternatively, the end of the connection circuit 42 may be formed on one side surface.

The supporting member 41 has good heat dissipation performance, and the supporting member 41 is independent of the projecting assembly 11 and the receiving module 20. The electronic component part 30 may be installed through the receiving hole 400 reserved in the supporting member 41, or may be placed in advance during the forming process of the supporting member 41.

Referring to fig. 7, there is shown another embodiment of the TOF camera module 1 according to the above preferred embodiment.

The TOF camera module 1 comprises the floodlight module 10, the receiving module 20 and at least one electronic component part 30, wherein the electronic component part 30 is respectively connected with the floodlight module 10 and the receiving module 20 in a conducting manner.

The floodlight module 10 comprises the projection assembly 11 and the second circuit board 12, wherein the projection assembly 11 comprises the light emitting element 111, the bracket 112 and the optical auxiliary member, the optical auxiliary member is supported by the bracket 112, and the light emitting element 111 of the projection assembly 11 is supported by the second circuit board 12 in a conductive manner.

The receiving module 20 includes a first lens assembly 21, a first light sensing element 22 and a first circuit board 23, the first light sensing element 22 is electrically connected to the first circuit board 23, and the first lens assembly 21 is held in a light sensing path where the first light sensing element 22 is located. The first lens assembly 21 includes the first lens 211 and the base 212, wherein the first lens 211 is supported by the base 212 and is held on a photosensitive path where the first photosensitive element 22 is located.

The receiving module 20 may further include a filter element 24, wherein the filter element 24 is attached to the first lens 211 upside down to facilitate reducing the height dimension of the receiving module 20.

The floodlight module 10 is supported on the first circuit board 23 of the receiving module 20.

Further, in the present embodiment, at least a portion of the electronic component part 30 is integrated with the first circuit board 23 of the receiving module 20.

The first circuit board 23 comprises two parts, one corresponding to the base 212 and the other corresponding to the luminaire module 10. At least part of the first circuit board 23 forms the support 41. The supporting member 41 supports the floodlight module 10 on the first circuit board 23 of the receiving module 20.

Specifically, in the manufacturing process of the first circuit board 23, the circuit portion where the first circuit board 23 is provided forms the electronic component section 30. That is, the type, number and connection relation of the electronic component parts 30 required for the operation of the TOF camera module 1 are predetermined, and when the first circuit board 23 is manufactured, the circuit part of the first circuit board 23 is designed, so that the circuit part of the first circuit board 23 can perform the function of the electronic component part 30 while performing the function of conduction.

For example, the cross-sectional area of the circuit portion of the first circuit board 23 is designed to be a certain size so that the portion can function as a resistor, or the circuit portion of the first circuit board 23 is designed so that the portion can function as a capacitor.

Further, the first circuit board 23 forms the support member 41 during the manufacturing process of the first circuit board 23. For example, after obtaining the circuit portion of the first circuit board 23, an insulating portion may be integrally formed on the circuit portion of the first circuit board 23, and the insulating portion may form a boss or a raised bracket 112 to form the supporting member 41.

The electronic component section 30 on the first circuit board 23 and other circuit portions of the first circuit board 23 are electrically connected to each other. The electronic component part 30 on the first circuit board 23 can also be conductively connected to the second circuit board 12 of the luminaire module 10. For example, the connection circuit 42 is located inside the main support body 41, or the connection circuit 42 is located outside the main support body 42.

The connection circuit 42 may be formed by previously holding the support member 41 in place and then integrally molding the support member 41 around the connection circuit 42. The connection circuit 42 may be mounted on the support 41 after the support 41 is formed.

The connection circuit 42 is only exemplary and is not limited to the formation or arrangement of the connection circuit.

At least part of the electronic component part 30 is integrated with the first circuit board 23 of the receiving module 20, which is beneficial to solving the manufacturing cost and simplifying the subsequent assembly process, as long as the floodlight module 10 is installed at the position where the supporting member 41 is formed on the first circuit board 23.

Further, the electronic component part 30 is disposed in a horizontal direction with respect to the first circuit board 23. When the electronic component part 30 is integrated with the first circuit board 23 of the receiving module 20 and located at the position of the supporting member 41, the area size of the first circuit board 23 does not need to reserve an installation space for installing the electronic component part 30, thereby being beneficial to reducing the area size of the whole TOF camera module 1.

Referring to fig. 8, there is shown another embodiment of the TOF camera module 1 according to the preferred embodiment described above.

The main differences between the present embodiment and the above-described embodiments are the first circuit board 23, the supporting member 41, and the electronic component section 30.

In this embodiment, the supporting member 41 is integrally formed on the first circuit board 23, and the accommodating hole 400 is reserved on the supporting member 41 in advance during the forming process of the supporting member 41. The accommodation hole 400 is used for accommodating the electronic component part 30.

For example, a circuit portion of the first circuit board 23 is formed first, and then an insulating portion is formed on the circuit portion, wherein the insulating portion forms a boss or a raised bracket as the supporting member 41, and the accommodating hole 400 is reserved.

It will be understood by those skilled in the art that the present disclosure is illustrative only, and the manner of manufacturing the first circuit board 23 is not limited thereto. The circuit portion of the first circuit board 23 may be formed layer by etching, and the insulating portion may be formed layer by layer along with the circuit portion.

The electronic component part 30 is then mounted in the housing hole 400. The size of the receiving hole 400 may be different to accommodate different types and sizes of the electronic component part 30.

It is understood that, after the supporting member 41 is integrally formed, the receiving hole 400 is formed in the supporting member 41 by drilling, and then the electronic component part 30 is mounted in the receiving hole 400.

Referring to fig. 9, there is shown another embodiment of the TOF camera module 1 according to the above preferred embodiment.

The receiving module 20 includes the first lens assembly 21, the first light sensing element 22 and the first circuit board 23, the first light sensing element 22 is electrically connected to the first circuit board 23, and the first lens assembly 21 is held in a light sensing path where the first light sensing element 22 is located. The first lens assembly 21 includes the first lens 211 and the base 212, wherein the first lens 211 is supported by the base 212 and is held on a photosensitive path where the first photosensitive element 22 is located.

The receiving module 20 may further include a filter element 24, wherein the filter element 24 may be attached to the first lens 211 in an inverted manner, so as to facilitate reducing the height dimension of the receiving module 20.

Further, in the present embodiment, the electronic component part 30 is integrated with the second circuit board 12 of the floodlight module 10.

Specifically, in the manufacturing process of the second circuit board 12, the circuit portion where the second circuit board 12 is provided forms the electronic component section 30. That is, the type, number and connection relation of the electronic component parts 30 required for the operation of the TOF camera module 1 are predetermined, and when the second circuit board 12 is manufactured, the circuit part of the second circuit board 12 is designed, so that the circuit part of the second circuit board 12 can have the expected function of the electronic component part 30 while performing a conduction function.

For example, the cross-sectional area of the circuit portion of the second circuit board 12 is designed to be a certain size so that the portion can function as a resistor, or the circuit portion of the second circuit board 12 is designed so that the portion can function as a capacitor.

Further, the second circuit board 12 forms the support 41 during the manufacturing process of the second circuit board 12. For example, after obtaining the circuit portion of the second circuit board 12, an insulating portion may be integrally formed on the circuit portion of the second circuit board 12, and the insulating portion may form a boss or a raised bracket to form the supporting member 41.

The electronic component section 30 on the second circuit board 12 and other circuit portions on the second circuit board 12 are electrically connected to each other. The electronic component part 30 on the second circuit board 12 can also be conductively connected to the second circuit board 12 of the luminaire module 10. For example, the connection circuit 42 is located inside the supporting member 41, or the connection circuit 42 is located outside the supporting member 41.

The connection circuit 42 may be formed by being held in place in advance and then integrally forming the support member 41 around the connection circuit 42. The connection circuit 42 may be mounted on the support 41 after the support 41 is formed.

At least part of the electronic component part 30 is integrated with the second circuit board 12 of the receiving module 20, which is beneficial to solving the manufacturing cost and simplifying the subsequent assembly process, as long as the floodlight module 10 is installed at the position where the supporting member 41 is formed on the second circuit board 12.

Further, the electronic component part 30 is disposed in a horizontal direction with respect to the first circuit board 23. When the electronic component part 30 is integrated with the second circuit board 12 of the receiving module 20 and located at the position of the supporting member 41, the area size of the first circuit board 23 does not need to reserve an installation space for installing the electronic component part 30, thereby being beneficial to reducing the area size of the whole TOF camera module 1.

Referring to fig. 10, there is shown another embodiment of the TOF camera module 1 according to the preferred embodiment described above.

The main differences between the present embodiment and the above-described embodiments are the second circuit board 12, the supporting member 41, and the electronic component section 30.

In this embodiment, the supporting member 41 is integrally formed on the second circuit board 12, and the accommodating hole 400 is reserved on the supporting member 41 in advance during the forming process of the supporting member 41. The accommodation hole 400 is used for accommodating the electronic component part 30.

For example, a circuit portion of the second circuit board 12 is formed first, and then an insulating portion is formed on the circuit portion, wherein the insulating portion forms a boss or a raised bracket as the supporting member 41, and the accommodating hole 400 is reserved.

It will be understood by those skilled in the art that the present disclosure is illustrative only, and the second circuit board 12 is not limited thereto. The circuit portion of the second circuit board 12 may be formed layer by etching, and the insulating portion may also be formed layer by layer along with the circuit portion.

Referring to fig. 11, another preferred embodiment of the TOF camera module 1 according to the invention is illustrated.

The receiving module 20 includes the first lens assembly 21, the first photosensitive element 22, the first circuit board 23, and the filter element 24, the first photosensitive element 22 is electrically connected to the first circuit board 23, and the first lens assembly 21 is held in a photosensitive path where the first photosensitive element 22 is located. The first lens assembly 21 includes the first lens 211 and the base 212, wherein the first lens 211 and the filter element 24 are respectively supported by the base 212 and are held in a light sensing path where the first light sensing element 22 is located.

Further, the TOF camera module 1 includes the supporting component 40, wherein the supporting component 41 of the supporting component 40 supports the projecting component 11 of the floodlight module 10 on the first circuit board 23 of the receiving module 20. By means of the support 41, the projecting assembly 11 can be superimposed on the first circuit board 23 of the receiving module 20, and the upper surface of the floodlight module 10 and the upper surface of the receiving module 20 can be as flush as possible.

In the present embodiment, the supporting member 41 is integrally formed with the first circuit board 23 and the second circuit board 12.

For example, the circuit portion of the first circuit board 23, the circuit portion of the second circuit board 12 and the circuit portion of the supporting member 41 are obtained first, and then the supporting member 41, the first circuit board 23 or the second circuit board 12 is formed completely through an injection molding or a molding process. Alternatively, after the first circuit board 23 and the second circuit board 12 are completely obtained, the supporting member 41 may be formed between the first circuit board 23 and the second circuit board 12 by molding or injection molding.

The electronic component part 30 may be placed in advance and then the support member 41 may be formed around the electronic component. The electronic component part 30 may be passed through the receiving hole 400 of the supporter 41 and then mounted to the supporter 41. The electronic component part 30 and the first circuit board 23 or the second circuit board 12 can be electrically connected via the connection circuit 42, which has at least one connection point 421, and the electronic component part 30 can be directly conductively connected to the connection point 421.

It will be understood by those skilled in the art that the embodiments of the present invention as described above and shown in the drawings are given by way of example only and are not limiting of the present invention. The objects of the present invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the embodiments without departing from the principles, embodiments of the present invention may have any deformation or modification.

Claims

The module of making a video recording of TOF, its characterized in that includes:

a receiving module;

a floodlight module;

at least one electronic component part; and

a support member, wherein at least one of the electronic component parts is accommodated in the support member, and the electronic component part positioned on the support member is conductively connected to the receiving module and/or the floodlight module, wherein the receiving module comprises a first photosensitive element and a first circuit board, the first photosensitive element is conductively connected to the first circuit board, and the floodlight module is positioned above the first circuit board and is supported on at least part of the first circuit board through the support member.
2. The TOF camera module of claim 1, wherein the support has at least one receiving hole in which the electronic component part is received.
3. The TOF camera module of claim 1, wherein the support member is integrally formed with the electronic component portion.
4. The TOF camera module of claim 2, wherein the TOF camera module further comprises a connection circuit, wherein the electronics portion is conducted to the first circuit board and/or the floodlight module through the connection circuit.
5. The TOF camera module of claim 3, wherein the TOF camera module further comprises a connection circuit, wherein the electronics portion is conducted to the first circuit board and/or the floodlight module through the connection circuit.
6. The TOF camera module of claim 1, wherein the supports are mounted to the first circuit board and the floodlight module, respectively.
7. The TOF camera module of claim 2, wherein the supports are mounted to the first circuit board and the floodlight module, respectively.
8. The TOF camera module of claim 3, wherein the supports are mounted to the first circuit board and the floodlight module, respectively.
9. The TOF camera module of claim 1, wherein the floodlight module comprises a light emitting element, a bracket and a second circuit board, wherein the light emitting element is communicably connected to the second circuit board, the bracket is supported on the second circuit board and surrounds the light emitting element, wherein the support is integrally formed with the second circuit board.
10. The TOF camera module of claim 9, wherein the support has at least one receiving hole in which the electronic component part is received.
11. The TOF camera module of claim 9, wherein the support member is integrally formed with the electronic component portion.
12. The TOF camera module of claim 9 wherein at least a portion of a circuit portion of the second circuit board forms at least one of the electronic component portions.
13. The TOF camera module of any of claims 9 to 12, wherein the mount is integrally formed with the second circuit board.
14. The TOF camera module of any of claims 1 to 9 wherein the electronic component is embedded in the support member.
15. The TOF camera module of any of claims 1 to 9, wherein said support member is a ceramic substrate.
16. The TOF camera module of any one of claims 1 to 9, wherein the difference in height between the upper surface of the floodlight module and the receiving module does not exceed 0.15 mm.
17. The TOF camera module of claim 1, wherein the support is integrally formed with the first circuit board.
18. An electronic device, comprising:

an electronic device main body; and

the TOF camera module is arranged on the electronic equipment main body and comprises a receiving module, a floodlight module, at least one electronic component part and a supporting piece, wherein at least one electronic component part is contained in the supporting piece, the electronic component part positioned on the supporting piece is connected with the receiving module and/or the floodlight module in a conduction mode, the receiving module comprises a first photosensitive element and a first circuit board, the first photosensitive element is connected with the first circuit board in a conduction mode, and the floodlight module is positioned above the first circuit board and is supported on at least part of the first circuit board through the supporting piece.
19. The electronic device of claim 18, wherein the support has at least one receiving hole in which the electronic component part is received.
20. The electronic device of claim 18, wherein the support member is integrally formed with the electronic component part.
21. The electronic device of claim 19, wherein the TOF camera module further comprises a connection circuit, and wherein the electronic component part is conducted to the first circuit board and/or the floodlight module through the connection circuit.
22. The electronic device of claim 20, wherein the TOF camera module further comprises a connection circuit, and wherein the electronic component part is conducted to the first circuit board and/or the floodlight module through the connection circuit.
23. The electronic device of claim 18, wherein the supports are mounted to the first circuit board and the floodlight module, respectively.
24. The electronic device of claim 19, wherein the supports are mounted to the first circuit board and the floodlight module, respectively.
25. The electronic device of claim 20, wherein the supports are mounted to the first circuit board and the floodlight module, respectively.
26. The electronic device defined in claim 18 wherein the luminaire module comprises a light-emitting element, a bracket, and a second circuit board, wherein the light-emitting element is conductively coupled to the second circuit board, the bracket being supported on the second circuit board and surrounding the light-emitting element, and wherein the support member is integrally formed with the second circuit board.
27. The electronic device of claim 26, wherein the support has at least one receiving hole in which the electronic component part is received.
28. The electronic device of claim 26, wherein the support member is integrally formed with the electronic component part.
29. The electronic device of claim 26, wherein at least a portion of a circuit portion of the second circuit board forms at least one of the electronic component parts.
30. The electronic device of any of claims 26-29, wherein the bracket is integrally formed with the second circuit board.
31. The electronic device according to any one of claims 18 to 26, wherein the electronic component part is buried in the support member.
32. The electronic device of any of claims 18-26, wherein the support is a ceramic substrate.
33. The electronic device of any of claims 18-26, wherein the height difference between the upper surface of the floodlight module and the receiving module is no more than 0.15 mm.
34. The electronic device of claim 18, wherein the support is integrally formed with the first circuit board.