CN210123561U

CN210123561U - Sensor assembly and pixel circuit thereof

Info

Publication number: CN210123561U
Application number: CN201920466250.2U
Authority: CN
Inventors: 潘华兵; 胡铁刚; 周延青; 郑泉智
Original assignee: Hangzhou Silan Microelectronics Co Ltd
Current assignee: Hangzhou Silan Microelectronics Co Ltd
Priority date: 2019-04-08
Filing date: 2019-04-08
Publication date: 2020-03-03
Anticipated expiration: 2029-04-08

Abstract

The application discloses a sensor assembly and a pixel circuit thereof. The pixel circuit includes: the amplifying modules are respectively connected with corresponding sensor units in the sensor units of the sensor array and used for pre-amplifying detection signals of the corresponding sensor units; the current source is connected with the plurality of amplifying modules to provide constant current; and a bias circuit connected with the plurality of amplification modules to provide a path of the constant current to ground, wherein the plurality of amplification modules share the current source and the bias circuit. A plurality of amplifying modules of the pixel circuit share a current source and a bias circuit, so that the chip area can be reduced, and the spatial resolution of a sensor assembly can be improved.

Description

Sensor assembly and pixel circuit thereof

Technical Field

The present invention relates to sensor technology, and more particularly, to a sensor assembly including a sensor array and CMOS circuitry and pixel circuitry therefor.

Background

Biometric identification is a technique for distinguishing different biometrics, including identification techniques such as fingerprints, palm prints, faces, DNA, voice, and the like. The fingerprint refers to uneven lines on the skin on the front face of the tail end of a human finger, and the lines are regularly arranged to form different line types. Fingerprint identification refers to identity authentication by comparing minutiae of different fingerprints. Fingerprint identification is becoming more and more widely used due to its lifetime invariance, uniqueness and convenience.

In fingerprint identification, a sensor is used to acquire fingerprint image information. Fingerprint sensors can be classified into optical, capacitive, pressure, and ultrasonic sensors according to their operating principles. The ultrasonic sensor is a third generation fingerprint sensor in which ultrasonic waves are generated using the inverse piezoelectric effect of piezoelectric materials. When ultrasonic waves are applied to a fingerprint, the fingerprint shows different reflectivities and transmittances in ridges and valleys of the fingerprint. The fingerprint information can be read by scanning the ultrasonic beam signal in a certain area. The ultrasonic waves generated by the ultrasonic sensor may be capable of scanning through a cell phone housing made of glass, aluminum, stainless steel, sapphire, or plastic, thereby disposing the ultrasonic sensor within the housing of an electronic device (e.g., a cell phone).

When applied in a product, the sensor assembly includes a sensor array and CMOS circuitry. The sensor array includes a plurality of sensor units that respectively acquire pixel signals of local areas. The pixel circuit in the CMOS circuit includes a plurality of amplification modules corresponding to the sensor units, and pre-amplifies detection signals of the corresponding sensor units, respectively. Further, the signal processing circuit of the CMOS circuit combines the pixel signals of the plurality of partial areas to form a complete detection signal.

Advances in sensor manufacturing technology have made it possible to reduce the size of sensor cells in a sensor array. However, the pixel circuit in the CMOS circuit includes many active devices, and the chip area is difficult to reduce. The size of the circuit unit in the pixel circuit is larger than that of the sensor unit, so that the size of the sensor assembly formed by packaging the two is difficult to reduce, and the spatial resolution of the sensor assembly is lower than that of an independent sensor array.

Accordingly, it is desirable to reduce the size of the sensor assembly to reduce the installation space in the electronic device and to improve the spatial resolution of the sensor assembly to improve the accuracy of the identification.

SUMMERY OF THE UTILITY MODEL

In view of the above, the present invention provides a sensor assembly and a pixel circuit thereof, wherein a plurality of amplifying modules in the pixel circuit share a current source and a bias circuit, thereby reducing the area of the pixel circuit to improve the spatial resolution of the sensor assembly.

According to a first aspect of the present invention, there is provided a pixel circuit for a sensor array, the sensor array comprising a plurality of sensor units, the pixel circuit comprising: a plurality of amplification modules, each of which includes an input terminal and an output terminal, the input terminal being connected to a corresponding sensor unit of the plurality of sensor units, the plurality of amplification modules pre-amplifying detection signals of the corresponding sensor units and providing pre-amplified signals at the output terminals, respectively; the current source is connected with the plurality of amplifying modules to provide constant current; and a bias circuit connected to the plurality of amplification modules to provide a path of the constant current to ground, wherein the plurality of amplification modules share the current source and the bias circuit.

Preferably, the amplifying module comprises a plurality of transistors, at least one of the plurality of transistors forming a parasitic diode between the input terminal and/or the output terminal and a semiconductor substrate, the parasitic diode acting as a clamping diode.

Preferably, the plurality of amplification modules respectively include: the pixel circuit comprises a first transistor, a second transistor, a third transistor, a fourth transistor, a fifth transistor, a sixth transistor, a seventh transistor, a sixth transistor, a seventh transistor, a sixth transistor, a seventh.

Preferably, the sensor array is an ultrasonic sensor array, and each of the plurality of amplification modules further includes: and a fifth transistor connected between the input terminal and ground, the fifth transistor being turned on when the sensor array transmits the ultrasonic wave, and being turned off when the sensor array receives the ultrasonic wave.

Preferably, the first to third transistors are P-type MOS transistors, the fourth and fifth transistors are N-type MOS transistors, and the control terminal is a gate.

Preferably, source and drain regions of the first to third transistors are formed in well regions connected to sources of the respective transistors, and source and drain regions of the fourth and fifth transistors are formed in the semiconductor substrate.

Preferably, the plurality of amplification modules further comprises: and the inverter is used for converting the first selection signal into an inverted second selection signal, wherein the control end of the first transistor receives the second selection signal, and the control end of the fourth transistor receives the first selection signal.

Preferably, the current source includes a sixth transistor, a seventh transistor, and a third switch connected in series between a power supply voltage and a power supply terminal of the plurality of amplification modules, the bias circuit includes an eighth transistor, a ninth transistor, and a fourth switch connected in series between a bias terminal of the plurality of amplification modules and ground, and the third switch and the fourth switch are turned on and off in synchronization to enable or disable the plurality of amplification modules connected to the respective sensor cells of the plurality of sensor cells.

Preferably, the sixth and seventh transistors are P-type MOS transistors, and the eighth and ninth transistors are N-type MOS transistors.

Preferably, the output terminals of the plurality of amplification blocks of the pixel circuit are connected together to provide the pre-amplified signal.

Preferably, the sensor array further includes replica sensor cells corresponding to the plurality of sensor cells, the pixel circuit further includes an additional amplification block and an additional bias circuit connected to the replica sensor cells, the additional amplification block having the same structure as the plurality of amplification blocks, the additional bias circuit having the same structure as the bias circuit, and a power supply terminal and a bias terminal of the additional amplification block are connected to the current source and the additional bias circuit, respectively.

Preferably, the pixel circuit further comprises an input common mode negative feedback module connected between the plurality of amplification modules and the additional amplification module, and an output common mode negative feedback module connected between the bias circuit and the additional bias circuit.

Preferably, the output terminals of the plurality of amplification blocks of the pixel circuit are connected together as a first differential output terminal, the output terminal of the additional amplification block is used as a second differential output terminal, and the pre-amplified signal is provided between the first differential output terminal and the second differential output terminal.

According to a second aspect of the present invention, there is provided a sensor assembly, comprising: a sensor array comprising a first electrode, a second electrode, and a piezoelectric layer sandwiched therebetween, wherein the first electrode comprises a plurality of sub-electrodes spaced apart from one another, thereby forming a plurality of sensor cells; and a CMOS circuit including a plurality of pixel circuits and a plurality of signal processing circuits, the plurality of pixel circuits being respectively connected to a corresponding group of sensor units among the plurality of sensor units, for pre-amplifying detection signals of the group of sensor units, the plurality of signal processing circuits being respectively connected to a group of pixel circuits, for signal processing the pre-amplified signals, wherein the plurality of pixel circuits of the CMOS circuit operate in a time-sharing manner, and the plurality of signal processing circuits operate in a time-sharing manner, so that the group of sensor units commonly use one pixel circuit, and the group of pixel circuits commonly use one signal processing circuit, the pixel circuit including: the amplifying modules respectively comprise input ends and output ends, the input ends are connected with corresponding sensor units in the sensor units to receive the detection signals, and the output ends are connected with corresponding signal processing circuits of the signal processing circuits to provide the pre-amplifying signals which are used for pre-amplifying the detection signals of the corresponding sensor units; the current source is connected with the plurality of amplifying modules to provide constant current; and a bias circuit connected to the plurality of amplification modules to provide a path of the constant current to ground, wherein the plurality of amplification modules share the current source and the bias circuit.

Preferably, the current source includes a sixth transistor, a seventh transistor, and a third switch connected in series between a power supply voltage and a power supply terminal of the plurality of amplification modules, the bias circuit includes an eighth transistor, a ninth transistor, and a fourth switch connected in series between a bias terminal of the plurality of amplification modules and ground, and the third switch and the fourth switch are turned on and off in synchronization to enable or disable the plurality of amplification modules connected to the group sensor unit.

Preferably, the sensor array further includes replica sensor cells corresponding to the plurality of sensor cells, the pixel circuit in the CMOS circuit further includes an additional amplification block and an additional bias circuit connected to the replica sensor cells, the additional amplification block having the same structure as the plurality of amplification blocks, the additional bias circuit having the same structure as the bias circuit, and a power supply terminal and a bias terminal of the additional amplification block being connected to the current source and the additional bias circuit, respectively.

Preferably, the signal processing circuit includes a selection switch and a signal processing block, the selection switch selecting one pixel circuit from the plurality of pixel circuits to be connected to the signal processing block, so that the signal processing block processes the pre-amplified signals from the plurality of pixel circuits in a time-division multiplexing manner.

Preferably, the plurality of pixel circuits constitute a circuit array, and the plurality of pixel circuits are respectively located below the corresponding plurality of sensor units.

Preferably, the sensor array and the CMOS circuit are packaged in the same chip in a stacked manner.

Preferably, at least one layer of the sensor array is deposited over the plurality of pixel circuits, and the sensor array and the plurality of pixel circuits are electrically connected to each other using vias.

Preferably, the sensor array and the CMOS circuitry are separate chips and are bonded to each other.

According to a third aspect of the present invention, there is provided a signal processing method for a sensor assembly including a sensor array and a CMOS circuit connected to each other, the CMOS circuit including a plurality of pixel circuits and a plurality of signal processing circuits, the signal processing method comprising: pre-amplifying detection signals of a plurality of sensor units of a sensor array by adopting a plurality of pixel circuits, wherein each pixel circuit is connected to a corresponding group of sensor units in the plurality of sensor units and works in a time-sharing manner; and signal processing the pre-amplified signals of the plurality of pixel circuits by using a plurality of signal processing circuits, wherein each signal processing circuit is connected to a corresponding group of pixel circuits in the plurality of pixel circuits and operates in a time-sharing manner.

Preferably, the pixel circuit includes: a plurality of amplification modules respectively connected with corresponding sensor units in the group of sensor units to acquire the detection signals; the current source is connected with the plurality of amplifying modules to provide constant current; and a bias circuit connected to the amplifying modules to provide a path of the constant current to ground, wherein the plurality of amplifying modules share the current source and the bias circuit.

Preferably, the plurality of amplification modules are enabled by synchronously turning on the current source and the bias circuit, and disabled by synchronously turning off the current source and the bias circuit.

Preferably, the sensor array is an ultrasonic sensor array, the amplification module operates when the sensor array receives ultrasonic waves by disconnecting the connection between the input terminal and the ground, and the amplification module stops operating when the sensor array transmits the ultrasonic waves by connecting the input terminal to the ground.

Preferably, the amplifying module includes a switch and a charge amplifying circuit connected in series between the current source and the bias circuit, and one amplifying module is selected from the plurality of amplifying modules to pre-amplify the detection signal when the pixel circuit operates in time division by closing and opening the switch.

Preferably, the sensor array further includes replica sensor cells corresponding to the plurality of sensor cells, the pixel circuit further includes an additional amplification block and an additional bias circuit connected to the replica sensor cells, the additional amplification block has the same structure as the plurality of amplification blocks, the additional bias circuit has the same structure as the bias circuit, and a power supply terminal and a bias terminal of the additional amplification block are connected to the current source and the additional bias circuit, respectively.

According to the utility model discloses sensor assembly, sensor array include a plurality of sensor unit, and the CMOS circuit includes a plurality of pixel circuit and a plurality of signal processing circuit. The set of sensor cells share one pixel circuit, and the set of pixel circuits share one signal processing circuit. Since the pixel circuit in the CMOS circuit includes a plurality of circuit units (i.e., amplification blocks) corresponding to a plurality of sensor units, and the plurality of circuit units share at least a part of the circuit blocks (i.e., current sources and bias circuits), the size of the circuit units can be reduced. The circuit cell size of the pixel circuit of the sensor assembly can be reduced to correspond to the sensor cell size of the sensor array. In the sensor assembly, the circuit cell size of the pixel circuit can be reduced corresponding to the sensor cell size of the sensor array, thus improving the spatial resolution of the sensor assembly. For example, the lateral resolution of the sensor assembly is up to 500 dpi.

In a preferred embodiment, the sensor assembly may package the sensor array and the CMOS circuitry in a stacked manner, with at least one layer of the sensor array being deposited over a plurality of pixel circuits and electrically connected to each other with vias, e.g., vias connecting the sensor cells and the pixel circuits directly, thereby substantially reducing the additional parasitic capacitance caused by the input electrodes. The sensor unit is directly connected with the pre-operational amplifier, so that the detection precision is greatly improved.

In a preferred embodiment, the sensor assembly may package the sensor array and the CMOS circuitry in a stacked manner, and the lowermost layer of the sensor array may be deposited directly on the uppermost layer of the CMOS circuitry, thereby eliminating the need for an adhesive therebetween. The method can avoid the adverse effects of various adverse factors such as propagation loss, reflection and scattering of the ultrasonic wave caused by the problem of the adhesive, thereby improving the performance of the acoustic wave sensor.

Drawings

The above and other objects, features and advantages of the present invention will become more apparent from the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:

fig. 1 shows a schematic cross-sectional view of an ultrasonic sensor according to the prior art;

fig. 2 shows a schematic cross-sectional view of an ultrasonic sensor according to a first embodiment of the invention;

fig. 3 and 4 respectively show a three-dimensional structure diagram of an ultrasonic sensor according to a first embodiment of the present invention and a schematic circuit diagram of a CMOS circuit;

FIG. 5 shows a schematic circuit diagram of an amplification block in the pixel circuit of the ultrasonic sensor shown in FIG. 4;

FIG. 6 shows a schematic circuit diagram of one pixel circuit of the ultrasonic sensor shown in FIG. 4; and

fig. 7 shows a schematic circuit diagram of another pixel circuit of the ultrasonic sensor shown in fig. 4.

Detailed Description

The invention will be described in more detail below with reference to the accompanying drawings. Like elements in the various figures are denoted by like reference numerals. For purposes of clarity, the various features in the drawings are not necessarily drawn to scale. In addition, certain well known components may not be shown.

Numerous specific details of the invention, such as structure, materials, dimensions, processing techniques and techniques of the devices are described below in order to provide a more thorough understanding of the invention. However, as will be understood by those skilled in the art, the present invention may be practiced without these specific details.

The present invention may be presented in a variety of forms, some of which are described below.

When applied to products, the sensor assembly of the present invention may be of the ultrasonic sensor type and other similar principles.

Fig. 1 shows a schematic cross-sectional view of an ultrasonic sensor according to the prior art. The ultrasonic sensor 100 includes a stacked CMOS circuit 110, a sensor array 120, a platen 130, and adhesives 141 and 142 for bonding the three together. Wherein the sensor array 120 is an ultrasonic sensor array. Details of the CMOS circuitry 110 and the sensor array 120 are not shown in the figure. It is understood that CMOS circuit 110 includes at least one transistor and at least one wiring layer, and sensor array 120 includes a piezoelectric layer and a pair of electrodes connected thereto. The transducer array 120 may include two piezoelectric layers independent of each other for transmitting and receiving ultrasonic waves, respectively, or may include a common piezoelectric layer for transmitting and receiving ultrasonic waves.

The piezoelectric layer is a functional layer of the sensor array 120, and is composed of, for example, an inorganic piezoelectric material or an organic piezoelectric material. The detailed structure and materials of the CMOS circuitry 110 and the sensor array 120 of the ultrasonic sensor 100 are known and will not be described in detail herein.

Preferably, a platen 130 is covered over the sensor array 120 to provide mechanical protection. The platen 130 may be any material that can be acoustically coupled to the sensor array, such as plastic, ceramic, sapphire, metal, alloys, polycarbonate, and glass. In some embodiments, the platen 130 may be some sort of protective device, such as a glass sheet. In other embodiments, the platen 130 may be aluminum, stainless steel, or the like.

The conventional manufacturing process of the ultrasonic sensor 100 includes: the first chip of the CMOS circuit 110 and the second chip of the sensor array 120 are manufactured using different substrates, respectively, using processes independent of each other. Then, the piezoelectric layer in the sensor array 120 is subjected to a polarization process. Finally, a first surface of the sensor array 120 is bonded to the CMOS circuit 110 with an adhesive 141, the platen 130 is bonded to a second surface of the sensor array 120 with an adhesive 142, the first surface and the second surface of the sensor array 120 are opposed to each other, and ultrasonic waves are transmitted and received via the second surface. In the ultrasonic sensor 100, the piezoelectric material of the piezoelectric layer is bonded to a CMOS circuit or the like after polarization processing, and therefore, the CMOS circuit 110 is not affected by the polarization electric field voltage.

However, the above-described prior art fabrication processes use adhesives to bond the polarized sensor array and the CMOS circuitry together. Since the problems of the adhesive cause various disadvantages such as propagation loss, reflection and scattering of the ultrasonic wave, resulting in deterioration of the performance of the ultrasonic sensor.

Fig. 2 shows a schematic cross-sectional view of an ultrasonic sensor according to a first embodiment of the present invention. The ultrasonic sensor 200 includes CMOS circuitry 110, a directly deposited sensor array 120, a platen 130, and an adhesive 142 for bonding the platen 130 to the sensor array 120. Details of the CMOS circuit 110 are not shown in the figure. It is understood that the CMOS circuit 110 includes at least one transistor and at least one wiring layer. The sensor array 120 includes a piezoelectric layer 121 and first and second electrodes 151 and 152 connected thereto. In this embodiment, piezoelectric layer 121 serves both to transmit and receive ultrasonic waves. In an alternative embodiment, the sensor array 120 may include two piezoelectric layers independent of each other for transmitting and receiving ultrasonic waves, respectively.

The piezoelectric layer 121 is a functional layer of the sensor array 120, and is composed of, for example, an inorganic piezoelectric material including one selected from Barium Titanate (BT), lead zirconate titanate (PZT), modified lead zirconate titanate, lead meta niobate, lead barium lithium niobate (PBLN), and modified lead titanate (PT), or an organic piezoelectric material including one selected from polyvinylidene fluoride (PVDF), polyvinylidene fluoride-trifluoroethylene (PVDF-TrFe), Polytetrafluoroethylene (PTFE), polyvinylidene chloride (PVDC), and diisopropylamine bromide (DIPAB).

A first electrode 151 and a second electrode 152 are respectively located on opposing surfaces of the piezoelectric layer 121. The first and second electrodes 151 and 152 may be composed of a conductive material, including a metallic conductive material and a non-metallic conductive material. The metal conductive material is, for example, Al-Si alloy, Cu, Ni-Cu, Au, Cr-Au, Pt-AU, Cr-Al, CrCu, Ag. The non-metallic conductive material is, for example, a conductive oxide, a conductive ink, or a conductive paste. The conductive oxide is, for example, Indium Tin Oxide (ITO). The conductive ink is, for example, silver-based ink. The conductive paste is, for example, silver-based epoxy resin or polyurethane.

In this embodiment, a first surface of piezoelectric layer 121 is adjacent CMOS circuitry 110 and a second surface is adjacent the touch surface. A first electrode 151 is located on a first surface of the piezoelectric layer 121 as a readout electrode. A second electrode 152 is located on a second surface of piezoelectric layer 121 as an emitter electrode. The first electrode 151 of the sensor array 120 is partitioned into a plurality of sub-electrodes spaced apart from each other, thereby forming a plurality of sensor cells. When the ultrasonic wave is transmitted, a varying electric field is generated between the first electrode 151 and the second electrode 152, so that the piezoelectric layer 121 is deformed due to the inverse piezoelectric effect, thereby transmitting the ultrasonic wave. When receiving the ultrasonic wave, the piezoelectric layer 121 is deformed by the echo of the ultrasonic wave, so that a voltage is generated between the first electrode 151 and the second electrode 152 due to the piezoelectric effect, thereby obtaining an ultrasonic signal.

The ultrasonic sensor 200 needs to satisfy a resolution of 500dpi of a fingerprint. Accordingly, the structure of both the CMOS circuit 110 and the sensor array 120 are designed to meet resolution requirements. In the sensor array 120, the area of each sensor cell of the first electrode 151 corresponds to a resolution, for example less than 50 microns by 50 microns. Although details are not shown in the drawings, the CMOS circuit 110 includes a plurality of pixel circuits corresponding to a plurality of sensor cells of the first electrode 151, each pixel circuit having an area corresponding to a resolution, for example, less than 50 micrometers by 50 micrometers. The plurality of pixel circuits of the CMOS circuit 110 and the sensor array 120 are directly deposited together by a first electrode 151, and the first electrode 151 is connected to an internal input of the CMOS circuit 110 through a via 171. The pixel circuit pre-amplifies the detection signals of the sensor array, and the pixel units and the sensor units directly correspond to each other one by one in physical positions, so that the phenomenon that the received signals are attenuated due to overlarge parasitic capacitance caused by too far position distance is avoided.

Further, the CMOS circuit 110 may further include a drive circuit connected to the second electrode 152 of the sensor array 120 via the via 172. In alternative embodiments, the bonding wires may be used to connect the CMOS circuit 110 and the sensor array 120 instead of the vias 172.

Preferably, the CMOS circuit further includes a plurality of cavities (not shown) corresponding to the plurality of sensor cells of the first electrode 151 for enhancing the transmitting and receiving effects of the ultrasonic waves.

Preferably, an additional protective layer 161 is provided between the sensor array 120 and the platen 130. The protective layer 161 is made of, for example, an organic substance, and is used to prevent the adhesive 142 from penetrating into the second electrode 152 or the piezoelectric layer 121.

The manufacturing process of the ultrasonic sensor 200 according to the first embodiment of the present invention includes: the first stack of CMOS circuits 110 and the second stack of sensor arrays 120 are fabricated sequentially on one substrate (e.g., a silicon substrate) using a continuous process. For example, the CMOS circuit 110 includes at least one transistor, at least one wiring layer connected to the at least one transistor, and an insulating layer on the at least one wiring layer. The first electrode 151, the piezoelectric layer 121 and the second electrode 152 of the sensor array 120 are deposited directly on the insulating layer. The first surface and the second surface of the sensor array 120 face each other, and transmit and receive ultrasonic waves via the second surface. Finally, the piezoelectric layer 121 in the sensor array 120 is subjected to a polarization process. This polarization process needs to be performed in an electric field of several tens of kilovolts, with the piezoelectric layer 121 in the CMOS circuit 110 and the sensor array 120 together while in the electric field. In order to avoid the CMOS circuit 110 from being damaged by coupling high-voltage charges in a high-voltage electric field, it needs to be protected accordingly during polarization.

In the ultrasonic sensor 200, the CMOS circuit 110 and the sensor array 120 are directly deposited as one body, an adhesive between them is omitted, and then the piezoelectric layer is subjected to polarization processing. The method can avoid the adverse effects of various adverse factors such as propagation loss, reflection and scattering of the ultrasonic wave caused by the problem of the adhesive, thereby improving the performance of the acoustic wave sensor.

Fig. 3 and 4 respectively show a schematic three-dimensional structure diagram of an ultrasonic sensor and a schematic circuit diagram of a CMOS circuit according to a first embodiment of the present invention. In the figure, a CMOS circuit 110 comprising a plurality of pixel circuits 111 and a plurality of signal processing circuits 112 and excitation circuits 113 and a sensor array 120 are shown.

The first electrode 151 of the sensor array 120 is patterned to form a plurality of sensor cells. In order to accurately perform fingerprint recognition, the plurality of sensor units form a sensor array of K × R, where K and R represent the number of rows and columns of the sensor array, respectively, both being natural numbers. In order to meet the criterion of ultrasonic fingerprinting of 500dpi, the area of each sensor element is for example less than 50 microns by 50 microns. In this embodiment, the plurality of sensor units in the same row are further divided into m groups, each group including n sensor units, where m and n are natural numbers, respectively, and R ═ m × n is satisfied. The method can reduce the number of pixel circuits corresponding to the sensor unit, thereby reducing circuit complexity.

The plurality of pixel circuits 111 of the CMOS circuit 110 correspond to, for example, are located below, a plurality of sensor cells of the sensor array 120. Each pixel circuit does not need to be designed as a complete amplifier in order to reduce the area occupied by the pixel circuit. The plurality of pixel circuits form a circuit array of K x m, wherein K and m respectively represent the number of rows and columns of the circuit array, and both are natural numbers. In this embodiment, the number K of rows of the pixel circuits 111 is equal to the number K of rows of the sensor cells, the number m of pixel circuits 111 in the same row is equal to the number m of groups of sensor cells in the corresponding row, and each pixel circuit 111 is connected to n sensor cells in the same group. That is, n sensor cells of the same group share one pixel circuit 111.

As shown in fig. 4, each pixel circuit 111 of the CMOS circuit 110 includes a plurality of amplification blocks 1111 and a current source 1112 and a bias circuit 1113 shared by the amplification blocks 1111. In this embodiment, in each pixel circuit 111, the number n of amplification modules 1111 is equal to the number n of sensor units in each group, and are connected respectively. In operation, the n amplification modules 1111 operate in a time-sharing manner and are sequentially connected to the current source 1112 and the bias circuit 1113, so as to select one sensor unit from the n sensor units and pre-amplify the detection signal.

The plurality of signal processing circuits 112 of the CMOS circuit 110 are connected to the plurality of pixel circuits 111. The signal processing circuit 112 includes a selection switch 1121 and a signal processing module 1122, respectively, for further processing the pre-amplified detection signal. In this embodiment, the number of the signal processing circuits 112 is K, where K is a natural number. The number K of the signal processing circuits 112 is equal to the number K of rows of the pixel circuits 111. One signal processing circuit 112 is shared by m pixel circuits 111 in the same row.

As shown in fig. 4, in the signal processing circuit 112 of the CMOS circuit 110, the selection switches 1121 are connected to the corresponding pixel circuits 111 in one row, and the signal processing module 1122 is connected to the selection switches 1121. In operation, the selection switch 1121 selects one pixel circuit from m pixel circuits in the same row to be connected to the signal processing module 1122, so that the pixel processing module 1122 operates in a time-division multiplexing manner to further amplify, demodulate, and sample-hold the pre-amplified detection signal.

It should be noted that only two groups of sensor cells and their associated circuit parts in a row of sensor cells are shown in fig. 4. In the circuit array of K × m, only two pixel circuits located in the same row connected to the two groups of sensor cells are shown, and in the signal processing circuit, only one signal processing circuit connected to the pixel circuit of the row is shown. However, as described above, the pixel circuits may constitute a circuit array of K × m, and thus, the CMOS circuit 110 may include any number of rows of pixel circuits, not only 1 row, but also 2 pixel circuits per row.

The CMOS circuit 110 according to this embodiment provides a two-stage multiplexing structure with a pixel circuit 111 in which a plurality of sensor cells of one row are divided into a plurality of groups and a signal processing circuit 112 in which each group of sensor cells is pre-amplified via a respective amplification block, but multiplexing current sources and bias circuits and in which each row of sensor cells multiplexes a signal processing block. This scheme adopts pixel circuit to realize the preliminary amplification of every sensor unit to can realize that the sensor unit area is little, consequently can directly arrange in under every sensor unit, directly be connected with the sensor unit, need not long distance walk the line, reduced input parasitic capacitance.

Fig. 5 shows a schematic circuit diagram of an amplification block in the pixel circuit of the ultrasonic sensor shown in fig. 4. The amplifying module 1111 includes MOS transistors M0 to M6 and a capacitor Cf, wherein the MOS transistors M0 to M3 are P-type MOS transistors, and the MOS transistors M4 to M6 are N-type MOS transistors. Source and drain regions of the P-type MOS transistors M0, M1, M2, and M3 are formed in well regions connected to the sources of the respective transistors, and source and drain regions of the N-type MOS transistors M4, M5, and M6 are formed in the semiconductor substrate.

In the amplifying module 1111, the transistors M2, M0, M1 and M5 are sequentially connected in series between the power supply terminal IO1 and the bias terminal IO 2. The power supply terminal IO1 is connected to a current source, for example, and the bias terminal IO2 is connected to a bias circuit, for example. The amplification modules 1111 of the plurality of pixel circuits may multiplex the current sources and the bias circuits.

The transistor M2 and the transistor M5 of the amplifying module 1111 form a selection switch to determine whether the pixel circuit is selected. The selection terminal En _ Pixel of the amplification block 1111 receives the selection signal. The MOS transistors M3 and M4 constitute an inverter for converting the received selection signal En _ Pixel into an inversion signal En _ Pixel _ n. The gate of the MOS transistor M5 further receives the selection signal En _ Pixel, and the gate of the MOS transistor M2 further receives the inversion signal En _ Pixel _ n. The amplifying module 1111 is connected with a current source and a bias circuit according to a selection signal, thereby realizing time-sharing operation.

The input terminal Vin of the amplification module 1111 is connected to a selected one of the plurality of sensor units via a selection switch, so as to receive the detection signal of the sensor array 120 and perform pre-amplification. The output terminal Vout of the amplifying module 1111 is connected to the signal processing circuit 112, and provides the pre-amplified detection signal thereto. The transistor M0 is a charge input amplifier transistor of the pixel circuit 111, and the transistor M1 is a cascode transistor of the transistor M0, which constitute a charge amplifier circuit. The input terminal Vin is connected to the gate of the transistor M0, and the output terminal Vout is connected to the drain of the transistor M1. The gate of transistor M1 receives a bias voltage Vb 1. The capacitor Cf is connected between the output terminal Vin and the output terminal Vout.

Further, the input terminal Vin of the amplifying module 1111 is connected to the ground via the transistor M6. The gate of MOS transistor M6 receives control signal Vctrl1, thereby constituting an additional control switch. The transistor M6 connects the input terminal Vin to ground during ultrasonic wave transmission, and the transistor M6 disconnects the input terminal Vin from ground during ultrasonic wave reception. Thus, the transistor M6 allows the sensor array 120 to switch between two states and share the first and second electrodes when transmitting and receiving ultrasound waves.

Fig. 6 shows a schematic circuit diagram of one pixel circuit of the ultrasonic sensor shown in fig. 4. The pixel circuit 111 includes a plurality of amplifying modules 1111 and a current source 1112 and a bias circuit 1113 shared by the amplifying modules 1111. The circuit structure of the plurality of amplification modules 1111 is as shown in fig. 5, and the plurality of amplification modules 1111 are connected in parallel between the current source 1112 and the bias circuit 1113, that is, the supply terminal IO1 of each amplification module 1111 is connected to the output terminal of the current source 1112, and the bias terminal IO2 is connected to the input terminal of the bias circuit 1113.

The current source 1112 includes MOS transistors M7-M8 and a switch S1 sequentially connected in series between the power source terminal VDD and the output terminal, and the bias circuit 1113 includes a switch S2 and MOS transistors M11-M12 sequentially connected in series between the input terminal and the ground, wherein the MOS transistors M7-M8 are P-type MOS transistors, and the MOS transistors M11-M12 are N-type MOS transistors. Source and drain regions of the P-type MOS transistors M7 to M8 are formed in well regions connected to the sources of the respective transistors, and source and drain regions of the N-type MOS transistors M11 to M12 are formed in the semiconductor substrate.

In the pixel circuit 111, a plurality of amplification modules 1111 are connected in parallel between the current source 1112 and the bias circuit 1113. The switch S1 in the current source 1112 and the switch S2 in the bias circuit 1113 are turned on and off in synchronization, so that one pixel circuit 111 corresponding to one group of sensor cells can be enabled or disabled.

The input terminals Vin of the amplifying modules 1111 are respectively connected to a corresponding one of the sensor units in the group, and the output terminals Vout may be connected to the same common node. As described above, the transistor M2 and the transistor M5 of each amplification block 1111 constitute a selection switch, so that whether the pixel circuit is selected or not can be determined, and therefore, in the enabled state of the pixel current 111, the plurality of amplification blocks 1111 can operate in time division according to the selection signal, pre-amplify the detection signals of the sensor units connected thereto, and supply the pre-amplified detection signals at the common node.

Fig. 7 shows a schematic circuit diagram of another pixel circuit of the ultrasonic sensor shown in fig. 4. The pixel circuit 211 includes a plurality of first amplifying modules 2111 and a common current source 1112 and a first bias circuit 2113, and a common second amplifying module 2112, a second bias circuit 2114, an input common mode negative feedback module 2115 and an output common mode negative feedback module 2116. The circuit structure of the plurality of first amplifying modules 2111 is as shown in fig. 5, and is connected in parallel between the current source 1112 and the first bias circuit 2113, that is, the power supply IO1 of each first amplifying module 2111 is connected to the output terminal of the current source 1112, and the bias terminal IO2 is connected to the input terminal of the first bias circuit 2113. The circuit structure of the second amplifying module 2112 is shown in fig. 5, and is connected between the current source 1112 and the second bias circuit 2114.

The current source 1112 includes MOS transistors M7 to M8 and a switch S1 sequentially connected in series between a power supply terminal VDD and an output terminal, the first bias circuit 2113 includes a switch S2 and MOS transistors M11 to M12 sequentially connected in series between the input terminal and ground, and the second bias circuit 2114 includes a switch S3 and MOS transistors M9 to M10 sequentially connected in series between the input terminal and ground, wherein the MOS transistors M7 to M8 are P-type MOS transistors, and the MOS transistors M9 to M12 are N-type MOS transistors. Source and drain regions of the P-type MOS transistors M7 to M8 are formed in well regions connected to the sources of the respective transistors, and source and drain regions of the N-type MOS transistors M9 to M12 are formed in a semiconductor substrate.

In the pixel circuit 211, a plurality of first amplification modules 2111 are connected in parallel between the current source 1112 and the first bias circuit 2113. The switch S1 in the current source 1112 and the switch S2 in the first bias circuit 2113 and the switch S3 in the second bias circuit 2114 are turned on and off in synchronization, so that one pixel circuit 211 corresponding to one group of sensor cells can be enabled or disabled.

The input terminals Vin of the plurality of first amplifying modules 2111 are respectively connected to a corresponding one of the sensor cells in the group, and the bias terminal IO2 doubles as an output terminal and is connected to the same common node. As described above, the transistor M2 and the transistor M5 of each first amplification block 2111 constitute a selection switch, so that whether the pixel circuit is selected or not can be determined, and therefore, in the enabled state of the pixel current 111, the plurality of first amplification blocks 2111 can operate in time division according to the selection signal to pre-amplify the detection signal of the sensor unit connected thereto.

The input of the second amplification module 2112 is connected to a replica sensor cell corresponding to the set of sensor cells. The replica sensor unit is, for example, an additional sensor unit provided at one side of each row of sensor units. On one side of the sensor array where the plurality of sensor cells make up K x R, a column of additional sensor cells is formed as a replica pixel column. For example, the inverter in the second amplification module 2112 is configured identically to the first amplification module 2111.

When the plurality of first amplification modules 2111 operate in a time-sharing manner, the input terminal Vin of one selected first amplification module 2111 and the input terminal VRin of the second amplification module 2112 form a differential input terminal. Further, an offset terminal IO2 of the first amplification module 2111 and an offset terminal IO2 of the second amplification module 2112 are selected as differential output terminals, and a differential output signal Vo is provided therebetween, so as to provide a pre-amplified detection signal.

Preferably, the pixel circuit 211 includes an input common-mode negative feedback module 2115 and an output common-mode negative feedback module 2116. The input common mode negative feedback module 2115 is connected between the plurality of first amplifying modules 2111 and the second amplifying modules 2112, and the output common mode negative feedback module 2116 is connected between the first bias circuit 2113 and the second bias circuit 2114 for stabilizing the input and output common mode voltage.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

In accordance with the embodiments of the present invention as set forth above, these embodiments are not exhaustive and do not limit the invention to the precise embodiments described. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical application, to thereby enable others skilled in the art to best utilize the invention and its various embodiments with various modifications as are suited to the particular use contemplated. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A pixel circuit for use in a sensor array, the sensor array comprising a plurality of sensor cells, the pixel circuit comprising:

a plurality of amplification modules, each of which includes an input terminal and an output terminal, the input terminal being connected to a corresponding sensor unit of the plurality of sensor units, the plurality of amplification modules pre-amplifying detection signals of the corresponding sensor units and providing pre-amplified signals at the output terminals, respectively;

the current source is connected with the plurality of amplifying modules to provide constant current; and

a bias circuit connected with the plurality of amplifying modules to provide a path of the constant current to ground,

wherein the plurality of amplification modules share the current source and the bias circuit.

2. The pixel circuit according to claim 1, wherein the amplification module comprises a plurality of transistors, at least one of the plurality of transistors forming a parasitic diode between the input and/or output and a semiconductor substrate, the parasitic diode acting as a clamping diode.

3. The pixel circuit according to claim 2, wherein the plurality of amplification modules respectively comprise:

first to fourth transistors connected in series in sequence between a supply terminal connected to the current source and a bias terminal connected to the bias circuit,

wherein the first transistor and the fourth transistor are respectively used as a first switch and a second switch for selecting one amplification module from the plurality of amplification modules to pre-amplify the detection signal when the pixel circuit operates in a time-sharing manner,

the second transistor and the third transistor are cascaded to form a charge amplification circuit, a control end of the second transistor is connected to the input end to receive the detection signal, and an intermediate node of the third transistor and the fourth transistor is connected to an output end to provide the pre-amplification signal.

4. The pixel circuit of claim 3, wherein the sensor array is an ultrasonic sensor array, and wherein each of the plurality of amplification modules further comprises: and a fifth transistor connected between the input terminal and ground, the fifth transistor being turned on when the sensor array transmits the ultrasonic wave, and being turned off when the sensor array receives the ultrasonic wave.

5. The pixel circuit according to claim 4, wherein the first to third transistors are P-type MOS transistors, the fourth and fifth transistors are N-type MOS transistors, and the control terminal is a gate.

6. The pixel circuit according to claim 5, wherein source and drain regions of the first to third transistors are formed in well regions connected to sources of the respective transistors, and source and drain regions of the fourth and fifth transistors are formed in the semiconductor substrate.

7. The pixel circuit of claim 3, wherein the plurality of amplification modules further comprises: and the inverter is used for converting the first selection signal into an inverted second selection signal, wherein the control end of the first transistor receives the second selection signal, and the control end of the fourth transistor receives the first selection signal.

8. The pixel circuit of claim 1, wherein the current source comprises a sixth transistor, a seventh transistor, and a third switch connected in series between a supply voltage and a supply terminal of the plurality of amplification modules, wherein the bias circuit comprises an eighth transistor, a ninth transistor, and a fourth switch connected in series between a bias terminal of the plurality of amplification modules and ground, and wherein the third switch and the fourth switch are turned on and off in synchronization to enable or disable the plurality of amplification modules connected to respective ones of the plurality of sensor cells.

9. The pixel circuit according to claim 8, wherein the sixth and seventh transistors are P-type MOS transistors and the eighth and ninth transistors are N-type MOS transistors.

10. The pixel circuit according to claim 2, wherein the output terminals of the plurality of amplification blocks of the pixel circuit are connected together to provide the pre-amplified signal.

11. The pixel circuit according to claim 2, wherein the sensor array further comprises replica sensor cells corresponding to the plurality of sensor cells, the pixel circuit further comprising an additional amplification block and an additional bias circuit connected to the replica sensor cells, the additional amplification block having the same structure as the plurality of amplification blocks, the additional bias circuit having the same structure as the bias circuit, a power supply terminal and a bias terminal of the additional amplification block being connected to the current source and the additional bias circuit, respectively.

12. The pixel circuit of claim 11, further comprising an input common-mode negative feedback module connected between the plurality of amplification modules and the additional amplification module, and an output common-mode negative feedback module connected between the bias circuit and the additional bias circuit.

13. The pixel circuit according to claim 12, wherein the outputs of the plurality of amplification blocks of the pixel circuit are connected together as a first differential output and the output of the additional amplification block is a second differential output, the pre-amplified signal being provided between the first differential output and the second differential output.

14. A sensor assembly, comprising:

a sensor array comprising a first electrode, a second electrode, and a piezoelectric layer sandwiched therebetween, wherein the first electrode comprises a plurality of sub-electrodes spaced apart from one another, thereby forming a plurality of sensor cells; and

a CMOS circuit including a plurality of pixel circuits respectively connected to corresponding groups of the plurality of sensor units for pre-amplifying detection signals of the groups of sensor units, and a plurality of signal processing circuits respectively connected to a group of pixel circuits for signal processing of the pre-amplified signals,

wherein the plurality of pixel circuits of the CMOS circuit operate in time-sharing and the plurality of signal processing circuits operate in time-sharing such that the group of sensor cells share one pixel circuit and the group of pixel circuits share one signal processing circuit,

the pixel circuit includes:

the amplifying modules respectively comprise input ends and output ends, the input ends are connected with corresponding sensor units in the sensor units to receive the detection signals, and the output ends are connected with corresponding signal processing circuits of the signal processing circuits to provide the pre-amplifying signals which are used for pre-amplifying the detection signals of the corresponding sensor units;

15. The sensor assembly of claim 14, wherein the amplification module comprises a plurality of transistors, at least one of the plurality of transistors forming a parasitic diode between the input and/or output and a semiconductor substrate, the parasitic diode acting as a clamping diode.

16. The sensor assembly of claim 15, wherein the plurality of amplification modules each comprise:

17. The sensor assembly of claim 16, wherein the sensor array is an ultrasonic sensor array, the plurality of amplification modules each further comprising: and a fifth transistor connected between the input terminal and ground, the fifth transistor being turned on when the sensor array transmits the ultrasonic wave, and being turned off when the sensor array receives the ultrasonic wave.

18. The sensor assembly of claim 17, wherein the first through third transistors are P-type MOS transistors, the fourth and fifth transistors are N-type MOS transistors, and the control terminal is a gate.

19. The sensor assembly of claim 18, wherein the source and drain regions of the first through third transistors are formed in well regions connected to the source of the respective transistors, and the source and drain regions of the fourth and fifth transistors are formed in the semiconductor substrate.

20. The sensor assembly of claim 16, wherein the plurality of amplification modules further comprises: and the inverter is used for converting the first selection signal into an inverted second selection signal, wherein the control end of the first transistor receives the second selection signal, and the control end of the fourth transistor receives the first selection signal.

21. The sensor assembly of claim 15, wherein the current source comprises a sixth transistor, a seventh transistor, and a third switch connected in series between a supply voltage and a supply terminal of the plurality of amplification modules, the bias circuit comprises an eighth transistor, a ninth transistor, and a fourth switch connected in series between a bias terminal of the plurality of amplification modules and ground, the third switch and the fourth switch are turned on and off in synchronization to enable or disable the plurality of amplification modules connected to the group sensor cell.

22. The sensor assembly of claim 21, wherein the sixth and seventh transistors are P-type MOS transistors and the eighth and ninth transistors are N-type MOS transistors.

23. The sensor assembly of claim 15, wherein the outputs of the plurality of amplification blocks of the pixel circuit are connected together to provide the pre-amplified signal.

24. The sensor assembly of claim 15, wherein the sensor array further comprises replica sensor cells corresponding to the plurality of sensor cells, the pixel circuit in the CMOS circuit further comprises an additional amplification block and an additional bias circuit connected to the replica sensor cells, the additional amplification block having a same structure as the plurality of amplification blocks, the additional bias circuit having a same structure as the bias circuit, a supply terminal and a bias terminal of the additional amplification block being connected to the current source and the additional bias circuit, respectively.

25. The sensor assembly of claim 24, wherein the pixel circuit further comprises an input common-mode negative feedback module connected between the plurality of amplification modules and the additional amplification module, and an output common-mode negative feedback module connected between the bias circuit and the additional bias circuit.

26. The sensor assembly of claim 25, wherein the outputs of the plurality of amplification blocks of the pixel circuit are connected together as a first differential output and the output of the additional amplification block is a second differential output, the pre-amplified signal being provided between the first differential output and the second differential output.

27. The sensor assembly of claim 14, wherein the signal processing circuit comprises a selection switch and a signal processing module, the selection switch selecting one pixel circuit from the plurality of pixel circuits to connect to the signal processing module such that the signal processing module processes the pre-amplified signals from the plurality of pixel circuits in a time-multiplexed manner.

28. The sensor assembly of claim 14, wherein the plurality of pixel circuits form a circuit array, and wherein the plurality of pixel circuits are respectively located below a corresponding plurality of sensor cells.

29. The sensor assembly of claim 28, wherein the sensor array and the CMOS circuitry are packaged in a stack in the same chip.

30. The sensor assembly of claim 29, wherein at least one layer of the sensor array is deposited over the plurality of pixel circuits, and the sensor array and the plurality of pixel circuits are electrically connected to each other with vias.

31. The sensor assembly of claim 28, wherein the sensor array and the CMOS circuit are separate chips and are bonded to each other.