CN210123746U - Adhesive layer and substrate integrated backboard - Google Patents
Adhesive layer and substrate integrated backboard Download PDFInfo
- Publication number
- CN210123746U CN210123746U CN201921231832.9U CN201921231832U CN210123746U CN 210123746 U CN210123746 U CN 210123746U CN 201921231832 U CN201921231832 U CN 201921231832U CN 210123746 U CN210123746 U CN 210123746U
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- Prior art keywords
- ultraviolet
- adhesive layer
- resistant film
- layer
- substrate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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Abstract
The utility model relates to a back plate with an adhesive layer and a base material integrated, which comprises a first ultraviolet-resistant film, a base material layer, a second ultraviolet-resistant film and an adhesive layer, wherein the lower surface of the first ultraviolet-resistant film is fixed with the upper surface of the base material layer, and the upper surface of the second ultraviolet-resistant film is fixed with the lower surface of the base material layer; the lower surface of the adhesive layer is fixed with the upper surface of the first ultraviolet-resistant film. The utility model discloses can make the process step simpler, process cost is cheaper.
Description
Technical Field
The utility model relates to a backplate, specifically speaking are backplate of adhesive layer and substrate integration for solar PV modules.
Background
Currently, a back plate for a photovoltaic module is a split structure in which a back plate substrate and an adhesive layer are independent from each other, a first ultraviolet-resistant film, a base material layer and a second ultraviolet-resistant film are fixed to form the back plate substrate, the first ultraviolet-resistant film is fixed to the upper surface of the base material layer, and the second ultraviolet-resistant film is fixed to the lower surface of the base material layer, as shown in fig. 1. And the adhesive layer is a single layer, as shown in fig. 2.
Such backplate for photovoltaic module needs two steps of actions when making, and not only the quantity of gluing agent layer is also great, and the first resistant ultraviolet rete adjacent with gluing agent layer needs to do the corona moreover, and this has increased technology cost undoubtedly.
Disclosure of Invention
The utility model aims at overcoming the not enough of existence among the prior art, provide a backplate of gluing agent layer and substrate integration that technology step is simple, low in process cost.
According to the technical scheme provided by the utility model, the adhesive layer and substrate integrated backboard comprises a first ultraviolet-resistant film, a substrate layer, a second ultraviolet-resistant film and an adhesive layer, wherein the lower surface of the first ultraviolet-resistant film is fixed with the upper surface of the substrate layer, and the upper surface of the second ultraviolet-resistant film is fixed with the lower surface of the substrate layer; the lower surface of the adhesive layer is fixed with the upper surface of the first ultraviolet-resistant film.
The first ultraviolet-resistant film is made of PVDF, and the thickness of the first ultraviolet-resistant film is 0.015-0.035 mm.
The material of substrate layer is PET, and the thickness of substrate layer is 0.18~0.30 mm.
The second ultraviolet-resistant film is made of PVDF, and the thickness of the second ultraviolet-resistant film is 0.015-0.035 mm.
The adhesive layer is made of EVA, and the thickness of the adhesive layer is 0.30-0.50 mm.
The utility model discloses can make the process step simpler, process cost is cheaper.
Drawings
Fig. 1 is a schematic structural diagram of a backplane substrate in the prior art.
Fig. 2 is a schematic structural diagram of an adhesive layer in the prior art.
Fig. 3 is a schematic structural diagram of the present invention.
Detailed Description
The present invention will be further described with reference to the following specific embodiments.
The utility model discloses a backplate that gluing agent layer and substrate integration, it includes first resistant ultraviolet membrane 1, substrate layer 2, second resistant ultraviolet membrane 3 and gluing agent layer 4, the lower surface of first resistant ultraviolet membrane 1 is fixed mutually with the upper surface of substrate layer 2, the upper surface of second resistant ultraviolet membrane 3 is fixed mutually with the lower surface of substrate layer 2; the lower surface of the adhesive layer 4 is fixed to the upper surface of the first ultraviolet-resistant film 1.
The first ultraviolet-resistant film 1 is made of PVDF, and the thickness of the first ultraviolet-resistant film 1 is 0.015-0.035 mm.
The material of substrate layer 2 is PET, and the thickness of substrate layer 2 is 0.18~0.30 mm.
The second ultraviolet-resistant film 3 is made of PVDF, and the thickness of the second ultraviolet-resistant film 3 is 0.015-0.035 mm.
The adhesive layer 4 is made of EVA, and the thickness of the adhesive layer 4 is 0.30-0.50 mm.
The utility model discloses an use the curtain coating method, with EVA curtain coating to the upper surface of first resistant ultraviolet membrane 1 and form gluing agent layer 4 in the backplate base plate (the backplate base plate comprises first resistant ultraviolet membrane 1, substrate layer 2 and the fixed an organic whole of the resistant ultraviolet membrane 3 of second), can make like this that the packing is more compact between the back of backplate base plate and gluing agent layer 4 to can reduce gluing agent layer 4's thickness, satisfy required filling effect.
Simultaneously, fix the gluing agent layer 4 of EVA material at the back of backplate base plate through the cooling method, make to have sufficient adhesion between gluing agent layer 4 and the backplate base plate to can skip the corona technology that needs on first resistant ultraviolet membrane 1 among the prior art, only need be in the second resistant ultraviolet membrane 3 and do corona technology once, make the utility model discloses a gluing agent layer can all have reduce cost's advantage from making the end to the user end with the backplate of substrate integration.
Claims (5)
1. The adhesive layer and base material integrated back plate comprises a first ultraviolet-resistant film (1), a base material layer (2), a second ultraviolet-resistant film (3) and an adhesive layer (4), wherein the lower surface of the first ultraviolet-resistant film (1) is fixed with the upper surface of the base material layer (2), and the upper surface of the second ultraviolet-resistant film (3) is fixed with the lower surface of the base material layer (2); the method is characterized in that: the lower surface of the adhesive layer (4) is fixed with the upper surface of the first ultraviolet-resistant film (1).
2. The adhesive layer-substrate integrated backsheet according to claim 1, wherein: the first ultraviolet-resistant film (1) is made of PVDF, and the thickness of the first ultraviolet-resistant film (1) is 0.015-0.035 mm.
3. The adhesive layer-substrate integrated backsheet according to claim 1, wherein: the material of substrate layer (2) is PET, and the thickness of substrate layer (2) is 0.18~0.30 mm.
4. The adhesive layer-substrate integrated backsheet according to claim 1, wherein: the second ultraviolet-resistant film (3) is made of PVDF, and the thickness of the second ultraviolet-resistant film (3) is 0.015-0.035 mm.
5. The adhesive layer-substrate integrated backsheet according to claim 1, wherein: the adhesive layer (4) is made of EVA, and the thickness of the adhesive layer (4) is 0.30-0.50 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921231832.9U CN210123746U (en) | 2019-07-31 | 2019-07-31 | Adhesive layer and substrate integrated backboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921231832.9U CN210123746U (en) | 2019-07-31 | 2019-07-31 | Adhesive layer and substrate integrated backboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210123746U true CN210123746U (en) | 2020-03-03 |
Family
ID=69634513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921231832.9U Active CN210123746U (en) | 2019-07-31 | 2019-07-31 | Adhesive layer and substrate integrated backboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210123746U (en) |
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2019
- 2019-07-31 CN CN201921231832.9U patent/CN210123746U/en active Active
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