CN210129371U

CN210129371U - Ultra-thin matrix backlight unit

Info

Publication number: CN210129371U
Application number: CN201920750327.9U
Authority: CN
Inventors: 孟沾霆; 王科; 吴疆; 彭友
Original assignee: Anhui Xinruida Technology Co Ltd
Current assignee: Anhui Xinruida Technology Co Ltd
Priority date: 2019-05-23
Filing date: 2019-05-23
Publication date: 2020-03-06
Anticipated expiration: 2029-05-23

Abstract

The utility model discloses an ultra-thin matrix backlight unit, including PCB board, a plurality of LED, diffuser plate and diaphragm structure, the PCB board is the rectangle structure, and a plurality of LED passes through the array mode and welds side by side in PCB board top, LED's interval is littleer, and base plate LED is many, and the subregion is many, can realize that more regional areas adjust luminance, and the contrast is higher, and luminance is higher, the diaphragm structure includes prism piece and diffusion piece, and LED direct lighting process diffuser plate breaks up light, sees through the prism piece and brightens, evenly presents light through the diffusion piece at last, the diffuser plate top is provided with the prism piece, the prism piece top is provided with the diffusion piece. The utility model has the advantages that: the led is directly fixed on the substrate without using a lens, and the OD height can be less than 10 mm. The LED interval is smaller, and base plate LED is many, and the subregion is many, can realize the regional dimming in more regions, and the contrast is higher, and luminance is higher. The LED specification that this product used is 2835PCT material, and the cost is lower.

Description

Ultra-thin matrix backlight unit

Technical Field

The utility model relates to a backlight unit specifically is an ultra-thin matrix backlight unit, belongs to backlight unit application technical field.

Background

The traditional direct type backlight technology in the current LED display industry reaches the bottleneck, the OD (Optical Distance) on the appearance cannot be less than 10mm, and the contrast, the brightness and the like on the product performance reach the upper line. At present, in order to improve the product performance, all major manufacturers have developed new products, and focus on the mini led display technology. However, the current difficulty of the mini led technology lies in the huge transfer of the wafer and the need for upgrading on the COB, and the cost of the product is too high at present without substantial technological breakthrough. The small-space LED display technology is between the traditional direct type backlight and the mini LED display technology, the performance of the small-space LED display technology can be superior to that of the traditional direct type backlight, and the technical problems of huge transfer of mini LED and the like do not exist. At present, manufacturers in the industry put out similar schemes and are provided with lenses, but the space is almost the same as that of the traditional direct type backlight, and the area of the substrate is larger.

The drawbacks of the prior art include the following:

firstly, the OD of the whole machine of the traditional direct type backlight technology can not reach below 10mm, even 15mm is difficult.

Second, the conventional direct type backlight can realize local dimming and zone control, but the number of zones is limited, such design circuit is complicated and the cost is higher if the color is improved by matching with RGB three-color LEDs.

And thirdly, the current direct type backlight aims at saving energy, reducing consumption, cost and LED number, reducing lamp number, avoiding LED lamp shadow, and changing lens design for uniform light mixing.

SUMMERY OF THE UTILITY MODEL

The utility model discloses an it is few just in order to solve current straight following formula backlight product zone control, the highlight atomizing, problem that visual angle is little, and provide an ultra-thin matrix backlight unit, the utility model discloses directly not with lens admittedly on the base plate with LED, OD highly can accomplish below 10mm, the utility model discloses the LED interval is littleer, and base plate LED is many, and the subregion is many, can realize that more regional dimming, and the contrast is higher, and luminance is higher, the utility model provides a LED specification is 2835PCT material, and the cost is lower.

The purpose of the utility model can be realized by the following technical scheme: an ultrathin matrix backlight module comprises a PCB (printed circuit board), a plurality of LEDs, a diffusion plate and a diaphragm structure;

the PCB is of a rectangular structure, the LEDs are welded above the PCB side by side in an array mode, the distance between the LEDs is smaller, the number of the LEDs on the substrate is large, the LEDs are divided into a plurality of regions, regional dimming of more regions can be realized, the contrast is higher, and the brightness is higher;

the film structure comprises a prism sheet and a diffusion sheet, the LED directly emits light, the light is scattered through the diffusion sheet, the light is brightened through the prism sheet, and finally the light is uniformly displayed through the diffusion sheet;

the PCB is characterized in that a diffusion plate is arranged above the PCB, a prism sheet is arranged above the diffusion plate, and a diffusion sheet is arranged above the prism sheet.

The utility model discloses a further technological improvement lies in: the distance between every two LED along the X axle direction of PCB board is 8.93mm, and a plurality of LED is 6.28mm along the distance between every two Y axle direction of PCB board, guarantees that the welding is good, and electrical property is intact. The utility model discloses a LED interval is littleer, and LED on the PCB board is many, and the subregion is many, can realize that more regional dimming, and the contrast is higher, and luminance is higher.

The utility model discloses a further technological improvement lies in: the areas of the PCB, the diffusion plate, the prism sheet and the diffusion sheet are matched.

The utility model discloses a further technological improvement lies in: the LED light source comprises a diffusion plate, a prism sheet and a diffusion sheet, wherein the diffusion plate is used for scattering light rays directly emitted by the LEDs, the prism sheet is used for brightening the scattered light rays, and the diffusion sheet is used for uniformly displaying the brightened light rays.

The utility model discloses a further technological improvement lies in: PCB board, diffuser plate, prism piece and diffusion piece all are parallel arrangement between two liang, guarantee the utility model discloses the luminance that the printing opacity was lighted is more even, and the prism piece is better to the effect of brightening of light.

The utility model discloses a further technological improvement lies in: the specification of a plurality of LEDs is PCT material.

A method for manufacturing an ultrathin matrix backlight module specifically comprises the following steps:

the method comprises the following steps: placing a PCB on a special carrier, fixing the PCB by using a special steel mesh by using a high-temperature adhesive tape, uniformly brushing lead-free solder paste with a melting point of more than 220 ℃ on the PCB, attaching LEDs on the PCB at an array interval of 8.93mm by 6.28mm, and melting the high-temperature solder paste by passing through a reflow oven with the temperature of more than 220 ℃, wherein blue LEDs can be welded on the PCB;

step two: after the PCB passes through the reflow oven, the PCB is required to be cooled, and the PCB and the carrier can be kept still for 15 to 20min until the PCB is sufficiently cooled; the carrier can also be directly placed into a condenser to be rapidly cooled in a blowing mode;

step three: and after the PCB is sufficiently cooled, taking down the PCB. The diffusion plate is horizontally pressed on the PCB in a pressing mode when the diffusion plate is horizontally placed on a desktop, and the diffusion plate needs to be kept horizontal;

step four: and pressing the prism sheet on the diffusion plate, pressing the diffusion sheet on the prism sheet, and cutting off the leftover material of the backlight module to complete the manufacture of the back module.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the led is directly fixed on the substrate without using a lens, and the OD height can be less than 10 mm.

2. The LED interval is smaller, and base plate LED is many, and the subregion is many, can realize the regional dimming in more regions, and the contrast is higher, and luminance is higher.

3. The LED specification that this product used is 2835PCT material, and the cost is lower. The utility model discloses have good social and economic benefits, be fit for using widely.

Drawings

In order to facilitate understanding for those skilled in the art, the present invention will be further described with reference to the accompanying drawings.

Fig. 1 is a top view of the overall structure of the present invention.

Fig. 2 is an exploded view of the present invention.

FIG. 3 is a left side view of the overall structure of the present invention

Fig. 4 is a right side view of the overall structure of the present invention.

In the figure: 1. a PCB board; 2. an LED; 3. a diffusion plate; 4. a prism sheet; 5. and a diffusion sheet.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1-4, an ultra-thin matrix backlight module includes a PCB 1, a plurality of LEDs 2, a diffuser plate 3 and a film structure;

the PCB 1 is of a rectangular structure, the LEDs 2 are welded above the PCB 1 side by side in an array mode, the distance between the LEDs 2 is smaller, the number of LEDs on the substrate is large, the number of partitions is large, regional dimming in more regions can be realized, the contrast is higher, and the brightness is higher;

the film structure comprises a prism sheet 4 and a diffusion sheet 5, the LED2 directly emits light, the light is scattered through the diffusion sheet 3, the light is brightened through the prism sheet 4, and finally the light is uniformly displayed through the diffusion sheet 5;

a diffusion plate 3 is arranged above the PCB 1, a prism sheet 4 is arranged above the diffusion plate 3, and a diffusion sheet 5 is arranged above the prism sheet 4.

As the utility model discloses the embodiment of preferred, a plurality of LED2 is 8.93mm along the X axle direction interval between two liang of PCB board 1, and a plurality of LED2 is 6.28mm along the Y axle direction interval between two liang of PCB board 1, the utility model discloses a LED2 interval is littleer, and LED2 on the PCB board 1 is many, and the subregion is many, can realize that more regional regions adjust luminance, and the contrast is higher, and luminance is higher.

As the preferred embodiment of the present invention, the area sizes of the PCB board 1 and the diffusion plate 3, the prism sheet 4 and the diffusion sheet 5 are matched.

As the embodiment of the present invention, the diffusion plate 3 is used to scatter the light directly emitted from the LED2, and the prism sheet 4 is used to brighten the scattered light, and the diffusion sheet 5 is used to uniformly display the brightened light.

As the utility model discloses the embodiment of preferred, PCB board 1, diffuser plate 3, prism piece 4 and diffusion piece 5 all are parallel arrangement between two liang, guarantee the utility model discloses the luminance that the printing opacity was lighted is more even, and prism piece 4 is better to the effect of brightening of light.

As the preferred embodiment of the present invention, the specification of a plurality of LEDs is 2835PCT material.

the method comprises the following steps: placing the PCB on a special carrier, fixing the PCB by using a special steel mesh by using a high-temperature adhesive tape, uniformly brushing lead-free solder paste with a melting point of more than 220 ℃ on the PCB, attaching the LEDs 2 on the PCB at an array interval of 8.93mm by 6.28mm, and melting the high-temperature solder paste by passing through a reflow oven with the temperature of more than 220 ℃, wherein the blue LEDs can be welded on the PCB 1;

step three: and after the PCB is sufficiently cooled, taking down the PCB. The diffusion plate 3 is horizontally pressed on the PCB 1 and needs to be kept horizontal;

step four: and pressing the prism sheet 4 on the diffusion plate 3, pressing the diffusion sheet 5 on the prism sheet 4, and cutting off the leftover material of the backlight module to complete the manufacture of the back module.

The working principle is as follows: the utility model discloses when using, at first, the inspection the utility model discloses security when each part uses, then, 1 circular telegram of PCB board, a plurality of LED2 sends light in step and lights, and the diaphragm framework of this module is a prism piece 4, and a diffusion 5 does not use lens, and LED2 directly shines through diffuser plate 3, breaks up light, sees through prism piece 4 and improves, evenly presents light through diffusion 5 at last, the utility model discloses a LED2 interval is littleer, and LED2 on the PCB board 1 is many, and the subregion is many, can realize that more regional areas adjust luminance, and the contrast is higher, and luminance is higher, and the LED specification that this product used is 2835PCT material, and the cost is lower.

The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments are not exhaustive and do not limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. The utility model provides an ultra-thin matrix backlight unit which characterized in that: the LED lamp comprises a PCB (printed circuit board) 1, a plurality of LEDs 2, a diffusion plate 3 and a diaphragm structure;

the PCB (1) is of a rectangular structure, and the LEDs (2) are welded above the PCB (1) side by side in an array mode;

the membrane structure comprises a prism sheet (4) and a diffusion sheet (5);

the PCB is characterized in that a diffusion plate (3) is arranged above the PCB (1), a prism sheet (4) is arranged above the diffusion plate (3), and a diffusion sheet (5) is arranged above the prism sheet (4).

2. The ultra-thin matrix backlight module as claimed in claim 1, wherein the distance between a plurality of the LEDs (2) is 8.93mm in the X-axis direction of the PCB (1), and the distance between a plurality of the LEDs (2) is 6.28mm in the Y-axis direction of the PCB (1).

3. An ultra thin matrix backlight module as claimed in claim 1, wherein the area sizes of the PCB board (1) and the diffusion plate (3), prism sheet (4) and diffusion sheet (5) are matched.

4. The ultra-thin matrix backlight module as claimed in claim 1, wherein the PCB board (1), the diffuser plate (3), the prism sheet (4) and the diffuser sheet (5) are disposed in parallel.

5. The ultra-thin matrix backlight module as claimed in claim 1, wherein the LEDs are 2835PCT standard.